On-chip antenna circuit system based on board-level welding

Abstract

The utility model relates to the technical field of wireless communication, in particular to an on-chip antenna circuit system based on board-level welding, which comprises an antenna board, a digital board and a bonding pad structure, the antenna board is used for receiving and transmitting millimeter wave frequency band signals, the digital board is used for processing digital signals and control logic, and the bonding pad structure is used for connecting the digital board and the bonding pad structure. The antenna board and the digital board are directly welded through the bonding pad structure. The pad structure is directly welded to replace a traditional connector, high-reliability connection between the antenna board and the digital board is achieved, and the risk of mechanical contact failure is eliminated. The bonding pad structure adopts an integrated design of a radio frequency signal bonding pad, a digital signal bonding pad, a power supply bonding pad and a ground bonding pad, supports transmission of multiple types of signals, and improves the integration level; in the split-board structure, a high-cost high-frequency microwave substrate and a low-cost universal printed circuit board substrate are used, so that the material cost is remarkably reduced.

Description

Technical Field

[0001] This utility model relates to the field of wireless communication technology, and in particular to an on-chip antenna circuit system based on board-level soldering. Background Technology

[0002] With the rapid development of millimeter-wave communication technology, various communication products, such as base stations, have entered the millimeter-wave stage. Applications such as 5G, satellite communication, and indoor positioning place increasingly stringent performance requirements on antenna systems. In antenna system design, the connection technology between the antenna board and the digital board is a critical aspect, directly impacting signal integrity, system efficiency, and reliability. Existing technologies primarily employ the following connection schemes:

[0003] Board-to-board RF connectors: Signal transmission is achieved through mechanical connectors, but they have problems such as high cost, increased contact resistance under long-term vibration and mechanical wear, which leads to decreased stability.

[0004] Conformal integration or packaging: Integrating the antenna and circuitry into the same PCB stack simplifies the structure, but requires the use of high-cost, high-frequency substrates for overall design, significantly increasing the difficulty of thermal management and system complexity.

[0005] Gold wire bonding: suitable for high-frequency signal connections, but limited by the inductive effect of gold wire, it is difficult to design and difficult to support the integration of multiple types of signals (such as power and digital signals).

[0006] The above solutions generally suffer from poor connection reliability, low integration, and high cost, making it difficult to meet the requirements of millimeter-wave systems for high performance, low cost, and high reliability. Utility Model Content

[0007] The purpose of this invention is to provide an on-chip antenna circuit system based on board-level soldering, which solves the problems of poor reliability, low integration and high cost in the connection between the antenna board and the digital board.

[0008] To achieve the above objectives, this utility model provides an on-chip antenna circuit system based on board-level soldering, including an antenna board, a digital board, and a pad structure. The antenna board is used to transmit and receive millimeter-wave band signals, and the digital board is used to process digital signals and control logic. The antenna board and the digital board are directly soldered together through the pad structure.

[0009] Furthermore, in the on-chip antenna circuit system, the pad structure includes, but is not limited to, radio frequency signal pads, digital signal pads, power pads, and ground pads, and the various types of pads form an integrated interconnect architecture.

[0010] Furthermore, in the on-chip antenna circuit system, both the antenna board and the digital board are provided with the pad structure, and the antenna board and the digital board are welded together through the solder points formed by the pad structure.

[0011] Furthermore, in the on-chip antenna circuit system, a microwave chip and an antenna patch are integrated on the antenna board, and the microwave chip radiates signals through the antenna patch.

[0012] Furthermore, in the on-chip antenna circuit system, the microwave chip includes at least one of an RF power amplifier chip, a driver amplifier chip, and a mixer chip.

[0013] Furthermore, in the on-chip antenna circuit system, a power chip is provided on the digital board, and the power chip transmits power to the microwave chip on the antenna board through the power pads of the pad structure.

[0014] Furthermore, in the on-chip antenna circuit system, the digital board is in contact with the heat dissipation boss on the external structural component.

[0015] Furthermore, in the on-chip antenna circuit system, the antenna board is made of high-frequency microwave substrate material, and the digital board is made of general-purpose printed circuit board substrate material.

[0016] Compared with the prior art, the present invention has at least the following technical effects:

[0017] This invention replaces traditional connectors with a direct soldering pad structure, achieving a highly reliable connection between the antenna board and the digital board and eliminating the risk of mechanical contact failure. The solder pad structure adopts an integrated design of RF signal pads, digital signal pads, power pads, and ground pads, supporting multiple types of signal transmission and improving integration. In the board-separated architecture, the use of high-cost high-frequency microwave substrates and low-cost general-purpose printed circuit board substrates significantly reduces material costs, while eliminating connectors and reducing assembly costs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of an on-chip antenna circuit system based on board-level soldering in one embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the bottom structure of the antenna plate in one embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the top structure of the antenna plate in one embodiment of the present invention;

[0021] Figure 4 In one embodiment of this utility model, and Figure 2The digital board corresponding to the antenna board in the diagram;

[0022] Figure 5 This is a block diagram showing the distribution of each functional chip on the digital board and the antenna board in one embodiment of the present invention.

[0023] Among them, 101 is the pad structure; 102 is the antenna board; 103 is the digital board; 104 is the heat dissipation boss; 105 is the microwave chip; 106 is the antenna patch; 201 is the RF signal pad solder joint; 202 is the ground pad solder joint; 203 is the digital signal pad solder joint; 204 is the power pad; 205 is the microwave chip; and 206 is the antenna patch. Detailed Implementation

[0024] The following is a more detailed description of an on-chip antenna circuit system based on board-level soldering according to the present invention, with reference to the schematic diagrams illustrating preferred embodiments of the present invention. It should be understood that those skilled in the art can modify the present invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the present invention.

[0025] For clarity, not all features of the actual embodiments are described. In the following description, well-known functions and structures are not detailed in detail, as they would confuse the present invention with unnecessary detail. It should be understood that in the development of any actual embodiment, numerous implementation details must be made to achieve the developer's specific goals, such as changes from one embodiment to another according to limitations related to the system or business. Furthermore, it should be understood that such development work may be complex and time-consuming, but is merely routine work for those skilled in the art.

[0026] The present invention will be described in more detail below by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0027] In millimeter-wave systems, the connection technology between the antenna board and the digital board directly affects signal integrity and system reliability. Traditional solutions, such as RF connectors, suffer from high cost and poor stability, while conformal integration or gold wire bonding increase complexity or design difficulty.

[0028] In view of this, and in view of these limitations of the prior art, this embodiment proposes an online antenna circuit system based on board-level welding to solve the problems of poor connection reliability, low integration and high cost in the prior art.

[0029] Specifically, such as Figure 1As shown, the online antenna circuit system based on board-level soldering includes an antenna board 102, a digital board 103, and a pad structure 101. The antenna board 102 is used to transmit and receive millimeter-wave band signals; the digital board 103 is used to process digital signals and control logic; the antenna board 102 and the digital board 103 are directly soldered together through the pad structure 101 to form a physical and electrical connection.

[0030] It should be noted that this embodiment uses direct soldering instead of traditional RF connectors, which can save on connector procurement and assembly costs. In addition, soldering can avoid the mechanical vibration sensitivity and contact resistance fluctuations of the connector, significantly improving long-term stability (solder joint resistance change ≤2% in vibration testing, while connector solutions ≥10%).

[0031] Furthermore, the pad structure 101 includes, but is not limited to, radio frequency signal pads, digital signal pads, power pads and ground pads, and the various types of pads form an integrated interconnect architecture.

[0032] In this embodiment, radio frequency, digital, power and ground signal transmission between antenna board 102 and digital board 103 is achieved through a single pad group. Antenna board 102 integrates a single microwave chip 105 and antenna patch 106, solving the problems of connection reliability, cost and integration, and is suitable for conventional scenarios.

[0033] For details, please refer to Figure 2-4 , Figure 2 This is a schematic diagram of the bottom structure of antenna plate 102. Figure 3 This is a schematic diagram of the top structure of antenna plate 102. Figure 4 To and Figure 2 The digital board corresponding to the antenna board in the diagram. Figure 2 The diagram above shows a solder joint with multiple pads, wherein the pad structure 101 includes an RF signal pad 201, a digital signal pad 203, a power pad 204, and a ground pad 202. The RF signal pad 201 is used to transmit RF signals from the digital board 103 to the antenna board 102. The digital signal pad 203 is used for transmitting control signals from the digital board 103 to the chips on the antenna board 102. The power pad 204 and ground pad 202 are respectively used by the digital board 103 to provide power supply circuits and signal reference grounds to the chips on the antenna board 102. Figure 3 The diagram illustrates the antenna patch 206 on the front of the antenna plate 102, which is used to radiate signals to the outside.

[0034] It should be noted that existing solutions only support antenna traces and ground pads, lacking integration of multiple signal types, requiring additional circuit layers or connectors to achieve power and digital signal transmission. This embodiment, however, supports the transmission of RF signals, digital signals, power signals, and ground signals within the same pad structure, reducing the number of wiring layers and improving integration.

[0035] Furthermore, both the antenna board 102 and the digital board 103 are provided with the pad structure, and the antenna board 102 and the digital board 103 are welded together through the welding points formed by the pad structure.

[0036] It should be noted that traditional soldering solutions have a loose pad layout, leading to signal path extension and impedance mismatch, and the cross-layer interconnect structure is not optimized. In this embodiment, the pad structures of the antenna board 102 and the digital board 103 adopt a symmetrical design, for example... Figure 4 Digital board 103 and Figure 2 The pads on the antenna board 102 are symmetrically positioned. Soldering is performed using a reflow soldering process with lead-free solder paste. This results in a robust mechanical connection, and cross-layer signal interconnection is achieved through blind or buried vias, significantly improving yield.

[0037] Furthermore, the antenna board 102 integrates a microwave chip 105 and an antenna patch 106, and the microwave chip 105 radiates signals through the antenna patch 106.

[0038] Furthermore, the microwave chip 105 includes at least one of an RF power amplifier chip, a driver amplifier chip, and a mixer chip, and is mounted on the surface of the antenna board 102.

[0039] In this embodiment, the antenna patch 106 and the output terminal of the microwave chip 105 are connected through transmission lines such as microstrip lines, coplanar waveguides, and striplines, or other passive devices (filters, power dividers, etc.) to achieve signal radiation.

[0040] It should be noted that existing technologies use external connectors to connect chips, resulting in longer signal paths and making it impossible to achieve compact integration of the microwave chip and the antenna. In this embodiment, however, the microwave chip 105 is directly mounted on the antenna board 102, significantly shortening the signal path and reducing transmission loss. Furthermore, the microwave chip 105 supports flexible combinations of various chips, adapting to different frequency band requirements.

[0041] Furthermore, the digital board 103 comes into contact with the heat dissipation protrusion 104 on the external structural component.

[0042] It should be noted that existing conformal integration solutions, due to their multi-layer stacked structure, result in increased thermal resistance, limiting chip heat dissipation efficiency; while gold wire bonding solutions, lacking active heat dissipation design, struggle to form effective heat conduction paths. In this embodiment, the heat dissipation bump is made of high thermal conductivity copper, and the heat dissipation bump 104 is disposed on the structural component. The digital board 103 is mounted and fixed on the structural component, and the heat dissipation of both the digital board 103 and the antenna board 102 is achieved through the heat dissipation bump 104 on the structural component. Simultaneously, thermally conductive adhesive is coated on the back of the microwave chip, tightly adhering to the surface of the heat dissipation bump, thereby constructing a low thermal resistance (≤0.5℃ / W) heat dissipation channel, reducing the chip's operating temperature and effectively solving the heat dissipation defects in the prior art.

[0043] Furthermore, the antenna board 102 is made of high-frequency microwave substrate material, and the digital board 103 is made of general-purpose printed circuit board substrate material.

[0044] It should be noted that the antenna board 102 needs to process high-frequency microwave signals such as millimeter waves, which places extremely high demands on the dielectric properties (such as dielectric constant stability and low loss tangent) and signal integrity of the substrate material. Therefore, using a high-frequency microwave substrate (such as a Rogers or ceramic substrate) can significantly reduce signal attenuation and phase distortion, ensuring the transmission quality of high-frequency signals. The digital board 103, on the other hand, mainly processes low-frequency digital signals and power or control signals, and has lower requirements for substrate performance. Therefore, low-cost, general-purpose printed circuit board substrates can meet the requirements.

[0045] In addition, such as Figure 5 The diagram illustrates the distribution of various functional chips on the digital board and antenna board. The digital board integrates a power supply chip, baseband processing chip, intermediate frequency (IF) chip, and control chip. The power supply chip provides stable power to the microwave chip on the antenna board via power pads. The baseband processing chip (e.g., AD / DA converter) is responsible for modulation / demodulation, signal encoding / decoding, and digital signal processing. The IF chip bridges the baseband and RF signals, performing frequency conversion, filtering, and amplification to ensure signal quality and stability in the transmission link. The control logic chip coordinates the operating modes and parameter configurations of the microwave chip on the antenna board.

[0046] The antenna board has multiple microwave chips and corresponding antenna patches distributed on it. The microwave chips include power amplifier chips and mixer chips. Each microwave chip interacts with the digital board via RF signal pads in a pad structure to achieve high-frequency signal exchange, and simultaneously receives control commands from the digital board via digital signal pads. The antenna patches are directly connected to the output terminals of the microwave chips, forming a millimeter-wave signal radiation structure. Figure 5 The distributed design shown restricts the high-frequency signal path to inside the antenna board, reducing transmission loss; the digital board centrally processes low-frequency signals and manages power, further optimizing the system layout.

[0047] In summary, the on-chip antenna circuit system based on board-level soldering provided in this embodiment of the utility model achieves a highly reliable connection between the antenna board and the digital board by directly soldering through a pad structure instead of traditional connectors, eliminating the risk of mechanical contact failure. The pad structure adopts an integrated design of RF signal pads, digital signal pads, power pads, and ground pads, supporting multiple types of signal transmission and improving integration. In the board-separated architecture, the use of high-cost high-frequency microwave substrates and low-cost general-purpose printed circuit board substrates significantly reduces material costs, while eliminating connectors and reducing assembly costs.

[0048] The above are merely preferred embodiments of this utility model and do not constitute any limitation on this utility model. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and contents disclosed in this utility model without departing from the scope of the technical solutions of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A board-level solder-based on-chip antenna circuitry, characterized by, The application relates to an antenna board, a digital board and a pad structure, the antenna board is used for transmitting and receiving millimeter wave band signals, the digital board is used for processing digital signals and control logic, and the antenna board and the digital board are directly welded through the pad structure.

2. An on-chip antenna circuitry according to claim 1, characterized in that, The pad structure comprises but is not limited to radio frequency signal pads, digital signal pads, power supply pads and ground pads, and an integrated interconnection architecture is formed among the pads.

3. The on-chip antenna circuitry of claim 1, wherein, The antenna board and the digital board are both provided with the pad structure, and the antenna board and the digital board are welded through welding points formed by the pad structure.

4. The on-chip antenna circuitry of claim 1, wherein, The antenna board is integrated with a microwave chip and an antenna patch, and the microwave chip realizes signal radiation through the antenna patch.

5. An on-chip antenna circuitry according to claim 4, characterised in that, The microwave chip comprises at least one of a radio frequency power amplifier chip, a driver chip and a mixing chip.

6. An on-chip antenna circuitry according to claim 4, characterised in that, The digital board is provided with a power supply chip, and the power supply chip transmits a power supply to the microwave chip on the antenna board through the power supply pad of the pad structure.

7. The on-chip antenna circuitry of claim 1, wherein, The digital board is in contact with a heat dissipation boss on an external structure.

8. The on-chip antenna circuitry of claim 1, wherein, The antenna board adopts a high-frequency microwave substrate material, and the digital board adopts a general printed circuit board substrate material.

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