Integrated temperature and pressure two-parameter sensing device for manipulator

By integrating temperature and pressure sensors into the robotic arm, utilizing the resistance of metal wires and the piezoresistive effect of single-crystal silicon for detection, and fixing them through adsorption and snap-fit ​​mechanisms, the problems of sensor instability and inaccurate sensing in the robotic arm are solved, achieving more stable and accurate detection of object temperature and pressure.

CN223630394UActive Publication Date: 2025-12-05CHANGZHOU FUPUSHENG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202520269030.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-20
Publication Date
2025-12-05
Estimated Expiration
2035-02-20

AI Technical Summary

Technical Problem

Existing robotic arms lack dual-parameter sensors for temperature and pressure, resulting in inaccurate sensing of the temperature of objects and the pressure of gripping, and the sensors are unstable.

Method used

Temperature and pressure sensors are installed in the palm and fingers of the robotic arm. Temperature and pressure are detected by utilizing the change in resistance of metal wires and the piezoresistive effect of single-crystal silicon. The sensors are fixed by adsorption and snap-on positioning mechanisms to prevent them from falling off and the wiring from becoming messy.

Benefits of technology

It achieves precise sensing of the temperature and pressure of objects, and the sensor is installed stably to avoid falling and wiring chaos, thus improving the accuracy of the robotic arm in simulating a human hand.

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Abstract

The utility model relates to the technical field of manipulators, and discloses an integrated temperature and pressure two-parameter sensing device for a manipulator, which comprises a manipulator body, a temperature sensor mechanism is arranged in the middle of the palm center of the manipulator body, and a pressure sensing mechanism is arranged at the finger position of the manipulator body. The pressure sensing mechanism and the manipulator body are installed and connected through the adsorption placing mechanism, and the buckle positioning mechanism is installed on the finger wall of the manipulator body. Through the pressure sensing mechanism structure, pressure parameters are effectively detected, installation is more convenient, installation gliding is effectively avoided, the pressure sensing mechanism is fixed through the adsorption placement mechanism, falling is effectively avoided after installation, installation and placement are more stable, and through the buckle positioning mechanism structure, the pressure sensing mechanism is fixed through the adsorption placement mechanism. In this way, the wire source on the outer side can be effectively fixed, the wire source can be placed more regularly, and therefore the wire source is not prone to being wound outside.
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