Light emitting component and optical module

Abstract

The utility model discloses a light emitting component and a light module. The light emitting component comprises an emitting shell. A first through hole is formed in one side of the light emitting shell, and an electric connector is arranged on the side wall opposite to the first through hole. The optical fiber adapter is connected with the first through hole. One side of the electric connector is located inside the transmitting shell, and the other side of the electric connector is located outside the transmitting shell. A first bonding pad area and a second bonding pad area which are different in height are arranged on the side, located in the transmitting shell, of the electric connector. The semiconductor cooler is located in the emission shell and connected with the bottom of the emission shell. The semiconductor cooler comprises a first substrate and a second substrate, wherein the first substrate is connected with the bottom of the emission shell. And a refrigerator electrode is arranged on the upper surface of the first substrate. The first bonding pad area is electrically connected with the refrigerator electrode. The thickness of the first substrate is larger than that of the second substrate, the height difference between the first bonding pad area and the refrigerator electrode is reduced, and the routing length between the first bonding pad area and the refrigerator electrode is reduced.

Description

Technical Field

[0001] This application relates to the field of communication technologies, and particularly to an optical emission component and an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the progress of optical communication technologies has become increasingly important. In optical communication technologies, an optical module is one of the key components in optical communication devices, and with the development needs of optical communication technologies, the transmission rate of optical modules has been continuously increasing.

[0003] In a high-speed information transceiver system, it is necessary to use high-density optical modules to replace traditional optical modules. The multi-channel optical transceiver technology is used, which can concentrate more optical emission components and optical receiving components in a smaller space. And within a limited space, improving the optical coupling efficiency of the optical receiving component helps to ensure the product stability. Summary of the Utility Model

[0004] This application provides an optical emission component and an optical module to reduce the space occupied by the optical emission component.

[0005] To solve the above technical problems, the embodiments of this application disclose the following technical solutions:

[0006] On the one hand, the embodiments of this application disclose an optical emission component, including: an emission housing, one end side wall of which is provided with a first through hole, and an electrical connector is provided at the opposite end of the first through hole;

[0007] An optical fiber adapter, connected to the first through hole;

[0008] A thermoelectric cooler, located inside the emission housing;

[0009] Wherein, the electrical connector includes:

[0010] A first pad area, located inside the emission housing;

[0011] A second pad area, located inside the emission housing, and the upper surface of the second pad area is higher than that of the first pad area;

[0012] A third pad area, located outside the emission housing;

[0013] The thermoelectric cooler includes:

[0014] A first substrate, connected to the emission housing;

[0015] A second substrate, the thickness of which is less than that of the first substrate;

[0016] On the upper surface of the second substrate, there is provided: a laser array, electrically connected to the first pad area;

[0017] The upper surface of the first substrate is provided with: a cooler electrode, and the cooler electrode is electrically connected to the first pad region.

[0018] On the other hand, an embodiment of the present application discloses an optical module, including:

[0019] An upper housing;

[0020] A lower housing, which is covered with the upper housing to form a housing;

[0021] A circuit board, which is located inside the housing;

[0022] A transmitting housing, one end side wall of which is provided with a first through hole, and an electrical connector is provided at the opposite end of the first through hole;

[0023] An optical fiber adapter, which is connected to the first through hole;

[0024] A semiconductor cooler, which is located inside the transmitting housing;

[0025] Wherein, the electrical connector includes:

[0026] A first pad region, which is located inside the transmitting housing;

[0027] A second pad region, which is located inside the transmitting housing, and the upper surface of the second pad region is higher than that of the first pad region;

[0028] A third pad region, which is located outside the transmitting housing and is electrically connected to the circuit board;

[0029] The semiconductor cooler includes:

[0030] A first substrate, which is connected to the transmitting housing;

[0031] A second substrate, the thickness of which is smaller than that of the first substrate;

[0032] The upper surface of the second substrate is provided with: a laser array, which is electrically connected to the first pad region;

[0033] The upper surface of the first substrate is provided with: a cooler electrode, and the cooler electrode is electrically connected to the first pad region.

[0034] Compared with the prior art, the present application has the following beneficial effects:

[0035] This application discloses an optical emission component and an optical module. The optical emission component includes: an emission housing. A first through hole is provided on one side of the optical emission housing, and an electrical connector is provided on the opposite side wall of the first through hole. An optical fiber adapter is connected to the first through hole. One side of the electrical connector is located inside the emission housing, and the other side is located outside the emission housing. On the side of the electrical connector located inside the emission housing, there are a first pad area and a second pad area with different heights. A thermoelectric cooler is located inside the emission housing and is connected to the bottom of the emission housing. The thermoelectric cooler includes: a first substrate and a second substrate, wherein the first substrate is connected to the bottom of the emission housing. A cooler electrode is provided on the upper surface of the first substrate. The first pad area is electrically connected to the cooler electrode. The thickness of the first substrate is greater than that of the second substrate, which is beneficial to reducing the height difference between the first pad area and the cooler electrode and reducing the wire bonding length between the first pad area and the cooler electrode. A laser array is disposed on the surface of the second substrate, reducing the substrate between the laser array and the thermoelectric cooler and improving the temperature control accuracy of the thermoelectric cooler for the laser array. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure, and those of ordinary skill in the art can also obtain other drawings based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and do not limit the actual dimensions of the products involved in the embodiments of the present disclosure, the actual processes of the methods, the actual timings of the signals, etc.

[0037] Figure 1 FIG. is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0038] Figure 2 FIG. is a partial structure diagram of a host computer provided according to some embodiments of the present disclosure;

[0039] Figure 3 FIG. is a structure diagram of an optical module provided according to some embodiments of the present disclosure;

[0040] Figure 4 FIG. is an exploded view of an optical module provided according to some embodiments of the present disclosure;

[0041] Figure 5 FIG. is a schematic diagram of an optical emission component, an optical reception component, and a circuit board provided according to some embodiments of the present disclosure;

[0042] Figure 6 FIG. is an exploded schematic diagram of an optical emission component, an optical reception component, and a circuit board provided according to some embodiments of the present disclosure;

[0043] Figure 7 Schematic diagram of a light-emitting component structure provided according to some embodiments;

[0044] Figure 8 Exploded view of a light-emitting component provided according to some embodiments Figure 1 ;

[0045] Figure 9 Exploded view of a light-emitting component provided according to some embodiments Figure 2 ;

[0046] Figure 10 Schematic diagram of the structure of an electrical connector provided according to some embodiments;

[0047] Figure 11 Cross-sectional schematic diagram of a light-emitting component provided according to some embodiments;

[0048] Figure 12 Schematic diagram of a semiconductor cooler provided according to some embodiments;

[0049] Figure 13 Optical path schematic diagram of a light-emitting component provided according to some embodiments. Detailed implementation manners

[0050] The following will clearly and detailedly describe some embodiments of the present disclosure in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided by the present disclosure fall within the scope of protection of the present disclosure.

[0051] Unless otherwise required by the context, in the whole specification and claims, the term "comprising" is interpreted as an open and inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" cannot be understood as indicating or implying relative importance or indicating the upper limit of quantity; the meaning of the term "plurality" is two or more; the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated, can be directly connected, or can be indirectly connected through an intermediate medium; the use of the term "suitable for" or "configured to" means open and inclusive language, which does not exclude devices suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", "flush" and the like do not limit to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences formed due to manufacturing reasons based on the same design concept. Without more limitations, elements defined by the statement "including one..." do not exclude the existence of other identical elements in the circuit structure, article or device including the said elements.

[0052] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. The light loaded with information is an optical signal. The optical signal propagates in the information transmission device, which can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. The information that information processing devices can process exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablet computers, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission devices.

[0053] The mutual conversion between optical signals and electrical signals between information processing devices and information transmission devices is achieved through optical modules. For example, an optical fiber is connected to the optical signal input end and / or optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or electrical signal output end of the optical module. The first optical signal from the optical fiber is transmitted into the optical module, and the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal into the optical network terminal. The second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module converts the second electrical signal into a second optical signal and transmits the second optical signal into the optical fiber. Since information processing devices can be interconnected through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0054] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure. As Figure 1 shown, the local part of the optical communication system presents as a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0055] One end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. Total internal reflection can occur to the optical signal in the optical fiber 101. The propagation of the optical signal in the total internal reflection direction can almost maintain the original optical power. Multiple total internal reflections occur to the optical signal in the optical fiber 101 to transmit the optical signal from the direction of the remote information processing device 1000 into the optical module 200, or to propagate the optical signal from the optical module 200 towards the remote information processing device 1000, achieving long-distance and low-power-loss information transmission.

[0056] The number of optical fibers 101 can be one or multiple (two or more); the optical fiber 101 and the optical module 200 can be connected in a pluggable and removable manner or in a fixed connection.

[0057] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that a unidirectional / bidirectional electrical signal connection is established between the host computer 100 and the optical module 200; the host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor and control the working state of the optical module 200.

[0058] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, and the external electrical interface can access an electrical signal network. Exemplarily, the network cable interface 104 is configured to access the network cable 103, so that a unidirectional / bidirectional electrical signal connection is established between the host computer 100 and the network cable 103.

[0059] An Optical Network Unit (ONU), an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), and a data center server are common host computers.

[0060] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

[0061] Exemplarily, a third electrical signal sent by the local information processing device 2000 is transmitted into the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101, and the second optical signal travels in the optical fiber 101 towards the remote information processing device 1000.

[0062] Exemplarily, a first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal. The host computer 100 transmits the fourth electrical signal into the local information processing device 2000.

[0063] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the above conversion process of optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0064] Figure 2 This is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a radiator 107 disposed on the cage 106, and an electrical connector (not shown in the figure) disposed inside the cage 106. The radiator 107 has a raised structure for increasing the heat dissipation area, and the fin-like structure is a common raised structure.

[0065] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0066] Figure 3 This is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 This is an exploded view of an optical module provided according to some embodiments of the present disclosure. As Figure 3 and Figure 4 shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, an optical transmitting component 400, and an optical receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the optical transmitting component 400 and the optical receiving component 500.

[0067] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form the above-mentioned shell having two openings 204 and 205; the outer contour of the shell generally presents a rectangular body.

[0068] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011. The cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0069] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0070] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger 301 of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0071] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0072] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0073] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0074] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the engaging component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the engaging component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the engaging component and the host computer to release the snap-fitting and fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be withdrawn from the cage 106.

[0075] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components can include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips can include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0076] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also convenient to be inserted into the electrical connectors in the host computer cage.

[0077] The circuit board 300 also includes a gold finger 301 formed on its end surface. The gold finger 301 is composed of a plurality of independent pins. When the circuit board 300 is inserted into the cage 106, the gold finger 301 conducts with the electrical connector in the cage 106. The gold finger 301 can be provided only on the surface of one side of the circuit board 300 (such as Figure 4 the upper surface shown), or can be provided on the surfaces of both the upper and lower sides of the circuit board 300 to provide more pins. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve functions such as power supply, grounding, I2C signal transmission, and data signal transmission.

[0078] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in cooperation with rigid circuit boards as a supplement to rigid circuit boards.

[0079] The optical emission component 400 and / or the optical reception component 500 are located on the side of the circuit board 300 away from the gold finger 301; in some embodiments, the optical emission component 400 and the optical reception component 500 are physically separated from the circuit board 300 respectively, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors respectively; in some embodiments, the optical emission component and / or the optical reception component can be directly disposed on the circuit board 300, and can be disposed on the surface of the circuit board or on the side of the circuit board.

[0080] Figure 5 It is a schematic diagram of an optical emission component, an optical reception component and a circuit board provided according to some embodiments of the present disclosure. Figure 6 It is an exploded schematic diagram of an optical emission component, an optical reception component and a circuit board provided according to some embodiments of the present disclosure. As Figure 5 and Figure 6 shown, the circuit board 300 is provided with a first avoidance opening 310, and the optical emission component is located within the first avoidance opening 310. Both the optical emission component and the optical reception component are located on the upper surface of the circuit board. The optical module further has a backing plate 420, the optical emission component is located on the backing plate 420, and a part of the backing plate 420 is located below the circuit board corresponding to the optical reception component.

[0081] In some embodiments, the first avoidance opening 310 is located on one side of the circuit board, and its opening communicates with the outside. The circuit board is provided with a signal pin area 320, and the optical emission component is wire-bonded to the signal pin area 320. On one side of the first avoidance opening 310 is a narrow board area 330, and the narrow board area 330 and the first avoidance opening 310 are juxtaposed in the width direction of the circuit board, and the optical reception component 500 is located in the narrow board area 330.

[0082] Figure 7 It is a schematic diagram of an optical emission component structure provided according to some embodiments. Figure 8 It is an exploded schematic of an optical emission component provided according to some embodiments Figure 1 . As Figure 7 and Figure 8 shown, the optical emission component may include: the optical emission component includes an emission housing 410 and an electrical connector 430. One side wall of the emission housing 410 is provided with a first through hole 4103, and the electrical connector 430 is provided on the opposite side wall of the first through hole 4103. An optical emission assembly is provided within the emission housing 410.

[0083] Another side wall of the emission housing 410 may be provided with a first opening 4105. The electrical connector 430 may be disposed at the first opening 4105.

[0084] A first through hole 4103 is provided on the emission housing 410. The first through hole 4103 communicates with the inner cavity of the emission housing 410, and the first through hole 4103 is connected to the fiber optic adapter 700.

[0085] Exemplarily, the emission housing 410 is an emission tube housing, and an optical emission component is provided inside, including: a laser array 411, a lens array 412, and an optical multiplexing component 413. The laser array 411 emits lights of different wavelengths. Each light beam is sequentially processed by the converging lenses in the lens array 412, and is converted from a divergent state to a converging state. Then, through the multiplexing process of the optical multiplexing component 413, the lights of different wavelengths are multiplexed into a single beam of light. This light is converted into parallel light after being collimated by the collimating lens in the fiber optic adapter 700, and is emitted from the emission housing 410 in the form of parallel light.

[0086] Figure 9 Schematic diagram of the decomposition of an optical emission component provided according to some embodiments Figure 2 As Figure 9 shown, the emission housing 410 may include an emission cover housing 4101 and a tube housing 4102. The emission cover housing 4101 covers the upper part of the tube housing 4102 to form an emission cavity.

[0087] The optical emission component may include: a photodetector array 415. In some embodiments, the photodetector array 415 may be located on the electrical connector 430 to reduce the volume of the optical emission housing.

[0088] In some embodiments, the optical emission component may include: a detection backing plate 416. The detection backing plate 416 is located on the electrical connector 430, and the photodetector array 415 may be located on the detection backing plate 416. The detection backing plate 416 can be used to isolate the photodetector array 415 from the electrical connector 430.

[0089] In some embodiments, the photodetector array 415 may include 4 photodetectors, and correspondingly, 4 detection backing plates may be provided.

[0090] In some embodiments, the photodetector array 415 may include 4 photodetectors, and correspondingly, 2 detection backing plates may be provided, where two photodetectors are provided on each detection backing plate.

[0091] Figure 10 Schematic diagram of the structure of an electrical connector provided according to some embodiments. As Figure 10 shown, the electrical connector 430 may include: a connection body 434. The connection body 434 is located at the first opening 4105.

[0092] A first opening 4105 is provided on the emission housing 410, and the first through hole 4103 and the first opening 4105 are respectively located on opposite sides of the emission housing.

[0093] In some embodiments, the electrical connector 430 is located at the first opening 4105. One side of the electrical connector 430 is inserted into the emission housing 410, and the other side is exposed outside the emission housing 410, so that the emission housing 410 and the electrical connector are assembled to form an optical emission cavity. One end of the electrical connector 430 located inside the emission housing is connected to the laser array 411 by a gold wire, and one end of the electrical connector 430 located outside the emission housing is connected to the circuit board by a flexible circuit board 302, transferring electrical signals, working signals, etc. generated by the circuit board 300 to the laser array 411 to drive each laser to emit laser beams of different wavelengths. Or one end of the electrical connector 430 located outside the emission housing is connected to the circuit board by wire bonding.

[0094] In some embodiments, the flexible circuit board 302 can be a single circuit board, or can include two circuit boards respectively located above and below one end of the electrical connector 430 located outside the emission housing.

[0095] The surface of the electrical connector 430 located inside the emission housing 410 forms a first pad area 431 and a second pad area 432. Among them, the first pad area 431 protrudes from the second pad area 432. The distance between the first pad area 431 and the laser array 411 is less than the distance between the second pad area 432 and the laser array 411.

[0096] A stepped surface is provided between the second pad area 432 and the first pad area 431, and the upper surface of the second pad area 432 is higher than the upper surface of the first pad area 431.

[0097] In some embodiments, the surface of the electrical connector 430 located outside the emission housing 410 forms a third pad area 433. The first pad area 431 is electrically connected to the third pad area 433, and the second pad area 432 is electrically connected to the third pad area 433, thereby realizing signal transmission inside and outside the emission housing 410, including the transmission of low-frequency signals and high-frequency signals. The third pad area 433 includes a low-frequency signal line and a high-frequency signal line. The low-frequency signal line is used for the transmission of low-frequency signals, and the high-frequency signal line is used for the transmission of high-frequency signals.

[0098] In some embodiments, the photodetector array 415 is located in the first pad area 431, a detection drive circuit is provided in the second pad area 432, and the photodetector array 415 is connected to the second pad area 432 by wire bonding.

[0099] Figure 11 It is a cross-sectional schematic diagram of an optical emission component provided according to some embodiments. As Figure 11 shown, the optical emission assembly may include: a thermoelectric cooler 417. The thermoelectric cooler 417 is disposed inside the emission housing 410, and the laser array 411 and the lens array 412 are disposed on the upper surface of the thermoelectric cooler 417.

[0100] Figure 12 Schematic diagram of a semiconductor cooler provided according to some embodiments. As Figure 12 shown, the semiconductor cooler 417 may include: a first substrate 4171. The bottom surface of the first substrate 4171 is in contact connection with the emission housing 410.

[0101] The semiconductor cooler 417 may include: a second substrate 4172. A heat exchange fin is provided between the first substrate 4171 and the second substrate 4172. The laser array 411 and the lens array 412 may be disposed on the upper surface of the second substrate 4172.

[0102] In some embodiments, the thickness of the first substrate 4171 is greater than the thickness of the second substrate 4172. Increasing the thickness of the first substrate 4171 is beneficial to raising the height of the upper surface of the semiconductor cooler 417, so that the laser array 411 and the lens array 412 are at the same height as the fiber optic adapter 700.

[0103] The surface area of the first substrate 4171 is greater than the surface area of the second substrate 4172. In some embodiments, one end of the first substrate 4171 protrudes beyond the projection range of the second substrate 4172. A cooler electrode may be provided on the first substrate 4171, including: a positive pin 4175 and a negative pin 4176.

[0104] The projection of the second substrate 4172 does not cover the cooler electrode.

[0105] In some embodiments, to reduce the wire bonding length between the laser array 211 and the first pad area 431, the laser array 211 and the first pad area 431 may be set at the same height.

[0106] The first pad area 431 is connected to the cooler electrode by wire bonding. The first pad area 431 is provided with a cooler power supply pin. To reduce the wire bonding length between the first pad area 431 and the cooler electrode and shorten the height difference between the first pad area 431 and the cooler electrode, the thickness of the first substrate 4171 may be set to be greater than the thickness of the second substrate 4172.

[0107] In some embodiments of the present application, the cooler electrode may be a metal sheet attached to the surface of the first substrate 4171.

[0108] When the overall thickness of the semiconductor cooler 417 remains unchanged, increasing the thickness of the first substrate 4171 so that the thickness of the first substrate 4171 is greater than the thickness of the second substrate 4172 is beneficial to reducing the height difference between the upper surface of the first substrate 4171 and the upper surface of the second substrate 4172, that is, the wire bonding length between the first pad area 431 and the cooler electrode can be reduced.

[0109] In some embodiments, the height difference between the upper surface of the first substrate 4171 and the first pad region 431 is less than 4 mm, which can meet the wire bonding requirements of an automatic wire bonder. The height difference between the power supply pin of the cooler and the cooler electrode is less than 4 mm, which can meet the wire bonding requirements of an automatic wire bonder, so as to make a wire bonding connection between the power supply pin of the cooler and the cooler electrode.

[0110] The height difference between the upper surface of the first substrate 4171 and the first pad region 431 is greater than or equal to 3.2 mm and less than 4 mm, which can meet the wire bonding requirements of an automatic wire bonder.

[0111] In some embodiments, a thermosensitive pad 4174 may be provided on the upper surface of the second substrate 4172. The thermistor 418 is electrically connected to the thermosensitive pad 4174. The thermosensitive pad 4174 may be electrically connected to the first pad region 431.

[0112] In some embodiments, to achieve the coupling of the photoelectric detection array 415 and the optical multiplexing component 413, the optical emission component 400 may include: a lifting substrate 419. The lifting substrate 419 is located below the optical multiplexing component 413 to lift the optical multiplexing component 413, so that the photoelectric detection array 415 is optically coupled with the optical multiplexing component 413.

[0113] In some embodiments, the lifting substrate 419 and the package 4102 may be an integral structure.

[0114] Figure 13 The figure is a schematic optical path diagram of an optical emission component provided according to some embodiments. As Figure 13 shown, the laser array 411 emits lights of different wavelengths, and a part of the lights is directed towards the lens array 412, and the other part is directed towards the photoelectric detection array 415. The photoelectric detection array 415 can be used to detect the optical power of the lasers at corresponding positions.

[0115] Multiple lights directed towards the lens array 412 are processed by the converging lenses in the lens array 412, and are converted from a divergent state to a converging state, and then through the multiplexing process of the optical multiplexing component 413, the lights of different wavelengths are multiplexed into one light beam.

[0116] In some embodiments of the present application, the cooler electrode is located on one side of the laser array 411, so that the center of the laser array 411 does not coincide with the center of the emission housing 420.

[0117] The central axis of the light output port of the optical multiplexing component 413 does not coincide with the central axis of the fiber optic adapter 700. To achieve optical coupling, the optical emission component may include: a displacement prism 414. In some embodiments, the displacement prism 414 is located above the lifting substrate 419. The displacement prism 414 allows the combined light to enter the fiber optic adapter 700.

[0118] The present application discloses an optical emission component, including: an emission housing. A first through hole is provided on one side of the optical emission housing, and an electrical connector is provided on the opposite side wall of the first through hole. An optical fiber adapter is connected to the first through hole. One side of the electrical connector is located inside the emission housing, and the other side is located outside the emission housing. On the side of the electrical connector located inside the emission housing, there are a first pad area and a second pad area with different heights. A thermoelectric cooler is located inside the emission housing and is connected to the bottom of the emission housing.

[0119] The thermoelectric cooler includes: a first substrate and a second substrate, wherein the first substrate is connected to the bottom of the emission housing. The thickness of the first substrate is greater than the thickness of the second substrate. A cooler electrode is provided on the upper surface of the first substrate. The first pad area is wire-bonded to the cooler electrode.

[0120] The first pad area is provided with a cooler power supply pin. To reduce the wire-bonding length between the first pad area and the cooler electrode and shorten the height difference between the first pad area and the cooler electrode, the thickness of the first substrate can be set to be greater than the thickness of the second substrate.

[0121] A thermal pad is provided on the upper surface of the second substrate, and a thermistor is provided on the thermal pad. The thermal pad is electrically connected to the first pad area.

[0122] A laser array and a lens array are provided on the upper surface of the second substrate. The first pad area carries a detection pad, and a photoelectric detection array is provided on the detection pad. The photoelectric detection array is wire-bonded to the second pad area. The second pad area is higher than the first pad area. The laser array is arranged on the surface of the second substrate, reducing the isolation of the substrate between the laser array and the thermoelectric cooler and improving the temperature control accuracy of the thermoelectric cooler for the laser array.

[0123] Since the above embodiments are all described by reference and combination on other methods, and there are the same parts between different embodiments, the same or similar parts between each embodiment in this specification can be referred to each other. Details are not elaborated here.

Claims

1. A light emitting component, characterized in that: include: A launching shell, a side wall of which one end is provided with a first through hole, and an electrical connector is provided at the opposite end of the first through hole; An optical fiber adapter connected to the first through hole; A semiconductor refrigerator is located inside the transmitting shell; Wherein, the electrical connector comprises: A first pad area is located inside the transmitting shell; A second pad area is located inside the transmitting shell, and an upper surface of the second pad area is higher than the first pad area; A third pad area is located outside the transmitting shell; The semiconductor refrigerator comprises: A first substrate connected to the launch shell; a second substrate having a thickness less than that of the first substrate; The upper surface of the second substrate is provided with: a laser array electrically connected to the first pad area; A cooler electrode is disposed on the upper surface of the first substrate, and the cooler electrode is electrically connected to the first pad region.

2. The light emitting component according to claim 1, characterized in that One end of the first substrate protrudes from the projection range of the second substrate, and the refrigerator electrode is not located within the projection range of the second substrate.

3. The light emitting component according to claim 1, characterized in that include: A thermosensitive pad is located on the upper surface of the second substrate, and the thermosensitive pad is located on one side of the laser array; The thermistor is located on the thermistor pad, and the thermistor is electrically connected to the first pad area.

4. The light emitting component according to claim 1, characterized in that include: Photoelectric detection array; A detection pad, located above the first pad area, and between the first pad area and the photoelectric detection array; The photodetection array is electrically connected to the second pad region.

5. The light emitting component according to claim 1, characterized in that include: A lifting base plate is located at the bottom of the launch shell; An optical multiplexing component is located above the lifting substrate, and is used for combining multiple light beams emitted by the laser array into one light beam.

6. The light emitting component according to claim 5, characterized in that include: A displacement prism is located above the lifting substrate, and the displacement prism is located between the optical multiplexing component and the optical fiber adapter.

7. An optical module, characterized in that: include: Upper shell; A lower shell, which is covered with the upper shell to form a shell; A circuit board is located inside the housing; A launching shell, a side wall of which one end is provided with a first through hole, and an electrical connector is provided at the opposite end of the first through hole; An optical fiber adapter connected to the first through hole; A semiconductor refrigerator is located inside the transmitting shell; Wherein, the electrical connector comprises: A first pad area is located inside the transmitting shell; A second pad area is located inside the transmitting shell, and an upper surface of the second pad area is higher than the first pad area; A third pad area, located outside the transmitting shell and electrically connected to the circuit board; The semiconductor refrigerator comprises: A first substrate connected to the launch shell; a second substrate having a thickness smaller than that of the first substrate; The upper surface of the second substrate is provided with: a laser array electrically connected to the first pad area; A cooler electrode is disposed on the upper surface of the first substrate, and the cooler electrode is electrically connected to the first pad region.

8. The optical module according to claim 7, characterized in that: One end of the first substrate protrudes out of the projection range of the second substrate, and the refrigerator electrode is not located in the projection range of the second substrate.

9. The optical module according to claim 7, characterized in that: include: A thermosensitive pad is located on the upper surface of the second substrate, and the thermosensitive pad is located on one side of the laser array; The thermistor is located on the thermistor pad, and the thermistor is electrically connected to the first pad area.

10. The optical module according to claim 7, characterized in that: include: Photoelectric detection array; A detection pad, located above the first pad area, and between the first pad area and the photoelectric detection array; The photodetection array is electrically connected to the second pad region.

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