Method for manufacturing epitaxial wafer, epitaxial wafer, and epitaxial growth apparatus
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2026-03-26
- Publication Date
- 2026-06-30
AI Technical Summary
After hardware replacement or maintenance, existing epitaxial growth equipment may have discrepancies between the temperature detection module and the actual temperature inside the reaction chamber, resulting in unreliable epitaxial wafer quality.
The temperature of the epitaxial growth equipment is detected by a temperature detection module to obtain the morphological characteristics of the epitaxial wafer. Linear fitting is performed, and the temperature detection module is calibrated based on the fitted curve to ensure the accuracy of temperature detection.
It improved the product yield of epitaxial wafers, ensured the quality of epitaxial wafers produced by epitaxial growth equipment, and significantly improved the accuracy and uniformity of temperature detection.
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Figure CN122304021A_ABST