A liquid-cooled GPU server based on 4U chassis installation of multiple hard disk box PCIe cards

By introducing a combination of air cooling and liquid cooling modules into the server, the heat dissipation problems of the CPU, GPU and memory are solved, noise and PUE values ​​are reduced, and the server's scalability is improved.

CN224319725UActive Publication Date: 2026-06-02SHENZHEN TONGTAIYI INFORMATION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN TONGTAIYI INFORMATION TECH CO LTD
Filing Date
2025-04-24
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

In existing servers, it is difficult to balance the heat dissipation of CPU, GPU and memory, which affects the expansion performance. In addition, the high power consumption of air-cooled modules leads to an excessively high PUE value, which limits the server's high performance.

Method used

It adopts a combination design of air-cooled module and liquid-cooled module, including water distributor, liquid flow pipe and cold plate, to dissipate heat for CPU and GPU, and combined with air-cooled module to dissipate heat for other components, reduce noise and optimize PUE value.

Benefits of technology

It effectively solved the heat dissipation problem of high-power CPUs and GPUs, reduced noise by more than 20 decibels, reduced the PUE value from 1.3 to below 1.2, and improved the server's scalability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a server design technical field, concretely relates to a kind of liquid cooling GPU server based on 4U cabinet installation multiple hard disk box PCIe card, and its technical key points are at: including box and server component, wherein, the server component is located in the box, further including air cooling module and liquid cooling module, the server component includes a mainboard, the air cooling module is located one end of the mainboard, the liquid cooling module is located the top of the mainboard, the liquid cooling module includes water distributor, liquid flow pipe and cold plate, the water distributor is located the top of air cooling module, for the distribution of low-temperature coolant and the collection of high-temperature coolant, the liquid flow pipe is used to connect the water distributor and the cold plate, the cold plate is located the side of the mainboard away from the air cooling module. Through the reasonable collocation of air cooling module and liquid cooling module, both the heat dissipation problem of two 500W high-power CPUs and 8 600W high-power GPUs is solved, noise is reduced, and PUE value is also reduced.
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