Controller

Abstract

The utility model discloses a controller, which is characterized in that the controller comprises a shell, the shell is provided with a bottom surface and a side wall arranged around the bottom surface, and the inner side of the shell further comprises a boss; the circuit board is located in the shell, the first surface of the circuit board is opposite to the bottom surface of the shell, and the second surface of the circuit board is provided with an electrical element; the protective layer is filled in the shell and covers the second surface of the circuit board; wherein the bottom surface of the shell is provided with a radiator facing the circuit board, and the radiator corresponds to a heating electrical element on the circuit board; the second surface of the circuit board is lower than the upper end face of the side wall. According to the scheme, the size of the controller is remarkably reduced, the occupied size of a compressor bin can be saved, space is vacated for a radiator, an air inlet pipeline and an air outlet pipeline, and the volume of the refrigerator is increased by reducing the size of the controller under the same size.

Description

Technical Field

[0001] The utility model relates to the technical field of control, and more specifically, to a controller for a DC compressor. Background Art

[0002] A car fridge refers to a refrigerator that can be carried in a vehicle. It is a new generation of refrigeration and cold storage appliance that has become popular in the international market in recent years.

[0003] There are mainly two types of car fridges on the market. One is a semiconductor car fridge, whose principle is to refrigerate by an electronic chip. The other is a compressor car fridge. The compressor is a traditional technology of traditional fridges. It has a low refrigeration temperature, with a refrigeration range of -18°C to 10°C. It has high refrigeration efficiency and can make ice and keep fresh.

[0004] However, for existing car fridges, due to the presence of a compressor, they also need to be equipped with a compressor controller, which occupies a relatively large overall volume, thus resulting in too small a volume of the car fridge. It is difficult to hold watermelons or larger fruits when refrigerating, and it is also not suitable for the popular in-vehicle fridges installed in the front armrest box.

[0005] Therefore, a new type of controller is proposed to significantly reduce the volume occupied by the controller so that it can be applicable to various limited spaces such as the front armrest box. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a controller to solve the technical problems of the existing controller being too large in volume and insufficient in heat dissipation ability, and to meet the requirements of small volume and strong heat dissipation.

[0007] According to one aspect of the utility model, there is provided a controller, including: a housing having a bottom surface and side walls surrounding the bottom surface; a circuit board located in the housing, with the first surface of the circuit board disposed opposite to the bottom surface of the housing, and electrical components disposed on the second surface of the circuit board; a protective layer filled in the housing and covering the second surface of the circuit board; wherein, a radiator is provided on the bottom surface of the housing facing the circuit board, and the radiator corresponds to the heat-generating electrical components on the circuit board.

[0008] Optionally, the second surface of the circuit board is lower than the upper end surface of the side wall.

[0009] Optionally, the protective layer is a three-proof paint, and the three-proof paint covers the second surface of the circuit board.

[0010] Optionally, the protective layer is a potting compound, and the potting compound wraps the circuit board.

[0011] Optionally, the radiator is a boss provided on the bottom surface of the housing facing the circuit board.

[0012] Optionally, the back surface of the housing corresponding to the boss is a flat surface.

[0013] Optionally, the back surface of the housing corresponding to the boss is recessed toward the circuit board side.

[0014] Optionally, the back surface of the housing corresponding to the boss protrudes outward.

[0015] Optionally, the radiator and the housing are of an integral structure or a split structure.

[0016] Optionally, a fastening bayonet perpendicular to the bottom surface of the housing is further provided on the back surface of the housing, and a bracket bayonet is further provided on at least one side of the housing. The fastening bayonet and the bracket bayonet are matched with the bracket of the compressor.

[0017] Optionally, at least two support columns are provided on the bottom surface, and the two support columns respectively correspond to two opposite corners of the circuit board. The circuit board is connected to the support columns on the bottom surface.

[0018] Optionally, the circuit board has through holes corresponding to the support columns, and the support columns also have threaded holes. The circuit board is connected to the support columns by screws.

[0019] Optionally, a protrusion is provided on the side wall of the housing, and a groove is provided on the side surface of the circuit board. The groove corresponds to the protrusion so that the direction of the circuit board corresponds to the housing.

[0020] Optionally, the height of the support column is greater than the height of the boss, and an insulating heat-conducting pad is further provided between the boss and the first surface of the circuit board.

[0021] Optionally, the height difference between the support column and the boss is less than the thickness of the insulating heat-conducting pad so that the insulating heat-conducting pad is compressed and the first surface of the circuit board is closely attached to the boss.

[0022] Optionally, the insulating heat-conducting pad includes a silicone film or a heat-conducting silicone sheet.

[0023] Optionally, the side wall further includes a housing fixing portion extending laterally outward. The housing fixing portion has a fixing through hole, and the controller is fixedly connected to the outside through the fixing through hole.

[0024] Optionally, the circuit board further has a potting hole communicating the first surface and the second surface. The potting compound fills the cavity between the first surface of the circuit board and the bottom surface of the housing through the potting hole.

[0025] Optionally, the pins of at least some of the components in the circuit board protrude from the potting glue.

[0026] Optionally, the potting glue includes a first potting glue and a second potting glue. The first potting glue fills the cavity between the circuit board and the bottom surface of the housing, and the second potting glue covers the second surface of the circuit board. The thermal conductivity of the first potting glue is greater than that of the second potting glue.

[0027] The controller provided by the present utility model realizes a significant reduction in the volume of the controller through the design of the product housing and the overall layout. Moreover, the controller can also prevent dust and water, and has excellent heat dissipation ability. Further, the housing of the controller is only a single component. Compared with the combined housing of the upper cover and the lower case, the housing of the controller of the present utility model requires fewer components, which can not only reduce costs, but also make its assembly and installation more convenient. The radiator of the housing of the controller dissipates heat by contacting the first surface of the circuit board through an insulating thermal pad. This heat dissipation design is simple and reasonable, and can meet the heat dissipation requirements of the circuit board. Specifically, the controller is small and thin, and can be used as the controller of a vehicle-mounted refrigerator. Since the controller has a small volume, it can save the volume occupied by the compressor compartment, make room for the radiator and the intake and exhaust pipelines, etc., and improve the refrigerator volume by reducing the volume of the controller under the same volume. Description of the Drawings

[0028] Through the following description of the embodiments of the present utility model with reference to the drawings, the above and other objects, features and advantages of the present utility model will become clearer.

[0029] Figure 1 Shows an exploded schematic view of the controller according to the first embodiment of the present utility model;

[0030] Figure 2 Shows a schematic view of the housing of the controller according to the first embodiment of the present utility model;

[0031] Figure 3 Shows an assembly schematic view of the controller according to the first embodiment of the present utility model;

[0032] Figure 4 Shows a schematic view of the assembled controller according to the first embodiment of the present utility model;

[0033] Figure 5 Shows a schematic view of the back of the housing of the controller according to the second embodiment of the present utility model;

[0034] Figure 6 Shows a schematic view of the back of the housing of the controller according to the third embodiment of the present utility model;

[0035] Figure 7Shows a schematic diagram of the inner side of the controller housing according to the third embodiment of the present invention. Detailed implementation manners

[0036] The present invention will be described in more detail below with reference to the accompanying drawings. In the respective drawings, the same elements are denoted by similar reference numerals. For the sake of clarity, the various parts in the drawings are not drawn to scale. In addition, some well-known parts may not be shown.

[0037] It should be understood that when describing the structure, when a component or a module is referred to as being "before" another component or another module, it may mean directly at the front end of the circuit of the other component or another module and connected thereto, or there are other components or modules between it and the other component or another module. And, if necessary, some modules can also adjust their positions and adjacency relationships.

[0038] If it is to describe the situation of being directly before another component or another module, the expressions "directly before..." or "before and adjacent to..." will be used in this article.

[0039] In the following, many specific details of some embodiments of the present invention are described, such as the specific circuit composition of the module, the component models, quantities, and connection relationships, in order to more clearly understand the present invention. However, as those skilled in the art can understand, the present invention can be implemented without these specific details.

[0040] The present invention can be presented in various forms, and some examples will be described below.

[0041] Figure 1 Shows an exploded schematic diagram of the controller according to the first embodiment of the present invention; in this exploded schematic diagram, the potting glue is omitted to better show other structures. The controller includes: a housing 100, an insulating and heat-conducting pad 200, and a circuit board 300, and is potted with potting glue to make the circuit board 300 in the housing 100 dustproof and waterproof. Specifically, the housing 100 includes a bottom surface 110 and a side wall 120 surrounding the bottom surface 110. The bottom surface 110 is, for example, a rounded rectangle, and the side wall 120 has a certain height, so that the bottom surface 110 and the side wall 120 enclose an open accommodation space. A boss 111 is also provided on the bottom surface 110, and the position, shape, and size of the boss, for example, correspond to the high-heat-generating electrical components on the circuit board 300. Support columns 112 are also provided in a set of diagonal regions of the bottom surface 110. The support columns 112 are, for example, used to support the circuit board 300. A protrusion 121 is also provided on the side wall 120 on one side of the housing 100, and a groove 320 corresponding to it is provided on the circuit board 300. Through the protrusion 121 and the groove 320, the circuit board 300 can be effectively prevented from rotating in the housing 100 and the direction of the circuit board 300 can be prevented from being incorrect during assembly.

[0042] The circuit board 300 includes a first surface facing the bottom surface 110 of the housing 100 and a second surface opposite to the first surface. A plurality of electrical components 310 are arranged on the circuit board 300. Specifically, the plurality of electrical components 310 are all located on the second surface of the circuit board 300. An insulating heat-conducting pad 200 is further arranged between the first surface of the circuit board 300 and the boss 111. The shape of the insulating heat-conducting pad 200 is, for example, matched with the boss 111. Through holes 330 are arranged at the corners of the circuit board 300 corresponding to the support posts 112. Threaded holes are arranged on the support posts 112. One end of a bolt 331 passes through the through hole 330 of the circuit board 300 and is connected to the threaded hole on the support post 112. By tightening the bolt 331, the circuit board 300 is connected to the housing 100 through the support posts 112. Further, since the insulating heat-conducting pad 200 needs to be arranged between the first surface of the circuit board 300 and the boss 111, the height of the support post 112 is greater than the height of the boss 111; in order to make the circuit board 300 closely connected to the boss 111, the insulating heat-conducting pad 200 needs to be compressed, so the height difference between the support post 112 and the boss 111 is less than the thickness of the insulating heat-conducting pad 200. When the bolt 331 is tightened to fix the circuit board 300 on the support post 112, the insulating heat-conducting pad 200 is compressed so that the first surface of the circuit board 300 is in close contact with the top surface of the boss 111. Specifically, the upper surface of the boss 111 is 0.5 mm lower than the top surface of the support post 112. The insulating heat-conducting pad 200 is, for example, a silicone film or a heat-conducting silicone sheet. The size of the insulating heat-conducting pad 200 is not less than the size of the boss 111. The thickness of the insulating heat-conducting pad 200 is, for example, 0.7 mm.

[0043] Figure 2Shows a schematic diagram of the controller housing according to the first embodiment of the present invention; the housing 100 includes a bottom surface 110 and side walls 120 surrounding the bottom surface 110. The bottom surface 110 is, for example, a rounded rectangle, and the side walls 120 have a certain height, such that the bottom surface 110 and the side walls 120 enclose an open accommodation space, enabling the circuit board 300 to be placed in this accommodation space. In the middle area of the bottom surface 110, there is a boss 111 corresponding to the position and size of the high-heat-generating electrical components in the circuit board 300. The boss 111 can be in contact with the first surface of the circuit board 300 through an insulating heat-conducting pad 200, thereby better conducting heat and enabling the electrical components to have better heat dissipation ability. The housing 100 is, for example, integrally formed. At the upper left corner and the lower right corner of the bottom surface 110, there is a support post 112 respectively. The top of the support post 112 is provided with a threaded hole, and the circuit board 300 can be connected to the support post 112 through a bolt 331, thereby fixing the circuit board 300. Of course, the height of the side walls 120 is greater than the height of the support posts 112, and more support posts 112 can be provided as needed. The above-mentioned scheme of only setting support posts 112 at a pair of corners is only an example. On the left side wall 120 of the housing 100, there is an inwardly protruding protrusion 121, which is used to match a corresponding groove 320 on the circuit board 300 to prevent the circuit board 300 from being installed in the wrong direction. The upper side wall 120, the right side wall 120, and the lower side wall 120 are all provided with a housing fixing portion 122 extending laterally outward. The housing fixing portion 122 has a fixing through hole, and the housing 100 of the controller can be connected to an external structure through the fixing through hole of the housing fixing portion 122 to realize the fixing of the controller. Of course, the number and position of the housing fixing portions 122 can also be adjusted according to actual needs. Further, an asymmetric design can be adopted to avoid the controller being installed in the wrong direction.

[0044] Figure 3 Shows an assembly schematic diagram of the controller according to the first embodiment of the present invention; as Figure 3 can be seen, the circuit board 300 has been installed in the housing 100 and the bolt 331 has been tightened. In order to make the controller have dust and water protection capabilities, it is necessary to use potting glue to pot the circuit board 300. In order to enable the potting glue to fill the space between the first surface of the circuit board 300 and the bottom surface 110 of the housing 100, the circuit board 300 is also provided with a potting hole 340 communicating the first surface and the second surface of the circuit board 300. For more convenient potting, the potting hole 340 is, for example, two. One is used for potting, and the other can be used for exhausting air to avoid the influence of air residue on the potting effect.

[0045] Figure 4 Shows a schematic diagram of the assembled controller according to the first embodiment of the present invention. In Figure 3On the basis of the assembly, potting is performed with potting glue 400. The potting glue 400 not only fills the space between the first surface of the circuit board 300 and the housing 100 through the potting holes 340, but also covers the second surface of the circuit board 300 where electrical components are arranged. At least part of the electrical components are covered by the potting glue 400. The filling height of the potting glue 400, for example, does not exceed the side wall of the housing 100, and at least part of the pins of the circuit board 300 extend from the potting glue 400. Further, the potting glue 400 may also include two potting glues with different thermal conductivity. The space between the first surface of the circuit board 300 and the housing 100 uses a potting glue with high thermal conductivity, and the second surface of the circuit board 300 uses a potting glue with relatively poor thermal conductivity and relatively strong protection. Optionally, the potting glue may be replaced with a three-proof paint, and the three-proof paint may be used to cover the second surface of the circuit board 300 where electrical components are arranged.

[0046] Figure 5 A schematic diagram of the back side of the controller housing of the second embodiment of the utility model is shown; the bottom surface 110 of the controller housing of the second embodiment and the back side corresponding to the boss 111 protrude outward to form a protruding structure 130, and the protruding structure 130 protrudes from the bottom surface 110 of the housing, which can obtain a larger heat dissipation area, so that the controller can be applied to working conditions with higher power and more severe heat generation.

[0047] Figure 6 and Figure 7 A schematic diagram of the back side of the controller housing of the third embodiment of the utility model and a schematic diagram of the inner side of the housing are respectively shown; the bottom surface 110 of the controller housing of the third embodiment and the back side corresponding to the boss 111 have a recess 140 facing one side of the circuit board to avoid and free up more space, the bottom surface 110 of the housing is also provided with a lug perpendicular to the bottom surface 110, and a fastening bayonet 150 is provided on the lug; a bracket bayonet 160 is also provided on the side wall 120 of one side of the housing; the fastening bayonet 150 and the bracket bayonet 160 match the bracket of the compressor, specifically, the fastening bayonet 150 is, for example, fixed to the side of the compressor, and the bracket bayonet 160 is, for example, fixed to the back of the compressor, and the controller can be installed on the compressor through the above two bayonet using fasteners such as screws, and the recess 140 can not only save materials and reduce costs, but also avoid the outer contour of the compressor, so that the two are more closely attached, reducing the space occupied by the controller and the compressor.

[0048] The controller provided by the present utility model realizes a significant reduction in the volume of the controller through the design of the product housing and the overall layout. Moreover, this controller can also prevent dust and water, and has excellent heat dissipation capacity. Further, the housing of this controller is only a single component. Compared with the combined housing of the upper cover and the lower case, the housing of the controller of the present utility model requires fewer components, which can not only reduce costs, but also be more convenient for assembly and installation. The radiator of the housing of this controller dissipates heat by contacting the first surface of the circuit board through an insulating heat-conducting pad. This heat dissipation design is simple and reasonable, and can meet the heat dissipation requirements of the circuit board. Specifically, this controller is small and thin, and can be used as the controller of a car refrigerator. Due to the small volume of this controller, the volume occupied by the compressor compartment can be saved, creating space for the radiator, the intake and exhaust pipelines, etc. By reducing the volume of the controller under the same volume, the refrigerator volume is increased.

[0049] In the above description, no detailed explanations have been made on the technical details such as the position combination and connection method of each component. However, those skilled in the art should understand that various technical means can be used to form the required connection relationship, etc. Additionally, for the purpose of having the same function, those skilled in the art can also design structures that are not exactly the same as the structures described above. Moreover, although the above embodiments have been described separately, this does not mean that the measures in each embodiment cannot be advantageously combined and used.

[0050] The embodiments of the present utility model have been described above. However, these embodiments are only for illustrative purposes and not for limiting the scope of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents. Without departing from the scope of the present utility model, those skilled in the art can make various substitutions and modifications, and these substitutions and modifications should all fall within the scope of the present utility model.

Claims

1. A controller, characterized in that, Comprising: A housing having a bottom surface and a side wall disposed around the bottom surface; A circuit board located in the housing, with the first surface of the circuit board disposed opposite to the bottom surface of the housing, and electrical components disposed on the second surface of the circuit board; A protective layer filled in the housing and covering the second surface of the circuit board; Wherein, a heat sink is disposed on the bottom surface of the housing facing the circuit board, and the heat sink corresponds to the electrical components generating heat on the circuit board.

2. The controller according to claim 1, characterized in that, The second surface of the circuit board is lower than the upper end surface of the side wall.

3. The controller according to claim 1, characterized in that, The protective layer is a three-proof paint, and the three-proof paint covers the second surface of the circuit board.

4. The controller according to claim 1, wherein The protective layer is a potting compound, and the potting compound wraps the circuit board.

5. The controller according to claim 1, wherein The heat sink is a boss disposed on the bottom surface of the housing facing the circuit board.

6. The controller according to claim 5, wherein The back surface of the bottom surface of the housing corresponding to the boss is a plane.

7. The controller according to claim 5, characterized in that, The back surface of the bottom surface of the housing corresponding to the boss is recessed towards the circuit board side.

8. The controller according to claim 5, wherein The back surface of the bottom surface of the housing corresponding to the boss protrudes outwards.

9. The controller according to claim 1, characterized in that, The heat sink and the housing are of an integral structure or a split structure.

10. The controller according to claim 1, wherein A fastening bayonet perpendicular to the bottom surface of the housing is further disposed on the back surface of the housing, and a bracket bayonet is further disposed on at least one side of the housing. The fastening bayonet and the bracket bayonet are matched with the bracket of the compressor.

11. The controller according to claim 5, wherein, At least two support columns are disposed on the bottom surface, and the two support columns respectively correspond to two opposite corners of the circuit board, and the circuit board is connected to the support columns on the bottom surface.

12. The controller according to claim 11, wherein, The circuit board has through holes corresponding to the support columns, and the support columns also have threaded holes, and the circuit board is connected to the support columns by screws.

13. The controller according to claim 11, wherein A protrusion is disposed on the side wall of the housing, and a groove is disposed on the side surface of the circuit board. The groove corresponds to the protrusion to make the direction of the circuit board correspond to the housing.

14. The controller according to claim 11, wherein The height of the support column is greater than the height of the boss, and an insulating heat-conducting pad is further disposed between the boss and the first surface of the circuit board.

15. The controller according to claim 14, wherein The height difference between the support column and the boss is less than the thickness of the insulating heat-conducting pad, so that the insulating heat-conducting pad is compressed, and the first surface of the circuit board is closely attached to the boss.

16. The controller according to claim 15, wherein The insulating heat-conducting pad includes a silicone film or a heat-conducting silicone sheet.

17. The controller according to claim 1, characterized in that, The side wall further includes a housing fixing portion extending laterally outwards. The housing fixing portion has a fixing through hole, and the controller is fixedly connected to the outside through the fixing through hole.

18. The controller according to claim 4, characterized in that, The circuit board further has a potting hole communicating the first surface and the second surface, and the potting compound fills the cavity between the first surface of the circuit board and the bottom surface of the housing through the potting hole.

19. The controller according to claim 4, wherein The pins of at least some components in the circuit board protrude from the potting compound.

20. The controller according to claim 4, wherein The potting compound includes a first potting compound and a second potting compound. The first potting compound fills the cavity between the circuit board and the bottom surface of the housing, and the second potting compound covers the second surface of the circuit board. The heat-conducting ability of the first potting compound is greater than that of the second potting compound.

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