Wafer alignment device and wafer alignment system

Abstract

The application relates to the technical field of semiconductor manufacturing equipment, and discloses a wafer alignment device and a wafer alignment system. The wafer alignment device comprises a base, an upper wafer module and a lower wafer module which are installed on a first surface of the base. The upper wafer module comprises an upper wafer carrier disc for carrying an upper wafer. The lower wafer module comprises a fixed seat installed on the base, a movable seat installed on the fixed seat and a lower wafer carrier disc installed on the movable seat, and the lower wafer carrier disc is used for carrying a lower wafer. A pulling device is arranged between the movable seat and the fixed seat, so that the movable seat can slide along a first direction between a first position and a second position relative to the fixed seat, and the first direction is parallel to the first surface. In the first position, the orthographic projection of the lower wafer carrier disc along a second direction is located in the first surface, and the second direction is perpendicular to the first surface. In the second position, the orthographic projection of the lower wafer carrier disc along the second direction at least partially exceeds the first surface. The wafer alignment device can realize intensive layout and is convenient to maintain.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, and more particularly to a wafer alignment device and a wafer alignment system. Background Technology

[0002] In the semiconductor device manufacturing process, wafer bonding is a key step in packaging technology, and wafer alignment equipment is the core equipment for ensuring bonding accuracy, improving device performance and yield. Precise wafer alignment can effectively reduce alignment errors after bonding, thereby improving the quality and consistency of the final product.

[0003] However, current wafer alignment devices suffer from complex and bulky structures, and are difficult to maintain. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides a wafer alignment apparatus and a wafer alignment system, which are described below.

[0005] In a first aspect, embodiments of this application provide a wafer alignment apparatus, which includes a base and an upper wafer module and a lower wafer module mounted on a first surface of the base. The upper wafer module includes an upper wafer carrier for carrying an upper wafer. The lower wafer module includes a fixed base, a movable base, and a lower wafer carrier. The fixed base is mounted on the base, the movable base is mounted on the fixed base, and the lower wafer carrier is mounted on the movable base and carries a lower wafer. A pull-out device is provided between the movable base and the fixed base to allow the movable base to slide relative to the fixed base between a first position and a second position along a first direction parallel to the first surface. In the first position, the orthographic projection of the lower wafer carrier along a second direction lies within the first surface, and the second direction is perpendicular to the first surface. In the second position, the orthographic projection of the lower wafer carrier along the second direction at least partially extends beyond the first surface.

[0006] The aforementioned wafer alignment device is easy to maintain and has a simple structure, enabling compact layout.

[0007] For example, when maintenance is required, the movable seat can be pulled out to the second position using the pull-out device. When handover and alignment are required, the movable seat can be returned to the first position using the pull-out device.

[0008] When the movable stand is in the second position, it is fully exposed to the outside environment, effectively increasing its maintenance space and facilitating the installation and maintenance of the lower wafer module. Furthermore, the space between the base and the upper wafer module is freed up, effectively increasing the maintenance space for other components (e.g., the base and the upper wafer module), thus enabling easier installation and maintenance of these components. After maintenance, the movable stand can be quickly reset to the first position using a pull-out mechanism. Therefore, the wafer alignment device is easy to maintain, reducing downtime and increasing production capacity.

[0009] It is understood that the above-mentioned pull-out device is only used to realize the pull-out operation during maintenance, and does not need to achieve high-precision movement. Therefore, the pull-out device can have a simpler and more compact structure and lower cost.

[0010] Furthermore, since there's no need to switch between handover and alignment stations by pulling down the wafer module, there's no need for an additional complex, high-precision pulling device. This further simplifies the overall structure, making it more compact. Additionally, the base's dimensions in the first direction can be smaller, effectively saving layout space in that direction, resulting in high space utilization and a compact structure. Simultaneously, it effectively saves station switching time, improving efficiency and enabling rapid alignment with excellent precision.

[0011] In one possible implementation of the first aspect described above, the lower wafer module further includes a quick-change assembly, which includes a first connector and a second connector. The first connector is disposed on a fixed base, and the second connector is disposed on a movable base. The first connector and the second connector cooperate to enable the quick-change assembly to be in a locked or unlocked state.

[0012] By setting up quick-change components, the reset accuracy and locking effectiveness before and after maintenance can be ensured, avoiding the problem of needing a lot of time to recalibrate and reset, thereby effectively improving work efficiency.

[0013] In one possible implementation of the first aspect described above, the lower wafer module further includes a first engaging portion and a second engaging portion, the first engaging portion being disposed on a fixed base and the second engaging portion being disposed on a movable base, the first engaging portion and the second engaging portion engaging with each other along a second direction.

[0014] By setting up a first locking part and a second locking part, the fixed seat and the movable seat can be quickly positioned, so as to ensure that the movable seat can be reset more accurately and quickly, thereby effectively improving maintenance efficiency.

[0015] In one possible implementation of the first aspect described above, the lower wafer module further includes a lifting assembly, the fixed end of which is connected to a fixed base, the driving end of which is connected to a movable base, and the lifting direction of the lifting assembly is parallel to the second direction.

[0016] By setting up a lifting component, clearance space can be provided for the first and second engaging parts during the maintenance process of pulling out the movable seat, so as to avoid interference between the first and second engaging parts.

[0017] In one possible implementation of the first aspect described above, the pull-out device includes a lifting bracket, a slide rail and a slider disposed on the lifting bracket, the slider being fixedly connected to a movable seat and slidingly engaged with the slide rail in a first direction. The drive end of the lifting assembly abuts against the lifting bracket in a second direction, so that the drive end of the lifting assembly is connected to the movable seat.

[0018] In this way, when the drive end of the ejector assembly drives the lifting bracket to move up and down relative to the fixed seat in the second direction, the slide rail and slider on the lifting bracket can also move up and down relative to the fixed seat in the second direction, so that the movable seat fixedly connected to the slider can also move up and down relative to the fixed seat in the second direction. Furthermore, this does not affect the normal pulling of the pull-out device, thus ensuring that the movable seat can slide normally relative to the fixed seat in the first direction.

[0019] In one possible implementation of the first aspect described above, the fixed base has a first through hole extending in a second direction, and the lifting assembly includes a cylinder mechanism and an elastic connector. The upper end of the cylinder mechanism is the driving end of the lifting assembly, passes through the first through hole, and is connected to the lifting bracket. The elastic connector is located on the side of the lifting bracket facing the cylinder mechanism, and includes a fixed plate and a spring plate mounted on the fixed plate. The fixed plate is fixedly connected to the lifting bracket, and the upper end of the cylinder mechanism passes through the spring plate. The upper end of the cylinder mechanism includes a first stop and a second stop connected to each other, and the first stop and the second stop clamp the spring plate along the second direction.

[0020] In this way, the reed can provide constraints to the cylinder mechanism in the plane containing the first direction and the third direction (i.e., the direction perpendicular to the first and second directions), ensuring that the lifting bracket will not slip unrestrained in this plane, thus improving lifting stability. Furthermore, the reed can undergo elastic deformation to allow angular displacement around the first direction and the third direction, achieving adaptive angular deviation. For example, when there are multiple lifting components, the lifting height of these components may have some error, causing angular deviation. By setting the reed, the angular deviation caused by the lifting height error between the lifting components can be adaptively absorbed, preventing the lifting bracket from jamming during lifting and ensuring smooth lifting operation.

[0021] In one possible implementation of the first aspect described above, the upper end of the cylinder mechanism includes a guide shaft and a first screw, the tail of which passes through a spring and is threadedly connected to the upper end of the guide shaft. The upper end of the guide shaft is a first stop, and the head of the first screw is a second stop, both abutting against the lifting bracket.

[0022] In one possible implementation of the first aspect described above, the lower wafer module further includes a first driving component and an air-bearing base. The lower wafer carrier is disposed on the top surface of the air-bearing base, and the bottom surface of the air-bearing base and the top surface of the movable base are air-bearingly connected. The first driving component drives the lower wafer carrier to translate or rotate along a plane parallel to the top surface of the movable base. The upper wafer module further includes a column extending along a second direction. The lower end of the column is fixedly connected to the base, the upper end of the column carries the upper wafer carrier, and the side of the column is air-bearingly connected to the side of the air-bearing base.

[0023] This allows for the calibration of errors in the external robotic arm's wafer mounting, helping to ensure the upper wafer on the lower wafer carrier is more accurately positioned in the preset location, thus enabling better alignment between the upper and lower wafers. Furthermore, by incorporating an air-bearing base, the movement of the lower wafer carrier can be further improved, reducing frictional resistance during movement and enhancing positioning accuracy. Simultaneously, reduced frictional resistance lowers the power requirements of the drive components, allowing for a smaller drive assembly and a more compact overall structure, facilitating a streamlined layout.

[0024] In one possible implementation of the first aspect described above, the lower wafer module further includes a clamping assembly that connects the air float and the movable seat, for clamping or releasing the air float and the movable seat to improve the stability of the air float.

[0025] In one possible implementation of the first aspect described above, the movable seat has a second through hole extending along a second direction, and the lower wafer module further includes a ejector pin assembly; the ejector pin assembly includes a first adapter plate, a second adapter plate, a second drive assembly, and a plurality of ejector pins extending along the second direction. Along the second direction, the lower wafer carrier and the second drive assembly are located on opposite sides of the second through hole, one end of the first adapter plate passes through the second through hole and is fixedly connected to the lower wafer carrier, the other end of the first adapter plate is fixedly connected to the fixed end of the second drive assembly, the drive end of the second drive assembly is connected to the second adapter plate, the lower end of the ejector pin is fixedly connected to the second adapter plate, and the upper end of the ejector pin is used to abut against the lower wafer.

[0026] By setting up a ejector pin assembly, the handover of the lower wafer can be achieved at the transfer station. Furthermore, by fixing the ejector pin assembly to the lower wafer carrier, the ejector pin assembly can move with the lower wafer carrier as it moves relative to the movable seat. This avoids interference between the ejector pin assembly and other components (such as drive components), eliminates complex motion attitude control and interlock control, and reduces the probability of frequent impact damage and system downtime for maintenance. Secondly, when the movable seat is removed for maintenance, the ejector pin assembly can also be removed, making maintenance of the ejector pin assembly more convenient, simpler, more efficient, and with a larger maintenance space.

[0027] In one possible implementation of the first aspect described above, the ejector pin includes an ejector pin body, a hollow bolt, a nut, and a marking element. The ejector pin body is inserted into the hollow bolt, the hollow bolt passes through the marking element and is threadedly connected to the nut, and the marking element passes through a second adapter plate and is fixedly connected to the second adapter plate. This allows for a modular design of the ejector pin, effectively improving the convenience of disassembly and maintenance.

[0028] In one possible implementation of the first aspect described above, the ejector pin further includes an adjusting member disposed between the ejector pin body and the hollow bolt, for adjusting the position of the ejector pin body in the second direction; and / or, the hollow bolt of one of the ejector pins is transitionally fitted with its corresponding marking member, while the hollow bolts of the remaining ejector pins are clearance-fitted with their corresponding marking members.

[0029] According to the embodiments of this application, by setting an adjustment member, the position of the ejector body in the second direction can be finely adjusted, thereby realizing the equal height adjustment control of multiple ejector pins.

[0030] By using the transition fit between the hollow bolt of one of the multiple ejector pins and its corresponding marker, and the clearance fit between the hollow bolts of the remaining ejector pins and their corresponding markers, this one ejector pin can be used as a reference ejector pin to adjust the radial position of the remaining ejector pins, thereby achieving alignment adjustment with the ejector pin holes of the lower wafer carrier.

[0031] In one possible implementation of the first aspect described above, at least one of the multiple ejector pins has a different appearance from the other pins. This enables a foolproof design, facilitating the differentiation of different ejector pins and effectively preventing reset errors during replacement and maintenance, thus helping to ensure consistency in maintenance interchangeability.

[0032] In one possible implementation of the first aspect described above, the mounting base has a third through hole extending along a second direction, the third through hole communicating with the second through hole along the second direction, and the first adapter plate and the second drive assembly passing through the third through hole. The solid portion of the mounting base used to form the third through hole includes a first portion and a second portion, the first portion and the second portion being detachably connected, and the first portion and the first adapter plate being disposed opposite each other along the first direction.

[0033] When maintenance is required, the first part can be removed. This prevents the fixed seat from obstructing the movement of the ejector pin assembly in the first direction during the maintenance process, allowing the ejector pin assembly to be pulled out for easy maintenance. After maintenance, the fixed seat and ejector pin assembly can be reset, and then the first part can be reinstalled onto the second part.

[0034] Secondly, embodiments of this application provide a wafer alignment system, which includes a plurality of wafer alignment devices as described in the first aspect and any possible implementation thereof. The plurality of wafer alignment devices includes a first wafer alignment device and a second wafer alignment device, which are arranged side-by-side along a third direction, the third direction being perpendicular to the first and second directions; and / or, the plurality of wafer alignment devices includes a third wafer alignment device and a fourth wafer alignment device, which are arranged side-by-side and spaced apart along the first direction.

[0035] Since the wafer alignment device provided in this application can achieve miniaturization and compact design, its overall size can be significantly reduced compared to wafer alignment devices in other solutions. Therefore, without changing the layout space, the wafer alignment system provided in this application embodiment can arrange more wafer alignment devices, resulting in a more compact layout and thus improving yield.

[0036] Furthermore, the wafer alignment device provided in this application is easy to operate and has low maintenance difficulty, which helps to reduce the overall downtime of the wafer alignment system and improve maintenance efficiency. Attached Figure Description

[0037] Figure 1A A schematic diagram of a wafer alignment device according to an embodiment of this application is shown.

[0038] Figure 1B A second schematic diagram of a wafer alignment device according to an embodiment of this application is shown.

[0039] Figure 2A A perspective view of the upper wafer module in an embodiment of this application is shown;

[0040] Figure 2BA side view of the upper wafer module in an embodiment of this application is shown;

[0041] Figure 3A A perspective view of the lower wafer module in an embodiment of this application is shown;

[0042] Figure 3B A side view of the lower wafer module in an embodiment of this application is shown;

[0043] Figure 3C according to Figure 3A and Figure 3B A schematic diagram of the structure of the fixing base in an embodiment of this application is shown;

[0044] Figure 3D according to Figure 3A and Figure 3B A schematic diagram of the structure of the movable seat in an embodiment of this application is shown;

[0045] Figure 4A This paper shows a schematic diagram of the structure of the quick-change component of the lower wafer module in an embodiment of this application;

[0046] Figure 4B This application illustrates the lower wafer module in an embodiment of the present application. Figure 4A A magnified view of a portion of region S1;

[0047] Figure 5A A schematic diagram of the lifting assembly of the lower wafer module in an embodiment of this application is shown;

[0048] Figure 5B This application illustrates the lower wafer module in an embodiment of the present application. Figure 5A A magnified view of a portion of region S2 in the middle;

[0049] Figure 6 A schematic diagram of the structure of the elastic connector in an embodiment of this application is shown;

[0050] Figure 7A This illustrates the working process of the lifting component in one embodiment of this application;

[0051] Figure 7B This illustrates the second working process of the lifting component in an embodiment of this application;

[0052] Figure 7C The third step in illustrating the operation of the lifting component in this embodiment is shown.

[0053] Figure 8A This illustrates the arrangement of the ejector pin assembly in the lower wafer module according to an embodiment of this application;

[0054] Figure 8B This application illustrates the lower wafer module in an embodiment of the present application. Figure 8A A sectional view obtained by cutting through section AA in the middle;

[0055] Figure 8C A perspective view of the ejector pin assembly in an embodiment of this application is shown;

[0056] Figure 9 according to Figures 8A to 8C A schematic diagram of the structure of three ejector pins in an embodiment of this application is shown;

[0057] Figure 10 according to Figures 8A to 8C This invention provides a schematic diagram of the structure of the markers corresponding to the three ejector pins in an embodiment of this application.

[0058] Figure 11A A schematic diagram of the third through hole on the fixed base in an embodiment of this application is shown from another perspective.

[0059] Figure 11B This shows a second schematic diagram of the structure of the third through hole on the fixed base in an embodiment of this application from another perspective;

[0060] Figure 12A An exemplary structure of a wafer alignment system according to an embodiment of this application is shown;

[0061] Figure 12B An exemplary structure two of the wafer alignment system in an embodiment of this application is shown.

[0062] Explanation of reference numerals in the attached figures:

[0063] 1-Wafer alignment system; 10-Wafer alignment device; 10a-First wafer alignment device; 10b-Second wafer alignment device; 10c-Third wafer alignment device; 10d-Fourth wafer alignment device; 100-Base; 110-First surface; 200-Upper wafer module; 210-Upper wafer carrier; 220-Y-axis drive assembly; 230-X-axis drive assembly; 240-Post; 300-Lower wafer module; 310-Fixing base 311-Base; 312-Guide seat; 313-First through hole; 314-Third through hole; 315-First part; 316-Second part; 320-Modible seat; 321-Second through hole; 330-Lower wafer carrier; 340-Pull-out device; 341-Slide rail; 342-Slider; 343-Lifting bracket; 3431-Second screw; 350-Quick-change assembly; 351-First connector; 352-Second connector; 361 - First engaging part; 362 - Second engaging part; 370 - Lifting assembly; 371 - Cylinder mechanism; 3711 - Guide shaft; 3712 - First screw; 3713 - Cylinder body; 3714 - Cylinder piston shaft; 3715 - Ball head screw; 3716 - Flat head screw; 3717 - Guide sleeve; 372 - Elastic connector; 3721 - Fixing plate; 3722 - Spring; 381 - Vertical drive assembly; 382 - First drive assembly; 3 83-Air float; 384-Clamping assembly; 390-Ejector pin assembly; 391-First adapter plate; 392-Second adapter plate; 393-Second drive assembly; 394-Ejector pin; 3941-Ejector pin body; 3942-Hollow bolt; 3943-Nut; 3944-Marker; 3945-Adjusting component; 400-Bottom frame; 500-Vibration damping module; 600-Vision inspection module; P1-First position; P2-Second position. Detailed Implementation

[0064] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0065] This application provides a wafer alignment apparatus and a wafer alignment system including the wafer alignment apparatus. The wafer alignment apparatus provided in this application will be described exemplarily below with reference to the accompanying drawings.

[0066] Figure 1A and Figure 1B A schematic diagram of a wafer alignment device 10 according to an embodiment of this application is shown. (Reference) Figure 1A and Figure 1BThe wafer alignment device 10 may include a base 100, an upper wafer module 200 and a lower wafer module 300, both of which are mounted on the first surface 110 of the base 100.

[0067] The base 100 serves as the basic structure supporting the entire device, providing a stable support foundation for components such as the upper wafer module 200 and the lower wafer module 300, ensuring that each module can maintain a precise relative position during the bonding process.

[0068] The upper wafer module 200 may include an upper wafer carrier 210 for carrying an upper wafer. The lower wafer module 300 may include a lower wafer carrier 330 for carrying a lower wafer.

[0069] In some implementations, the upper wafer module 200 can control the movement of the upper wafer carrier 210, so that the upper wafer carried by the upper wafer carrier 210 is located in a preset position; the lower wafer module 300 can control the movement of the lower wafer carrier 330, so that the lower wafer carried by the lower wafer carrier 330 can be located in a preset position, thereby achieving alignment between the upper and lower wafers.

[0070] In some other implementations, the lower wafer carrier 330 of the lower wafer module 300 may be fixed, while the upper wafer module 200 controls the movement of the upper wafer carrier 210 to achieve alignment between the upper and lower wafers.

[0071] In some of these implementations, the upper wafer carrier 210 of the upper wafer module 200 can be fixed, while the lower wafer module 300 controls the movement of the lower wafer carrier 330 to achieve alignment between the upper and lower wafers.

[0072] Continue to refer to Figure 1A and Figure 1B The lower wafer module 300 may further include a fixed base 310, a movable base 320, and a lower wafer carrier 330. The fixed base 310 is mounted on the base 100, the movable base 320 is mounted on the fixed base 310, and the lower wafer carrier 330 is mounted on the movable base 320. A pull-out device 340 may be provided between the fixed base 310 and the movable base 320, allowing the movable base 320 to move relative to the fixed base 310 along the Y-axis direction (as an example of a first direction). Figure 1A The first position P1 shown is... Figure 1B The two sides slide between the second position P2 shown, with the Y-axis direction parallel to the first surface 110 of the base 100.

[0073] exist Figure 1AAt the first position P1 shown, the orthographic projection of the lower wafer carrier 330 along the Z-axis (as an example of the second direction) lies within the first surface 110 of the base 100, with the Z-axis direction perpendicular to the first surface 110 of the base 100. That is, the orthographic projection of the lower wafer carrier 330 onto a projection plane perpendicular to the Z-axis lies within the orthographic projection of the first surface 110 of the base 100 onto that projection plane. Alternatively, viewed along the Z-axis, the first surface 110 of the base 100 covers the lower wafer carrier 330.

[0074] At this time, the wafer alignment device 10 can be located at the handover station and the alignment station. At the handover station, the wafer alignment device 10 can hand over the upper and lower wafers to an external robotic arm. For example, in... Figure 1A In the embodiment shown, the base 100, the lower wafer carrier 330 and the upper wafer carrier 210 can be arranged sequentially along the Z-axis direction. The robotic arm can extend between the lower wafer carrier 330 and the upper wafer carrier 210 to realize the handover of the upper and lower wafers.

[0075] At the alignment station, the wafer alignment device 10 can adjust the position of the upper wafer and / or the lower wafer so that the upper wafer and the lower wafer can be aligned to facilitate subsequent bonding.

[0076] exist Figure 1B At the second position P2 shown, at least a portion of the orthographic projection of the lower wafer carrier 330 along the Z-axis extends beyond the first surface 110 of the base 100. That is, at least a portion of the orthographic projection of the lower wafer carrier 330 onto a projection plane perpendicular to the Z-axis lies outside the orthographic projection of the first surface 110 of the base 100 onto that projection plane. In other words, when viewed along the Z-axis, there is a non-overlapping portion between the first surface 110 of the base 100 and the lower wafer carrier 330.

[0077] At this time, the wafer alignment device 10 can be located at the maintenance station. Maintenance can be performed on the wafer alignment device 10 at the maintenance station.

[0078] When maintenance is required, the movable base 320 of the aforementioned wafer alignment device 10 can be pulled out to the second position P2 via the pull-out device 340. At this time, the movable base 320 is fully exposed to the outside environment, effectively increasing its maintenance space and facilitating the installation and maintenance of the lower wafer module 300. Furthermore, the space between the base 100 and the upper wafer module 200 is freed up, effectively increasing the maintenance space for other components (e.g., the base 100 and the upper wafer module 200), thus facilitating their installation and maintenance. After maintenance, the movable base 320 can be quickly reset to the first position P1 via the pull-out device 340. Therefore, the wafer alignment device 10 is easy to maintain, with low maintenance difficulty, which helps reduce downtime for maintenance and increase production capacity.

[0079] It is understood that the pull-out device 340 provided in this application embodiment is intended to reduce the maintenance difficulty of the wafer alignment device 10. Therefore, it only needs to be able to achieve relative sliding between the fixed seat 310 and the movable seat 320, without requiring high precision. For example, the pull-out device 340 can be manually driven to make the movable seat 320 slide relative to the fixed seat 310 along the Y-axis direction; or, for example, the pull-out device 340 can also be driven by electric or pneumatic methods. This application does not impose specific limitations on this.

[0080] The following is an exemplary description of the wafer alignment apparatus 10 provided in the embodiments of this application, and a comparison with a conventional multi-station switching wafer alignment apparatus.

[0081] In traditional multi-station wafer alignment systems, the lower wafer module needs to switch between a horizontal alignment station and a handover station via moving components. Maintenance of the wafer alignment system is typically performed at the handover station, where the upper and lower wafer modules are offset along the Z-axis. However, since alignment and handover processes usually require precise positioning, both the upper and lower wafer modules must be positioned directly above the base for stability, regardless of the station. In this configuration, the bottom of the lower wafer module is close to the base, limiting maintenance space to the side. This makes maintenance difficult and costly, especially when the lower wafer module structure is complex.

[0082] In this embodiment, the pull-out device 340 is only used for pull-out operations during maintenance and does not require high-precision movement. Therefore, the pull-out device 340 can have a simpler, more compact structure and lower cost. Furthermore, at the first position P1, the wafer alignment device 10 can perform handover and alignment. Therefore, there is no need to set up an additional complex high-precision pull-out device to achieve the switching between the handover station and the alignment station, which can further simplify the overall structure and make it more compact.

[0083] Furthermore, since there is no need to switch between handover and alignment stations by pulling down the wafer module 300, the dimensions of the base 100 in the X-axis or Y-axis direction can be set to be smaller, thereby effectively saving layout space, achieving high space utilization and a compact structure.

[0084] Finally, in traditional multi-station switching wafer alignment devices, the lower wafer module 300 needs to move along the X-axis or Y-axis to switch between the handover station and the alignment station. The movement stroke is large, the time required is long, the efficiency is low, and the frequent back-and-forth between different stations makes it difficult to control the accuracy.

[0085] In this embodiment, the lower wafer module 300 does not need to move along the X-axis or Y-axis to switch workstations, which can effectively save workstation switching time, improve efficiency, achieve rapid alignment, and achieve good accuracy.

[0086] In summary, compared with traditional multi-station switching wafer alignment devices, the wafer alignment device 10 provided in this application embodiment has a simple structure, can achieve compact layout, and has low maintenance difficulty, better working efficiency and accuracy.

[0087] It is understood that the above embodiments only schematically illustrate the main components included in the wafer alignment apparatus 10, but this application is not limited thereto. In some other embodiments, the wafer alignment apparatus 10 may also include more components to achieve more functions, which will be briefly described below.

[0088] For example, the wafer alignment device 10 may also include components such as a bottom frame 400, a vibration damping module 500, and a vision inspection module 600. The bottom frame 400 can provide bottom support and also serve as a mounting base for other components (e.g., pneumatic control components, electrical control components, etc.).

[0089] In some implementations, the vibration damping module 500 is mounted on the bottom frame 400 and supports the base 100. The vibration damping module 500 can be used to isolate vibrations and crosstalk to ensure the stability of the base 100.

[0090] The visual inspection module 600 may include multiple image acquisition devices, which are mounted on the base 100 and located above the upper wafer module 200 to provide wafer pattern acquisition.

[0091] In some implementations, the visual inspection module 600 may further include multiple Z-axis drive components, each corresponding to a different image acquisition device. Each Z-axis drive component can move the image acquisition device along the Z-axis for focusing during the image inspection process. For example, the Z-axis drive component may include a motor, a lead screw drive assembly, and a grating assembly. The lead screw drive assembly converts the rotational motion of the motor into linear motion, thereby driving the image acquisition device to move along the Z-axis. The grating assembly is used to detect the position of the image acquisition device, ensuring that the image acquisition device can accurately move to a preset position, thus improving positioning accuracy.

[0092] To facilitate a further understanding of the technical solution of this application, the structure and working principle of the base 100, upper wafer module 200 and lower wafer module 300 in the wafer alignment device 10 will be described in detail below with reference to the accompanying drawings.

[0093] In some embodiments of this application, the base 100 can be a marble base. Marble has good thermal stability and is not easily deformed by heat, thus providing a precise installation reference. Furthermore, marble is not easily worn or scratched, allowing the base 100 to maintain a smooth and flat surface for a long time, making it less prone to wear and having a long service life.

[0094] Figure 2A and Figure 2B This shows a schematic diagram of the structure of the upper wafer module 200 in an embodiment of this application. Figure 2A This is a 3D view of the upper wafer module 200. Figure 2B This is a side view of the upper wafer module 200.

[0095] refer to Figure 2A and Figure 2B In some embodiments of this application, the upper wafer module 200 can control the movement of the upper wafer carrier 210. This movement can include translation along the X-axis, translation along the Y-axis, and rotation (or Rz-axis rotation) about the Z-axis. In this way, the upper wafer carried by the upper wafer carrier 210 can be positioned in a preset position to achieve alignment between the upper wafer and the lower wafer.

[0096] In some implementations, the upper wafer module 200 may include two Y-axis drive components 220 and two X-axis drive components 230. The two Y-axis drive components 220 may be spaced apart along the X-axis direction; the two X-axis drive components 230 may be spaced apart along the Y-axis direction.

[0097] For example, the upper wafer carrier 210 can be rotated in the Rz direction by the differential of the two Y-axis drive components 220; or, the upper wafer carrier 210 can also be rotated in the Rz direction by the differential of the two X-axis drive components 230. This application does not impose any specific limitations on this.

[0098] For example, the Y-axis drive assembly 220 may include a linear motor, a guide assembly, and a grating assembly. The linear motor converts electrical energy into linear motion to drive the upper wafer carrier 210 to translate along the Y-axis. The guide assembly guides the movement of the upper wafer carrier 210. The grating assembly detects the position of the upper wafer carrier 210, ensuring that the upper wafer carrier 210 can move accurately to a preset position, thereby improving positioning accuracy.

[0099] Similarly, the X-axis drive assembly 230 may include a linear motor, a guide assembly, and a grating assembly, as detailed above in the description of the Y-axis drive assembly 220, and will not be repeated here.

[0100] In some implementations, the upper wafer can be transferred to a predetermined position on the upper wafer carrier 210 and fixed. Then, multiple image acquisition devices in the vision inspection module 600 (not shown) focus and image the upper wafer, calculating its position coordinates. Next, the Y-axis drive assembly 220 and X-axis drive assembly 230 adjust the three degrees of freedom (XYRz) of the upper wafer, allowing it to be accurately positioned at the preset location. The travel in the X and Y axes can be small, as long as it meets the actual offset adjustment compensation requirements in the X and Y axes to achieve rapid alignment; for example, the offset can be approximately ±1.5 mm.

[0101] It is understandable that the above Figure 2A and Figure 2B This is merely illustrative and does not constitute a limitation on this application. For example, in some other embodiments, the upper wafer carrier 210 may be fixed in place, and correspondingly, the upper wafer module 200 may not include the Y-axis drive assembly 220 or the X-axis drive assembly 230.

[0102] Continue to refer to Figure 2A and Figure 2B In some embodiments of this application, the upper wafer module 200 may further include a pillar 240, which may extend along the Z-axis direction. The lower end of the pillar 240 may be fixedly connected to the base 100, and the upper end of the pillar 240 may support components such as the upper wafer carrier 210, the Y-axis drive assembly 220, and the X-axis drive assembly 230. In this way, a sufficiently large Z-axis space can be provided between the upper wafer carrier 210 and the base 100 to accommodate other components (e.g., the lower wafer module 300).

[0103] In some implementations, the number of pillars 240 can be four to stably support the upper wafer carrier 210, but this application is not limited to this. In other implementations, the number of pillars 240 can be more or less, for example, three, five, six, seven or eight, as long as it meets the actual usage requirements.

[0104] Figure 3A and Figure 3B This paper shows a schematic diagram of the structure of the lower wafer module 300 in an embodiment of this application. Figure 3A This is a 3D view of the lower wafer module 300. Figure 3B This is a side view of the lower wafer module 300. Figure 3C according to Figure 3A and Figure 3B A schematic diagram of the structure of the fixing base 310 in an embodiment of this application is shown. Figure 3D according to Figure 3A and Figure 3B A schematic diagram of the structure of the movable seat 320 in an embodiment of this application is shown.

[0105] refer to Figures 3A to 3D In some embodiments of this application, the mounting base 310 of the lower wafer module 300 may include a base 311 and a guide seat 312. The guide seat 312 is disposed on the base 311 and extends along the Y-axis direction. The pull-out device 340 may be disposed on the guide seat 312. The guide seat 312 provides limiting and stable support for the pull-out device 340.

[0106] In some embodiments of this application, the pull-out device 340 of the lower wafer module 300 may include a slide rail 341, a slider 342, and a lifting bracket 343. The slide rail 341 and the slider 342 are disposed on the lifting bracket 343, which is disposed on the fixed base 310. The slider 342 is fixedly connected to the movable base 320, and the slider 342 also slides with the slide rail 341 along the Y-axis. During the sliding of the slider 342 relative to the slide rail 341 along the Y-axis, the movable base 320 can slide relative to the fixed base 310 along the Y-axis, thereby realizing the pull-out and reset of the movable base 320.

[0107] For example, the lifting bracket 343 can be raised and lowered relative to the fixed base 310 along the Z-axis to meet other usage requirements, which will be described in detail later in conjunction with the lifting assembly 370, and will not be elaborated here.

[0108] In some embodiments of this application, the lower wafer module 300 may further include a quick-swap assembly 350. Exemplarily, Figure 4A This paper shows a schematic diagram of the structure of the quick-swap component 350 of the lower wafer module 300 in an embodiment of this application. Figure 4B This application illustrates the lower wafer module 300 in an embodiment of the present application. Figure 4AA magnified view of a portion of region S1.

[0109] refer to Figure 4A and Figure 4B The quick-change assembly 350 may include a first connector 351 and a second connector 352. The first connector 351 may be disposed on the fixed base 310, for example, the first connector 351 may be disposed on the guide seat 312 of the fixed base 310. The second connector 352 may be disposed on the movable base 320. The first connector 351 and the second connector 352 can cooperate with each other, so that the quick-change assembly 350 can be in an unlocked state or a locked state.

[0110] When the quick-change component 350 is in the unlocked state, the movable seat 320 can slide relative to the fixed seat 310 along the Y-axis direction to facilitate the removal of the movable seat 320 for maintenance and to reset the movable seat 320.

[0111] When the quick-change assembly 350 is in the locked state, the movable seat 320 can be in the reset state and fixed relative to the fixed seat 310 to facilitate subsequent alignment, handover and other operations, and to prevent the movable seat 320 from accidentally sliding out.

[0112] By setting up the quick-change component 350, the reset accuracy and locking effectiveness before and after maintenance can be ensured, avoiding the problem of needing a lot of time to recalibrate the reset and the error caused by the pull-out device 340 during operation, thereby effectively improving work efficiency.

[0113] It is understood that the number of quick-change components 350 can be one or more (e.g., two, three, or four), and this application does not impose a specific limitation on this, as long as it meets the actual usage requirements. For example, the number of quick-change components 350 can be four, that is, the number of first connectors 351 can be four, and the number of second connectors 352 can be four. Figure 3C In the illustrated embodiment, the four first connectors 351 can be arranged in a 2×2 matrix; correspondingly, the four second connectors 352 (not shown) can also be arranged in a 2×2 matrix.

[0114] By setting multiple quick-change components 350, the locking effectiveness can be further improved, making the connection between the fixed seat 310 and the movable seat 320 more reliable.

[0115] In some implementations, the first connector 351 and the second connector 352 can be engaged or disengaged by electric or pneumatic means, allowing the quick-change assembly 350 to switch between a locked and unlocked state. Alternatively, in other implementations, the first connector 351 and the second connector 352 can be magnetic, using magnetic force to switch the quick-change assembly 350 between the locked and unlocked states. It is understood that this application does not impose specific limitations on the specific structural form of the first connector 351 and the second connector 352, as long as the aforementioned locking and unlocking effects are achieved.

[0116] In some embodiments of this application, the lower wafer module 300 may further include a first engaging portion 361 and a second engaging portion 362. The first engaging portion 361 is disposed on the fixed base 310, and the second engaging portion 362 is disposed on the movable base 320. The first engaging portion 361 and the second engaging portion 362 can engage with each other along the Z-axis direction.

[0117] By setting the first engaging part 361 and the second engaging part 362, the fixed seat 310 and the movable seat 320 can be quickly positioned, so as to ensure that the movable seat 320 can be reset more accurately and quickly, thereby effectively improving maintenance efficiency.

[0118] In some implementations, the first engaging portion 361 can be a protrusion, and the second engaging portion 362 can be a recess adapted to the protrusion. The protrusion can be inserted into the recess along the Z-axis direction, thereby causing the first engaging portion 361 and the second engaging portion 362 to engage along the Z-axis direction, but this application is not limited to this. In other implementations, the first engaging portion 361 and the second engaging portion 362 can also have other structural forms. For example, the first engaging portion 361 can be a recess, and the second engaging portion 362 can be a protrusion adapted to the recess.

[0119] In some implementations, the first connector 351 can be disposed on the first engaging portion 361, and the second connector 352 can be disposed on the second engaging portion 362. This effectively saves layout space and helps to achieve a compact layout. In other implementations, the first connector 351 and the first engaging portion 361 can also be disposed separately. Similarly, the second connector 352 and the second engaging portion 362 can also be disposed separately. This application does not impose specific restrictions on this, as long as it meets the actual usage requirements.

[0120] In some embodiments of this application, the lower wafer module 300 may further include a lifting assembly 370. Exemplarily, Figure 5A This paper shows a schematic diagram of the lifting component 370 of the lower wafer module 300 in an embodiment of this application. Figure 5B This application illustrates the lower wafer module 300 in an embodiment of the present application. Figure 5AA magnified view of a portion of region S2.

[0121] refer to Figure 5A and Figure 5B The fixed end of the lifting component 370 can be connected to the fixed base 310, or in other words, the lifting component 370 is mounted on the fixed base 310. The driving end of the lifting component 370 can be connected to the movable base 320. The lifting direction of the lifting component 370 is parallel to the Z-axis direction, so the lifting component 370 can drive the movable base 320 to rise and fall along the Z-axis direction.

[0122] When the movable seat 320 is in the raised position, the above Figure 4A and Figure 4B The quick-change component 350 shown can be in the unlocked state, as described above. Figure 4A and Figure 4B The first engaging portion 361 and the second engaging portion 362 shown do not overlap in the orthographic projection in the Y-axis direction, so that the movable seat 320 can slide smoothly relative to the fixed seat 310 in the Y-axis direction.

[0123] When the movable seat 320 is in the lowered position, the above Figure 4A and Figure 4B The quick-change assembly 350 shown can be in a locked state, as described above. Figure 4A and Figure 4B The first engaging portion 361 and the second engaging portion 362 shown overlap in the orthographic projection along the Y-axis direction, and the first engaging portion 361 and the second engaging portion 362 engage along the Z-axis direction, so that the movable seat 320 can be fixed relative to the fixed seat 310.

[0124] By setting up the lifting component 370, the aforementioned [features / features] can be provided during the maintenance process of pulling out the movable seat 320. Figure 4A and Figure 4B The first engaging portion 361 and the second engaging portion 362 shown provide clearance space to avoid interference between the first engaging portion 361 and the second engaging portion 362.

[0125] In some implementations, the drive end of the lifting assembly 370 can abut against the lifting bracket 343 of the pull-out device 340 along the Z-axis, thereby connecting the drive end of the lifting assembly 370 to the movable seat 320.

[0126] Thus, when the driving end of the lifting assembly 370 drives the lifting bracket 343 to rise and fall relative to the fixed seat 310 along the Z-axis, the slide rail 341 and slider 342 provided on the lifting bracket 343 can also rise and fall relative to the fixed seat 310 along the Z-axis. Consequently, the movable seat 320, which is fixedly connected to the slider 342, can also rise and fall relative to the fixed seat 310 along the Z-axis. Furthermore, this does not affect the normal pulling of the pull-out device 340, thereby ensuring that the movable seat 320 can slide normally relative to the fixed seat 310 along the Y-axis.

[0127] It is understood that the number of lifting components 370 can be one or more (e.g., two, three, or four, etc.), and this application does not impose a specific limitation on this, as long as it can meet the actual use requirements. For example, the number of lifting components 370 can be four, and the four lifting components 370 can be arranged in a 2×2 matrix. By setting multiple lifting components 370, the lifting stability can be further improved.

[0128] The following section uses one of the lifting components, 370, as an example to introduce the specific structural form of the lifting component 370 in detail.

[0129] Continue to refer to Figure 5B In some embodiments of this application, the fixing base 310 may have a first through hole 313 extending along the Z-axis direction. Exemplarily, the first through hole 313 may penetrate the base 311 and guide seat 312 of the fixing base 310 along the Z-axis direction.

[0130] The lifting assembly 370 may include a cylinder mechanism 371 and an elastic connector 372. The upper end of the cylinder mechanism 371 can be the driving end of the lifting assembly 370. The upper end of the cylinder mechanism 371 passes through the first through hole 313 and is connected to the lifting bracket 343.

[0131] The elastic connector 372 is located on the side of the lifting bracket 343 facing the cylinder mechanism 371. Figure 6 A schematic diagram of the structure of the elastic connector 372 in an embodiment of this application is shown. (Reference) Figure 6 and combined Figure 5B The elastic connector 372 may include a fixed plate 3721 and a spring 3722. The fixed plate 3721 is fixedly connected to the lifting bracket 343, and the spring 3722 is mounted on the fixed plate 3721. The upper end of the cylinder mechanism 371 passes through the spring 3722, and the upper end of the cylinder mechanism 371 may include a first stop and a second stop connected together. The first stop and the second stop can clamp the spring 3722 along the Z-axis direction.

[0132] Thus, the reed 3722 can provide constraints in the XY plane to the cylinder mechanism 371, ensuring that the lifting bracket 343 does not slip unrestrainedly in the XY plane, thereby improving lifting stability. Furthermore, the reed 3722 can undergo elastic deformation to allow angular displacement in the Rx and Ry directions, achieving adaptive angular deviation. For example, when there are multiple lifting components 370, the lifting height of these components may have some error, causing angular deviation. By setting the reed 3722, the angular deviation caused by the lifting height error between the lifting components 370 can be adaptively absorbed, preventing the lifting bracket 343 from jamming during lifting and ensuring smooth lifting operation.

[0133] In some implementations, the upper end of the cylinder mechanism 371 may include a guide shaft 3711 and a first screw 3712. The tail of the first screw 3712 passes through a spring 3722 and is threadedly connected to the upper end of the guide shaft 3711. The upper end of the guide shaft 3711 may be a first stop; the head of the first screw 3712 may be a second stop, and the head of the first screw 3712 abuts against the lifting bracket 343.

[0134] For example, the first screw 3712 can be a ball head, and the lifting bracket 343 can include a second screw 3431, which is a flat head. The head of the second screw 3431 abuts against the head of the first screw 3712, and the contact surfaces between them are a flat surface and a curved surface. This ensures effective force transmission, allowing the lifting assembly 370 to drive the lifting bracket 343 to move up and down along the Z-axis. Simultaneously, it can adapt to angular deviations. For example, when there are multiple lifting assemblies 370, the lifting height of the multiple lifting assemblies 370 may have some error, causing angular deviations. Through this contact cooperation of the flat and curved surfaces, the angular deviations caused by the lifting height errors between the lifting assemblies 370 can be adaptively absorbed, preventing the lifting bracket 343 from jamming during lifting and ensuring smooth lifting operation.

[0135] Alternatively, for example, the first screw 3712 could be a flat head and the second screw 3431 a ball head. This application does not impose specific restrictions on this, as long as it can meet the actual use requirements.

[0136] In some implementations, the cylinder mechanism 371 may further include a cylinder body 3713, a cylinder piston shaft 3714, a ball-end screw 3715, a flat-head screw 3716, and a guide sleeve 3717. The cylinder body 3713 serves as the fixed end of the lifting assembly 370. The lower end of the cylinder piston shaft 3714 is located within the cylinder body 3713, and the upper end of the cylinder piston shaft 3714 is threadedly connected to the tail of the ball-end screw 3715. The head of the ball-end screw 3715 abuts against the head of the flat-head screw 3716, and the tail of the flat-head screw 3716 is threadedly connected to the lower end of the guide shaft 3711. A guide sleeve 3717 is fitted around the outer periphery of the upper end of the guide shaft 3711.

[0137] When the cylinder mechanism 371 is working, the cylinder piston shaft 3714 can move up and down relative to the fixed seat 310 along the Z-axis. During this process, the cylinder piston shaft 3714 can transmit force to the lifting bracket 343 through the ball head screw 3715, the flat head screw 3716 and the guide shaft 3711, so that the lifting bracket 343 can move up and down relative to the fixed seat 310 along the Z-axis.

[0138] The ball-head screw 3715 and the flat-head screw 3716 engage to ensure effective force transmission and adapt to angular deviations. The guide sleeve 3717 provides precise guiding support for the guide shaft 3711.

[0139] For example, the guide sleeve 3717 can be a linear bearing to achieve better guiding and support effects. For example, the cylinder of the cylinder mechanism 371 can be a single-acting cylinder, and both the intake and exhaust can be equipped with flow regulation devices. In this way, the lifting speed of multiple cylinder mechanisms 371 can be synchronously adjusted and corrected, so that multiple cylinder mechanisms 371 can be lifted synchronously; and the descent speed buffer control can also be realized, so that the lifting bracket 343 can fall back smoothly and avoid large impacts and vibrations.

[0140] In some implementations, the fixing plate 3721 and the spring 3722 of the elastic connector 372 can be an integral structure, or in other words, the fixing plate 3721 and the spring 3722 can be integrally molded, rather than being molded separately and then assembled together by means of bonding, snap-fitting, or fastener connection. In this way, auxiliary installation structures (such as screws, pressure plates, etc.) can be eliminated, meeting the requirement of arranging the spring 3722 in a limited space.

[0141] Figures 7A to 7C The diagram illustrates the operation of the lifting assembly 370 in this embodiment. It should be noted that, for the sake of brevity, Figures 7A to 7C The rectangle filled with squares represents the slide rail 341 and slider 342. In reality, the slide rail 341 and slider 342 are two parts, and relative sliding can occur between the slide rail 341 and slider 342.

[0142] refer to Figures 7A to 7C First, the quick-change assembly 350 (not shown) can be switched to the unlocked state. Then, the lifting assembly 370 is activated, which lifts the lifting bracket 343 along the Z-axis, thereby causing the slide rail 341, slider 342, and movable seat 320 to rise relative to the fixed seat 310 along the Z-axis. As the movable seat 320 rises along the Z-axis, the second engaging part 362 on the movable seat 320 and the first engaging part 361 on the fixed seat 310 can separate in the Z-axis direction.

[0143] Next, slider 342 can slide relative to slide rail 341 along the Y-axis, thereby allowing movable seat 320 to move relative to fixed seat 310. Figure 7B The first position P1 shown is slid to Figure 7C The second position P2 is shown. Thus, the movable seat 320 can be pulled out for maintenance.

[0144] After maintenance, the movable seat 320 can be moved from... Figure 7C The second position P2 shown is reset to Figure 7B The first position P1 is shown. Then, the lifting assembly 370 is closed, and the lifting assembly 370 slowly descends along the Z-axis, so that the movable seat 320 falls smoothly back along the Z-axis, avoiding damage to the fixed seat 310, the movable seat 320 and other components supported by them due to a rapid fall.

[0145] As the movable seat 320 falls back along the Z-axis, the first engaging part 361 and the second engaging part 362 can engage with each other along the Z-axis, and the quick-change assembly 350 (not shown) can be switched to the locked state to achieve fixation between the fixed seat 310 and the movable seat 320.

[0146] After introducing the components in wafer module 300 used for maintenance functions, the following section, with reference to the accompanying drawings, introduces the components in wafer module 300 used for motion functions.

[0147] Continue to refer to Figure 3A In some embodiments of this application, the lower wafer module 300 may include a vertical drive assembly 381. The fixed end of the vertical drive assembly 381 is mounted on the base 100, and the drive end of the vertical drive assembly 381 can pass through the base 100 along the Z-axis and be fixedly connected to the fixed base 310 to drive the fixed base 310 to move, thereby driving the components carried by the fixed base 310 (e.g., the movable base 320 and the lower wafer carrier 330). This movement may include translation along the Z-axis, rotation (or Rx-axis rotation) around the X-axis, and rotation (or Ry-axis rotation) around the Y-axis. In this way, position adjustment in the Z-axis direction and angular offset adjustment in the Rx and Ry directions can be realized, so that the lower wafer carried by the lower wafer carrier 330 can be accurately positioned in a preset position to achieve alignment and bonding of the upper and lower wafers.

[0148] In some implementations, a large Z-axis space can exist between the lower wafer carrier 330 and the upper wafer carrier 210 (not shown) to accommodate other components, such as a robotic arm for transferring the upper and lower wafers, a vision inspection module, etc. Accordingly, the vertical drive assembly 381 can drive the mounting base 310 to translate along the Z-axis at a faster speed to compensate for the increased motion time caused by the increased travel in the Z-axis direction. For example, the travel in the Z-axis direction can be greater than or equal to 30 mm.

[0149] For example, firstly, the vertical drive assembly 381 can drive the mounting base 310 to descend to its lowest position along the Z-axis, maximizing the Z-axis space between the lower wafer carrier 330 and the upper wafer carrier 210, thereby facilitating the lower wafer carrier 330 to receive and carry the lower wafer. After the lower wafer carrier 330 receives and carries the lower wafer, the vertical drive assembly 381 can drive the mounting base 310 to rise along the Z-axis to the inspection station at a relatively high speed to complete the inspection. Then, the vertical drive assembly 381 can drive the mounting base 310 to rise along the Z-axis to a position close to the upper wafer carrier 210 at a relatively high speed. For example, at this time, the distance between the lower wafer carried by the lower wafer carrier 330 and the upper wafer carried by the upper wafer carrier 210 can be less than or equal to 500 μm. Next, the vertical drive assembly 381 can perform fine-tuning of Z-axis translation, Rx-axis rotation and Ry-axis rotation at a slower speed and with a smaller step size (e.g., less than or equal to 50 nm). After the adjustment is in place, the upper and lower wafers are bonded.

[0150] In some implementations, the vertical drive assembly 381 may include multiple Z-axis drive assemblies (e.g., two, three, or four) to further enhance motion stability. Each Z-axis drive assembly may include a motor, a lead screw drive assembly, a guide assembly, and a grating assembly. The lead screw drive assembly converts the rotational motion of the motor into linear motion, thereby driving the fixed base 310 to move along the Z-axis. The guide assembly guides the movement of the fixed base 310. The grating assembly detects the position of the fixed base 310, ensuring that the fixed base 310 can accurately move to the preset position, improving positioning accuracy.

[0151] Continue to refer to Figure 3D In some embodiments of this application, the lower wafer module 300 may further include a first driving component 382 and an air float 383. The first driving component 382 can drive the lower wafer carrier 330 to move. This movement may include translation along the X-axis, translation along the Y-axis, and rotation in the Rz direction. That is, the lower wafer carrier 330 can translate or rotate along a plane parallel to the top surface of the movable seat 320. In this way, the loading error of the external robotic arm can be calibrated, thereby helping to make the lower wafer carried by the lower wafer carrier 330 more accurately positioned in a preset position, and thus enabling better alignment between the upper and lower wafers.

[0152] The lower wafer carrier 330 can be disposed on the top surface of the air-bearing base 383. The bottom surface of the air-bearing base 383 is air-bearingly connected to the top surface of the movable base 320, and the side surface of the air-bearing base 383 is air-bearingly connected to the side surface (not shown) of the upper wafer module's pillar 240 to provide guidance. The upper wafer module's pillar 240 can be specifically described above. Figure 2A and Figure 2B The description of the column 240 in the illustrated embodiment will not be repeated here.

[0153] By setting the air float 383, the movement effect of the lower wafer carrier 330 can be further improved, the frictional resistance during the movement of the lower wafer carrier 330 can be reduced, and the positioning accuracy can be improved. At the same time, the reduced frictional resistance also reduces the power requirements of the first drive component 382. Therefore, the size of the first drive component 382 can be smaller, resulting in a more compact overall structure and facilitating a compact layout.

[0154] In some embodiments of this application, the lower wafer module 300 may further include a clamping assembly 384, which connects the air float 383 and the movable seat 320, and is used to clamp or release the air float 383 and the movable seat 320 to improve the stability of the air float 383.

[0155] In some of these implementations, a combination Figure 3A and Figure 3B When the vertical drive assembly 381 is working, the clamping assembly 384 can clamp the air float 383 and the movable seat 320. In this way, it can be prevented that the air float 383 and the movable seat 320 will detach or collide during movement.

[0156] When the first drive assembly 382 operates, the clamping assembly 384 can release the air float 383 and the movable seat 320 to avoid affecting the movement of the air float 383 relative to the movable seat 320. Alternatively, the clamping assembly 384 can also provide a clamping force along the Z-axis to the air float 383 to clamp the air float 383 and the movable seat 320. This clamping force can be less than the buoyancy force between the air float 383 and the movable seat 320; in other words, this clamping force can be understood as a preload, providing only preload. This allows for higher movement stability of the air float 383 without affecting its normal movement.

[0157] In some embodiments of this application, the lower wafer module 300 may include a ejector pin assembly 390. Exemplarily, Figure 8A This illustrates the arrangement of the ejector pin assembly 390 in the lower wafer module 300 in an embodiment of this application. Figure 8B This application illustrates the lower wafer module 300 in an embodiment of the present application. Figure 8A The cross-sectional view obtained by cutting the middle AA section shows a portion of the mounting base 310 and the lower wafer carrier 330 in dashed lines. Figure 8C A perspective view of the ejector pin assembly 390 in an embodiment of this application is shown.

[0158] refer to Figures 8A to 8CThe movable seat 320 may have a second through hole 321 extending along the Z-axis direction. The ejector pin assembly 390 may include a first adapter plate 391, a second adapter plate 392, a second drive assembly 393, and a plurality of ejector pins 394, which extend along the Z-axis direction respectively.

[0159] Along the Z-axis, the lower wafer carrier 330 and the second drive assembly 393 can be located on opposite sides of the second through-hole 321. One end of the first adapter plate 391 passes through the second through-hole 321 and is fixedly connected to the lower wafer carrier 330. Figures 8A to 8C In the illustrated embodiment, the lower wafer carrier 330 is mounted on the air float 383. One end of the first adapter plate 391 can be fixedly connected to the air float 383, thereby achieving an indirect fixed connection with the lower wafer carrier 330. However, this application is not limited to this. In other embodiments, the lower wafer module 300 may not include the air float 383, and one end of the first adapter plate 391 can be directly fixedly connected to the lower wafer carrier 330.

[0160] The other end of the first adapter plate 391 is fixedly connected to the fixed end of the second drive assembly 393. The drive end of the second drive assembly 393 is connected to the second adapter plate 392. The lower end of the ejector pin 394 is fixedly connected to the second adapter plate 392, and the upper end of the ejector pin 394 is used to abut against the lower wafer carried by the lower wafer carrier 330. Exemplarily, the lower wafer carrier 330 may have ejector pin holes, and the upper end of the ejector pin 394 may pass through the ejector pin holes to abut against the lower wafer.

[0161] By setting the ejector pin assembly 390, the handover of the lower wafer can be realized at the handover station. The handover process can include loading and unloading. For example, during the loading process, the driving component of the ejector pin assembly 390 can drive the second adapter plate 392 to descend along the Z-axis, thereby driving the ejector pin 394 to descend along the Z-axis. As the ejector pin 394 descends along the Z-axis, the lower wafer supported by the ejector pin 394 also descends along the Z-axis until the lower wafer is placed on the lower wafer carrier 330, thus realizing the loading of the lower wafer.

[0162] During the wafer unloading process, the second drive component 393 of the ejector pin assembly 390 can drive the second adapter plate 392 to rise along the Z-axis direction, thereby causing the ejector pin 394 to rise along the Z-axis direction. As the ejector pin 394 rises along the Z-axis direction, it can lift the lower wafer, thereby moving the lower wafer away from the lower wafer carrier 330, so as to facilitate the unloading of the lower wafer.

[0163] Compared to traditional solutions that fix the ejector pin assembly to the base, this embodiment of the application fixes the ejector pin assembly 390 to the lower wafer carrier 330. When the lower wafer carrier 330 moves relative to the movable base 320, the ejector pin assembly 390 can move with the lower wafer carrier 330, thereby avoiding interference between the ejector pin assembly 390 and other components (such as the vertical drive assembly 381, the first drive assembly 382, ​​etc.), avoiding complex motion attitude control and interlock control, and reducing the probability of the ejector pin 394 being frequently damaged by impacts and requiring maintenance. Furthermore, when the movable base 320 is removed for maintenance, the ejector pin assembly 390 can also be removed, making maintenance of the ejector pin assembly 390 more convenient, simpler and more convenient, providing more maintenance space, and higher maintenance efficiency.

[0164] In some implementations, the second drive assembly 393 may include a direct-drive screw motor, a guide assembly, a grating assembly, and a photoelectric switch.

[0165] A direct-drive lead screw motor can convert electrical energy into linear motion to drive the second adapter plate 392 to move up and down along the Z-axis. For example, the direct-drive lead screw motor may include a motor body and a lead screw shaft, with the motor body directly connected to the lead screw shaft, eliminating the need for a coupling. This effectively improves rigidity and enables a greater Z-axis lifting stroke within a limited height.

[0166] The guide assembly is used to guide the movement of the second adapter plate 392. Exemplarily, the guide assembly can be a high-rigidity cross roller guide, which can withstand multi-directional loads and is not easily deformed, with low rolling friction, smooth movement, and good stability.

[0167] The grating assembly is used to detect the position of the second adapter plate 392, ensuring that the second adapter plate 392 can move accurately to the preset position and improve positioning accuracy.

[0168] A photoelectric switch is a non-contact position sensor. When a slider moves to a specific position, it blocks the light path of the photoelectric switch, triggering a signal to indicate a specific workstation. Thus, each time power is applied, only the position of the photoelectric switch needs to be located for positioning, thereby eliminating accumulated errors.

[0169] It is understandable that the above Figures 8A to 8C In the illustrated embodiment, the number of ejector pins 394 can be three, but this application is not limited to this. In other embodiments, the number of ejector pins 394 can also be four, five, or more, as long as it meets the actual usage requirements.

[0170] To facilitate understanding, we will continue with... Figures 8A to 8C The three ejector pins 394 in the illustrated embodiment are used as examples to introduce the structure of the ejector pins 394.

[0171] Figure 9 according to Figures 8A to 8C This paper shows a schematic diagram of the structure of three ejector pins 394 in an embodiment of this application. Figure 9 (a), (b), and (c) represent the structures of three different thimbles 394. Figure 9 As shown in (a) as an example, in some embodiments of this application, the ejector pin 394 may include an ejector pin body 3941, a hollow bolt 3942, a nut 3943, and a marking element 3944. The ejector pin body 3941 is inserted into the hollow bolt 3942. The hollow bolt 3942 passes through the marking element 3944 and is threadedly connected to the nut 3943. The marking element 3944 passes through the second adapter plate 392 and is fixedly connected to it. This modular design of the ejector pin 394 effectively improves the convenience of disassembly and maintenance.

[0172] Understandable. Figure 9 The components included in the ejector pin 394 shown in (b) and (c) are similar to those in the image. Figure 9 The ejector pin 394 shown in (a) is essentially the same; therefore, please refer to the above for details. Figure 9 The relevant descriptions in the embodiment shown in (a) will not be repeated here.

[0173] In some implementations, the hollow bolt 3942 of one of the multiple ejector pins 394 is transition-fitted with its corresponding marker 3944, while the hollow bolts 3942 of the remaining ejector pins 3944 are clearance-fitted with their corresponding markers 3944. For example, Figure 9 In the ejector pin 394 shown in (a), the hollow bolt 3942 is transitionally fitted with its corresponding marking piece 3944; Figure 9 In the ejector pin 394 shown in (b) and (c), the hollow bolt 3942 is clearance-fitted with its corresponding marking piece 3944.

[0174] In this way, it can be Figure 9 As shown in (a), ejector pin 394 is used as the reference ejector pin, and adjustments are made. Figure 9 The radial position of ejector pin 394 shown in (b) and (c) enables alignment with the ejector pin hole of the lower wafer carrier 330 (not shown).

[0175] In some implementations, the ejector pin 394 may also include an adjusting member 3945, which is located between the ejector pin body 3941 and the hollow bolt 3942, and is used to adjust the position of the ejector pin body 3941 in the Z-axis direction. In this way, fine adjustment of the position of the ejector pin body 3941 in the Z-axis direction can be achieved, thereby realizing equal height adjustment control of the three ejector pins 394.

[0176] Figure 10 according to Figures 8A to 8C A schematic diagram of the structure of the marker 3944 corresponding to the three ejector pins 394 in an embodiment of this application is shown. (Reference) Figure 10 In some implementations, at least one of the multiple ejector pins 394 has a different appearance from the other ejector pins 3944. This enables a foolproof design, making it easy to distinguish between different ejector pins 394, thereby effectively avoiding the problem of reset confusion that may occur during replacement and maintenance operations, and helping to ensure the consistency of maintenance interchangeability.

[0177] For example, the marker 3944 corresponding to the ejector pin 394 used as a reference ejector pin can be circular, while the markers 3944 corresponding to the other ejector pins 394 can be triangular. In this way, during disassembly and assembly, the ejector pin 394 used as a reference ejector pin and its corresponding installation position can be accurately identified, thereby avoiding misalignment between the ejector pin 394 and the other ejector pins 394 and effectively reducing the time spent on repeated adjustments.

[0178] Continue to refer to Figure 8B In some embodiments of this application, the mounting base 310 has a third through hole 314 extending along the Z-axis direction. The third through hole 314 is connected to the second through hole 321 along the Z-axis direction, and the first adapter plate 391 and the second drive assembly 393 can pass through the third through hole 314. In this way, the mounting base 310 can effectively prevent the mounting base 310 from obstructing the connection between the first adapter plate 391 and the lower wafer carrier 330.

[0179] Figure 11A and Figure 11B This paper shows a schematic diagram of the third through hole 314 on the fixing base 310 in an embodiment of this application from another perspective. Figure 11B Partial structure of the ejector pin assembly 390 is also shown.

[0180] refer to Figure 11A and Figure 11B and combined Figure 8B The solid portion of the fixing base 310 used to form the third through hole 314 may include a first portion 315 and a second portion 316. The first portion 315 and the second portion 316 are detachably connected, and the first portion 315 and the first adapter plate 391 are arranged opposite to each other along the Y-axis direction.

[0181] When maintenance is required, the first part 315 can be removed. This prevents the fixed seat 310 from obstructing the movement of the ejector pin assembly 390 along the Y-axis during the maintenance process of pulling out the movable seat 320, allowing the ejector pin assembly 390 to be pulled out for maintenance. After maintenance, the fixed seat 310 and ejector pin assembly 390 can be reset, and then the first part 315 can be reinstalled onto the second part 316.

[0182] In summary, the wafer alignment apparatus 10 provided in this application embodiment, by setting up a fixed base 310, a movable base 320, and a pull-out device 340, allows the movable base 320 to be pulled out via the pull-out device 340 when maintenance is required, and to be reset via the pull-out device 340 after maintenance. This effectively reduces maintenance difficulty and achieves a compact layout. Secondly, by setting up a quick-change component 350, a first locking part 361, a second locking part 362, and a lifting component 370, the rapid and accurate reset of the movable base 320 before and after maintenance can be effectively ensured, while avoiding interference between components during the pull-out process. Finally, the ejector pin assembly 390 can be pulled out synchronously with the movable base 320, and the ejector pin assembly 390 adopts a differentiated foolproof design, which further reduces the difficulty of maintenance and reset, making maintenance more convenient.

[0183] This application embodiment also provides a wafer alignment system, which may include multiple wafer alignment devices, and the wafer alignment devices may be those described above. Figures 1A to 11B Any one of the wafer alignment devices 10 in the embodiments shown.

[0184] For example, the number of wafer alignment devices 10 can be two, three, four or five, etc. This application does not impose a specific limitation on this, as long as it can meet the actual use requirements.

[0185] As mentioned above, the wafer alignment device 10 provided in this application embodiment can achieve miniaturization and compact design. Its overall size can be significantly reduced compared to wafer alignment devices in other solutions. Therefore, without changing the layout space, the wafer alignment system 1 provided in this application embodiment can arrange more wafer alignment devices 10, with a more compact layout, thereby achieving an increase in yield.

[0186] The following description, in conjunction with the accompanying drawings, provides an exemplary illustration of the layout of the plurality of wafer alignment devices 10.

[0187] Figure 12A and Figure 12B Exemplary structures of several wafer alignment systems 1 in embodiments of this application are shown. (Reference) Figure 12A In some embodiments of this application, the wafer alignment system 1 may include a first wafer alignment device 10a and a second wafer alignment device 10b. The first wafer alignment device 10a and the second wafer alignment device 10b may be arranged side by side along the X-axis direction (as an example of a third direction).

[0188] In some implementations, along the Y-axis, the robotic arm handover area and the maintenance area are located on opposite sides of the wafer alignment system 1. The robotic arm handover area provides the movement space for the robotic arm, allowing it to transfer upper and lower wafers. The maintenance area provides the operating space for maintenance, facilitating maintenance of the wafer alignment system 1 by operators.

[0189] refer to Figure 12B In other embodiments of this application, the wafer alignment system 1 may include a third wafer alignment device 10c and a fourth wafer alignment device 10d. The third wafer alignment device 10c and the fourth wafer alignment device 10d may be arranged side by side along the Y-axis direction.

[0190] In some implementations, along the Y-axis, the robotic arm junction area is located between the third wafer alignment device 10c and the fourth wafer alignment device 10d; the maintenance area can be divided into two, with the two maintenance areas located on opposite sides of the wafer alignment system 1.

[0191] It is understandable that the above Figure 12A and Figure 12B The illustrated embodiments are merely illustrative of several layout schemes and do not constitute a limitation of this application. For example, in some other embodiments, the above... Figure 12A and Figure 12B The wafer alignment apparatus 10 in the illustrated embodiment can be arranged in combination with each other. That is, the wafer alignment system 1 can include the above-described... Figure 12A The first wafer alignment device 10a and the second wafer alignment device 10b in the illustrated embodiment, and the above-mentioned Figure 12B The third wafer alignment device 10c and the fourth wafer alignment device 10d in the illustrated embodiment.

[0192] The above description illustrates the implementation of this application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to these embodiments, and this application can also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0193] In the description of this application, it should be noted that the term "and / or" is a term used to describe the relationship between related objects, indicating that there are three possible scenarios. For example, A and / or B can mean: A exists alone, B exists alone, or A and B exist simultaneously.

[0194] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0195] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

Claims

1. A wafer alignment apparatus (10), characterized in that, Includes a base (100), and an upper wafer module (200) and a lower wafer module (300) mounted on a first surface (110) of the base (100). The upper wafer module (200) includes an upper wafer carrier (210) for carrying the upper wafer; The lower wafer module (300) includes a fixed base (310), a movable base (320), and a lower wafer carrier (330). The fixed base (310) is mounted on the base (100), the movable base (320) is mounted on the fixed base (310), and the lower wafer carrier (330) is mounted on the movable base (320) and is used to carry the lower wafer. A pull-out device (340) is provided between the movable seat (320) and the fixed seat (310) so that the movable seat (320) can slide relative to the fixed seat (310) between a first position (P1) and a second position (P2) along a first direction, the first direction being parallel to the first surface (110). In the first position (P1), the orthographic projection of the lower wafer carrier (330) along the second direction is located within the first surface (110), and the second direction is perpendicular to the first surface (110). At the second position (P2), the orthographic projection of the lower wafer carrier (330) along the second direction at least partially extends beyond the first surface (110).

2. The wafer alignment apparatus (10) according to claim 1, characterized in that, The lower wafer module (300) further includes a quick-change assembly (350), which includes a first connector (351) and a second connector (352). The first connector (351) is disposed on the fixed base (310), and the second connector (352) is disposed on the movable base (320). The first connector (351) and the second connector (352) cooperate to make the quick-change assembly (350) be in a locked state or an unlocked state.

3. The wafer alignment apparatus (10) according to claim 1 or 2, characterized in that, The lower wafer module (300) further includes a first engaging portion (361) and a second engaging portion (362). The first engaging portion (361) is disposed on the fixed base (310), and the second engaging portion (362) is disposed on the movable base (320). The first engaging portion (361) and the second engaging portion (362) engage with each other along the second direction.

4. The wafer alignment apparatus (10) according to claim 3, characterized in that, The lower wafer module (300) further includes a lifting assembly (370), the fixed end of which is connected to the fixed base (310), and the driving end of which is connected to the movable base (320). The lifting direction of the lifting assembly (370) is parallel to the second direction.

5. The wafer alignment apparatus (10) according to claim 4, characterized in that, The pull-out device (340) includes a lifting bracket (343), a slide rail (341) and a slider (342) disposed on the lifting bracket (343). The slider (342) is fixedly connected to the movable seat (320) and slides in cooperation with the slide rail (341) along the first direction. The driving end of the lifting assembly (370) abuts against the lifting bracket (343) in the second direction, so that the driving end of the lifting assembly (370) is connected to the movable seat (320).

6. The wafer alignment apparatus (10) according to claim 5, characterized in that, The fixed base (310) is provided with a first through hole (313) extending in the second direction, and the lifting assembly (370) includes a cylinder mechanism (371) and an elastic connector (372). The upper end of the cylinder mechanism (371) is the driving end of the lifting assembly (370). The upper end of the cylinder mechanism (371) passes through the first through hole (313) and is connected to the lifting bracket (343). The elastic connector (372) is located on the side of the lifting bracket (343) facing the cylinder mechanism (371). The elastic connector (372) includes a fixing plate (3721) and a spring (3722) mounted on the fixing plate (3721). The fixing plate (3721) is fixedly connected to the lifting bracket (343). The upper end of the cylinder mechanism (371) passes through the spring (3722). The upper end of the cylinder mechanism (371) includes a first stop and a second stop connected to each other. Along the second direction, the first stop and the second stop clamp the spring (3722).

7. The wafer alignment apparatus (10) according to claim 6, characterized in that, The upper end of the cylinder mechanism (371) includes a guide shaft (3711) and a first screw (3712), the tail of the first screw (3712) passes through the spring (3722) and is threaded to the upper end of the guide shaft (3711). The upper end of the guide shaft (3711) is the first stop part, the head of the first screw (3712) is the second stop part, and they abut against the lifting bracket (343).

8. The wafer alignment apparatus (10) according to claim 1, characterized in that, The lower wafer module (300) also includes a first driving component (382) and an air float (383). The lower wafer carrier (330) is disposed on the top surface of the air-bearing seat (383), the bottom surface of the air-bearing seat (383) and the top surface of the movable seat (320) are connected by air-bearing connection, and the first driving component (382) drives the lower wafer carrier (330) to translate or rotate along a plane parallel to the top surface of the movable seat (320). The upper wafer module (200) also includes a column (240) extending along the second direction. The lower end of the column (240) is fixedly connected to the base (100), and the upper end of the column (240) carries the upper wafer carrier (210). The side of the column (240) is air-floatedly connected to the side of the air-float base (383).

9. The wafer alignment apparatus (10) according to claim 8, characterized in that, The lower wafer module (300) further includes a clamping assembly (384) that connects the air float (383) and the movable seat (320) for clamping or releasing the air float (383) and the movable seat (320).

10. The wafer alignment apparatus (10) according to claim 1, characterized in that, The movable seat (320) is provided with a second through hole (321) extending along the second direction. The lower wafer module (300) also includes a ejector pin assembly (390). The ejector pin assembly (390) includes a first adapter plate (391), a second adapter plate (392), a second drive assembly (393), and a plurality of ejector pins (394) extending along the second direction. Along the second direction, the lower wafer carrier (330) and the second driving assembly (393) are located on opposite sides of the second through hole (321), one end of the first adapter plate (391) passes through the second through hole (321) and is fixedly connected to the lower wafer carrier (330), the other end of the first adapter plate (391) is fixedly connected to the fixed end of the second driving assembly (393), the driving end of the second driving assembly (393) is connected to the second adapter plate (392), the lower end of the ejector pin (394) is fixedly connected to the second adapter plate (392), and the upper end of the ejector pin (394) is used to abut against the lower wafer.

11. The wafer alignment apparatus (10) according to claim 10, characterized in that, The ejector pin (394) includes an ejector pin body (3941), a hollow bolt (3942), a nut (3943), and a marking element (3944). The ejector pin body (3941) is inserted into the hollow bolt (3942). The hollow bolt (3942) passes through the marking element (3944) and is threadedly connected to the nut (3943). The marking element (3944) passes through the second adapter plate (392) and is fixedly connected to the second adapter plate (392).

12. The wafer alignment apparatus (10) according to claim 11, characterized in that, The ejector pin (394) further includes an adjusting member (3945), which is disposed between the ejector pin body (3941) and the hollow bolt (3942) for adjusting the position of the ejector pin body (3941) in the second direction; And / or, the hollow bolt (3942) of one of the plurality of ejector pins (394) is transition-fitted with its corresponding mark (3944), while the hollow bolts (3942) of the remaining ejector pins (394) are clearance-fitted with their corresponding mark (3944).

13. The wafer alignment apparatus (10) according to claim 11, characterized in that, At least one of the multiple pins (394) of the mark (3944) has a different appearance from the other marks (3944).

14. The wafer alignment apparatus (10) according to claim 10, characterized in that, The fixing base (310) has a third through hole (314) extending along the second direction. The third through hole (314) is connected to the second through hole (321) along the second direction. The first adapter plate (391) and the second drive assembly (393) pass through the third through hole (314). The solid portion of the fixing base (310) used to form the third through hole (314) includes a first portion (315) and a second portion (316), the first portion (315) and the second portion (316) are detachably connected, and the first portion (315) and the first adapter plate (391) are arranged opposite to each other along the first direction.

15. A wafer alignment system (1), characterized in that, Includes a wafer alignment device (10) according to any one of claims 1 to 14; The plurality of wafer alignment devices (10) include a first wafer alignment device (10a) and a second wafer alignment device (10b), wherein the first wafer alignment device (10a) and the second wafer alignment device (10b) are arranged side by side along a third direction, the third direction being perpendicular to the first direction and the second direction; and / or The plurality of wafer alignment devices (10) include a third wafer alignment device (10c) and a fourth wafer alignment device (10d), wherein the third wafer alignment device (10c) and the fourth wafer alignment device (10d) are arranged side by side and spaced apart along the first direction.

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