Supercomputer water-cooling plate structure

Abstract

The utility model discloses a supercomputer water cooling plate structure relates to water cooling plate field, including bottom frame and mainboard, bottom frame and mainboard are connected through the friction stir welding, the top of mainboard is installed with the mounting block, and the one side of mounting block is provided with the liquid inlet pipe, the both sides of mounting block are provided with the liquid outlet pipe, and the inside of mounting block is provided with two groups of through -hole, the inside of mainboard is provided with solution groove, the top of mainboard is provided with two groups of liquid hole. The utility model solves the higher cost problem of current bottom frame and mainboard when welding, and the bottom frame and mainboard are fixed through the friction stir welding mode, and the working efficiency of this mode is high, stable, low cost and environmental protection, replaces the fixing mode of traditional brazing, and through the solution groove and fin of setting, the coolant enters into the solution groove, and the contact area with liquid can be increased through the fin of setting, thereby better heat dissipation can be carried out, and the water cooling plate main body heat dissipation effect is better.

Description

Technical Field

[0001] This utility model relates to the field of water-cooled plates, specifically a water-cooled plate structure for supercomputers. Background Technology

[0002] A water-cooled plate is a heat dissipation device that directly cools heat-generating components through liquid circulation. It is widely used in high-performance computing, power electronics, new energy and other fields. Its core principle is to quickly absorb heat through the coolant (such as water, ethylene glycol solution or dielectric fluid) in the flow channel, so as to achieve efficient heat dissipation. The water-cooled plate consists of a bottom frame and a water-cooled main plate.

[0003] The base frame is usually made of aluminum, while the water-cooling motherboard is made of copper. The base frame and the water-cooling motherboard are fixed together by brazing. Brazing requires the use of brazing flux to achieve copper-aluminum welding. This method is not only costly and complex, but also takes a long time and has a low pass rate, resulting in low heat dissipation efficiency of the water-cooling plate during use. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a supercomputer water-cooled plate structure to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a supercomputer water-cooled plate structure, including a bottom frame and a motherboard, wherein the bottom frame and the motherboard are connected by friction stir welding, a mounting block is installed on the top of the motherboard, and a liquid inlet pipe is provided on one side of the mounting block, and a liquid outlet pipe is provided on both sides of the mounting block, and two sets of through holes are opened inside the mounting block, a solution tank is opened inside the motherboard, and two sets of liquid holes are opened on the top of the motherboard.

[0006] By adopting the above technical solution, the problem of high cost in welding the existing bottom frame and motherboard is solved. The bottom frame and motherboard are fixed by friction stir welding. This method is highly efficient, stable, low-cost and environmentally friendly, replacing the traditional brazing method. At the same time, through the solution tank and fins, the coolant enters the solution tank. The fins can increase the contact area with the liquid, thereby better heat dissipation and making the water-cooled plate body have better heat dissipation effect.

[0007] The present invention is further configured such that a second mounting groove is provided inside the bottom frame, and a groove is provided on the inner wall of the second mounting groove, and a protrusion is fixed to the bottom of the motherboard.

[0008] Preferably, the second mounting slot facilitates the installation of the motherboard. The groove and the protrusion work together to limit the position of the motherboard and facilitate friction stir welding of the motherboard and the bottom frame.

[0009] The present invention is further configured such that a first mounting groove is provided on the top of the motherboard, and a sealing ring is provided inside the first mounting groove.

[0010] Preferably, the first mounting groove facilitates the installation of the sealing ring. When the mounting block is installed, the bottom of the mounting block will compress the sealing ring, thereby preventing liquid leakage.

[0011] The present invention is further configured such that multiple sets of fixing blocks are fixed on the top of the motherboard, and multiple sets of clearance grooves are provided on the bottom of the mounting block.

[0012] Preferably, the clearance groove allows the mounting block to engage with the outer wall of the fixing block during installation, thereby limiting the mounting block and preventing it from moving. It also facilitates the alignment of the through hole at the bottom of the mounting block with the liquid hole, preventing deviation.

[0013] The present invention is further configured such that the liquid inlet pipe is connected to a set of the through holes, and the liquid outlet pipe is connected to another set of the through holes.

[0014] Preferably, the liquid enters the through hole through the inlet pipe and then enters the interior of the solution tank. The liquid flows through another set of through holes into the drain pipe, realizing liquid circulation and thus achieving the purpose of heat dissipation.

[0015] The present invention is further configured such that a fixing plate is fixed to the inner wall of the solution tank, and multiple sets of fins are fixed inside the solution tank.

[0016] Preferably, the fixing plate and fins are positioned in the solution tank, with their bottoms in contact with the motherboard. When the motherboard absorbs heat, the fixing plate and fins also absorb heat. The fixing plate and fins are in contact with the liquid, thereby allowing the liquid to dissipate heat from the fixing plate and fins, and the fixing plate and fins to dissipate heat from the motherboard.

[0017] The present invention is further configured such that the fixing block is connected to the mounting block by bolts.

[0018] Preferably, fixing the mounting block with bolts can provide a better fixation effect and prevent the mounting block from shaking.

[0019] In summary, the present invention has the following main advantages:

[0020] This invention solves the problem of high welding costs associated with existing base frames and main boards by incorporating a base frame, main board, mounting block, solution tank, and fins. The base frame and main board are fixed by friction stir welding, a method that is highly efficient, stable, low-cost, and environmentally friendly, replacing the traditional brazing method. Furthermore, the solution tank and fins allow coolant to enter the solution tank, and the fins increase the contact area with the liquid, thus improving heat dissipation and enhancing the overall cooling performance of the water-cooled plate. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of this utility model;

[0022] Figure 2 This is a perspective view of the base frame of this utility model;

[0023] Figure 3 This is a schematic diagram showing the connection between the motherboard and the mounting block of this utility model;

[0024] Figure 4 This is a perspective view of the motherboard of this utility model;

[0025] Figure 5 This is a schematic diagram showing the connection between the main board and the fixing block of this utility model;

[0026] Figure 6 This is a schematic diagram of the internal structure of the motherboard of this utility model;

[0027] Figure 7 This is a perspective view of the mounting block of this utility model;

[0028] Figure 8 This is a cross-sectional view of the mounting block of this utility model.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Base frame; 2. Main board; 21. First mounting slot; 22. Fixing block; 3. Mounting block; 31. Liquid inlet pipe; 32. Liquid outlet pipe; 33. Through hole; 34. Clearance groove; 4. Second mounting slot; 41. Groove; 5. Protrusion; 6. Liquid hole; 7. Sealing ring; 8. Solution tank; 81. Fixing plate; 82. Fin. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0032] The embodiments of this utility model will be described below based on its overall structure.

[0033] Please see Figures 1-8 It includes a bottom frame 1 and a main board 2, which are connected by friction stir welding. The bottom frame 1 and the main board 2 constitute the main body of the water-cooled plate. The bottom frame 1 is made of aluminum, and the main board 2 is made of copper. A mounting block 3 is installed on the top of the main board 2, and a liquid inlet pipe 31 is provided on one side of the mounting block 3. A liquid outlet pipe 32 is provided on both sides of the mounting block 3. Two sets of through holes 33 are opened inside the mounting block 3. A solution tank 8 is opened inside the main board 2, and two sets of liquid holes 6 are opened on the top of the main board 2.

[0034] For details regarding the above embodiments, please refer to [link / reference]. Figures 1-3 The bottom frame 1 has a second mounting groove 4 inside, and the inner wall of the second mounting groove 4 has a groove 41. The bottom of the motherboard 2 is fixed with a protrusion 5. The second mounting groove 4 makes it easy to install the motherboard 2. The groove 41 and the protrusion 5 cooperate to limit the motherboard 2 while also facilitating the friction stir welding of the motherboard 2 and the bottom frame 1.

[0035] For details regarding the above embodiments, please refer to [link / reference]. Figure 4 and Figure 5 The motherboard 2 has a first mounting groove 21 on its top, and a sealing ring 7 is provided inside the first mounting groove 21. The sealing ring 7 can be easily installed through the first mounting groove 21. When the mounting block 3 is installed, the bottom of the mounting block 3 will squeeze the sealing ring 7, thereby avoiding the problem of liquid leakage.

[0036] For details regarding the above embodiments, please refer to [link / reference]. Figure 5 and Figure 7 The top of the motherboard 2 is fixed with multiple sets of fixing blocks 22, and the bottom of the mounting block 3 is provided with multiple sets of clearance grooves 34. The clearance grooves 34 can make the mounting block 3 engage with the outer wall of the fixing block 22 during installation, thereby limiting the mounting block 3 and preventing the mounting block 3 from moving. At the same time, it can also facilitate the alignment of the through hole at the bottom of the mounting block 3 with the liquid hole 6, avoiding the problem of deviation.

[0037] For details regarding the above embodiments, please refer to [link / reference]. Figures 3-7 The inlet pipe 31 is connected to a set of through holes 33, and the outlet pipe 32 is connected to another set of through holes 33. The liquid will enter the through holes 33 through the inlet pipe 31 and then enter the interior of the solution tank 8 through the through holes 33. The liquid will flow through the other set of through holes 33 into the outlet pipe 32, realizing liquid circulation and thus achieving the purpose of heat dissipation.

[0038] For details regarding the above embodiments, please refer to [link / reference]. Figure 6A fixing plate 81 is fixed to the inner wall of the solution tank 8, and multiple sets of fins 82 are fixed inside the solution tank 8. The fixing plate 81 and fins 82 are located inside the solution tank 8, and the bottom of the fixing plate 81 and fins 82 are in contact with the main board 2. When the main board 2 absorbs heat, the fixing plate 81 and fins 82 will also absorb heat. The fixing plate 81 and fins 82 are in contact with the liquid, so that the liquid dissipates heat from the fixing plate 81 and fins 82, and the fixing plate 81 and fins 82 dissipate heat from the main board 2.

[0039] For details regarding the above embodiments, please refer to [link / reference]. Figure 1 and Figure 3 The fixing block 22 is connected to the mounting block 3 by bolts. The bolt fixing method can make the mounting block 3 more secure and avoid the problem of the mounting block 3 shaking.

[0040] In practical operation, the following steps are performed during welding: The oxide layer on the surfaces of the bottom frame 1 and the main board 2 is treated. The main board 2 is then installed inside the second mounting groove 4, with the protrusion 5 entering the groove 41. Appropriate friction welding equipment and suitable friction welding tools are then used for stirring friction welding. After completion, the mounting block 3 is installed. The clearance groove 34 at the bottom of the mounting block 3 engages with the outer wall of the fixing block 22. The mounting block 3 is then fixed to the fixing block 22 with bolts. The through hole 33 at the bottom of the mounting block 3 is aligned with the liquid hole 6. The mounting block 3 compresses the sealing ring 7. The inlet pipe 31 and the outlet pipe 32 are both connected to water pipes. Liquid enters the solution tank 8 through the inlet pipe 31. The main board 2 and the bottom frame 1 absorb heat. The liquid entering the solution tank 8 contacts the fins 82, carrying away the heat absorbed by the fins 82 and the bottom frame 1 of the main board 2, thus dissipating heat from the water-cooled plate body.

[0041] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A supercomputer water-cooled plate structure, comprising a bottom frame (1) and a motherboard (2), wherein the bottom frame (1) and the motherboard (2) constitute the main body of the water-cooled plate, characterized in that: The bottom frame (1) and the main board (2) are connected by friction stir welding. The top of the main board (2) is equipped with a mounting block (3), and a liquid inlet pipe (31) is provided on one side of the mounting block (3). A liquid drain pipe (32) is provided on both sides of the mounting block (3). Two sets of through holes (33) are opened inside the mounting block (3). A solution tank (8) is opened inside the main board (2). Two sets of liquid holes (6) are opened on the top of the main board (2).

2. The supercomputer water-cooled plate structure according to claim 1, characterized in that: The bottom frame (1) has a second mounting groove (4) inside, and the inner wall of the second mounting groove (4) has a groove (41). The bottom of the main board (2) is fixed with a protrusion (5).

3. The supercomputer water-cooled plate structure according to claim 1, characterized in that: The motherboard (2) has a first mounting groove (21) on its top, and a sealing ring (7) is provided inside the first mounting groove (21).

4. The supercomputer water-cooled plate structure according to claim 1, characterized in that: The top of the motherboard (2) is fixed with multiple sets of fixing blocks (22), and the bottom of the mounting block (3) is provided with multiple sets of clearance grooves (34).

5. The supercomputer water-cooled plate structure according to claim 1, characterized in that: The inlet pipe (31) is connected to a set of through holes (33), and the outlet pipe (32) is connected to another set of through holes (33).

6. The supercomputer water-cooled plate structure according to claim 1, characterized in that: The inner wall of the solution tank (8) is fixed with a fixing plate (81), and multiple sets of fins (82) are fixed inside the solution tank (8).

7. The supercomputer water-cooled plate structure according to claim 4, characterized in that: The fixing block (22) is connected to the mounting block (3) by bolts.

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