Microelectromechanical holding device, image sensor device and method for manufacturing a microelectromechanical holding device

Abstract

A microelectromechanical holding device for an image sensor comprises a substrate and at least two deflection devices arranged on the substrate. Each deflection device has a frame for connection with the image sensor and at least one electrode device. The electrode assembly has at least one electrode pair. For each electrode pair, a first electrode is fixedly connected with the substrate. A second electrode is coupled with the frame. The electrode pair can be actuated such that the frame is deflected in a predefined first direction, which depends on the electrode pair.

Description

Technical Field

[0001] This invention relates to a microelectromechanical holding device, an image sensor device, and a method for manufacturing the microelectromechanical holding device. Background Technology

[0002] To achieve optical image stabilization in portable devices (such as smartphones), a lens can be displaced. Alternatively, an imaging chip (CIS) can be displaced. This displacement using a microelectromechanical system (MEMS) is known from US 11,274,033 B2. The MEMS actuator includes a first set of actuator fingers, a second set of actuator fingers, and a first bridging structure. The first bridging structure couples at least two fingers from the first set of actuator fingers, and simultaneously bridges at least one finger from the second set of actuator fingers. A capacitively driven frame is provided on which the CIS can be mounted. This allows for lateral displacement of the entire structure in the x / y plane and rotation within the plane. Summary of the Invention

[0003] The present invention provides a microelectromechanical holding device having the features of the independent claims, an image sensor device, and a method for manufacturing the microelectromechanical holding device.

[0004] The preferred embodiments are the subject of the corresponding dependent claims.

[0005] Therefore, according to a first aspect, the present invention relates to a microelectromechanical holding device for an image sensor, having a substrate and at least two offset devices disposed on the substrate. Each offset device has a frame for connection to the image sensor and at least one electrode device. The electrode assembly has at least one electrode pair. For each electrode pair, a first electrode is fixedly connected to the substrate. A second electrode is coupled to the frame. The electrode pair can be manipulated such that the frame is offset in a predetermined first direction, the predetermined first direction depending on the electrode pair.

[0006] Therefore, according to a second aspect, the present invention relates to an image sensor device having an image sensor and a microelectromechanical holding device according to the second aspect, wherein the image sensor is arranged on the holding device.

[0007] Therefore, according to a third aspect, the present invention relates to a method for manufacturing a microelectromechanical holding device for an image sensor. A substrate is provided. At least two offset devices are arranged on the substrate. Each offset device has a frame for connection to the image sensor and at least one electrode assembly. The electrode assembly has at least one electrode pair. For each electrode pair, a first electrode is fixedly connected to the substrate, while a second electrode is coupled to the frame. The electrode pair can be manipulated such that the frame is offset in a predetermined first direction, the predetermined first direction depending on the electrode pair.

[0008] Advantages of the invention The holding device includes multiple segmented offset devices that can be independently manipulated and moved, which together carry the image sensor and realize the offset of the image sensor.

[0009] This segmentation allows for the design of micromechanical holding devices independent of the size of the image sensor, and conversely, allows for the use of micromechanical holding devices for arbitrarily large image sensors.

[0010] The micromechanical holding device can be constructed to a small size, with a total area significantly smaller than that of an image sensor, which simplifies manufacturing.

[0011] According to the extended scheme of the microelectromechanical holding device, the predetermined first direction of one electrode pair of the electrode device of the first offset device is orthogonal to the predetermined first direction of one electrode pair of the electrode device of the second offset device. Therefore, these two electrode pairs achieve the offset of the image sensor in orthogonal directions.

[0012] According to an extended scheme of the microelectromechanical holding device, the second electrode of the electrode pair is arranged on a carrier coupled to the substrate, such that the carrier can be offset in a predetermined first direction of the electrode pair and substantially fixed in a second direction orthogonal to the predetermined first direction of the electrode pair.

[0013] According to an extended version of the microelectromechanical holding device, the carrier is connected to an external frame via a coupling device, allowing the external frame to offset relative to the carrier in a second direction. This prevents such offset from being transmitted to the electrode device.

[0014] According to an extended scheme of the microelectromechanical holding device, the coupling device is configured such that the outer frame is fixed relative to the carrier along a first direction, thereby transmitting this offset.

[0015] According to an extension of the microelectromechanical holding device, the coupling device is a push rod or spring element.

[0016] According to an extended scheme of the microelectromechanical holding device, the coupling device has a first coupling element and a second coupling element, which are connected to the carrier on opposite sides of the electrode device.

[0017] According to the extended scheme of the microelectromechanical holding device, the first electrode and the second electrode are interdigital electrodes. Attached Figure Description

[0018] Further advantages, features and details of the invention derive from the following description, in which various embodiments are explained in detail with reference to the accompanying drawings.

[0019] It shows: Figure 1 : A schematic top view of an image sensor device according to an embodiment of the present invention; Figure 2 : A schematic top view of the offset device of the micromechanical holding device according to an embodiment of the present invention; Figure 3a -c: According to Figure 1 A schematic top view of an image sensor device, used to illustrate the offset of the image sensor; Figure 4 : A schematic top view of the offset device of the micromechanical holding device according to an embodiment of the present invention; Figure 5a -d: A schematic top view of the offset device of the micromechanical holding device according to an embodiment of the present invention; Figure 6 : A schematic top view of an image sensor device according to an embodiment of the present invention; and Figure 7 A flowchart of a method for manufacturing a micromechanical holding device according to an embodiment of the present invention.

[0020] In all the accompanying drawings, identical or functionally equivalent elements and devices are given the same reference numerals. The numbering of method steps is for clarity and should not, in general, imply a specific temporal order. In particular, multiple method steps may be performed simultaneously. Detailed Implementation

[0021] Figure 1 A schematic top view of an image sensor device 100 is shown. The image sensor device 100 includes an image sensor 400 (e.g., an imaging chip) and a microelectromechanical holding device 200. The image sensor 400 is arranged or fixed on the holding device 200. The microelectromechanical holding device 200 includes four offset devices 10a to 10d, which are fixedly fastened to a substrate.

[0022] The four offset devices 10a to 10d are arranged in a matrix, that is, in a 2x2 grid.

[0023] By manipulating the offset devices 10a to 10d, the image sensor 2 can be displaced along the first direction y or the second direction x, or it can also rotate in the xy plane, as explained more precisely below.

[0024] Figure 2 Shown in Figure 1 The diagram shows a schematic top view of the offset device 10 of the microelectromechanical holding device 200.

[0025] The offset device 10 has a frame 1. To secure the image sensor 400 to the holding device 200, the image sensor 400 can be... Figure 1 The connection area 300 shown in the example is fastened to the frame 1.

[0026] The offset device 10 has an electrode assembly. For this purpose, multiple electrode pairs are provided. Multiple first electrodes 7a, 7b and second electrodes 6 are provided, each having a comb-like structure, wherein the fingers of the comb extend parallel to each other along a first direction y. Electrodes 6, 7a, and 7b are therefore constructed as interdigitated electrodes.

[0027] The second electrode 6 is fixedly connected to the carrier 2, which extends along the second direction y. The second electrode 6 has fingers that intersect with the fingers of one of the first electrodes 7a, and fingers that intersect with the fingers of the other first electrode 7b, thus forming two electrode pairs. Figure 2 In the illustrated embodiment, a total of six electrode pairs are formed, but the invention is not limited to a specific number of electrode pairs.

[0028] The carrier 2 is connected to anchor points 5a and 5b via two rocker springs 3a and 3b located on opposite sides of the electrode assembly, wherein the anchor points 5a and 5b are fixedly arranged on the substrate. Via the rocker springs 3a and 3b, the carrier 2 can be offset in a predetermined first direction y of the electrode pair 6, 7a, 7b and substantially fixed in a second direction x orthogonal to the predetermined first direction y of the electrode pair 6, 7a, 7b. Therefore, only parallelogram-shaped offsets are possible, wherein essentially only the coordinates along the predetermined first direction y change, while the coordinates along the second direction x orthogonal to it remain substantially the same.

[0029] The carrier 2 is further connected to the outer frame 1 via a coupling device 4. The coupling device 4 can be a push rod, which essentially prevents the frame 1 from moving relative to the carrier 2 along a predetermined first direction y, but allows movement of the frame 1 relative to the carrier 2 along a predetermined second direction x. Therefore, the outer frame 1 can be offset relative to the carrier 2 along the second direction x.

[0030] The flexible push rod 4 thus buffers the movement of the outer frame 1 in the second direction x and does not transmit it to the electrode device.

[0031] The first electrodes 7a and 7b are fixedly connected to the substrate. The second electrode 6 is coupled to the frame 1 and is movable relative to the substrate.

[0032] Electrode pairs 6, 7a, and 7b can be manipulated to offset frame 1 in a predetermined first direction x, which depends on electrode pairs 6, 7a, and 7b. By applying a voltage to one of the first electrodes 7a, carrier 2 and thus frame 1 can be offset in the positive direction along the first direction y. Conversely, by applying a voltage to the first electrode 7b opposite the second electrode 2, carrier 2 and thus frame 1 can be offset in the negative direction along the first direction y. By appropriately selecting the voltage, the precise position of frame 1, and thus image sensor 400, can be set.

[0033] exist Figure 1 In the image sensor device 100 shown, in Figure 2 The offset devices 10 shown are oriented differently. Thus, the carrier 2 is located at the upper edge of the offset device 10a arranged in the upper left, at the right edge of the offset device 10b arranged in the upper right, at the left edge of the offset device 10c arranged in the lower left, and at the lower edge of the offset device 10d arranged in the lower left.

[0034] Figure 3a -c indicates according to Figure 1 A schematic top view of the image sensor device 100, used to illustrate the offset of the image sensor 400.

[0035] like Figure 3a As shown, offset devices 10a and 10d, located in the upper left and lower right corners of a 2x2 grid, can be manipulated to offset the frame 1 and thus the image sensor 400 to the right (or left). Due to the connection via the image sensor 400, the frame 1 of the two differently oriented offset devices 10b and 10c also offsets along the second direction x. However, this movement is buffered by the push rod 4 and is not transmitted to the electrode assembly.

[0036] like Figure 3b As shown, offset devices 10b and 10c located in the upper right and lower left of the 2x2 grid can be manipulated to offset the frame 1 and thus the image sensor 400 upward (or downward).

[0037] The image sensor 400 can therefore be deflected in all directions via an electrostatic comb actuator with fixed comb electrodes.

[0038] like Figure 3c As shown, by the combined operation of all the offset devices 10a to 10d, a counterclockwise (or clockwise) offset can be generated, thereby causing the image sensor 400 to rotate.

[0039] In general, by using multiple offset devices 10a to 10d, arbitrary displacement or rotation of the image sensor 400 within a predetermined limit is possible.

[0040] Figure 4 A schematic top view of the offset device of the micromechanical holding device 20 is shown, which is used in an image sensor device or in a micromechanical holding device. Here, in contrast to Figure 2 Compared to the micromechanical holding device 10 shown, the arrangement is symmetrical, that is, there are first and second carriers 2a and 2b on both sides of the electrode device, which are coupled to the frame 1 by corresponding push rods 4a and 4b and connected to anchor points 5a and 5b by corresponding rocker arm springs 3c to 3f.

[0041] Figure 5a -d shows a schematic top view of the offset device 30 to 60 of the micromechanical holding device.

[0042] exist Figure 5a In this configuration, a spring 4c is provided as a coupling device between the carrier 2 and the outer frame 1. The spring is connected to the carrier 2 in the outer region of the carrier 2 and extends toward the opposite outer region of the carrier 2.

[0043] exist Figure 5b In the design, two springs 4d are provided as coupling devices between the carrier 2 and the outer frame 1, thus resulting in a symmetrical structure.

[0044] exist Figure 5c In this design, a separate spring 4e serves as a coupling device between the carrier 2 and the outer frame 1, but this coupling device is connected to the carrier 2 in the central region of the carrier 2. This also allows for a symmetrical structure.

[0045] exist Figure 5d In the middle, a spring 4f is provided as a coupling device between the carrier 2 and the outer frame 1, and... Figure 5a Compared to the coupling device 4c shown, the spring has a sharper orientation.

[0046] Figure 6 A schematic top view of yet another image sensor device 101 is shown. (Compared to...) Figure 1 Unlike the image sensor device 100 shown, the micromechanical holding device 201 here includes only two holding devices 80a and 80b. These holding devices 80a and 80b each consist of two interconnected components, which respectively correspond to… Figure 1One of the holding devices 10a of the image sensor device 100 shown is rotated 90 degrees relative to each other. According to another embodiment, the two holding devices 80a and 80b may also each have a one-piece frame.

[0047] Individual holding devices 80a and 80b can cause the carrier 2 to move both along the first direction y and the second direction x.

[0048] Figure 7 A flowchart is shown for a method of manufacturing a micro-mechanical holding device for an image sensor 400, and in particular a method of one of the aforementioned microelectromechanical holding devices 200 and 201.

[0049] A substrate is provided in the first step S1.

[0050] In the second step S2, at least two offset devices 10 to 80 are arranged on the substrate. Each offset device 10 to 80 has a frame 1 for connection to the image sensor 400 and at least one electrode assembly. The electrode assembly has at least one electrode pair 6, 7a, 7b. For each electrode pair 6, 7a, 7b, the first electrode 7a, 7b is fixedly connected to the substrate and the second electrode 6 is coupled to the frame 1. The electrode pairs 6, 7a, 7b are configured to be operable such that the frame 1 can be offset in a predetermined first direction y, which depends on the electrode pairs 6, 7a, 7b.

[0051] Here, the second electrode 6 of the electrode pair 6, 7a, 7b can be arranged on the carrier 2, which is coupled to the substrate, such that the carrier 2 can be offset in a predetermined first direction y of the electrode pair 6, 7a, 7b and substantially fixed in a second direction x orthogonal to the predetermined first direction y of the electrode pair 6, 7a, 7b.

[0052] The carrier 2 can be connected to the outer frame 1 via coupling devices 4, 4a-4f, so that the outer frame 1 can be offset relative to the carrier 2 along the second direction x.

[0053] The coupling devices 4, 4a-4f can be configured such that the outer frame 1 is fixed relative to the carrier 2 along a first direction y. The coupling devices 4, 4a-4f can be push rods or spring elements.

[0054] The coupling devices 4a and 4b may have a first coupling element 4a and a second coupling element 4b, which are connected to the carrier 2 on opposite sides.

[0055] The first electrodes 7a and 7b and the second electrode 6 can be interdigitated electrodes.

Claims

1. A microelectromechanical holding device (200; 201) for an image sensor (400), comprising: Substrate; and At least two offset devices (10-80) arranged on the substrate, wherein, Each offset device (10-80) has a frame (1) for connection with the image sensor (400) and at least one electrode assembly, wherein the electrode assembly has at least one electrode pair (7a, 7b), wherein for each electrode pair (6, 7a, 7b), a first electrode (7a, 7b) is fixedly connected to the substrate, and a second electrode (6) is coupled to the frame (1), wherein the electrode pair (6, 7a, 7b) can be manipulated such that the frame (1) is offset in a predetermined first direction (y), the predetermined first direction depending on the electrode pair (6, 7a, 7b).

2. The microelectromechanical holding device (200; 201) according to claim 1, wherein, The predetermined first direction (y) of the electrode pair (6, 7a, 7b) of the electrode device of the first offset device (10-80) is orthogonal to the predetermined first direction (y) of the electrode pair (6, 7a, 7b) of the electrode device of the second offset device (10-80).

3. The microelectromechanical holding device (200; 201) according to claim 1 or 2, wherein, The second electrode (6) of the electrode pair (6, 7a, 7b) is arranged on a carrier (2) coupled to the substrate such that the carrier (2) can be offset in the predetermined first direction (y) of the electrode pair (6, 7a, 7b) and substantially fixed in a second direction (x) orthogonal to the predetermined first direction (y) of the electrode pair (6, 7a, 7b).

4. The microelectromechanical holding device (200; 201) according to claim 3, wherein, The carrier (2) is connected to the outer frame (1) via coupling devices (4, 4a-4f) so that the outer frame (1) can be offset relative to the carrier (2) along the second direction (x).

5. The microelectromechanical holding device (200; 201) according to claim 4, wherein, The coupling devices (4, 4a-4f) are configured such that the outer frame (1) is fixed relative to the carrier (2) along the first direction (y).

6. The microelectromechanical holding device (200; 201) according to any one of the preceding claims, wherein, The coupling device (4, 4a-4f) is a push rod or spring element.

7. The microelectromechanical holding device (200; 201) according to any one of the preceding claims, wherein, The coupling device (4a, 4b) has a first coupling element (4a) and a second coupling element (4b), which are connected to the carrier (2) on opposite sides of the electrode device.

8. The microelectromechanical holding device (200; 201) according to any one of the preceding claims, wherein, The first electrode (7a, 7b) and the second electrode (6) are interdigitated electrodes.

9. An image sensor device (100; 101) comprising: Image sensor (400); and The microelectromechanical holding device (200; 201) according to any one of the preceding claims, wherein, The image sensor (400) is arranged on the holding device (200; 201).

10. A method for manufacturing a microelectromechanical holding device (200; 201) for an image sensor (400), comprising the following steps: Provide (S1) substrate; and At least two offset devices (10-80) are arranged (S2) on the substrate, wherein, Each offset device (10-80) has a frame (1) for connection with the image sensor (400) and at least one electrode assembly, wherein the electrode assembly has at least one electrode pair (6, 7a, 7b), wherein for each electrode pair (6, 7a, 7b), a first electrode (7a, 7b) is fixedly connected to the substrate, and a second electrode (6) is coupled to the frame (1), wherein the electrode pair (6, 7a, 7b) can be manipulated such that the frame (1) is offset in a predetermined first direction (y), the predetermined first direction depending on the electrode pair (6, 7a, 7b).

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