Device front end module comprising a transfer device

Abstract

This invention proposes a transfer device and a front-end module including the same. The transfer device is used to transport a wafer and includes a body and a pickup component. The pickup component is movably connected to the body and can switch between a first detection state and a second detection state. The pickup component includes a first toothed element and a second toothed element. When the pickup component is in the first detection state, the first toothed element supports the wafer and the second toothed element is not in contact with the wafer. When the pickup component is in the second detection state, the second toothed element supports the wafer and the first toothed element is not in contact with the wafer.

Description

Technical Field

[0001] This invention relates to a transfer device. More specifically, this invention relates to a transfer device disposed within a front-end module of a device. Background Technology

[0002] Equipment front-end modules (EFEMs) are primarily used for handling and storing wafers in semiconductor processes, thereby improving the capacity and efficiency of semiconductor products.

[0003] In addition to using a wafer handling robot to move and store wafers, the front-end module of a typical equipment can also utilize a camera device inside the module to perform double-sided appearance inspection of the wafers placed on the robot. However, when performing double-sided appearance inspection of wafers using the aforementioned camera device, local areas on the lower surface of the wafer are often obscured by the forks of the robot, severely affecting the image inspection results.

[0004] In view of this, how to provide a front-end module for equipment that can directly perform complete double-sided appearance inspection on wafers placed on wafer handling robotic arms has become an important challenge for researchers in this field. Summary of the Invention

[0005] The purpose of this invention is to provide a transfer device and a front-end module of the device comprising the same, in order to solve at least one of the above-mentioned problems.

[0006] In view of the aforementioned known problems, one embodiment of the present invention provides a transfer device for transporting a wafer, including a body and a pickup assembly. The pickup assembly is movably connected to the body and can switch between a first detection state and a second detection state. The pickup assembly includes a first toothed element and a second toothed element. When the pickup assembly is in the first detection state, the first toothed element supports the wafer, and the second toothed element is not in contact with the wafer. When the pickup assembly is in the second detection state, the second toothed element supports the wafer, and the first toothed element is not in contact with the wafer.

[0007] An embodiment of the present invention also provides a device front-end module, including a transfer unit and an alignment unit. The transfer unit includes a transfer device and an appearance inspection device. The transfer device moves a wafer to a detection area of ​​the appearance inspection device, thereby performing macroscopic appearance inspection on the wafer by the appearance inspection device. The alignment unit includes an image alignment device, and the transfer device moves the wafer to the image alignment device to obtain position information of the wafer relative to the transfer device. The transfer device includes a body and a pickup component. The pickup component is movably connected to the body and can switch between a first detection state and a second detection state. The pickup component includes a first toothed element and a second toothed element. When the pickup component is in the first detection state, the first toothed element supports the wafer and the second toothed element does not contact the wafer. When the pickup component is in the second detection state, the second toothed element supports the wafer and the first toothed element does not contact the wafer.

[0008] Therefore, the beneficial effects of the present invention are that the equipment front-end module provided in one embodiment of the present invention can not only be used to transport wafers, but also to perform appearance inspections on wafers at different resolutions. After the aforementioned inspections, the wafers are removed from the equipment front-end module and transported to the back-end manufacturing equipment. In addition, when the equipment front-end module performs double-sided appearance inspection on the wafers, the alternating pick-up components set by the transfer device prevent local areas of the wafer from being obscured, thus avoiding affecting the inspection quality. This can significantly improve the inspection efficiency of the wafers and the yield of semiconductor products. At the same time, the equipment front-end module does not need to be equipped with an additional flipping mechanism, thereby effectively saving space and cost, and significantly shortening the inspection process. Attached Figure Description

[0009] Figure 1 A block diagram illustrating a device front-end module according to an embodiment of the present invention.

[0010] Figure 2 express Figure 1 A schematic diagram of the transfer device and the appearance inspection device.

[0011] Figure 3 This is a perspective view showing the pickup component of a transfer device according to an embodiment of the present invention in a preset position relative to an appearance inspection device.

[0012] Figure 4 This is a schematic diagram showing the pickup component of a transfer device according to an embodiment of the present invention in a first detection state relative to an appearance inspection device.

[0013] Figure 5 This is a schematic diagram showing the pickup component of a transfer device according to an embodiment of the present invention in a second detection state relative to an appearance inspection device.

[0014] The attached figures are labeled as follows: 100: Equipment front-end module 10: Transfer Unit 11: Transfer device 111:Ontology 12: Appearance inspection device 121: First Camera 122: Second camera 20: Alignment Unit 21: Image alignment device 22: Calibration Stage 23: Image extraction device A: Detection area BP: Back-end manufacturing equipment C: Storage device D1: First Direction D2: Second Direction F: Pick up component F1: First toothed fork element F2: Second toothed fork element V: Image Capture Area W: Wafer Detailed Implementation

[0015] The following describes a transfer device and a front-end module comprising the present invention according to embodiments of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the invention in particular methods and are not intended to limit the scope of the invention.

[0016] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0017] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used in the embodiments are for illustrative purposes and not for limiting the present invention.

[0018] Please refer to the following first. Figure 1 ,in Figure 1 A block diagram illustrating a device front-end module according to an embodiment of the present invention.

[0019] like Figure 1 As shown, the device front-end module 100 of an embodiment of the present invention is mainly used for handling and storing wafers in semiconductor processes. It includes a transfer unit 10 and a alignment unit 20. The aforementioned transfer unit 10 includes a transfer device 11 and an appearance inspection device 12. The aforementioned alignment unit 20 includes an image alignment device 21, a calibration stage 22 and an image extraction device 23.

[0020] Specifically, the transfer device 11 of the aforementioned transfer unit 10 may include, for example, a transfer robot, which can be used to remove a wafer W stored inside a storage device C and transport it to the front-end module 100 of the device. For example, the aforementioned storage device C may be a wafer cassette or other container used to hold the wafer W.

[0021] After the transfer device 11 moves the wafer W into the front-end module 100 of the equipment, the transfer device 11 can then move the wafer W to the image alignment device 21 and take a picture of the wafer W on the transfer device 11 through the camera of the image alignment device 21 to obtain the position information of the wafer W relative to the transfer device 11.

[0022] Next, the image alignment device 21 can transmit the aforementioned position information and other related parameters to the calibration stage 22 and / or the transfer device 11, so that the transfer device 11 can subsequently place the wafer W accurately at a correct position on the calibration stage 22.

[0023] As mentioned above, the transfer device 11 can move the wafer W and place it on the calibration stage 22 according to the aforementioned position information. Then, the calibration stage 22 can move the wafer W to an image acquisition area V via a linear track, so that the image extraction device 23 can capture and acquire image information of the wafer W, thereby enabling high-resolution appearance inspection of the wafer W in the image acquisition area V.

[0024] After completing the aforementioned high-resolution appearance inspection, the transfer device 11 can transport the wafer W on the calibration stage 22 back to the transfer unit 10. Then, the appearance inspection device 12 can perform macroscopic image inspection on the wafer W, after which the wafer W is removed from the front-end module 100 and transported to a back-end manufacturing device BP (such as...). Figure 1 (As indicated by the middle arrow).

[0025] Please refer to the following as well. Figure 1 and Figure 2 ,in Figure 2 express Figure 1 A schematic diagram of the transfer device and the appearance inspection device.

[0026] like Figure 2As shown, the transfer device 11 in this embodiment mainly includes a body 111 and a pickup component F connected to each other. The body 111 is, for example, a transfer robot capable of moving in three-dimensional space, and the pickup component F can be used to carry the wafer W. On the other hand, the appearance inspection device 12 includes a first camera 121 and a second camera 122, which can be used to perform macroscopic appearance inspection on the upper and lower surfaces of the wafer W, respectively. In one embodiment, the image extraction device 23, the first camera 121, and the second camera 122 are either one-line scanning cameras or one-line scanning cameras, and the present invention is not limited thereto.

[0027] Specifically, the aforementioned transfer device 11 can move the wafer W through the detection area between the first camera 121 and the second camera 122, thereby performing image scanning and macroscopic appearance inspection on the upper and lower surfaces of the wafer W.

[0028] Please see again Figure 3 ,in Figure 3 This is a perspective view showing a transfer device according to an embodiment of the present invention in a preset position relative to an appearance inspection device.

[0029] like Figure 3 As shown, the pickup component F of the transfer device 11 in this embodiment includes two first toothed fork elements F1 and one second toothed fork element F2. The aforementioned first toothed fork elements F1 and second toothed fork elements F2 are used to carry the wafer W and can be extended relative to the body 111 along a first direction D1 or retracted along a second direction D2.

[0030] In this embodiment, the aforementioned elongated first and second toothed fork elements F1 and F2 are arranged side by side, and the aforementioned second toothed fork element F2 is located between the two first toothed fork elements F1. For example, suction cups for adsorbing the wafer W can be provided on the surfaces of the aforementioned first and second toothed fork elements F1 and F2, but this is not limited to the embodiments disclosed in this invention. In other embodiments, the morphology of the first toothed fork element F1 and the second toothed fork element F2 can be changed according to actual design requirements, and is not limited to this invention.

[0031] Please refer to the following: Figure 4 ,in Figure 4 This is a schematic diagram showing the pickup component of a transfer device according to an embodiment of the present invention in a first detection state relative to an appearance inspection device.

[0032] like Figure 4As shown, when the first camera 121 and the second camera 122 are used to perform macroscopic appearance inspection on the wafer W, the transfer device 11 can be used to move the wafer W along the first direction D1 and through a detection area A between the first camera 121 and the second camera 122, so as to perform image scanning on the upper and lower surfaces of the wafer W.

[0033] During the first macroscopic appearance inspection of wafer W by the appearance inspection device 12, to prevent the second toothed fork element F2 of the pickup component F from obscuring a local area on the lower surface of wafer W and affecting the image captured by the second camera 122, Figure 4 In this process, only the first toothed fork element F1 in the pickup component F supports the wafer W, while the second toothed fork element F2 does not contact the wafer W; that is, the second toothed fork element F2 does not cover the lower surface of the wafer W (for example, only the first toothed fork element F1 can extend out of the body 111 along the first direction D1). Thus, the appearance inspection device 12 can obtain an image of the upper surface and a first lower surface of the wafer W after the first macroscopic appearance inspection procedure.

[0034] from Figure 4 As can be seen, when the wafer W is supported only by the first toothed fork element F1 in the pickup assembly F, the pickup assembly F is in a first detection state. At this time, the second toothed fork element F2 does not overlap with the wafer W in the direction perpendicular to the surface of the wafer W, and at this time, the first toothed fork element F1 protrudes more from the body 111 than the second toothed fork element F2 in the first direction D1.

[0035] After the wafer W passes through the detection area A between the first camera 121 and the second camera 122 along the first direction D1 and completes the first macroscopic appearance inspection procedure, the transfer device 11 can move the wafer W along a second direction D2 and exit the aforementioned detection area A to reach the aforementioned preset position. Then, the second toothed fork element F2 in the pickup component F can be switched and used to support the wafer, wherein the aforementioned second direction D2 is opposite to the aforementioned first direction D1.

[0036] Please see Figure 5 ,in Figure 5 This is a schematic diagram showing the pickup component of a transfer device according to an embodiment of the present invention in a second detection state relative to an appearance inspection device.

[0037] like Figure 5 As shown, when the wafer W is subjected to a second macroscopic appearance inspection procedure by the appearance inspection device 12, the wafer W is supported by the second toothed fork element F2 in the pickup component F, and the wafer W is moved again along the first direction D1 by the transfer device 11 and passes through the detection area A between the first camera 121 and the second camera 122, so as to scan the lower surface of the wafer W and obtain a second lower surface image of the wafer W.

[0038] In order to prevent the first toothed fork element F1 of the pickup component F from obscuring a local area on the lower surface of the wafer W and affecting the image captured by the second camera 122, therefore... Figure 5 In this process, only the second toothed fork element F2 in the pickup component F supports the wafer W, while the aforementioned first toothed fork element F1 does not contact the wafer W; that is, the first toothed fork element F1 does not cover the lower surface of the wafer W (for example, only the second toothed fork element F2 can extend out of the body 111 along the first direction D1). Thus, the appearance inspection device 12 can obtain a second lower surface image of the wafer W after the second macroscopic appearance inspection procedure.

[0039] from Figure 5 As can be seen, when the wafer W is supported only by the second toothed fork element F2 in the pickup assembly F, the pickup assembly F is in a second detection state. At this time, the first toothed fork element F1 and the wafer W do not overlap in the direction perpendicular to the surface of the wafer W, and at this time, the second toothed fork element F2 protrudes more from the body 111 than the first toothed fork element F1 in the first direction D1.

[0040] After wafer W passes through the aforementioned detection area A along the first direction D1 and completes the second macroscopic appearance inspection procedure, the transfer device 11 can move wafer W again along the second direction D2 and exit the aforementioned detection area A. Then, wafer W can be removed from the front-end module 100 of the equipment and transported to the back-end manufacturing equipment BP (such as...). Figure 1 (As indicated by the middle arrow).

[0041] After the appearance inspection device 12 acquires the upper surface image, the first lower surface image, and the second lower surface image of the wafer W, the image processing unit (not shown) combines the first lower surface image and the second lower surface image to obtain a complete lower surface image of the wafer W, thereby completing the double-sided macroscopic appearance inspection of the wafer W.

[0042] In this embodiment, the resolution of the aforementioned appearance inspection device 12 is lower than the image resolution of the aforementioned image extraction device 23. Furthermore, the number of the aforementioned first toothed fork element F1 and second toothed fork element F2 can be one or more, and is not limited to those disclosed in this embodiment. In other embodiments, the transfer device 11 includes multiple first toothed fork elements F1 and multiple second toothed fork elements F2, which are alternately arranged; this is not a limitation of the present invention.

[0043] In summary, the front-end module provided in one embodiment of the present invention can not only be used to transport wafers, but also to perform appearance inspections on wafers at different resolutions. After the aforementioned inspections, the wafers are removed from the front-end module and transported to the back-end manufacturing equipment. Furthermore, when the front-end module performs double-sided macroscopic appearance inspections on the wafers, the alternating pick-up components in the transfer device prevent local areas of the wafer from being obscured, thus avoiding impact on inspection quality. This significantly improves wafer inspection efficiency and semiconductor product yield. Simultaneously, the front-end module does not require an additional flipping mechanism, thereby effectively saving space and cost, and significantly shortening the inspection process.

[0044] While the embodiments and advantages of the present invention have been disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Any processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps currently or in the future that can be developed from the disclosure of this invention can be used according to the present invention, as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of the various claims and embodiments.

[0045] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A transfer device for transporting a wafer, comprising: One entity; and A pickup component is movably connected to the body and can switch between a first detection state and a second detection state; in, The pickup component includes a first toothed fork element and a second toothed fork element. When the pickup component is in the first detection state, the first toothed fork element supports the wafer and the second toothed fork element does not contact the wafer. When the pickup component is in the second detection state, the second toothed fork element supports the wafer and the first toothed fork element does not contact the wafer.

2. The transfer device of claim 1, wherein when the pickup component is in the first detection state, the first toothed fork element protrudes further from the body than the second toothed fork element, and the second toothed fork element does not overlap with the wafer in a direction perpendicular to the wafer surface; and when the pickup component is in the second detection state, the second toothed fork element protrudes further from the body than the first toothed fork element, and the first toothed fork element does not overlap with the wafer in a direction perpendicular to the wafer surface.

3. The transfer device as claimed in claim 1, wherein the body comprises a transport robot.

4. The transfer device of claim 1, wherein the pickup component includes two first toothed fork elements, and the second toothed fork element is located between the two first toothed fork elements.

5. The transfer device of claim 1, wherein the pickup assembly includes a plurality of first toothed fork elements and a plurality of second toothed fork elements, the plurality of first toothed fork elements and the plurality of second toothed fork elements being alternately arranged.

6. A device front-end module, comprising: A transfer unit includes a transfer device and an appearance inspection device, wherein the transfer device moves a wafer to an inspection area of ​​the appearance inspection device, thereby performing macroscopic appearance inspection on the wafer by the appearance inspection device; and A pair of alignment units includes an image alignment device, wherein the transfer device moves the wafer to the image alignment device to obtain position information of the wafer relative to the transfer device; in, The transfer device includes a body and a pickup component, the pickup component being movably connected to the body and switchable between a first detection state and a second detection state. The pickup component includes a first toothed fork element and a second toothed fork element. When the pickup component is in the first detection state, the first toothed fork element supports the wafer and the second toothed fork element does not contact the wafer. When the pickup component is in the second detection state, the second toothed fork element supports the wafer and the first toothed fork element does not contact the wafer.

7. The device front-end module as described in claim 6, wherein the alignment unit further includes a calibration stage and an image extraction device, the transfer device moves the wafer to the calibration stage according to the position information, and the calibration stage moves the wafer to an image acquisition area, and the image extraction device captures an image of the wafer in the image acquisition area.

8. The device front-end module as described in claim 6, wherein the appearance inspection device includes a first camera and a second camera, and the inspection area is located between the first and second cameras.

9. The device front-end module as claimed in claim 8, wherein when the pickup component is in the first detection state, the transfer device moves the wafer to the detection area and extracts an upper surface image and a first lower surface image of the wafer through the appearance detection device, and when the pickup component is in the second detection state, the transfer device moves the wafer to the detection area and extracts a second lower surface image of the wafer through the appearance detection device.

10. The device front-end module as described in claim 6, wherein the appearance inspection device merges the first lower surface image and the second lower surface image to obtain a complete lower surface image of the wafer.

11. The device front-end module of claim 6, wherein the pickup component includes a plurality of first toothed fork elements and a plurality of second toothed fork elements, the plurality of first toothed fork elements and the plurality of second toothed fork elements being alternately arranged.

12. The device front-end module of claim 6, wherein when the pickup component is in the first detection state, the first toothed fork element protrudes further from the body than the second toothed fork element, the second toothed fork element does not overlap with the wafer in a direction perpendicular to the wafer surface, and when the pickup component is in the second detection state, the second toothed fork element protrudes further from the body than the first toothed fork element, the first toothed fork element does not overlap with the wafer in a direction perpendicular to the wafer surface.

Images