Radio frequency module, radar and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of semiconductors, and discloses a radio frequency module, radar and electronic equipment, the radio frequency module comprises a chip packaging body, the chip packaging body is provided with at least one radiation part, and a plurality of salient points are arranged around the radiation part and form a first waveguide channel; a second waveguide channel is arranged at the position, corresponding to each first waveguide channel, of the PCB carrier plate; the waveguide antenna is provided with at least one antenna unit and a third waveguide channel; wherein the first waveguide channel, the second waveguide channel and the third waveguide channel are communicated to form a radio frequency signal transmission channel. According to the scheme, the loss of the module on the feeder line can be effectively reduced, and the waveguide antenna is externally connected to the PCB, so that replacement is convenient to realize.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor technology, and in particular to a radio frequency module, a radar, and an electronic device. Background Art

[0002] In traditional packaging technology, the RF signal is generated by an integrated circuit (IC) and connected to an external circuit through a package. After fanning out, the RF signal is connected to the planar waveguide in the printed circuit board (PCB) through solder balls to achieve a signal path. The RF signal is connected to the antenna via the planar waveguide feeder on the PCB. Since the planar waveguide has large dielectric loss and radiation loss, these losses are proportional to the length of the feeder. This RF module that uses a planar waveguide to feed the antenna has a large loss; and since the antenna is designed on the PCB, once the chip is soldered to the PCB, the antenna cannot be replaced. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a radio frequency module, radar and electronic equipment, which can effectively reduce the loss of the module on the feeder, and the waveguide antenna is externally connected to the PCB board to facilitate replacement.

[0004] In order to solve the above technical problems, an embodiment of the present application provides a radio frequency module, including:

[0005] A chip package, wherein at least one radiation portion is disposed on a first surface of the chip package, and a plurality of bumps are disposed on the first surface, wherein the plurality of bumps are disposed around the radiation portion and form a first waveguide channel;

[0006] A PCB carrier having a second surface and a third surface opposite to each other, wherein the second surface is butted against the first surface of the chip package, and a second waveguide channel is arranged at a position of the PCB carrier corresponding to the first waveguide channel;

[0007] A waveguide antenna, comprising a fourth surface and a fifth surface opposite to each other, wherein the fourth surface is connected to the third surface, at least one antenna unit is arranged on the fifth surface, and a third waveguide channel is arranged inside the waveguide antenna;

[0008] Among them, the first waveguide channel, the second waveguide channel, and the third waveguide channel are connected to form a radio frequency signal transmission channel.

[0009] Compared with the related art, the embodiment of the present application designs a radiating part on the external surface of the chip package, and sets a plurality of protrusions around the radiating part, and these protrusions form a first waveguide channel around each radiating part; a second waveguide channel is set on the PCB carrier corresponding to each first waveguide channel, and a third waveguide channel is set in the waveguide antenna. The RF signal is connected through the first waveguide channel, the second waveguide channel and the third waveguide channel to form an RF signal transmission channel, and the RF signal in the package is transmitted to the external waveguide antenna without the need for other conversion structures, thereby reducing the complexity of the design, and is also beneficial to reducing the chip size, increasing the channel isolation of the multi-channel system and reducing the system loss; the use of the waveguide antenna process can also effectively reduce the feeder loss and improve the performance of the RF module.

[0010] In some embodiments, the chip package includes at least a substrate and an IC bare chip; a side of the substrate facing away from the IC bare chip is the first surface, a feeder is arranged inside the substrate, and the RF signal is transmitted to the radiation part through the feeder.

[0011] In some embodiments, the substrate includes at least a metal ground layer, a feed line layer, and a patch layer; the feed line is arranged in the feed line layer, and the radiating part is arranged in the patch layer; wherein the RF signal is coupled to the radiating part through the feed line.

[0012] In some embodiments, an isolation structure is disposed on the fourth surface, and the isolation structure includes a plurality of periodically arranged protrusion structures.

[0013] In some embodiments, the protrusion structure includes a plurality of first protrusion structures and a plurality of second protrusion structures, and a cross-sectional area of ​​the first protrusion structure is greater than or equal to a cross-sectional area of ​​the second protrusion structure.

[0014] In some embodiments, a gap between the upper surface of the first convex structure and the second convex structure and the third surface is no greater than 400 μm.

[0015] In some embodiments, the plurality of first protrusion structures are located at a midline of a long side of the third waveguide channel.

[0016] In some embodiments, the heights of the first protruding structure and the second protruding structure are Wherein λ is the operating wavelength of the radio frequency signal.

[0017] In some embodiments, a plurality of the second protrusion structures are arranged around the first protrusion structure, and the first protrusion structure and the second protrusion structure are cylinders.

[0018] In some embodiments, the diameter of the second protrusion structure is Wherein λ is the operating wavelength of the radio frequency signal.

[0019] In some embodiments, the distance between the first protruding structure and the adjacent second protruding structure is Wherein λ is the operating wavelength of the radio frequency signal.

[0020] In some embodiments, the third waveguide channel is connected to the antenna unit from one end of the broadside side of the antenna unit or from a middle position of the broadside side.

[0021] In some embodiments, the third waveguide channel includes at least two cavity segments with rectangular cross-sections, and a stepped transition structure is provided at the connection between adjacent cavity segments.

[0022] In some embodiments, the radiating portion is a radiating patch.

[0023] In some embodiments, a cross-section of the second waveguide channel is a single-ridge type.

[0024] In some embodiments, the bumps are solder balls.

[0025] In some embodiments, the second surface is connected to the first surface via a plurality of solder balls.

[0026] In some embodiments, the second waveguide channels are arranged in an array, and long sides of two adjacent second waveguide channels are perpendicular to each other.

[0027] In some embodiments, the antenna unit comprises a plurality of radiation slots for transmitting and / or receiving the radio frequency signal.

[0028] Another aspect of an embodiment of the present application provides a radar, including: a radio frequency module as described in any of the above embodiments.

[0029] On the other hand, an embodiment of the present application provides an electronic device, including: the radar as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0031] Figure 1 is a cross-sectional view of a radio frequency module in the prior art;

[0032] Figure 2 is a cross-sectional view of a radio frequency module provided according to an embodiment of the present application;

[0033] Figure 3is a cross-sectional view of the connection between a substrate and a PCB carrier provided according to an embodiment of the present application;

[0034] Figure 4 is a top view of a substrate and a bump connection provided according to an embodiment of the present application;

[0035] Figure 5 is a top view of the connection between a substrate, a bump and a PCB carrier provided according to an embodiment of the present application;

[0036] Figure 6 is a top view of a PCB carrier provided according to an embodiment of the present application;

[0037] Figure 7 is a top view of a waveguide antenna provided according to an embodiment of the present application;

[0038] Figure 8 is a schematic diagram of a connection method between a feeder and an antenna unit provided according to an embodiment of the present application;

[0039] Fig. 9 is a schematic diagram of the layout of feeder lines and antenna units provided according to an embodiment of the present application;

[0040] Fig.10 is a schematic diagram of a double-layer structure of a waveguide antenna provided according to an embodiment of the present application;

[0041] Fig.11 It is a schematic diagram of a stepped transition structure provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0042] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for the convenience of description, and the specific implementation of the present application should not be construed as any limitation, and the various embodiments can be combined and referenced with each other without contradiction.

[0043] In traditional packaging technology, such as Figure 1As shown, the RF signal is generated by the IC in the chip 01 and connected to the external circuit through the package. After the RF signal is fanned out through the package substrate, it passes through the solder ball 02 and the planar waveguide in the PCB board 03 to realize the signal path, and then connects to the antenna 04 on the PCB board 03 through the planar waveguide feeder. That is, the transmission process of the RF signal from the IC to the antenna 04 is completed through the planar waveguide mode, and the antenna 04 is also fixedly set on the side surface of the PCB board 03 facing the chip 01. Since the planar waveguide has large dielectric loss and radiation loss, these losses are proportional to the length of the feeder. Therefore, the RF module that uses a planar waveguide to feed the antenna has a large system loss; and the antenna is designed on the PCB board. Once the chip is soldered to the PCB board, the antenna cannot be replaced.

[0044] An embodiment of the present application relates to a radio frequency module, such as Figure 2 As shown, the radio frequency module includes: a chip package 11, a PCB carrier board 21 and a waveguide antenna 31.

[0045] The chip package 11 has a first surface S1 of the chip package 11 on which at least one radiation portion 12 is disposed. The first surface S1 is provided with a plurality of bumps 13 . The plurality of bumps 13 are disposed around the radiation portion 12 and form a first waveguide channel 14 .

[0046] The first surface S1 is a side of the chip package 11 facing the PCB carrier 21, and a radiation part 12 is arranged on the first surface S1, and the radiation part 12 is used to send and receive radio frequency signals. The radiation part 12 can be a radiation patch, but the radiation part 12 is not limited to the radiation patch, and can also be other forms of radiation structures; the shape of the radiation patch can be at least one of a rectangle, a diamond and a butterfly, or any other pattern shape; the radiation patch is arranged in a patterned form in the metal layer of the integrated circuit.

[0047] There can be multiple radiation parts 12, and multiple bumps 13 are arranged around each radiation part 12. The bumps 13 can be solder balls, or can be implemented by conductive adhesive or the like. The bumps 13 can be in any shape such as spherical, columnar, or block; the bumps 13 can be metal solder balls, and the material thereof can be gold, copper, copper-nickel-gold, tin, or the like.

[0048] Figure 2 and Figure 3 In the figure, the space surrounded by the plurality of protrusions 13 is used as a waveguide channel for transmitting radio frequency signals, and is called a first waveguide channel 14.

[0049] Figure 2 and Figure 4In the figure, the radio frequency signal inside the chip package 11 can be radiated into the first waveguide channel through the radiation part 12. The bumps 13 arranged around the radiation part 12 are connected to the chip package 11 at one end and to the PCB carrier 21 at the other end. The closed rectangular circle thus formed can confine the electromagnetic wave in a single signal transmission channel, thereby effectively preventing signal leakage between channels, reducing crosstalk between channels, and improving isolation.

[0050] Figure 2 In the embodiment, the PCB carrier 21 has a second surface S2 and a third surface S3 opposite to each other. The second surface S2 is connected to the first surface S1 of the chip package 11 . A second waveguide channel 22 is arranged at a position of the PCB carrier 21 corresponding to the first waveguide channel 14 .

[0051] Among them, the second surface S2 and the third surface S3 are two surfaces parallel to each metal layer in the PCB board 21, wherein the second surface S2 is in direct contact with the bump 13 to achieve docking between the PCB carrier 21 and the chip package 11. When the bump 13 is a solder ball, the second surface S2 can be connected to the first surface S1 through the solder ball through the welding effect of the solder ball to achieve stable docking. On the second surface S2 after docking, a second waveguide channel 22 that runs through the second surface S2 and the third surface S3 is provided at a position corresponding to each first waveguide channel 14. The cross section of the second waveguide channel 22 can be a single ridge type, or can be a rectangular, double ridge type, or other structures.

[0052] The cross section of the second waveguide channel 22 is set to a single-ridge type, which can effectively reduce the area occupied by the second waveguide channel 22 on the PCB carrier 21 compared to the conventional rectangular waveguide. Since the channel port size of the first waveguide channel 14 surrounded by the bumps 13 is consistent with that of the second waveguide channel 22, the setting of the single-ridge waveguide channel can reduce the size of the chip package 11 by reducing the size of the first waveguide channel 14.

[0053] Figure 2 In the figure, the waveguide antenna 31 has a fourth surface S4 and a fifth surface S5 opposite to each other. The fourth surface S4 is connected to the third surface S3. At least one antenna unit 32 is arranged on the fifth surface S5. A third waveguide channel 33 is arranged inside the waveguide antenna 31.

[0054] Among them, the fourth surface S4 is the side where the waveguide antenna 31 is connected to the third surface S3 of the PCB carrier 21, and the fifth surface S5 is the side away from the PCB carrier 21 when the waveguide antenna 31 is connected to the PCB carrier 21. An antenna unit 32 is arranged on the fifth surface S5, and the antenna unit 32 is used to send and receive radio frequency signals. Each antenna unit 32 may include multiple radiation slots (waveguide slot antennas) for transmitting and / or receiving radio frequency signals. There are multiple third waveguide channels 33 arranged in the waveguide antenna 31, and one end of each third waveguide channel 33 is connected to a second waveguide channel 22, and the other end is connected to an antenna unit 32.

[0055] Figure 2 In the embodiment, the RF signal generated in the chip package 11 is coupled to the radiating portion 12 and then radiated outward, and is transmitted to the antenna unit 32 through the RF signal transmission channel formed by the first waveguide channel 14, the second waveguide channel 22 and the third waveguide channel 33 connected in sequence, and then radiated outward by the antenna unit 32 as a radio signal; conversely, after receiving the radio signal, the antenna unit 32 transmits it to the radiating portion 12 through the RF signal transmission channel formed by the third waveguide channel 33, the second waveguide channel 22 and the first waveguide channel 14, and the radiating portion 12 then couples the received signal to the inside of the chip package 11 for processing.

[0056] Among them, the RF signal transmission channel can realize the connection between the chip package 11, the PCB carrier 21 and the waveguide antenna 31 and the matching of the RF signal. The waveguide antenna 31 can be directly connected to the chip package 11 without other conversion structures, thereby reducing the load of the design. Compared with the planar waveguide, the use of the waveguide antenna 31 can effectively reduce the feeder loss and improve the output performance of the RF module.

[0057] In addition, the PCB carrier 21 is located between the chip package 11 and the waveguide antenna 31. In addition to being used to connect the chip package 11 and the waveguide antenna 31, it can also carry other peripheral circuits, and these peripheral circuits and the second waveguide channel 22 can be isolated from each other by setting a gap in the non-metallic area.

[0058] In some embodiments, Figure 2 As shown, the chip package 11 at least includes a substrate 15 and an IC die 16 . The side of the substrate 15 facing away from the IC die 16 is a first surface S1 , and a feed line 17 is disposed inside the substrate, and the RF signal is transmitted to the radiation portion 12 via the feed line 17 .

[0059] The substrate 15 serves as a carrier of the IC die 16 and a medium for transmitting the RF signal generated by the IC die 16 to the radiating portion 12. By arranging a feed line 17 inside the substrate, the RF signal generated by the IC die 16 can be fanned out to a plurality of radiating portions 12 that are relatively dispersed.

[0060] In some embodiments, Figure 3 to Figure 5 As shown, the substrate 15 at least includes a metal ground layer 151, a feeder layer 152, and a patch layer 153; the feeder 17 is arranged on the feeder layer 151, and the radiation part 12 is arranged on the patch layer 153, wherein the radio frequency signal is coupled to the radiation part 12 through the feeder 17.

[0061] Figure 3 It is a top view of the feeder layer 152 and the patch layer 153 , and the viewing angle is from the inside of the chip package 11 to the outside of the chip package 11 . Figure 2 and Figure 3 In the figure, the radio frequency signal generated by the IC bare chip 16 is transmitted to the feeder layer 152 through the via 18, and is coupled to the radiating part 12 of the patch layer 153 at the end of the feeder 17. The feeder layer 152 and the patch layer 153 have rectangular windows 19 facing each other. The sizes of the two rectangular windows 19 can be the same or different. The feeder 17 and the radiating part 12 are respectively located in the rectangular windows 19 of the metal layers to which they belong, and the outside of the rectangular windows 19 is GND. The gap generated by the rectangular windows 19 can isolate the feeder 17 and the radiating part 12 from the external GND. Vias 18 arranged at equal intervals can also be set on the inner side of the GND near the rectangular windows 19. These vias 18 connect the GND of the feeder layer 152 and the GND of the patch layer 153. Below the patch layer 153, there is a circle of grounded solder balls 13 that are soldered below the GND circle outside the rectangular windows 19, and the lower surface of the solder balls is soldered on the PCB carrier 21.

[0062] Figure 4-5 In the embodiment, when the radiating part 12 radiates the millimeter wave signal obtained from the feed line 17 in a coupled manner, the closed first waveguide channel 14 surrounded by the solder balls 13 surrounding the radiating part 12 can confine the electromagnetic wave in a single signal transmission channel, thereby reducing the crosstalk between channels and improving the isolation. The cavity surrounded by the GND of the patch layer 153 in the substrate 15, the solder balls 13 and the metal on the upper surface of the PCB carrier 21 is located between the radiating part 12 and the single ridge opening (the second waveguide channel 22), which plays a role in mode matching and impedance matching, so that the electromagnetic wave can be well converted from the transmission mode of the planar microstrip line to the waveguide transmission mode.

[0063] Figure 5 It is a top view of the connection between the feeder layer 152 , the patch layer 153 and the PCB carrier 21 , and the viewing angle is from the inside of the chip package 11 to the outside of the chip package 11 . Figure 3 and Figure 5In the figure, a single-ridge window is opened on the PCB carrier 21 as the second waveguide channel 22, and its position is opposite to the radiation part 12 in the chip package. The side walls and upper and lower surfaces of the single-ridge window are plated with a conductive metal layer, and the metal coating on the upper and lower surfaces extends outward from the edge of the single-ridge window to cover the welding area of ​​the solder ball 13.

[0064] In actual process design, no other metal layer may be set on the other side of the metal layer 151 in the substrate 15, and the IC die 16 may be directly set above the metal layer 151. The function of the metal layer 151 is to isolate the IC die 16 from the feeder layer 152. Other metal layers may also be set on the other side of the metal layer 151 in the substrate 15, and the IC die 16 may be directly set above other metal layers. The function of the metal layer 151 is to isolate the other metal layers from the feeder layer 152. In the metal layer 151, the feeder layer 152, and the patch layer 153, a dielectric layer is set between each two adjacent layers, and connection can be achieved by setting vias 18 between the metal layers.

[0065] In some embodiments, the second waveguide channels 33 are arranged in an array, and the long sides of two adjacent second waveguide channels 33 are perpendicular to each other.

[0066] like Figure 6 , which shows the port layout of the second waveguide channel 33 in a 4T4R (4 groups of transmission and 4 groups of reception) radio frequency module. The perspective of the figure is from the third surface S3 of the PCB carrier board 21 to the second surface S2. Figure 6 The cross section of the second waveguide channel 33 is a single ridge type (single ridge waveguide), and the direction of the electric field when the electromagnetic wave propagates therein is mainly perpendicular to the long side where the ridge is located. The port arrangement shown in this example can ensure that the polarizations between adjacent ports are perpendicular to each other, thereby reducing the signal crosstalk problem at the port. At the same time, each second waveguide channel 33 can be smoothly connected.

[0067] In some embodiments, Figure 2 As shown, an isolation structure 34 is further disposed on the fourth surface S4 , and the isolation structure 34 includes a plurality of periodically arranged protrusion structures.

[0068] When the waveguide antenna 31 is assembled on the PCB carrier 21, the surfaces of the two are not tightly connected due to processing and assembly errors, so that gaps are inevitably present. When the RF signal leaks from the gap, the transmission efficiency of the RF signal in the channel will be reduced. At the same time, the signal will also be coupled to other channels through the gap to form channel crosstalk, resulting in reduced isolation, which seriously affects the performance of the RF module.

[0069] Therefore, the present embodiment proposes to set an isolation structure 34 on the fourth surface S4 to prevent the signal from being transmitted laterally along the surface of the gap. The isolation structure can be composed of a plurality of protruding structures set on the fourth surface S4. The shape, quantity, and arrangement of these protruding structures are not limited in the present embodiment. The protruding structure can be a cylinder, a cuboid, a hexagonal prism, etc.; the protruding structure is a metal structure or a structure with a metal plated surface; a plurality of periodically arranged protruding structures can prevent the propagation of surface waves, thereby preventing the radio frequency signal from leaking from the transmission channel to the outside, and can also prevent the free radio frequency signal in the gap of the end face where the PCB carrier 21 and the waveguide antenna 31 are connected to enter the adjacent transmission channel, thereby realizing signal isolation in each transmission channel. In some embodiments, the waveguide antenna 31 is connected to the PCB carrier 21 by fasteners such as screws and bolts.

[0070] In some embodiments, Figure 7 As shown, the protrusion structure includes a plurality of first protrusion structures 35 and a plurality of second protrusion structures 36 , and the cross-sectional area of ​​the first protrusion structure 35 is greater than or equal to the cross-sectional area of ​​the second protrusion structure 36 .

[0071] Figure 7 : is a top view of the third waveguide channel 33 on the fourth surface S4 of the waveguide antenna 31, and the perspective of the figure is from the fourth surface S4 to the inside of the waveguide antenna 31. This example uses a rectangular waveguide antenna, which has low requirements for computer numerical control (CNC) technology or plastic injection molding electroplating technology, and the port shape presented on the fourth surface S4 is rectangular. Non-uniform protrusion structures can be set around the port to surround it.

[0072] When the end port of the third waveguide channel 33 for docking with the second waveguide channel 22 is rectangular (rectangular waveguide hole), the middle position of the two long sides of the rectangular waveguide hole is the strongest signal field area, and the signal field strength gradually decreases from the middle position outward, so protrusion structures with different cross-sectional areas can be set in signal field areas with different strengths to achieve differentiated isolation. In this embodiment, two types of protrusion structures are set on the fourth surface S4, namely, a first protrusion structure 35 and a second protrusion structure 36, wherein the cross-sectional area of ​​the first protrusion structure 35 is greater than or equal to the cross-sectional area of ​​the second protrusion structure 36.

[0073] In some embodiments, the plurality of first protrusion structures 35 are located at the center line of the long side of the third waveguide channel 33 .

[0074] In some embodiments, a plurality of second protrusion structures 36 are disposed around the first protrusion structure 35 .

[0075] In some embodiments, the gap between the upper surfaces of the first protrusion structure 35 and the second protrusion structure 36 and the third surface S3 is no more than 400 μm.

[0076] Figure 7 In the embodiment, a thick cylinder as the first protruding structure 35 (taking this example as an example, working in the 77GHz automotive millimeter wave frequency band, the diameter and height of the cylinder are about 1mm) is symmetrically placed at the center of the long side of the rectangular waveguide hole of the third waveguide channel 33. When the electromagnetic wave is transmitted from the second waveguide channel 22 of the PCB carrier 21 to the third waveguide channel 33, the thick cylinder can maintain the normal transmission of the electromagnetic wave and ensure good matching. This embodiment allows a certain gap between the waveguide antenna 31 and the PCB carrier 21. This gap is the distance between the upper surface of the protruding structure and the third surface. For the automotive millimeter wave frequency band, this gap is about 0 to 400μm. Thin cylinders as the second protruding structure 36 are distributed around the thick cylinder to block the subtle energy escaping from the gap. There is no strict requirement for the size of these thin cylinders (the height is consistent with the thick cylinder, and the diameter and the gap with the surrounding cylinders can be within half a wavelength). The distance error between the thick cylinder and the center of the long side of the rectangular waveguide hole is kept within ±100um to improve the consistency between channels.

[0077] In some embodiments, the height of the first protruding structure 35 and the second protruding structure 36 is Where λ is the operating wavelength of the RF signal.

[0078] In some embodiments, the diameter of the second protrusion structure 36 is Where λ is the operating wavelength of the RF signal.

[0079] In some embodiments, the distance between the first protruding structure 35 and the adjacent second protruding structure 36 is Where λ is the operating wavelength of the RF signal.

[0080] In some embodiments, Figure 8 As shown, the third waveguide channel 33 is connected to the antenna unit 33 from one end of the wide side of the antenna unit 32 or the middle position of the wide side.

[0081] Combination Fig.10 The cross-section of the waveguide cavity of the antenna unit 32 is a rectangle, wherein the side where the long side of the rectangle is located is called the long side side, and the side where the wide side of the rectangle is located is called the wide side side. Figure 8 A slot for radiating radio frequency signals outward is arranged on the side surface of the middle long side. Figure 8 Two feeding methods of waveguide antenna are given in the figure: the left figure shows that the RF signal in the third waveguide channel 33 is fed into the antenna unit 32 from one end of the wide side of the antenna unit 32, which is called "side feeding"; the right figure shows that the RF signal in the third waveguide channel 33 is fed into the antenna unit 32 from the middle position of the wide side of the antenna unit 32, which is called "center feeding".

[0082] like Fig. 9 As shown, it is a layout diagram of the feeding line formed by the third waveguide channel 33 in the waveguide antenna 31 and the array formed by the antenna unit 32.

[0083] In some embodiments, Fig.10 As shown, the waveguide antenna 31 includes two parts (an upper part and a lower part divided along a dividing line) that are spliced ​​together, a splicing surface of the two parts is parallel to the surface current direction of the radio frequency signal, and the path of the surface current is located on the splicing surface.

[0084] For example Fig.10 In the figure, the waveguide antenna 31 is designed as a double-layer structure, which is divided into two parts at the dividing line in the figure. For the rectangular waveguide in the figure, the path of the surface current parallel to the extension direction of the waveguide coincides with the dividing line. When the upper and lower structures are not tightly connected, Fig.10 The segmentation method in can effectively reduce energy leakage.

[0085] In some embodiments, Fig.11 As shown, the third waveguide channel 33 includes at least two cavity segments 37 with rectangular cross sections, and a stepped transition structure 38 is provided at the connection between adjacent cavity segments 37 .

[0086] For example Fig.11 In (a), two cavity segments 37 are included from bottom to top, wherein the cavity segment 37 located above turns out from the long side of the cavity segment 37 located below, also known as "long side turning out"; (b) and (c) two cavity segments 37 are included from bottom to top, wherein the cavity segment 37 located above turns out from the wide side of the cavity segment 37 located below, also known as "wide side turning out". A stepped transition structure 38 is also designed at the connection between the adjacent cavity segments 37, that is, the "turn-out position". By reasonably designing the recessed and protruding steps to form the stepped transition structure 38, better impedance matching can be achieved and electromagnetic wave reflection at the turning discontinuity can be reduced. The stepped transition structure 38 can be a single-step structure as in (a) and (b), or a multi-step structure as in (c). In this embodiment, the number of layers of the stepped structure is not limited.

[0087] The RF module in this embodiment has the following advantages over the traditional RF module:

[0088] When the chip package 11 is packaged and designed, the feed line 17 is fanned out inside the substrate 15 and a radiating portion 12 is provided outside the chip package 11; the radiating portion 12 can couple the RF signal from the chip package to the external waveguide antenna, thereby improving the flexibility of the chip and antenna design and being more conducive to realizing a miniaturized design.

[0089] To prevent leakage between channels, the radiation portion 12 is surrounded by bumps 13 to form a first waveguide channel 14. When the bumps 13 are solder balls, one end of the solder ball is connected to the chip package 11, and the other end is soldered to the PCB carrier 21, thereby achieving channel docking.

[0090] A single ridge window is dug out in the PCB carrier 21 corresponding to the area surrounded by the solder ball as the second waveguide channel 22 for achieving the connection between the chip package 11, the PCB carrier 21 and the waveguide antenna 31 and the matching of the radio frequency signal.

[0091] The waveguide antenna 31 adopts a two-layer structure for easy processing, the upper layer includes the antenna unit 32 and part of the feed line 17, and the lower layer includes part of the feed line 17 and the interface of the feed line 17 connected to the first waveguide channel 14. The dividing line of the two-layer structure is parallel to the direction of the surface current inside the rectangular waveguide, which effectively reduces the energy leakage at the dividing line.

[0092] The use of the waveguide antenna 31 can reduce feeder line loss and increase the output power of the radar.

[0093] In summary, the RF module provided in the above embodiments of the present application reduces the size of the chip package and has low cost, high power, good isolation and robustness.

[0094] Another embodiment of the present application further provides a radar, including: a radio frequency module as in any of the above embodiments.

[0095] The radar is used to transmit electromagnetic wave signals through the transmitting antenna based on the reference frequency, and to receive the echo formed by the reflection of the target object through the receiving antenna, and to perform down-conversion processing based on the transmitted radio frequency signal to generate and output the intermediate frequency signal. The radar is also used to convert the intermediate frequency signal into a digital signal and then perform signal processing.

[0096] Optionally, in some embodiments, the frequency modulated continuous wave signal is a millimeter wave signal, so that the electronic device equipped with the radar can be applied to the fields of autonomous driving, industrial automation, smart home appliances, and security inspection. The radar can be an AiP millimeter wave radar chip with an integrated antenna.

[0097] For example, the radar generates a chirp signal according to a preset continuous frequency modulation mode; obtains a radio frequency transmission signal through frequency multiplication processing, and feeds it to the transmitting antenna to transmit the corresponding detection signal wave. When the detection signal wave is reflected by an object, an echo signal wave is formed. The echo signal wave is converted into a radio frequency receiving signal by the receiving antenna. The radar uses the radio frequency transmission signal to down-convert, filter and other processes the radio frequency receiving signal, and then performs analog-to-digital conversion processing to output a baseband digital signal representing the difference frequency between the detection signal wave and the echo signal wave. Then, measurement information is extracted from the baseband digital signal through signal processing, and measurement data is output. Among them, the signal processing includes performing digital signal processing calculations such as phase, frequency, and time domain on at least one signal to be processed provided by at least one receiving antenna. The measurement data includes at least one of the following: distance data for representing the relative distance of at least one detected obstacle; speed data for representing the relative speed of at least one detected obstacle; angle data for representing the relative angle of at least one detected obstacle, etc.

[0098] In some embodiments, the present disclosure also provides an electronic device including the aforementioned radar.

[0099] In some embodiments, the electronic device includes: a device body; and electronic devices such as radars in the above embodiments arranged on the device body. The device body is a structure that carries a radio device and is connected to the radio device signal. The radio device transmits and / or receives a radio signal that has been phase-shifted by a phase shifter to achieve functions such as target detection and / or communication within the range of beam scanning, so as to provide the device body with detection target information and / or communication information, thereby assisting or even controlling the operation of the device body.

[0100] In some embodiments, the electronic device including the device body and the aforementioned at least one radio device may be a component or product used in fields such as smart housing, transportation, smart home, consumer electronics, monitoring, industrial automation, in-cabin detection, and health care. For example, the device body may be intelligent transportation equipment (such as automobiles, bicycles, motorcycles, ships, subways, trains, etc.), security equipment (such as cameras), liquid level / flow rate detection equipment, intelligent wearable devices (such as bracelets, glasses, etc.), smart home equipment (such as sweeping robots, door locks, televisions, air conditioners, smart lights, etc.), various communication devices (such as mobile phones, tablet computers, etc.), and gates, intelligent traffic lights, intelligent signs, traffic cameras, and various industrialized mechanical arms (or robots), etc. It may also be various instruments for detecting life characteristic parameters and various equipment equipped with the instruments, such as in-cabin detection of automobiles, indoor personnel monitoring, intelligent medical equipment, consumer electronic equipment, etc.

[0101] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.

Claims

1. A radio frequency module, characterized in that: include: A chip package, wherein at least one radiation portion is disposed on a first surface of the chip package, and a plurality of bumps are disposed on the first surface, wherein the plurality of bumps are disposed around the radiation portion and form a first waveguide channel; A PCB carrier having a second surface and a third surface opposite to each other, wherein the second surface is butted against the first surface of the chip package, and a second waveguide channel is arranged at a position of the PCB carrier corresponding to the first waveguide channel; A waveguide antenna, comprising a fourth surface and a fifth surface opposite to each other, wherein the fourth surface is connected to the third surface, at least one antenna unit is arranged on the fifth surface, and a third waveguide channel is arranged inside the waveguide antenna; Among them, the first waveguide channel, the second waveguide channel, and the third waveguide channel are connected to form a radio frequency signal transmission channel.

2. The radio frequency module according to claim 1, characterized in that: The chip package at least includes a substrate and an IC bare chip; The side of the substrate facing away from the IC bare chip is the first surface. A feed line is arranged inside the substrate, and the radio frequency signal is transmitted to the radiation part through the feed line.

3. The radio frequency module according to claim 2, characterized in that: The substrate at least includes a metal layer, a feeder layer, and a patch layer; The feed line is arranged on the feed line layer, and the radiating part is arranged on the patch layer; wherein the radio frequency signal is coupled to the radiating part through the feed line.

4. The radio frequency module according to claim 1, characterized in that: An isolation structure is disposed on the fourth surface, and the isolation structure includes a plurality of periodically arranged protrusion structures.

5. The radio frequency module according to claim 4, characterized in that: The protrusion structure includes a plurality of first protrusion structures and a plurality of second protrusion structures, and a cross-sectional area of ​​the first protrusion structure is greater than or equal to a cross-sectional area of ​​the second protrusion structure.

6. The radio frequency module according to claim 5, characterized in that: A gap between the upper surface of the first convex structure and the second convex structure and the third surface is no more than 400 μm.

7. The radio frequency module according to claim 5, characterized in that: The plurality of first protrusion structures are located at a midline of a long side of the third waveguide channel.

8. The radio frequency module according to claim 5, characterized in that: The heights of the first protruding structure and the second protruding structure are Wherein λ is the operating wavelength of the radio frequency signal.

9. The radio frequency module according to claim 5, characterized in that: A plurality of the second protrusion structures are arranged around the first protrusion structure, and the first protrusion structure and the second protrusion structure are cylinders.

10. The radio frequency module according to claim 5, characterized in that: The diameter of the second protrusion structure is Wherein λ is the operating wavelength of the radio frequency signal.

11. The radio frequency module according to claim 5, characterized in that: The distance between the first protruding structure and the adjacent second protruding structure is Wherein λ is the operating wavelength of the radio frequency signal.

12. The radio frequency module according to claim 1, characterized in that: The third waveguide channel is connected to the antenna unit from one end of the wide side surface of the antenna unit or a middle position of the wide side surface.

13. The radio frequency module according to claim 12, characterized in that: The third waveguide channel comprises at least two cavity segments with rectangular cross sections, and a step-type transition structure is provided at the connection between adjacent cavity segments of the at least two cavity segments with rectangular cross sections.

14. The radio frequency module according to any one of claims 1 to 13, characterized in that: The radiation part is a radiation patch.

15. The radio frequency module according to any one of claims 1 to 13, characterized in that: The cross section of the second waveguide channel is a single-ridge type.

16. The radio frequency module according to any one of claims 1 to 13, characterized in that: The bumps are solder balls.

17. The radio frequency module according to claim 16, characterized in that: The second surface is connected to the first surface through a plurality of solder balls.

18. The radio frequency module according to any one of claims 1 to 13, characterized in that: The second waveguide channels are arranged in an array, and the long sides of two adjacent second waveguide channels are perpendicular to each other.

19. The radio frequency module according to any one of claims 1 to 13, characterized in that: The antenna unit includes a plurality of radiation slots for transmitting and / or receiving the radio frequency signal.

20. A radar, characterized in that: include: A radio frequency module as claimed in any one of claims 1 to 19.

21. An electronic device, characterized in that: include: The radar as claimed in claim 20.

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