Multifunctional ceramic package substrate and method of manufacturing the same

CN122373834APending Publication Date: 2026-07-10SUZHOU RIGGER MICRO TECH GRP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUZHOU RIGGER MICRO TECH GRP CO LTD
Filing Date
2026-03-20
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

The existing ceramic core board wiring layer and electronic component separation structure leads to easy cracking of solder joints, increased contact resistance, increased equipment thickness, and extended signal transmission path, making it difficult to meet the requirements of high-frequency and high-speed circuits.

Method used

The system employs a multifunctional ceramic packaging substrate structure, embedding electronic components within the ABF composite layer. The conductive dielectric layer is combined with the ceramic core board to achieve integration of the device and wiring layer. Electroplated copper film layer, copper clad laminate layer, and solder mask layer are used for electrical connection and protection.

Benefits of technology

It improves the reliability and space utilization of devices and wiring layers, reduces equipment thickness and signal transmission delay, adapts to the requirements of thinner and lighter and high-frequency and high-speed circuits, and has process compatibility and maintainability.

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  • Figure CN122373834A_ABST
    Figure CN122373834A_ABST
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Abstract

The application belongs to the technical field of electronic component substrates, and discloses a multifunctional ceramic packaging substrate and a preparation method thereof. The multifunctional ceramic packaging substrate comprises a ceramic core plate and an ABF composite layer, and the upper and lower sides of the ceramic core plate are provided with the ABF composite layer, and the ABF composite layer is embedded with electronic components. The preparation method comprises the following steps: S10, providing a ceramic substrate; S20, providing an electroplated copper film layer on the surface of the ceramic substrate; S30, providing an ABF composite layer on the upper and lower sides of the ceramic substrate; S40, embedding electronic components in the ABF composite layer; S50, providing a solder resist layer on the surface of the outermost ABF layer; and S60, providing a surface treatment layer on the outer side of the solder resist layer. The reliability of the application is significantly improved, the space utilization rate and the advantages of lightness and thinness are prominent, the high-frequency and high-speed performance is optimized, and the process compatibility is strong.
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