Wafer printing positioning device capable of fast positioning

Abstract

The utility model relates to wafer printing positioning device technical field, concretely relates to a wafer printing positioning device of quick positioning, including printing platform, arc cover and baffle, the inside symmetry of printing platform is provided with receiving groove, the inside of two receiving grooves all movably sets up arc cover, the both sides of receiving groove inner wall all are provided with guide groove no.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer printing positioning devices, specifically to a wafer printing positioning device capable of rapid positioning. Background Technology

[0002] Wafer printing is a key process in semiconductor manufacturing. It uses photolithography to precisely transfer circuit patterns from a photomask to the surface of a wafer. Its core technologies include high-precision optical alignment, nanoscale positioning platforms (such as linear motors and laser interferometers), and strict environmental control (temperature, humidity, vibration isolation) to ensure the accuracy of multi-layer pattern overlay. As process nodes continue to shrink (e.g., below 3nm), traditional positioning technologies face challenges in resolution, speed, and anti-interference capabilities, directly affecting chip yield and performance. With the development of the semiconductor industry, wafers, as the basic material for manufacturing semiconductor chips, can be processed by technicians to create various circuit components. Therefore, wafer processing and manufacturing has always been a core research area. In the semiconductor integrated circuit manufacturing process, many processes require pre-positioning and aligning the wafers to ensure uniform wafer positioning and facilitate process expansion. Current wafer printing positioning devices suffer from insufficient accuracy, low alignment efficiency, and poor compatibility (difficult to adapt to wafers of different sizes / thicknesses). Furthermore, the operation during clamping or disassembly is cumbersome, resulting in low processing efficiency. Moreover, due to the lack of protective mechanisms when clamping the wafers, the positioning devices are prone to squeezing damage or deformation, affecting subsequent processing. Existing wafer positioning devices have problems such as inconvenience in clamping wafers and easy squeezing damage and deformation, which affect semiconductor manufacturing yield and production efficiency.

[0003] A search revealed a utility model patent with publication number CN214848577U, which discloses a wafer positioning device, relating to the field of wafer manufacturing equipment technology. The device includes a mounting block and a positioning block. A compression spring is fixedly connected to the upper end of a sliding rod. A sliding block is rotatably connected to the end of a rotating rod away from the sliding rod via a rotating shaft. A lever is rotatably connected to the outer surface of a fixed shaft. One end of the sliding shaft is fixedly connected to the sliding rod. A buffer spring is fixedly connected to one side of a limiting block. A top block is inserted into the middle of a guide rail. A fixing block is threadedly connected to the outer surface of a threaded rod. This utility model, by setting up a lever, fixed shaft, transmission groove, sliding shaft, sliding rod, compression spring, rotating rod, and sliding block, makes wafer clamping more convenient and faster, improving work efficiency to a certain extent. By setting up a fixing block, threaded rod, top block, fixing block, buffer spring, and limiting block, the mechanism ultimately protects the wafer, preventing damage or deformation during clamping.

[0004] The aforementioned patent only uses a lever, fixed shaft, transmission groove, sliding shaft, sliding rod, compression spring, rotating rod and sliding block. This mechanism makes it easier and faster to clamp the wafer, but it cannot fully guarantee the service life of the spring. The wafer is positioned by the spring. After long-term use, the spring is prone to loosening, which can cause inaccurate positioning and affect the processing quality. In addition, the existing positioning device lacks anti-pollution protection in the working area. During the processing, particles in the environment will accumulate, which is not convenient for subsequent cleaning.

[0005] Therefore, it is necessary to invent a wafer printing positioning device that can quickly position wafers to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a wafer printing positioning device capable of rapid positioning. Through the arrangement and coordinated use of servo motor one, bidirectional screw one, servo motor two, and bidirectional screw two, the device can quickly and stably position and clamp the wafer according to its size. By adding an arc-shaped cover and isolation plate to the top of the printing table, the device can reduce environmental particle deposition. The removable isolation plate facilitates cleaning. The arc-shaped cover can slide along the guide groove one to the printing table surface via guide block one and is magnetically attracted by magnetic chucks, isolating the wafer from the external environment, reducing particle settling and preventing debris scattering. This addresses the problem in existing technologies where the lifespan of the springs cannot be adequately guaranteed. Using springs for wafer positioning over long periods can cause the springs to loosen, leading to inaccurate positioning and affecting processing quality. Furthermore, existing positioning devices lack anti-contamination protection in the working area, making it difficult to clean after particle deposition during processing.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a wafer printing positioning device capable of rapid positioning, comprising a printing table, an arc-shaped cover, and isolation plates. The printing table has symmetrically arranged storage slots inside, and an arc-shaped cover is movably arranged inside each of the two storage slots. A guide groove is formed on both sides of the inner wall of each storage slot. A guide block is symmetrically fixed to one end of each arc-shaped cover, and the guide groove and guide block are matched. The other end of the arc-shaped cover extends to the top of the printing table and is fixedly connected to a magnetic suction plate. Isolation plates are detachably connected to the front and rear sides of the top of the printing table via screws. The two isolation plates are symmetrically distributed about the central axis of the printing table. Fixing blocks are symmetrically arranged at the ends of the storage slots. The two fixing blocks are detachably connected to the printing table via screws. A limiting groove is formed inside each fixing block, and a limiting block is slidably arranged inside the limiting groove. The limiting block is fixedly connected to one side of the inner wall of the limiting groove via a spring. A cleaning sponge is fixedly connected to the side of the limiting block away from the spring.

[0008] Preferably, the printing table has a working cavity inside. A servo motor is installed on one side of the inner wall of the working cavity. The output shaft of the servo motor is fixedly connected to a bidirectional screw via a coupling. A servo motor is installed on the rear side of the inner wall of the working cavity. The output shaft of the servo motor is fixedly connected to a bidirectional screw via a coupling. Moving rods are symmetrically fitted on the surfaces of both the bidirectional screws. The moving rods are threadedly connected to the bidirectional screws. A positioning clamp is fixedly connected to the top of the moving rod.

[0009] Preferably, a first dust suction port is symmetrically provided at the top of the working chamber, and a second dust suction port is provided at the middle of the top of the working chamber. The second dust suction port is located between the two first dust suction ports. Grooves are provided on both sides of the inner wall of the working chamber, and a filter screen is movably engaged between the two grooves.

[0010] Preferably, a dust collection channel is provided at the bottom of the working chamber, a dust collection hopper is fixedly connected between the working chamber and the dust collection channel, an ULPA filter is installed inside the dust collection channel, and a negative pressure fan is installed at the end of the dust collection channel.

[0011] Preferably, a sealing plate is detachably connected to the front side of the working chamber by screws.

[0012] Preferably, a base is movably provided at the bottom of the printing table, and guide blocks two are symmetrically fixed at the bottom of the printing table. A guide groove two is provided at the top of the base. The guide blocks two and the guide groove two are matched. A servo motor three is installed inside the base. The output shaft of the servo motor three is fixedly connected to a rotating rod through a coupling. The upper end of the rotating rod is fixedly connected to the printing table.

[0013] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0014] 1. By installing an arc-shaped cover and isolation plate on the top of the printing table, the deposition of environmental particles can be reduced. The removable isolation plate facilitates cleaning. The arc-shaped cover can slide along the guide groove to the printing table surface via the guide block and magnetic attraction plate to isolate the wafer from the external environment, reduce particle settling and prevent debris from flying. The two cleaning sponges, together with the expansion of the spring, can keep in contact with the inner and outer surfaces of the arc-shaped cover. As the arc-shaped cover moves, it can clean the impurities adsorbed on the surface, effectively improving the protective effect of the arc-shaped cover.

[0015] 2. By using servo motor one, bidirectional screw one, servo motor two, and bidirectional screw two in combination, the wafer can be quickly and stably positioned and clamped according to its size, improving the practicality and durability of the device. Through the setup and use of the working chamber, dust suction port one, dust suction port two, filter, dust suction channel, dust collection hopper, ULPA filter, and negative pressure fan, the device uses negative pressure adsorption to suck up debris and volatiles generated on the printing table surface and inside the positioning device area. The sucked gas will pass through the groove filter to remove debris and be purified by the ULPA filter before being discharged, avoiding the accumulation of pollution. This effectively targets dust or volatile organic compounds generated during the printing process. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a top view of the structure of this utility model;

[0019] Figure 3 This is a schematic cross-sectional view of the connection between the printing table and the working cavity of this utility model.

[0020] Figure 4 This is a schematic cross-sectional view of the connection between the printing table and the arc-shaped cover of this utility model.

[0021] Figure 5 For the present utility model Figure 4 Enlarged structural diagram at point A in the middle;

[0022] Figure 6 This is a schematic cross-sectional view of the connection between the printing table and the dust extraction channel of this utility model.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Printing table; 2. Storage slot; 3. Arc-shaped cover; 4. Guide groove one; 5. Guide block one; 6. Magnetic suction plate; 7. Isolation plate; 8. Limiting groove; 9. Limiting block; 10. Spring; 11. Cleaning sponge; 12. Working chamber; 13. Servo motor one; 14. Bidirectional screw one; 15. Servo motor two; 16. Bidirectional screw two; 17. Moving rod; 18. Positioning clamp; 19. Dust suction port one; 20. Dust suction port two; 21. Groove; 22. Filter screen; 23. Dust suction channel; 24. Dust collection hopper; 25. ULPA filter; 26. Negative pressure fan; 27. Sealing plate; 28. Base; 29. ​​Guide block two; 30. Guide groove two; 31. Servo motor three; 32. Rotating rod; 33. Fixing block. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0026] This utility model provides, for example Figure 1-6 The wafer printing positioning device shown includes a printing table 1, an arc-shaped cover 3, and isolation plates 7. The printing table 1 has symmetrically arranged receiving slots 2 inside, and arc-shaped covers 3 are movably installed inside each of the two receiving slots 2. Guide slots 4 are formed on both sides of the inner wall of each receiving slot 2. Guide blocks 5 are symmetrically fixed to one end of each arc-shaped cover 3, and the guide slots 4 and guide blocks 5 are matched. The other end of the arc-shaped cover 3 extends to the top of the printing table 1 and is fixedly connected to a magnetic suction plate 6. Isolation plates 7 are detachably connected to the front and rear sides of the top of the printing table 1 by screws. The two isolation plates 7 are symmetrically distributed about the central axis of the printing table 1. Fixing blocks 33 are symmetrically arranged at the ends of the receiving slots 2, and the two fixing blocks 33 are detachably connected to the printing table 1 by screws. The connection is removed. A limiting groove 8 is opened inside the fixing block 33. A limiting block 9 is slidably installed inside the limiting groove 8. The limiting block 9 is fixedly connected to one side of the inner wall of the limiting groove 8 by a spring 10. A cleaning sponge 11 is fixedly connected to the side of the limiting block 9 away from the spring 10. The arc-shaped cover 3 can move in the storage groove 2 by sliding along the guide groove 4 through the guide block 5 until the magnetic suction piece 6 at the ends of the two arc-shaped covers 3 magnetically attracts and cooperates with the isolation plate 7 to isolate the positioning device from the external environment. As the arc-shaped cover 3 moves, the cleaning sponge 11 can clean the dust and impurities that the arc-shaped cover 3 avoids adsorbing. The fixing block 33 can be detached from the printing table 1 to facilitate the cleaning of the cleaning sponge 11. The isolation plate 7 is detachable for easy cleaning.

[0027] The printing table 1 has a working chamber 12 inside. A servo motor 13 is installed on one side of the inner wall of the working chamber 12. The output shaft of the servo motor 13 is fixedly connected to a bidirectional screw 14 via a coupling. A servo motor 25 is installed on the rear side of the inner wall of the working chamber 12. The output shaft of the servo motor 25 is fixedly connected to a bidirectional screw 26 via a coupling. Moving rods 17 are symmetrically fitted on the surfaces of both the bidirectional screw 14 and the bidirectional screw 26. The moving rods 17 are threadedly connected to the bidirectional screw 14 and the bidirectional screw 26. A positioning clamping block 18 is fixedly connected to the top of the moving rod 17. When the servo motor 13 and the servo motor 2 work simultaneously, they can drive the bidirectional screw 14 and the bidirectional screw 26 to rotate simultaneously, so that the two sets of positioning clamping blocks 18 can quickly position and clamp the two sides and the front and rear sides of the wafer, respectively, improving the stability of use.

[0028] The top of the working chamber 12 is symmetrically provided with a first dust suction port 19, and the middle of the top of the working chamber 12 is provided with a second dust suction port 20. The second dust suction port 20 is located between the two first dust suction ports 19. Grooves 21 are provided on both sides of the inner wall of the working chamber 12. A filter screen 22 is movably engaged between the two grooves 21. The first dust suction port 19 and the second dust suction port 20 provide space for the movement of the positioning clamp 18 and are used to adsorb volatile organic compounds floating in the working area. The filter screen 22 is used to filter impurities in the passing air. The grooves 21 limit the filter screen 22 and facilitate the subsequent removal of the filter screen 22.

[0029] The bottom of the working chamber 12 is provided with a dust collection channel 23. A dust collection hopper 24 is fixedly connected between the working chamber 12 and the dust collection channel 23. An ULPA filter 25 is installed inside the dust collection channel 23. A negative pressure fan 26 is installed at the end of the dust collection channel 23. The ULPA filter 25 further purifies the air passing through, making it easier to discharge later.

[0030] A sealing plate 27 is detachably connected to the front side of the working chamber 12 by screws. After the sealing plate 27 is removed, the internal components and structure can be inspected and repaired.

[0031] A base 28 is movably mounted on the bottom of the printing table 1. Guide blocks 29 are symmetrically fixed on the bottom of the printing table 1. A guide groove 30 is opened on the top of the base 28. The guide blocks 29 and the guide groove 30 are matched. A servo motor 31 is installed inside the base 28. The output shaft of the servo motor 31 is fixedly connected to a rotating rod 32 through a coupling. The upper end of the rotating rod 32 is fixedly connected to the printing table 1. The servo motor 31 drives the rotating rod 32 to rotate the printing table 1, which can rotate the entire printing table 1. This allows for convenient rotation of the wafer as needed for wafer processing, eliminating the need for manual wafer rotation and improving the practicality of the device. The guide blocks 29 slide along the guide groove 30 to assist in the stable rotation of the printing table 1.

[0032] The working principle of this utility model is as follows: Simultaneous activation of servo motor 13 and servo motor 15 allows the positioning clamps 18 to move closer together, used for positioning and clamping wafers of different specifications. Pulling up the magnetic suction plate 6 pulls out the arc-shaped cover 3, and the two magnetic suction plates 6 attract each other, isolating the wafer printing work area from the external environment through the two arc-shaped covers 3 and the two isolation plates 7. When the printing work begins, the power of the negative pressure fan 26 is turned on, and a negative pressure state is formed inside the dust collection channel 23 and the working chamber 12. At this time, the suction port 19 and the suction port 20 generate suction to absorb the floating objects inside the cavity formed by the arc-shaped cover 3 and the isolation plate 7. The floating impurities are filtered by the filter screen 22 in the working chamber 12, and after filtration, they enter the dust collection channel 23 through the dust collection hopper 24. When passing through the dust collection channel 23, they are purified by the ULPA filter 25, and finally discharged by the negative pressure fan 26. Afterwards, the sealing plate 27 is removed from the printing table 1 to facilitate the removal of the filter screen 22 for cleaning.

[0033] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A wafer printing positioning device capable of rapid positioning, comprising a printing table (1), an arc-shaped cover (3), and a partition plate (7), characterized in that: The printing table (1) has symmetrically arranged storage slots (2) inside. Each of the two storage slots (2) has a movable arc-shaped cover (3) inside. Guide slots (4) are arranged on both sides of the inner wall of the storage slots (2). Guide blocks (5) are symmetrically fixed to one end of the arc-shaped cover (3). The guide slots (4) and guide blocks (5) match. The other end of the arc-shaped cover (3) extends to the top of the printing table (1) and is fixedly connected to a magnetic suction piece (6). The front and rear sides of the top of the printing table (1) are detachably connected to isolation plates (7) by screws. The two isolation plates (7) are symmetrically distributed about the central axis of the printing table (1). The ends of the storage groove (2) are symmetrically provided with fixing blocks (33). The two fixing blocks (33) are detachably connected to the printing table (1) by screws. The fixing blocks (33) have a limiting groove (8) inside. The limiting groove (8) is slidably provided with a limiting block (9). The limiting block (9) is fixedly connected to one side of the inner wall of the limiting groove (8) by a spring (10). A cleaning sponge (11) is fixedly connected to the side of the limiting block (9) away from the spring (10).

2. The wafer printing positioning device capable of rapid positioning according to claim 1, characterized in that: The printing table (1) has a working chamber (12) inside. A servo motor (13) is installed on one side of the inner wall of the working chamber (12). The output shaft of the servo motor (13) is fixedly connected to a bidirectional screw (14) through a coupling. A servo motor (2) is installed on the rear side of the inner wall of the working chamber (12). The output shaft of the servo motor (2) is fixedly connected to a bidirectional screw (2) (16) through a coupling. Moving rods (17) are symmetrically fitted on the surfaces of the bidirectional screws (14) and (2) (16). The moving rods (17) are threadedly connected to the bidirectional screws (14) and (2) (16). A positioning clamp (18) is fixedly connected to the top of the moving rod (17).

3. The wafer printing positioning device capable of rapid positioning according to claim 2, characterized in that: The top of the working chamber (12) is symmetrically provided with a first dust suction port (19), and the middle of the top of the working chamber (12) is provided with a second dust suction port (20). The second dust suction port (20) is located between the two first dust suction ports (19). Grooves (21) are provided on both sides of the inner wall of the working chamber (12), and a filter screen (22) is movably engaged between the two grooves (21).

4. The wafer printing positioning device capable of rapid positioning according to claim 3, characterized in that: The bottom of the working chamber (12) is provided with a dust collection channel (23), and a dust collection hopper (24) is fixedly connected between the working chamber (12) and the dust collection channel (23). An ULPA filter (25) is installed inside the dust collection channel (23), and a negative pressure fan (26) is installed at the end of the dust collection channel (23).

5. A wafer printing positioning device capable of rapid positioning according to claim 4, characterized in that: A sealing plate (27) is detachably connected to the front side of the working chamber (12) by screws.

6. A wafer printing positioning device capable of rapid positioning according to claim 1, characterized in that: The printing table (1) has a base (28) movably mounted on its bottom. Guide blocks (29) are symmetrically fixed on the bottom of the printing table (1). Guide grooves (30) are opened on the top of the base (28). The guide blocks (29) and guide grooves (30) are matched. A servo motor (31) is installed inside the base (28). The output shaft of the servo motor (31) is fixedly connected to a rotating rod (32) through a coupling. The upper end of the rotating rod (32) is fixedly connected to the printing table (1).

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