Cooling slide holder based on water circulation

Abstract

The utility model discloses a cooling slide holder based on water circulation, which relates to the technical field of semiconductor test equipment and comprises a slide holder and a circulation disc. The chip holder is used for placing a chip; a connecting device is arranged between the circulating disc and the slide holder, the circulating disc and the slide holder are connected through the connecting device, a water flow channel is arranged in the circulating disc, and the head and tail ends of the water flow channel are respectively a water inlet and a water outlet. According to the cooling slide holder based on water circulation, heat of the slide holder can be taken away in time under the condition that chip testing is not affected, and a chip is maintained in a reasonable temperature interval.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing equipment, in particular to a cooling wafer stage based on water circulation. Background Art

[0002] After the chip is made, a probe test is required to detect whether the chip functions normally. Specifically, the probe is used to contact the detection point of the chip to connect the circuit. A large current will be applied during the detection process. As the current applied increases, the chip will generate a large amount of heat, causing the temperature of the detection platform to rise sharply. However, chip testing is sensitive to temperature, and the temperature control requirements are very strict. Therefore, the detection platform used to place the chip needs to release heat in time to maintain the temperature within a reasonable range. Generally, air cooling is provided at the detection platform, but air cooling is prone to generate dust, which will affect the cleanliness of the chip. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a cooling wafer stage based on water circulation, which can remove the heat of the wafer stage in time without affecting chip testing and maintain the chip within a reasonable temperature range.

[0004] The cooling wafer stage based on water circulation according to the embodiment of the utility model comprises: a wafer stage, wherein the wafer stage is used to place a chip;

[0005] A circulation disk, wherein a connecting device is provided between the circulation disk and the wafer stage and the circulation disk and the wafer stage are connected to each other through the connecting device. A water flow channel is provided inside the circulation disk, and the first and last ends of the water flow channel are respectively a water inlet and a water outlet.

[0006] The cooling wafer stage based on water circulation according to the embodiment of the utility model has at least the following beneficial effects: the water inlet is used to connect to the cold water pipe, the water outlet is used to connect to the return water pipe, the cooling water can continuously flow inside the circulation disk through the water flow channel of the circulation disk for heat exchange, and take away the heat of the circulation disk; the wafer stage is used to place the chip, and the large amount of heat generated during the chip test is transferred to the circulation disk through the wafer stage, and then taken away by the water flow, thereby ensuring that the temperature of the wafer stage is controlled within a reasonable range. Compared with air cooling, water circulation heat dissipation is more efficient and will not have an adverse effect on chip detection.

[0007] According to some embodiments of the utility model, the connecting device includes an adsorption mechanism, and negative pressure adsorption is performed between the wafer carrier and the adsorption mechanism, and negative pressure adsorption is also performed between the circulation disk and the adsorption mechanism.

[0008] According to some embodiments of the utility model, a connecting disk is provided between the wafer carrier and the circulation disk, both sides of the connecting disk are flat surfaces, a side of the wafer carrier in contact with the connecting disk is provided with a first adsorption surface, and a side of the circulation disk in contact with the connecting disk is provided with a second adsorption surface.

[0009] According to some embodiments of the utility model, the first adsorption surface is provided with a plurality of first air guide grooves, the wafer carrier is provided with a first air suction nozzle, the plurality of first air guide grooves are interconnected, and the first air guide grooves are connected to the first air suction nozzle.

[0010] According to some embodiments of the present invention, the plurality of first air guide grooves include a plurality of radial air guide grooves disposed on the first adsorption surface, and a plurality of arc-shaped air guide grooves are disposed between the radial air guide grooves and are connected.

[0011] According to some embodiments of the utility model, the circulation disk includes a first disk body and a second disk body stacked and fixed on each other, the side of the first disk body away from the second disk body is in contact with the wafer carrier, and a water guide groove is provided on the surface of the first disk body facing the second disk body, and the water guide groove and the disk surface of the second disk body together constitute the water flow channel.

[0012] According to some embodiments of the present invention, the water guide groove is spirally arranged on the first disk.

[0013] According to some embodiments of the present utility model, a connecting rod for fixed connection is provided between the first disk body and the second disk body, and the connecting rod passes through the second disk body and is screwed into the first disk body.

[0014] According to some embodiments of the utility model, a side of the circulation disk away from the wafer carrier is connected to a bottom plate, and the bottom plate is provided with a fixing device.

[0015] According to some embodiments of the utility model, a plurality of second air guide grooves are provided inside the wafer stage, the wafer stage is provided with a second air exhaust nozzle, a plurality of air guide holes are provided on a side surface of the wafer stage away from the circulation disk, the second air guide grooves are connected with the air guide holes, and the second air guide grooves are connected with the second air exhaust nozzle.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0018] Figure 1This is a schematic diagram of the structure of a cooling wafer stage based on water circulation according to an embodiment of the utility model;

[0019] Figure 2 It is a schematic diagram of the exploded structure of the cooling wafer stage based on water circulation in the embodiment of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the wafer carrier in the embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the first adsorption surface in the embodiment of the utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the circulation disk in the embodiment of the utility model;

[0023] Figure 6 This is a schematic diagram of the structure of the bottom plate and the fixing device in the embodiment of the utility model;

[0024] Figure 7 It is a schematic diagram of the partially enlarged structure of the wafer carrier in the embodiment of the utility model.

[0025] Figure Number:

[0026] The wafer carrier 100, the first adsorption surface 101, the first air guide groove 102, the first air suction nozzle 103, the second air suction nozzle 104, the air guide hole 105, the circulation disk 200, the second adsorption surface 201, the water inlet 210, the water outlet 220, the first disk body 230, the water guide groove 231, the second disk body 240, the connecting device 300, the adsorption mechanism 310, the connecting disk 311, the connecting rod 410, the bottom plate 420, and the fixing device 430. DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] In the description of the present invention, it should be understood that the descriptions involving orientation, such as the orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In the description of the present utility model, "a plurality" means more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0030] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0031] In chip manufacturing related technologies, the chip needs to be placed on a testing platform for testing, which can be a wafer stage. To test whether the chip functions normally, a large current is often applied to the chip, which generates a large amount of heat. The heat cannot be released in time through natural heat dissipation, causing the temperature of the chip and the wafer stage to rise sharply, affecting the test. If air cooling is used, although the test area is a dust-free environment, it is relatively impossible to be completely clean, and the wind can easily carry dust in the air to the chip.

[0032] Reference Figure 1 As shown, a cooling wafer stage based on water circulation in one embodiment of the utility model comprises a wafer stage 100 and a circulation disk 200. The wafer stage 100 is used to place chips; a connecting device 300 is provided between the circulation disk 200 and the wafer stage 100 and they are connected to each other through the connecting device 300, and a water flow channel is provided inside the circulation disk 200, and the first and last ends of the water flow channel are respectively a water inlet 210 and a water outlet 220. This embodiment can take away the heat of the wafer stage in time without affecting the chip test, and maintain the chip in a reasonable temperature range.

[0033] The connecting device 300 is used to connect the circulation disk 200 and the wafer stage 100, so that good contact is formed between the circulation disk 200 and the wafer stage 100 to achieve heat transfer. The chip generates a large amount of heat on the wafer stage 100. Since cooling water is passed through the circulation disk 200 for cooling, the heat is transferred toward the circulation disk 200 with a lower temperature, and the heat is taken away by the cooling water to achieve temperature control of the wafer stage 100. The water inlet 210 is used to connect an external cold water pipeline. The cooling water enters the water flow channel inside the circulation disk 200 from the water inlet 210, exchanges heat with the circulation disk 200 to carry heat, and indirectly cools the wafer stage 100. The heated water flows out from the water outlet 220, and the water outlet 220 is externally connected to a reflux pipeline, and the cooling water can also be recycled.

[0034] It can be understood that the connecting device 300 includes an adsorption mechanism 310 , and the wafer stage 100 and the adsorption mechanism 310 are adsorbed by negative pressure, and the circulation disk 200 and the adsorption mechanism 310 are also adsorbed by negative pressure.

[0035] The wafer stage 100 and the circulation disk 200 are respectively connected to the adsorption mechanism 310 by means of negative pressure adsorption. Compared with external clamps or bolt connections, the adsorption mechanism 310 adopts a negative pressure adsorption method, which can ensure that the wafer stage 100 and the circulation disk 200 are tightly fitted, thereby improving the heat transfer efficiency and thus improving the heat dissipation effect, and making it easier to control the temperature of the wafer stage 100 within a reasonable range.

[0036] Reference Figure 2 As shown, it can be understood that a connecting disk 311 is provided between the wafer carrier 100 and the circulation disk 200, both sides of the connecting disk 311 are flat surfaces, a side of the wafer carrier 100 in contact with the connecting disk 311 is provided with a first adsorption surface 101, and a side of the circulation disk 200 in contact with the connecting disk 311 is provided with a second adsorption surface 201.

[0037] The flatter the surface of the connection disk 311 is, the smaller the gap between the wafer stage 100 and the circulation disk 200 and the contact surface of the connection disk 311 is, or even the gap is eliminated, thereby increasing the contact area and improving the heat transfer efficiency. At the same time, a smaller gap also makes it easier to maintain the negative pressure between the wafer stage 100 and the connection disk 311, as well as the negative pressure between the circulation disk 200 and the connection disk 311, thereby improving the stability of the adsorption connection.

[0038] Reference Figure 3 and Figure 4 As shown, it can be understood that in one embodiment, the first adsorption surface 101 is provided with a plurality of first air guide grooves 102, the wafer carrier 100 is provided with a first air suction nozzle 103, the plurality of first air guide grooves 102 are interconnected, and the first air guide grooves 102 are connected to the first air suction nozzle 103.

[0039] The first vacuum nozzle 103 is used for an external vacuum pumping device. When the first adsorption surface 101 contacts the surface of the connecting disk 311, the first air guide groove 102 and the surface of the connecting disk 311 form a closed area. The first air guide groove 102 is evacuated by the vacuum pumping device to form a negative pressure. The first adsorption surface 101 can be in close contact with the connecting disk 311 to fix the wafer carrier 100 on the connecting disk 311.

[0040] Similarly, the second adsorption surface 201 of the circulation disk 200 may also adopt the same or similar structural design as the first adsorption surface 101 to achieve adsorption and fixation of the circulation disk 200 and the connecting disk 311 .

[0041] It can be understood that the plurality of first air guiding grooves 102 include a plurality of radial air guiding grooves disposed on the first adsorption surface 101 , and a plurality of arc-shaped air guiding grooves are disposed between the radial air guiding grooves and are connected.

[0042] The radial air guide grooves can be distributed as much as possible on the first adsorption surface 101, and the radial air guide grooves are connected by arc-shaped air guide grooves, which can improve the adsorption effect of the first adsorption surface 101, and the force at various locations of the first adsorption surface 101 can be evenly distributed.

[0043] Reference Figure 5 As shown, it can be understood that the circulation disk 200 includes a first disk body 230 and a second disk body 240 which are stacked and fixed on each other, and the side of the first disk body 230 away from the second disk body 240 is in contact with the wafer carrier 100, and a water guide groove 231 is provided on the surface of the first disk body 230 facing the second disk body 240, and the water guide groove 231 and the disk surface of the second disk body 240 together constitute a water flow channel.

[0044] The circulation disk 200 is divided into a first disk body 230 and a second disk body 240, so as to facilitate the opening of a water guide groove 231 inside the circulation disk 200. The water guide groove 231 can be opened on the first disk body 230 or the second disk body 240. In the present embodiment, it is preferably opened on the first disk body 230 closer to the wafer stage 100 to improve the heat exchange efficiency. It is understandable that the first disk body 230 and the second disk body 240 can both be opened with a water guide groove 231 to form a water flow channel when stacked and assembled, but this scheme has high requirements for the stacking and positioning of the first disk body 230 and the second disk body 240, so it is preferred to open the water guide groove 231 only on the first disk body 230. When the first disk body 230 and the second disk body 240 are stacked, the water guide groove 231 is closed by the surface of the second disk body 240 to form a water flow channel.

[0045] It can be understood that the water guide groove 231 is spirally disposed on the first plate 230 .

[0046] The spirally wound water guide groove 231 can extend the flow path of the cooling water in the circulation disk 200 , thereby extending the heat exchange time between the cooling water and the circulation disk 200 , and improving the cooling capacity of the circulation disk 200 .

[0047] Reference Figure 6 As shown, it can be understood that a connecting rod 410 for fixed connection is provided between the first disk body 230 and the second disk body 240 , and the connecting rod 410 passes through the second disk body 240 and is screwed into the first disk body 230 .

[0048] The second disk body 240 may be provided with a through hole for the connecting rod 410 to pass through, and the end of the connecting rod 410 may be provided with a threaded structure for screwing into the first disk body 230 for fixing. The connecting rod 410 may be provided with a shoulder, and the shoulder abuts against the second disk body 240, and the end is threadedly connected with the first disk body 230, thereby connecting the first disk body 230 and the second disk body 240. Of course, the above is only one embodiment, and the connecting rod 410 may also be threadedly connected with the second disk body 240, that is, the second disk body 240 has a threaded through hole for the connecting rod 410 to be screwed out.

[0049] It can be understood that a bottom plate 420 is connected to the side of the circulation disk 200 away from the wafer carrier stage 100 , and the bottom plate 420 is provided with a fixing device 430 .

[0050] The fixture 430 is used to connect with the moving parts of the test equipment, and the bottom plate 420 is used to connect with the circulation disk 200, so as to install the fixture 430 on the circulation disk 200. The circulation disk 200 is connected with the moving parts to realize the movement of the wafer stage 100, and is used with the test equipment for automation.

[0051] Reference Figure 7 As shown, it can be understood that a plurality of second air guide grooves are provided inside the wafer stage 100, the wafer stage 100 is provided with a second air exhaust nozzle 104, a plurality of air guide holes 105 are provided on the side surface of the wafer stage 100 away from the circulation disk 200, the second air guide grooves are connected to the air guide holes 105, and the second air guide grooves are connected to the second air exhaust nozzle 104.

[0052] The second air suction nozzle 104 is also used for connecting an external vacuum pump. A negative pressure trend can be formed on the surface of the wafer stage 100 through the second air guide groove and the air guide hole 105. When a chip is placed on the surface of the wafer stage 100, it can be fixed on the wafer stage 100 by negative pressure adsorption.

[0053] A specific test process is that the chip is placed on the surface of the wafer stage 100, and a negative pressure is formed on the surface of the wafer stage 100 by a vacuum device, so that the chip is adsorbed on the wafer stage 100. The test equipment starts to test the chip, and a temperature sensor can be placed on the wafer stage 100. When the temperature detected by the temperature sensor reaches the set value, the chiller (external cooling water supply equipment) starts cooling, and the water inlet 210 and the water outlet 220 are respectively connected to the pipes of the chiller to ensure that the cooling water of the chiller enters the circulation disk 200 from the water inlet 210 and returns to the chiller from the water outlet 220. The chiller introduces low-temperature cooling water into the circulation disk 200 for circulating heat exchange, and finally transfers heat to the wafer stage 100 for heat dissipation and cooling.

[0054] It is understandable that the temperature sensor can also be used for feedback regulation. When the temperature sensor detects that the temperature of the wafer stage 100 is about to exceed the set temperature value, the water chiller can be turned on. When the temperature sensor detects that the temperature of the wafer stage 100 is about to fall below the set temperature value, the water chiller can be stopped. By starting and stopping the water chiller, the degree of heat exchange is controlled, and the temperature of the wafer stage 100 is controlled within a reasonable range.

[0055] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A cooling slide stage based on water circulation, It is characterized in that include: A chip carrier (100), the chip carrier (100) being used to place a chip; A circulation disk (200), wherein a connecting device (300) is provided between the circulation disk (200) and the wafer carrier (100), and the two are connected to each other through the connecting device (300), and a water flow channel is provided inside the circulation disk (200), and the first and last ends of the water flow channel are a water inlet (210) and a water outlet (220), respectively.

2. The cooling stage based on water circulation according to claim 1, Features: The connecting device (300) includes an adsorption mechanism (310), and negative pressure adsorption is performed between the wafer carrier (100) and the adsorption mechanism (310), and negative pressure adsorption is also performed between the circulation disk (200) and the adsorption mechanism (310).

3. The cooling wafer stage based on water circulation according to claim 2, Features: A connecting disk (311) is provided between the wafer carrier (100) and the circulation disk (200), and both sides of the connecting disk (311) are flat surfaces. The side of the wafer carrier (100) in contact with the connecting disk (311) is provided with a first adsorption surface (101), and the side of the circulation disk (200) in contact with the connecting disk (311) is provided with a second adsorption surface (201).

4. The cooling stage based on water circulation according to claim 3, Features: The first adsorption surface (101) is provided with a plurality of first air guide grooves (102), the wafer carrier (100) is provided with a first air suction nozzle (103), the plurality of first air guide grooves (102) are interconnected, and the first air guide grooves (102) are connected to the first air suction nozzle (103).

5. The cooling stage based on water circulation according to claim 4, Features: The plurality of first air guiding grooves (102) include a plurality of radial air guiding grooves arranged on the first adsorption surface (101), and a plurality of arc-shaped air guiding grooves are arranged between the radial air guiding grooves and are connected.

6. The cooling stage based on water circulation according to claim 1, Features: The circulation disk (200) comprises a first disk body (230) and a second disk body (240) which are stacked and fixed on each other, wherein a side of the first disk body (230) away from the second disk body (240) is in contact with the wafer carrier (100), and a water guide groove (231) is provided on a surface of a side of the first disk body (230) facing the second disk body (240), and the water guide groove (231) and the disk surface of the second disk body (240) together constitute the water flow channel.

7. The cooling stage based on water circulation according to claim 6, Features: The water guide groove (231) is spirally arranged on the first disk body (230).

8. The cooling stage based on water circulation according to claim 6, Features: A connecting rod (410) for fixed connection is provided between the first disk body (230) and the second disk body (240); the connecting rod (410) passes through the second disk body (240) and is screwed into the first disk body (230).

9. The cooling stage based on water circulation according to claim 1, Features: A bottom plate (420) is connected to the side of the circulation disk (200) away from the wafer carrier (100), and the bottom plate (420) is provided with a fixing device (430).

10. The cooling wafer stage based on water circulation according to claim 1, Features: A plurality of second air guide grooves are provided inside the wafer carrier (100), and a second air suction nozzle (104) is provided on the wafer carrier (100). A plurality of air guide holes (105) are provided on a surface of the wafer carrier (100) away from the circulation disk (200), and the second air guide grooves are connected to the air guide holes (105), and the second air guide grooves are connected to the second air suction nozzle (104).

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