Ultra-wideband dual-frequency combiner and wireless radio frequency equipment

Abstract

The utility model provides an ultra-wide bandwidth dual-frequency combiner. The ultra-wide bandwidth dual-frequency combiner comprises a main shell, a high-frequency band-pass assembly and a low-frequency band-pass assembly. The main shell is provided with a high-frequency resonant cavity and a low-frequency resonant cavity, the two components are adjacently arranged, and the resonant cavities are communicated at the combined output end. The low-frequency band-pass component comprises a band-shaped main body, a 90-degree bent three-section band-shaped bent part and a plurality of resonance branches, two ends of the band-shaped main body are respectively connected with a low-frequency input end and a combined output end, the bent part extends a transmission path to adjust equivalent inductance, and compared with a traditional linear structure, the filter network parameters can be flexibly optimized; resonance branches of different areas expand the out-of-band suppression range, and the filtering characteristic is improved. Wherein the passband of the high-frequency band-pass assembly is 4800-5000MHz, the passband of the low-frequency assembly is 700-3700MHz, and the high-frequency band-pass assembly and the low-frequency assembly realize ultra-wide-band low-pass and high-pass dual-frequency signal efficient combination transmission through a combination output end.

Description

Technical Field

[0001] This disclosure relates to the technical field of dual-band combiners, and in particular to an ultra-wide bandwidth dual-band combiner and a wireless radio frequency device. Background Technology

[0002] In wireless communication systems, the combiner, as a key radio frequency front-end device, directly affects the quality of signal transmission and system stability. With the development of communication technology towards multi-band and miniaturization, combiners need to achieve efficient bandpass filtering of signals from different frequency bands within a limited space, especially for the wideband pass requirements in dual-band composite scenarios.

[0003] Traditional bandpass filtering schemes for combiners typically rely on additional cavity filters or multi-stage discrete components to construct a filtering network, achieving impedance transformation and signal reflection by adding resonant cavities or complex matching structures. However, as... Figure 3 As shown, this type of design, due to the simple structure of the bandpass filter, results in a narrow passband frequency of the bandpass filter in the combiner, making it difficult to meet the wideband design requirements of modern dual-frequency combiner equipment.

[0004] For example, the published application document CN201520287486.1 discloses a dual-band combiner. 2G & 3G signals are directly coupled to the output port via a band-stop filter cavity and resonant rod, achieving a DC path through a dedicated coupling conductor. WLAN signals undergo frequency selection via a band-pass filter cavity and resonant post, and are then coupled and output at the end via a common post capacitor. However, this scheme uses a simple band-pass filter coupling conductor structure, resulting in a narrow passband. Consequently, this dual-band combiner is only suitable for low-frequency combining and cannot meet the requirements of high-frequency combining applications. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide an ultra-wideband dual-frequency combiner and wireless radio frequency device applicable to wideband signal combining.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] An ultra-wideband dual-frequency combiner includes a main housing, at least one high-frequency bandpass component, and at least one low-frequency bandpass component. The main housing has a high-frequency resonant cavity and a low-frequency resonant cavity. The high-frequency bandpass component is disposed in the high-frequency resonant cavity, and the low-frequency bandpass component is disposed in the low-frequency resonant cavity. The high-frequency bandpass component and the low-frequency bandpass component are disposed adjacent to each other. The high-frequency resonant cavity is connected to one end of the low-frequency resonant cavity adjacent to the combining output terminal of the main housing.

[0008] The low-frequency bandpass component includes a strip-shaped body, a strip-shaped bend, and multiple resonant branches. The strip-shaped bend and the resonant branches are all connected to the strip-shaped body. The first end of the strip-shaped body is used to connect to the low-frequency input terminal of the main housing, and the second end of the strip-shaped body is used to connect to the combined output terminal of the main housing. The strip-shaped bend includes a first bend region, a second bend region, and a third bend region that are connected to each other.

[0009] The bending angles of the first bending region, the second bending region, and the third bending region are all 90 degrees. The passband frequency range of the low-frequency bandpass component is 700MHz to 3700MHz, and the passband frequency range of the high-frequency bandpass component is 4800MHz to 5000MHz.

[0010] In one embodiment, the number of resonant branches is six, each of which is connected to the strip body and arranged at intervals along the strip body.

[0011] In one embodiment, the plurality of resonant branches are all located on the same side of the strip body.

[0012] In one embodiment, the areas of each of the resonant branches are not equal.

[0013] In one embodiment, the thickness of the strip body ranges from 1.0 mm to 1.1 mm.

[0014] In one embodiment, the thickness of the strip body is 1.0 mm.

[0015] In one embodiment, the high-frequency bandpass component includes multiple resonators and multiple resonant windows. The high-frequency resonant cavity has multiple resonant sub-cavities, each resonant sub-cavity is provided with one of the resonators, and a resonant window is provided between any two adjacent resonators.

[0016] In one embodiment, a plurality of the resonators are spaced apart between the high-frequency input terminal of the main housing and the combined output terminal of the main housing.

[0017] In one embodiment, the ultra-wideband dual-frequency combiner further includes a second high-frequency bandpass component and a second low-frequency bandpass component, wherein the two low-frequency bandpass components and the two high-frequency bandpass components are respectively arranged axially symmetrically along the center line of the width direction of the main housing.

[0018] This application also provides a wireless radio frequency device, including an ultra-wide bandwidth dual-band combiner as described in any embodiment.

[0019] Compared with the prior art, this disclosure has at least the following advantages:

[0020] The aforementioned ultra-wide bandwidth dual-frequency combiner extends the length of the strip body by setting a strip-shaped bend in the low-frequency bandpass component, thereby adjusting the equivalent inductance of the strip body. Compared with the traditional straight transmission line structure, it can more flexibly optimize the filter network parameters. Furthermore, by setting multiple resonant branches with different areas, it expands the out-of-band suppression frequency range. Compared with the traditional single resonant branch, it can improve the filtering characteristics. At the same time, it is combined with the high-frequency bandpass component to achieve efficient combined transmission of dual-frequency signals with ultra-wide bandwidth low-pass frequency (700MHz to 3700MHz) and high-pass frequency (4800MHz to 5000MHz). Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of an ultra-wideband dual-frequency combiner according to one embodiment;

[0023] Figure 2 for Figure 1 The diagram shows the structure of the low-frequency bandpass component.

[0024] Figure 3 This is a schematic diagram of the structure of a dual-frequency combiner in the prior art. Detailed Implementation

[0025] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0029] like Figure 1 and Figure 2 As shown, an ultra-wideband dual-frequency combiner 10 according to an embodiment of the present disclosure includes a main housing 100, at least one high-frequency bandpass component 200 and at least one low-frequency bandpass component 300. The main housing 100 has a high-frequency resonant cavity 1001 and a low-frequency resonant cavity 1002. The high-frequency bandpass component 200 is disposed in the high-frequency resonant cavity 1001 and the low-frequency bandpass component 300 is disposed in the low-frequency resonant cavity 1002. The high-frequency bandpass component 200 and the low-frequency bandpass component 300 are disposed adjacent to each other. The high-frequency resonant cavity 1001 is connected to one end of the low-frequency resonant cavity 1002 adjacent to the combining output terminal of the main housing 100.

[0030] The low-frequency bandpass component 300 includes a strip-shaped body 310, a strip-shaped bend 320, and multiple resonant branches 330. The strip-shaped bend 320 and the resonant branches 330 are both connected to the strip-shaped body 310. The first end of the strip-shaped body 310 is used to connect to the low-frequency input terminal of the main housing 100, and the second end of the strip-shaped body 310 is used to connect to the combined output terminal of the main housing 100. The strip-shaped bend 320 includes a first bend region 321, a second bend region 322, and a third bend region 323 that are connected to each other.

[0031] The bending angles of the first bending region 321, the second bending region 322, and the third bending region 323 are all 90 degrees. The passband frequency range of the low-frequency bandpass component 300 is 700MHz to 3700MHz, and the passband frequency range of the high-frequency bandpass component 200 is 4800MHz to 5000MHz.

[0032] In this embodiment, a low-frequency signal (700-3700MHz) enters the strip body 310 of the low-frequency bandpass component 300 from the low-frequency input terminal of the main housing 100. The strip body 310 serves as the main transmission line. When the low-frequency signal propagates along the strip body 310, the three 90-degree bending regions (first bending region 321, second bending region 322, and third bending region 323) of the strip bending section 320 increase the equivalent inductance by extending the current path, and segmented inductance adjustment is achieved through different bending regions. The resonant branch 330 serves as an equivalent parallel capacitor unit, forming an LC resonant circuit with the equivalent inductance of the strip body 310. The larger area branch corresponds to a lower resonant frequency (3800-4500MHz), and the smaller area branch corresponds to a higher resonant frequency (4500-5000MHz), thus effectively forming a multi-stage series inductor network equivalent to a Chebyshev low-pass filter, thereby creating a flat response within the passband and steep attenuation at the passband edges. When a high-frequency interference signal (above 3800MHz) enters the low-frequency bandpass component 300, the resonant branch 330 resonates with its main inductor, ensuring effective attenuation of signals outside the low-frequency passband through impedance mismatch reflection. Furthermore, high-frequency signals (4800-5000MHz) enter the high-frequency bandpass component 200 through the high-frequency input terminal of the main housing 100. Its internal filter cavity achieves bandpass characteristics through multiple resonant structures, while the low-frequency component 300 suppresses the low-frequency path, preventing high-frequency signals from interfering with the low-frequency passband.

[0033] The aforementioned ultra-wide bandwidth dual-frequency combiner uses a low-frequency bandpass component 300 to extend the length of the strip body 310 by setting a strip-shaped bend 320, thereby adjusting the equivalent inductance of the strip body 310. Compared with the traditional straight transmission line structure, this allows for more flexible optimization of the filter network parameters. Furthermore, by setting multiple resonant branches 330 with different areas, the out-of-band suppression frequency range is expanded. Compared with the traditional single resonant branch 330, this improves the filtering characteristics. Simultaneously, it is combined with the high-frequency bandpass component 200 to achieve efficient combined transmission of dual-frequency signals with ultra-wide bandwidth, including low-pass frequency (700MHz to 3700MHz) and high-pass frequency (4800MHz to 5000MHz).

[0034] like Figure 1 and Figure 2As shown, in one embodiment, there are six resonant branches 330, each connected to the strip body 310 and spaced apart along the strip body 310. In this embodiment, since the suppression bandwidth of a single resonant branch 330 is relatively narrow, the synergistic effect of the six resonant branches 330 significantly widens the harmonic suppression bandwidth of the entire low-frequency bandpass component 300. When a harmonic signal is transmitted on the strip body 310, once its frequency is equal to the resonant frequency of a certain resonant branch 330, that resonant branch 330 will resonate in parallel. At this time, the impedance of the resonant branch 330 reaches its maximum value, forming an open circuit at the connection between the strip body 310 and the resonant branch 330. Since the terminal of the resonant branch 330 is usually in an open circuit state, the harmonic signal entering the resonant branch 330 will form a standing wave inside it. In this process, the harmonic signal will gradually attenuate through the ohmic loss mechanism, thereby realizing the band-stop filtering function.

[0035] like Figure 1 and Figure 2 As shown, in one embodiment, multiple resonant branches 330 are all located on the same side of the strip body 310. In this embodiment, when the harmonic signal is transmitted in the strip body 310, the reflected wave generated by the single-sided branch has higher phase consistency, and arranging multiple resonant branches 330 on the same side can make more efficient use of space. Compared with the design of distributing the resonant branches 330 on both sides of the strip body 310, the layout on the same side avoids spatial intersection and overlap, making the structure of the entire low-frequency bandpass component 300 more compact, thereby improving the internal space utilization of the ultra-wideband dual-frequency combiner 10.

[0036] like Figure 1 and Figure 2 As shown, in one embodiment, the area of ​​each resonant branch 330 is not equal. In this embodiment, resonant branches 330 with different areas have different equivalent capacitance values. In the low-frequency bandpass component 300, when a low-frequency signal (700-3700MHz) propagates along the strip body 310, the resonant frequency of the resonant branch is far from the low-frequency signal band, thus presenting low impedance to the low-frequency signal and having little impact on the transmission of the low-frequency signal. However, when a high-frequency interference signal enters the low-frequency bandpass component 300, the high-frequency interference signal covers a wide frequency range (3800-5000MHz), and interference signals of different frequencies will resonate with resonant branches 330 of different areas. According to the resonant frequency formula... The larger-area resonant branch 330, due to its larger equivalent capacitance C, corresponds to a lower resonant frequency f and will resonate with high-frequency interference signals in the 3800-4500MHz band. The smaller-area resonant branch 330, with its smaller equivalent capacitance C, corresponds to a higher resonant frequency f and will resonate with high-frequency interference signals in the 4500-5000MHz band. When an interference signal of a certain frequency resonates with the corresponding resonant branch 330, the resonant branch 330 will exhibit specific electrical characteristics. Specifically, the resonant branch 330 will resonate in parallel with the equivalent inductance of the strip body, at which point its impedance reaches its maximum value, forming an open circuit at the connection between the strip body 310 and the resonant branch 330. Since the resonant branch 330 is usually in an open-circuit state, the interference signal entering the resonant branch 330 will form a standing wave inside it, and then gradually attenuate through the ohmic loss mechanism. Since the resonant branches 330 with different areas correspond to different resonant frequencies, they can work together to effectively suppress high-frequency interference signals over a wide frequency range, so that the suppressed frequency can be in the entire stopband range of 3800MHz to 5000MHz, thereby widening the out-of-band suppression range of the low-frequency bandpass component 300 to ensure that high-frequency signals outside the low-frequency passband are effectively attenuated.

[0037] like Figure 1 and Figure 2 As shown, in one embodiment, the thickness of the strip body 310 ranges from 1.0 mm to 1.1 mm. In this embodiment, the thickness of the strip body directly affects its equivalent inductance and resistance. According to electromagnetic theory, since an increase in thickness increases the cross-sectional area of ​​the current path, when the thickness of the strip body 310 is in the range of 1.0 mm to 1.1 mm, its equivalent inductance will increase slightly with the increase in thickness, while its equivalent resistance will decrease slightly with the increase in thickness. When a low-frequency signal (700-3700 MHz) enters the strip body 310 of the low-frequency bandpass component 300 from the low-frequency input terminal of the main housing 100, the strip body 310 acts as the main transmission line, through which current is transmitted. Because its thickness is between 1.0 mm and 1.1 mm, compared to a strip body that is too thin, it can carry a larger current without causing problems such as overheating due to excessive current density. Furthermore, within this thickness range, the current distribution of the strip body 310 is relatively uniform, which reduces current concentration caused by uneven thickness and ensures stable transmission of low-frequency signals. A thickness of 1.0mm to 1.1mm for the strip body 310 helps reduce signal transmission losses. Thinner strip bodies may experience greater ohmic losses due to higher resistance, while strip bodies within this thickness range have relatively moderate resistance, effectively reducing energy loss caused by resistance and thus improving the transmission efficiency of low-frequency signals.

[0038] like Figure 1 and Figure 2As shown, in one embodiment, the thickness of the strip body 310 is 1.0 mm. In this embodiment, according to electromagnetic principles, a thickness of 1.0 mm allows the equivalent inductance and resistance of the strip body 310 to reach a relatively balanced state. Compared to a thicker strip body, its equivalent inductance is relatively small. During signal transmission, a smaller equivalent inductance helps reduce the inductance's obstruction of the signal, allowing low-frequency signals to be transmitted more smoothly in the strip body 310. At the same time, the equivalent resistance at this thickness is also within a suitable range, avoiding the problem of excessive ohmic loss caused by excessive resistance in an overly thin strip body. This effectively reduces energy loss during signal transmission, improves the transmission efficiency and quality of low-frequency signals, and enables signals within the low-frequency passband to be transmitted with higher fidelity.

[0039] like Figure 1 and Figure 2As shown, in one embodiment, the high-frequency bandpass assembly 200 includes multiple resonators 210 and multiple resonant windows 220. The high-frequency resonant cavity 1001 has multiple resonant sub-cavities, each containing a resonator 210. A resonant window 220 is provided between any two adjacent resonators 210. In this embodiment, when a high-frequency signal (4800-5000MHz) enters the high-frequency resonant cavity 1001 of the high-frequency bandpass assembly 200 through the high-frequency input terminal of the main housing 100, the signal first encounters the first resonator 210. Each resonator 210 has its specific resonant frequency, which is precisely designed within the 4800-5000MHz high-frequency bandpass range. When the frequency of the high-frequency signal matches the resonant frequency of the resonator 210, the resonator 210 resonates, allowing the signal of that frequency to pass smoothly, while signals of other frequencies are suppressed. The resonant windows 220 between adjacent resonators 210 play a role in regulating signal coupling and transmission. When a signal is transmitted from one resonator cavity to an adjacent resonator cavity through the resonant window 220, the resonant window 220 fine-tunes the amplitude, phase, and frequency characteristics of the signal according to its own structure and parameters. This fine-tuning enhances the coupling effect between the resonators, enabling high-frequency signals to be transmitted efficiently between multiple resonators, while further suppressing out-of-band interference signals. As the signal is continuously transmitted in the cascaded structure composed of multiple resonators 210 and resonant windows 220, each resonator 210 filters and transmits the signal, while the resonant window 220 optimizes and adjusts the signal. After multiple such processes, only high-frequency signals within the 4800-5000MHz band can pass through the high-frequency bandpass component 200 with low loss and finally reach the combined output of the main housing 100. The resonant characteristics of the multiple resonators 210 enable the high-frequency bandpass component 200 to accurately filter signals within the 4800-5000MHz band while effectively suppressing signals outside this band.

[0040] like Figure 1 and Figure 2As shown, in one embodiment, multiple resonators 210 are spaced apart between the high-frequency input terminal and the combined output terminal of the main housing 100. In this embodiment, when the frequency of the high-frequency signal matches the resonant frequency of the first resonator 210, the resonator 210 resonates, allowing the signal of that frequency to pass smoothly, while signals of other frequencies are initially suppressed. The signal then continues to transmit, passing through the resonant window 220 between adjacent resonators 210. The resonant window 220 fine-tunes the amplitude, phase, and frequency characteristics of the signal according to its own structure and parameters, enhancing the coupling effect between adjacent resonators 210, allowing the signal to be transmitted to the next resonator 210 more efficiently. Subsequently, the signal passes sequentially through multiple spaced resonators 210. Each time it passes through a resonator 210, the signal undergoes a filtering and transmission process. As the signal continuously transmits in the cascaded structure composed of multiple resonators 210 and resonant windows 220, the signal in the 4800-5000MHz frequency band is further filtered. Ultimately, only high-frequency signals within this band can pass through the high-frequency bandpass component 200 with low loss and reach the combined output of the main housing 100. Highly precise band filtering: Multiple spaced resonators 210 act like layers of barriers, filtering the high-frequency signals multiple times. This ensures that only signals with frequencies precisely within the 4800-5000MHz band can pass through, greatly improving the filtering accuracy of the target frequency band signal and effectively preventing interference signals from other frequency bands from entering the high-frequency passband, ensuring the high purity and quality of the high-frequency signal.

[0041] like Figure 1 and Figure 2 As shown, in one embodiment, the ultra-wideband dual-frequency combiner 10 further includes a second high-frequency bandpass component 400 and a second low-frequency bandpass component 500. The two low-frequency bandpass components and the two high-frequency bandpass components are arranged symmetrically along the centerline of the width direction of the main housing. In this embodiment, when dual-frequency signals are input from the two low-frequency input terminals and the two high-frequency input terminals of the main housing, the low-frequency bandpass components and the high-frequency bandpass components on both sides achieve parallel signal processing based on the symmetrical structure. Taking the low-frequency signal path as an example, the first end of the strip-shaped body of the left low-frequency bandpass component receives the left low-frequency input signal, and the first end of the strip-shaped body of the right low-frequency bandpass component receives the right low-frequency input signal. The two are symmetrically distributed along the centerline, forming a mirror transmission path. Similarly, for high-frequency signals, the high-frequency bandpass components on both sides process the corresponding high-frequency input signals respectively. Since the two high-frequency bandpass components and the two low-frequency bandpass components adopt the same structural parameters and are symmetrically arranged, the ultra-wideband dual-frequency combiner can share the same processing technology during production, thereby reducing mold wear and production costs.

[0042] This application also provides a wireless radio frequency device, including an ultra-wideband dual-band combiner 10 according to any embodiment. In this embodiment, a low-frequency signal (700-3700MHz) enters the strip body 310 of the low-frequency bandpass component 300 from the low-frequency input terminal of the main housing 100. The strip body 310 serves as the main transmission line. When the low-frequency signal is transmitted along the strip body 310, the three 90-degree bending regions (first bending region 321, second bending region 322, and third bending region 323) of the bending portion 320 increase the equivalent inductance by extending the current path, and segmented inductance adjustment is achieved through different bending regions. The resonant branch 330 serves as an equivalent parallel capacitor unit, forming an LC resonant circuit with the equivalent inductance of the strip body 310. The larger-area branches correspond to lower resonant frequencies (3800-4500MHz), while the smaller-area branches correspond to higher resonant frequencies (4500-5000MHz), thus effectively functioning as a multi-stage series inductor network of a Chebyshev low-pass filter, resulting in a flat response within the passband and steep attenuation at the passband edges. When a high-frequency interference signal (above 3800MHz) enters the low-frequency bandpass component 300, the resonant branch 330 resonates with its main inductor, ensuring effective attenuation of signals outside the low-frequency passband through impedance mismatch reflection. Furthermore, high-frequency signals (4800-5000MHz) enter the high-frequency bandpass component 200 through the high-frequency input terminal of the main housing 100. Its internal filter cavity achieves bandpass characteristics through multiple resonant structures, while the low-frequency component 300 suppresses the low-frequency path, preventing high-frequency signals from interfering with the low-frequency passband.

[0043] Compared with the prior art, this disclosure has at least the following advantages:

[0044] The aforementioned ultra-wide bandwidth dual-frequency combiner uses a low-frequency bandpass component 300 to extend the length of the strip body 310 by setting a strip-shaped bend 320, thereby adjusting the equivalent inductance of the strip body 310. Compared with the traditional straight transmission line structure, this allows for more flexible optimization of the filter network parameters. Furthermore, by setting multiple resonant branches 330 with different areas, the out-of-band suppression frequency range is expanded. Compared with the traditional single resonant branch 330, this improves the filtering characteristics. Simultaneously, it is combined with the high-frequency bandpass component 200 to achieve efficient combined transmission of dual-frequency signals with ultra-wide bandwidth, including low-pass frequency (700MHz to 3700MHz) and high-pass frequency (4800MHz to 5000MHz).

[0045] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. An ultra-wideband dual-frequency combiner, comprising a main housing, at least one high-frequency bandpass component and at least one low-frequency bandpass component, wherein the main housing has a high-frequency resonant cavity and a low-frequency resonant cavity, the high-frequency bandpass component is disposed within the high-frequency resonant cavity, the low-frequency bandpass component is disposed within the low-frequency resonant cavity, the high-frequency bandpass component and the low-frequency bandpass component are disposed adjacent to each other, and the high-frequency resonant cavity is connected to one end of the low-frequency resonant cavity adjacent to the combining output terminal of the main housing, characterized in that... The low-frequency bandpass component includes a strip-shaped body, a strip-shaped bend, and multiple resonant branches. The strip-shaped bend and the resonant branches are both connected to the strip-shaped body. The first end of the strip-shaped body is used to connect to the low-frequency input terminal of the main housing, and the second end of the strip-shaped body is used to connect to the combined output terminal of the main housing. The strip-shaped bend includes a first bend region, a second bend region, and a third bend region that are connected to each other. The bending angles of the first bending region, the second bending region, and the third bending region are all 90 degrees. The passband frequency range of the low-frequency bandpass component is 700MHz to 3700MHz, and the passband frequency range of the high-frequency bandpass component is 4800MHz to 5000MHz.

2. The ultra-wide bandwidth dual-frequency combiner according to claim 1, characterized in that, The number of resonant branches is six, and each of the resonant branches is connected to the strip body and arranged at intervals along the strip body.

3. The ultra-wide bandwidth dual-frequency combiner according to claim 2, characterized in that, All of the resonant branches are located on the same side of the strip-shaped body.

4. The ultra-wide bandwidth dual-frequency combiner according to claim 2, characterized in that, The area of ​​each of the resonant branches is not equal.

5. The ultra-wide bandwidth dual-frequency combiner according to claim 1, characterized in that, The thickness of the strip-shaped body ranges from 1.0 mm to 1.1 mm.

6. The ultra-wide bandwidth dual-frequency combiner according to claim 5, characterized in that, The thickness of the strip-shaped body is 1.0 mm.

7. The ultra-wide bandwidth dual-frequency combiner according to claim 1, characterized in that, The high-frequency bandpass component includes multiple resonators and multiple resonant windows. The high-frequency resonant cavity has multiple resonant sub-cavities. Each resonant sub-cavity is provided with one of the resonators. A resonant window is provided between any two adjacent resonators.

8. The ultra-wide bandwidth dual-frequency combiner according to claim 7, characterized in that, Multiple resonators are spaced apart between the high-frequency input terminal and the combined output terminal of the main housing.

9. The ultra-wide bandwidth dual-frequency combiner according to claim 1, characterized in that, The ultra-wide bandwidth dual-frequency combiner further includes a second high-frequency bandpass component and a second low-frequency bandpass component, with the two low-frequency bandpass components and the two high-frequency bandpass components arranged symmetrically along the center line of the width direction of the main housing.

10. A wireless radio frequency device, characterized in that, Includes the ultra-wide bandwidth dual-frequency combiner as described in any one of claims 1 to 9.

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