Method for manufacturing epitaxial wafer, epitaxial wafer, and epitaxial growth apparatus

CN122304021APending Publication Date: 2026-06-30XIAN ESWIN MATERIAL TECHNOLOGY CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
Filing Date
2026-03-26
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

After hardware replacement or maintenance, existing epitaxial growth equipment may have discrepancies between the temperature detection module and the actual temperature inside the reaction chamber, resulting in unreliable epitaxial wafer quality.

Method used

The temperature of the epitaxial growth equipment is detected by a temperature detection module to obtain the morphological characteristics of the epitaxial wafer. Linear fitting is performed, and the temperature detection module is calibrated based on the fitted curve to ensure the accuracy of temperature detection.

Benefits of technology

It improved the product yield of epitaxial wafers, ensured the quality of epitaxial wafers produced by epitaxial growth equipment, and significantly improved the accuracy and uniformity of temperature detection.

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Abstract

This invention provides a method for preparing an epitaxial wafer. The method includes: detecting the temperature of a reaction chamber using a temperature detection module; when the temperature detected by the temperature detection module reaches a target temperature, controlling an epitaxial growth device to perform epitaxial growth on a loaded polished wafer to obtain an epitaxial wafer; there are multiple target temperatures, each corresponding to one epitaxial wafer; acquiring the morphological characteristics of each epitaxial wafer, including edge curvature and / or surface haze; performing linear fitting based on the target temperature and morphological characteristics corresponding to each epitaxial wafer to obtain a fitting curve; calibrating the temperature detection module based on the fitting curve; detecting the temperature of the reaction chamber using the calibrated temperature detection module; when the temperature detected by the calibrated temperature detection module meets preset epitaxial growth conditions, performing epitaxial growth on a newly loaded polished wafer using an epitaxial growth device to obtain a target epitaxial wafer, thereby improving the product quality of the epitaxial wafer.
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