Tin-climbing-prevention PIN bonding pad power module substrate

Abstract

The utility model relates to an anti-tin-climbing PIN bonding pad power module substrate, which comprises a substrate body and a Pin assembly, the Pin assembly is welded on the substrate body, each Pin comprises a pin seat and a pin body, the pin seat is provided with a through hole, the pin body is matched with the through hole and is inserted in the through hole, the pin seat comprises a column body, a solder resisting ring is formed on the circumferential surface of the upper end of the column body, and the solder resisting ring is connected with the pin body. The solder mask ring is arranged at the upper end of the needle seat, so that tin liquid can be blocked by the solder mask ring when moving from the bottom of the needle seat to the needle body in the tin soldering process, tin is prevented from climbing onto the needle body, the needle body is prevented from being free of tin, and a power module and a PCB (printed circuit board) can be assembled smoothly at a client.

Description

TECHNICAL FIELD

[0001] The utility model belongs to power module pin technology field, concretely relates to a kind of anti-tin PIN needle pad power module substrate. BACKGROUND

[0002] Power module signal PIN needle is a kind of copper as base material, surface gold-plated material.Usually there is split type via and split type blind hole structure.In recent years, HPD (Hybrid PACK Drive) encapsulation module is rapidly widely used in electric vehicle market by the advantages of high power density, simple design.But in module encapsulation process, because PIN needle surface gold-plated, wettability is good, cause the soldering tin at PIN needle bottom tin will be along the needle body upwards, affect the bonding force of PIN needle and pad.If tin is serious, soldering tin climbs to PIN needle top, causes power module and drive PCB (Printed Circuit Board) assembly is blocked.

[0003] Therefore, the present application is produced. CONTENT OF UTILITY MODEL

[0004] In view of the deficiencies of the prior art, the technical problem to be solved by the utility model is to provide a kind of anti-tin PIN needle pad power module substrate, it can.

[0005] To solve the above technical problems, the technical scheme adopted by the utility model is: a kind of anti-tin PIN needle pad power module substrate, including substrate body and Pin needle component, the Pin needle component is welded on substrate body, the Pin needle includes needle seat and needle body, the needle seat has through hole, the needle body is adapted to through hole and is inserted in through hole, the needle seat includes column, the upper end circumferential surface of the column is formed with solder stop ring.

[0006] Further, the solder stop ring and the outer circumferential surface of the column form a chamfer.

[0007] Further, the lower end circumferential surface of the column is provided with a bottom ring, and the lower surface of the bottom ring is flush with the lower surface of the column.

[0008] Further, the bottom ring and the circumferential surface of the column form a chamfer.

[0009] Further, the needle body includes a connecting portion and a plug-in portion, the connecting portion is connected above the plug-in portion, the plug-in portion is inserted into the through hole, the plug-in portion is circular in horizontal cross section, and the through hole is a circular hole.

[0010] Further, the upper surface of the column has a convex ring, and the through hole penetrates to the upper surface of the convex ring.

[0011] The utility model provides a kind of anti-tin creep pin pin pad power module substrate, including substrate body and Pin needle assembly, the Pin needle assembly is welded on substrate body, the Pin needle includes needle seat and needle body, the needle seat has slot, the needle body is adapted with slot and is inserted in slot, the side of needle seat is formed with notch, the notch is communicated with slot, the needle seat includes column, the upper end circumferential surface of column is formed with solder mask ring.

[0012] Further, the lower end circumferential surface of the column is provided with a bottom ring, and the lower surface of the bottom ring is flush with the lower surface of the column.

[0013] Further, the needle body includes a connecting portion and an insertion portion, the connecting portion is connected above the insertion portion, the insertion portion is inserted into the slot, the horizontal cross section of the insertion portion is circular, and the horizontal cross section of the slot is circular.

[0014] Further, the upper surface of the column has a convex ring, and the slot opening penetrates to the upper surface of the convex ring.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] 1. The utility model discloses a solder mask ring on the upper end of the needle seat, which prevents the tin liquid from moving from the bottom of the needle seat to the needle body during the soldering process, prevents the tin from climbing onto the needle body, and makes the power module and PCB assembly at the client end smooth.

[0017] 2. When the tin liquid overflows the solder mask ring due to improper operation of the operator during the soldering process, such as too much solder, the upper surface of the needle seat is also provided with a convex ring, so that the overflowing tin liquid does not climb onto the needle body.

[0018] 3. The insertion portion and the through hole of the needle body are changed from the traditional square shape to the circular shape, so that the needle body and the through hole cooperate less and the gap is smaller. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a perspective structure schematic view of the Pin needle assembly in the utility model embodiment 1.

[0020] Figure 2 It is a sectional structure schematic view of the Pin needle assembly in the utility model embodiment 1.

[0021] Figure 3 It is a perspective structure schematic view of the utility model embodiment 2.

[0022] Figure 4 It is a perspective structure schematic view of the Pin needle assembly in the utility model embodiment 2.

[0023] Figure 5It is the cross section structure schematic view of Pin needle assembly in the embodiment 2 of the utility model;

[0024] Figure 6 It is the three-dimensional structure schematic view of Pin needle assembly in the embodiment 3 of the utility model;

[0025] Figure 7 It is the cross section structure schematic view of Pin needle assembly in the embodiment 3 of the utility model;

[0026] Figure 8 It is the three-dimensional structure schematic view of the embodiment 4 of the utility model;

[0027] Figure 9 It is the three-dimensional structure schematic view of Pin needle assembly in the embodiment 4 of the utility model;

[0028] Figure 10 It is the cross section structure schematic view of Pin needle assembly in the embodiment 4 of the utility model;

[0029] Figure 11 It is the three-dimensional structure schematic view of Pin needle assembly in the embodiment 5 of the utility model;

[0030] Figure 12 It is the cross section structure schematic view of Pin needle assembly in the embodiment 5 of the utility model;

[0031] Figure 13 It is the three-dimensional structure schematic view of Pin needle assembly in the embodiment 6 of the utility model;

[0032] Figure 14 It is the cross section structure schematic view of Pin needle assembly in the embodiment 6 of the utility model;

[0033] Figure 15 It is the three-dimensional structure schematic view of Pin needle assembly in the embodiment 7 of the utility model;

[0034] Figure 16 It is the cross section structure schematic view of Pin needle assembly in the embodiment 7 of the utility model;

[0035] Figure 17 It is the three-dimensional structure schematic view of Pin needle assembly in the embodiment 8 of the utility model;

[0036] Figure 18 It is the cross section structure schematic view of Pin needle assembly in the embodiment 8 of the utility model.

[0037] Marked in the drawing: 1, base plate body;2, Pin needle assembly;21, needle holder;211, through hole;212, insertion slot;2121, notch;213, convex ring;214, solder resist ring;215, bottom ring;22, needle body;221, connecting part;222, insertion part. Detailed Implementation

[0038] To make the above-mentioned features and advantages of this utility model more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings for detailed explanation.

[0039] Example 1

[0040] like Figures 1-2 As shown, this embodiment provides a power module substrate with anti-solder creep PIN pads, including a substrate body 1 and a PIN assembly 2.

[0041] Pin assembly 2 is soldered onto substrate body 1. Pin includes pin base 21 and pin body 22. Pin base 21 has through hole 211. Pin body 22 is adapted to through hole 211 and inserted into through hole 211. Pin base 21 includes column. Solder resist ring 214 is formed on the upper peripheral surface of column. Chamfer is formed between solder resist ring 214 and outer peripheral surface of column. During soldering, solder can be guided to the outer side of column, which can effectively prevent solder from climbing.

[0042] Preferably, the needle body 22 includes a connecting part 221 and an insert part 222. The connecting part 221 is connected above the insert part 222, and the insert part 222 is inserted into the through hole 211. The horizontal cross-section of the insert part 222 is circular, and the through hole 211 is a circular hole. Changing the traditional square shape of the insert part 222 and the through hole 211 of the needle body 22 to a circle makes the fit between the needle body 22 and the through hole 211 less and the gap smaller.

[0043] Example 2

[0044] like Figures 3-5 As shown, the difference between this embodiment and embodiment 1 is that a bottom ring 215 is provided on the lower circumferential surface of the column. The lower surface of the bottom ring 215 is flush with the lower surface of the column. A chamfer is formed between the bottom ring 215 and the circumferential surface of the column. The bottom ring 215 increases the welding area, so that the pin seat 21 is more firmly welded to the substrate body 1.

[0045] Example 3

[0046] like Figures 6-7 As shown, the difference between this embodiment and embodiment 1 is that the upper surface of the column has a raised ring 213, and the through hole 211 extends through to the upper surface of the raised ring 213. The raised ring 213 is provided so that when the solder overflows the solder resist ring 214, the upper surface of the needle seat 21 is also provided with a raised ring 213, so that the overflowing solder will not climb onto the needle body 22.

[0047] Example 4

[0048] like Figures 8-10 As shown, the difference between this embodiment and embodiment 2 is that the upper surface of the column has a raised ring 213, and the through hole 211 extends through to the upper surface of the raised ring 213.

[0049] Embodiment 5

[0050] As Figures 11-12 shown, a anti-creep tin pin pin soldering pad power module substrate includes a substrate body 1 and a pin pin assembly 2, the pin pin assembly 2 is welded on the substrate body 1, the pin pin includes a pin seat 21 and a pin body 22, the pin seat 21 has a slot 212, the pin body 22 is matched with the slot 212 and is inserted into the slot 212, a notch 2121 is formed on the side of the pin seat 21, the notch 2121 is communicated with the slot 212, the pin seat 21 includes a column, an upper end peripheral surface of the column is formed with a solder mask ring 214, and a chamfer is formed between the solder mask ring 214 and the peripheral surface of the column.

[0051] Preferably, the pin body 22 includes a connecting part 221 and an insertion part 222, the connecting part 221 is connected above the insertion part 222, the insertion part 222 is inserted into the slot 212, the horizontal section of the insertion part 222 is circular, and the through hole 211 is a circular hole, so that the insertion part 222 of the pin body 22 and the through hole 211 are changed from the traditional square to the circular, and the cooperation between the pin body 22 and the through hole 211 is less and the gap is smaller.

[0052] In the soldering process, the tin liquid is overflowed into the through hole 211 to realize the connection between the pin body 22 and the pin seat 21, since the pin seat 21 is attached to the substrate body 1 during welding, the overflowed tin liquid is less, in order to solve this problem, the through hole 211 is changed to the slot 212, the two sides of the slot 212 are provided with the notch 2121, in the soldering process, when the tin liquid overflows upward, it can overflow from the notch 2121, so that the pin seat 21 and the pin body 22 are connected.

[0053] Preferably, the slot 212 is divided into an upper end and a lower end, the diameter of the lower end of the slot 212 is greater than the diameter of the insertion part 222, so that the tin liquid can better overflow, the connection firmness of the pin seat 21 and the pin body 22 is enhanced, and the tin creep can be prevented.

[0054] Embodiment 6

[0055] As Figures 13-14 shown, the difference between the present embodiment and embodiment 5 is that a bottom ring 215 is arranged on the peripheral surface of the lower end of the column, the lower surface of the bottom ring 215 is flush with the lower surface of the column, and a chamfer is formed between the bottom ring 215 and the peripheral surface of the column.

[0056] Embodiment 7

[0057] As Figures 5-16 shown, the difference between the present embodiment and embodiment 5 is that the upper surface of the column has a convex ring 213, the through hole 211 penetrates to the upper surface of the convex ring 213,

[0058] Embodiment 8

[0059] As Figures 17-18As shown, the embodiment is different from the embodiment 6 in that the upper surface of the column body has a convex ring 213, and the through hole 211 penetrates to the upper surface of the convex ring 213.

[0060] The basic principle and main features of the present application and the advantages of the present application are shown and described above, and those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A creepage-preventing, tin-pin land power module substrate, characterized by: The application relates to a substrate body and a Pin needle assembly welded on the substrate body, wherein the Pin needle comprises a needle base and a needle body, the needle base is provided with a through hole, the needle body is matched with the through hole and is inserted into the through hole, the needle base comprises a column body, and a soldering prevention ring is formed on the upper peripheral surface of the column body.

2. The anti-creep soldered PIN-socket land power module substrate of claim 1, wherein: An inverted angle is formed between the soldering prevention ring and the peripheral surface of the column body.

3. The anti-creep soldered PIN-socket land power module substrate of claim 1, wherein: A bottom ring is arranged on the lower peripheral surface of the column body, and the lower surface of the bottom ring is flush with the lower surface of the column body.

4. The anti-creep soldered PIN-socket land power module substrate of claim 3, wherein: An inverted angle is formed between the bottom ring and the peripheral surface of the column body.

5. The anti-creep soldered PIN-socket land power module substrate of claim 1, wherein: The needle body comprises a connecting part and an insertion part, the connecting part is connected above the insertion part, the insertion part is inserted into the through hole, the horizontal section of the insertion part is circular, and the through hole is a circular hole.

6. The anti-creep soldered PIN-socket land power module substrate according to claim 1 or 3 or 5, wherein: The upper surface of the column body is provided with a convex ring, and the through hole penetrates to the upper surface of the convex ring.

7. A creepage-preventing tin-PIN-landed power module substrate, characterized by: The application relates to a substrate body and a Pin needle assembly welded on the substrate body, wherein the Pin needle comprises a needle base and a needle body, the needle base is provided with a through hole, the needle body is matched with the through hole and is inserted into the through hole, the needle base comprises a column body, and a soldering prevention ring is formed on the upper peripheral surface of the column body.

8. The anti-creep soldered PIN-socket land power module substrate of claim 7, wherein: An inverted angle is formed between the soldering prevention ring and the peripheral surface of the column body.

9. The anti-creep soldered PIN-socket land power module substrate of claim 7, wherein: A bottom ring is arranged on the lower peripheral surface of the column body, and the lower surface of the bottom ring is flush with the lower surface of the column body.

10. The anti-creep soldered PIN-socket land power module substrate of claim 7 or 8, wherein: The needle body comprises a connecting part and an insertion part, the connecting part is connected above the insertion part, the insertion part is inserted into the through hole, the horizontal section of the insertion part is circular, and the through hole is a circular hole. The upper surface of the column body is provided with a convex ring, and the through hole penetrates to the upper surface of the convex ring.

Images