A static levelling system

Abstract

The utility model embodiment provides a kind of static force level measurement system, comprising: minimum system unit, external communication unit, measurement unit, power unit, main shell and static force level assembly;The circuit board embedded in main shell is provided with minimum system unit, external communication unit, measurement unit, power unit;Minimum system unit is connected with external communication unit, measurement unit and power unit respectively;The main shell outside is provided with the navigation plug mounting plate, and static force level assembly is connected with measurement unit based on the navigation plug on the navigation plug mounting plate.Through the scheme, the problem of inconvenient installation of static force level measurement system in prior art can be solved.

Description

Technical Field

[0001] This utility model relates to the field of natural disaster early warning technology, and in particular to a static leveling measurement system. Background Technology

[0002] Static leveling systems can be used to monitor ground subsidence in real time and have a wide range of applications in urban construction and large-scale infrastructure projects.

[0003] However, in the existing technology, the static leveling system is relatively large and requires many small components or structural parts to be installed, which makes the installation of the static leveling system very inconvenient. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a static leveling measurement system to solve the problem of inconvenient installation of existing static leveling measurement systems. The specific technical solution is as follows:

[0005] This utility model provides a static leveling measurement system, including: a minimum system unit, an external communication unit, a measurement unit, a power supply unit, a main housing, and a static leveling component;

[0006] The circuit board built into the main housing is equipped with the minimum system unit, the external communication unit, the measurement unit, and the power supply unit;

[0007] The minimum system unit is connected to the external communication unit, the measurement unit, and the power supply unit, respectively;

[0008] An aerial insertion mounting plate is provided on the outside of the main housing, and the static leveling component is connected to the measuring unit based on the aerial insertion on the aerial insertion mounting plate.

[0009] In one embodiment of this utility model, the static leveling component includes: a static level and an inclination acceleration sensor, wherein the inclination acceleration sensor is fixed inside the upper cover of the static level based on a fixing member.

[0010] In one embodiment of this utility model, the minimum system unit includes: a microcontroller unit (MCU), a storage unit, and a peripheral interface expansion unit;

[0011] The storage unit is connected to the MCU via an integrated circuit bus (IIC) or a serial peripheral interface (SPI).

[0012] One end of the peripheral interface expansion unit is connected to the MCU via IIC, and the other end of the peripheral interface expansion unit is connected to the peripheral via a universal asynchronous transceiver (UART) or an I / O bus.

[0013] In one embodiment of this utility model, the external communication unit includes: a wireless communication unit, an RS232 communication unit, and an RS485 communication unit;

[0014] The wireless communication unit is connected to the MCU or the peripheral interface expansion unit via UART;

[0015] The RS232 communication unit and the RS485 communication unit are connected to the MCU or the peripheral interface expansion unit via UART.

[0016] In one embodiment of this utility model, the wireless communication unit is one of the following: a 4G communication unit, a LoRa communication unit, a WiFi communication unit, and a BeiDou-3 short message communication unit.

[0017] In one embodiment of this utility model, the debugging equipment is connected to the RS232 communication unit via an aviation connector on the aviation connector mounting plate.

[0018] In one embodiment of this utility model, the measuring unit includes: a vibrating wire analog measuring unit and a 485 digital acquisition unit;

[0019] One end of the vibrating wire simulation measurement unit is connected to the MCU or the peripheral interface expansion unit via UART or SPI, and the other end of the vibrating wire simulation measurement unit is connected to the vibrating wire sensor via a 5-core wire. The 5 wires in the 5-core wire are: frequency +, frequency -, temperature +, temperature -, and protective ground.

[0020] One end of the 485 digital acquisition unit is connected to the MCU or the peripheral interface expansion unit via a 485 bus, and the other end of the 485 digital acquisition unit is connected to the hydrostatic level.

[0021] In one embodiment of this utility model, the vibrating wire simulation measurement unit includes: an excitation component, a conversion component, and a vibration pickup unit;

[0022] The excitation component, the conversion component, and the vibration pickup unit are all connected to the MCU.

[0023] In one embodiment of this utility model, the power supply unit includes: voltage regulation units at various levels and a power supply unit;

[0024] The voltage regulation units at each stage are connected to the power supply unit at the front end and to the power supply pins of each unit in the hydrostatic leveling system at the rear end; the voltage regulation units at each stage are used to provide the appropriate voltage for each unit.

[0025] In one embodiment of this utility model, an indicator light panel is provided on the top of the main housing, and the indicator light panel is provided with a power light, a 4G communication light and a running alarm light.

[0026] The static leveling measurement system provided in this embodiment of the utility model has an integrated design of a minimum system unit, an external communication unit, a measurement unit and a power supply unit on a circuit board built into the main housing. This integrated design reduces the size of the static leveling measurement system and makes it easier for engineers to install and maintain.

[0027] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0029] Figure 1 A schematic diagram of the structure of a static leveling system provided by this utility model;

[0030] Figure 2 This is a structural schematic diagram of a static leveling component provided by this utility model;

[0031] Figure 3 A schematic diagram of the connection between the various units of an RTU provided by this utility model;

[0032] Figure 4 A schematic diagram of an RTU provided by this utility model;

[0033] Figure 5 A flowchart of a static leveling system provided for embodiments of this utility model;

[0034] Figure 6 A flowchart illustrating the operation of a vibrating wire simulation measurement unit provided in this embodiment of the present invention;

[0035] Figure 7 This utility model provides an internal structural diagram of the vibration pickup unit in a static leveling system.

[0036] Figure 8 A schematic diagram of the vibrating wire sweeping process in a static leveling system provided by this utility model;

[0037] Figure 9This is a schematic diagram of a static leveling component provided for an embodiment of the present utility model;

[0038] Figure 10 This invention provides a pin assignment diagram for an RJ45 tube in a static leveling system. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art based on this application are within the protection scope of the present utility model.

[0040] To promptly grasp the degree and speed of land subsidence, predict its development trend, assess the impact of land subsidence on urban construction, and ensure the safety of urban infrastructure, a static leveling measurement system was specifically developed to monitor land subsidence in real time.

[0041] Static leveling systems have wide applications in urban construction and large-scale infrastructure development. In subway construction, settlement monitoring of buildings surrounding subway tunnels is necessary to ensure the safety of buildings and the stability of the subway system. In bridge construction, settlement monitoring of bridge foundations is required to ensure the stability and safety of the bridge structure. In large-scale earthwork projects, settlement monitoring of the project area is essential to ensure the smooth progress of the project and control its impact on the surrounding environment. Static leveling systems can also be used to assess and predict land settlement, enabling geological environment analysis and research, which in turn facilitates rational urban planning and land use. Static leveling systems can also be used to monitor changes in groundwater levels. In short, static leveling systems have extensive applications in urban construction and large-scale infrastructure development.

[0042] A static leveling system typically consists of data acquisition and analysis equipment and a static level instrument.

[0043] However, existing hydrostatic leveling systems have the following technical problems:

[0044] (1) The data acquisition and analysis equipment in the static leveling system is large in size, making it inconvenient to install and maintain;

[0045] (2) The data acquisition and analysis equipment in the static leveling system includes many fragmented components or structural parts, which makes it inconvenient to install in the field.

[0046] (3) In a static leveling system, if the static level is tilted, the collected settlement data will be inaccurate.

[0047] (4) When maintaining static leveling, it is necessary to disassemble the outer casing of the data acquisition and analysis equipment, which can easily introduce the external environment (high humidity, high salt, high sulfur, etc.) into the static leveling system, introduce hidden dangers, shorten the service life of the equipment and increase the probability of failure.

[0048] To solve at least one of the above-mentioned technical problems, this utility model provides a static leveling measurement system.

[0049] Example 1

[0050] See Figure 1 This is a structural schematic diagram of a static leveling system provided by this utility model.

[0051] The static leveling system includes a minimum system unit 1, an external communication unit 2, a measurement unit 3, a power supply unit 4, a main housing 5, and a static leveling assembly 6;

[0052] The circuit board inside the main housing 5 is equipped with a minimum system unit 1, an external communication unit 2, a measurement unit 3, and a power supply unit 4.

[0053] The minimum system unit 1 is connected to the external communication unit 2, the measurement unit 3, and the power supply unit 4, respectively.

[0054] The main housing 5 is provided with an aerial insertion mounting plate 7, and the static leveling component 6 is connected to the measuring unit 3 based on the aerial insertion on the aerial insertion mounting plate 7.

[0055] It should be noted that, Figure 1 Only two static leveling components are shown in the figure and do not serve a limiting function. Additionally, for ease of explanation of the internal structure of the main housing, the top cover of the main housing is shown in the figure; however, in practical applications, the top cover of the main housing is not necessary.

[0056] In this embodiment, the main housing houses a circuit board, on which a minimum system unit, an external communication unit, a measurement unit, and a power supply unit are integrated, thereby integrating the minimum system unit, external communication unit, measurement unit, and power supply unit into a single housing. It should be noted that in this solution, integrating the minimum system unit 1, external communication unit 2, measurement unit 3, and power supply unit 4 into the main housing achieves an integrated design of the Remote Terminal Unit (RTU) in the hydrostatic leveling system (hereinafter, the main housing and its encapsulated external communication unit, measurement unit, and power supply unit will be referred to as the RTU).

[0057] In this embodiment, the minimum system unit refers to the most concise set of circuits necessary for a microcontroller or microprocessor to run a program independently; it is the "brain" and core of the entire hydrostatic leveling system. The external communication unit refers to the interface circuitry that allows the circuit board to exchange data and transmit information with the external world (such as a host computer, sensors, or a cloud platform). The measurement unit is the circuitry on the circuit board used to sense, acquire, and quantify signals from the external physical world. Specifically, in this embodiment, the measurement unit converts physical quantities (such as frequency, temperature, and liquid level) into electrical signals that the minimum system unit can process. The power supply unit is the circuitry that provides stable, reliable, and compliant electrical energy to all other units on the circuit board; it is the foundation for the operation of the entire hydrostatic leveling system.

[0058] In this embodiment, the connection relationship between the minimum system unit, external communication unit, measurement unit, and power supply unit integrated on the circuit board is as follows: the minimum system unit is directly connected to the external communication unit, measurement unit, and power supply unit, respectively, or the minimum system unit is indirectly connected to the external communication unit, measurement unit, and power supply unit through an expansion chip, respectively.

[0059] In this embodiment, the hydrostatic leveling system includes not only the RTU but also hydrostatic leveling components. These components measure the relative elevation changes between two or more points with high precision based on the principle of hydrostatic equilibrium. The number of hydrostatic leveling components is at least two. When there are two components, one is used as the reference point and the other as the measuring point. Alternatively, one component can be used as the reference point and the others as measuring points. In practical use, to ensure the accuracy of settlement data, the number of hydrostatic leveling components is generally set to more than two. For example, in this embodiment, the number of hydrostatic leveling components can be seven.

[0060] An aviation connector plate is installed on the exterior of the RTU main housing. This plate integrates or adapts to aviation connectors (aviation plugs) on a circuit board or device interface board, enabling reliable electrical connections between devices. The static leveling component connects to the measurement unit inside the RTU via an aviation connector on the mounting plate located on the exterior of the main housing. Specifically, a connecting cable with an aviation connector can be used; one end of the cable connects to the corresponding aviation connector on the mounting plate, and the other end connects to the static leveling component.

[0061] For example, in this embodiment, the aviation connector board integrates 10 aviation connectors, including CH0-CH7, as well as an RS232 interface and a 12VDC interface. Among them, eight aviation connectors (CH0-CH7) are used to connect the static leveling components and vibrating wire sensors to the measurement units inside the RTU. More specifically, one aviation connector is used to connect the vibrating wire sensor to the vibrating wire analog measurement unit inside the RTU, seven aviation connectors are used to connect the seven static leveling components to the seven 485 digital acquisition units inside the RTU, the RS232 interface is used to connect the debugging equipment to the RS232 communication unit inside the RTU, and the 12VDC interface is used to connect the external power supply to the power module inside the RTU.

[0062] As can be seen from the above embodiments, in this embodiment, the static leveling measurement system consists of an RTU and a static leveling component. The circuit board built into the main housing is equipped with a minimum system unit, an external communication unit, a measurement unit, and a power supply unit, realizing an integrated design of the RTU. This integrated design reduces the size of the RTU, making it easier for engineers to install and maintain. Furthermore, the RTU is connected to the static leveling component, enabling timely collection and analysis of settlement data, and providing timely settlement warnings for settlement-sensitive structures (such as bridges, dams, subways, and nuclear power plants).

[0063] Example 2

[0064] In one embodiment of this utility model, the static leveling component in the static leveling measurement system may include: a static level instrument and an inclination acceleration sensor. The RTU part in the static leveling measurement system is similar to that in Embodiment 1, and will not be described in detail here.

[0065] See Figure 2 This is a structural schematic diagram of a static leveling component provided by this utility model.

[0066] like Figure 2 As shown, in one embodiment of the present invention, the static leveling component 6 includes a static level instrument 61 and an inclination acceleration sensor 62, wherein the inclination acceleration sensor 62 is fixed inside the upper cover of the static level instrument 61 based on a fixing member.

[0067] For example, the tilt acceleration sensor described above can be fixed inside the top cover of the hydrostatic level via a PCB board. The fixing component can be a copper insert and a threaded connecting sleeve. The tilt acceleration sensor 62 is fixed inside the top cover of the hydrostatic level by connecting the copper insert and the threaded connecting sleeve. Of course, other fixing methods can also be used, and this embodiment does not specifically limit the fixing method.

[0068] The hydrostatic level includes a magnetostrictive displacement sensor, which is used to measure the liquid level. In addition, the hydrostatic level also includes a liquid storage tank, base plate, leveling bolts, mounting base, vent valve, observation cable, antifreeze, liquid inlet pipe, connecting joint, etc.

[0069] The tilt acceleration sensor measures tilt acceleration data to determine if the hydrostatic level is tilted. If tilted, the tilt acceleration data can be used to correct the liquid level data, thus obtaining accurate settlement data. When the hydrostatic level is tilted, the settlement data monitored by the displacement sensor is inaccurate. Therefore, in this embodiment, a tilt acceleration sensor is embedded in the upper cover of the hydrostatic level. If the hydrostatic level is tilted, the hydrostatic leveling system can use the tilt acceleration data to correct the settlement data, thereby improving the accuracy of the settlement data. The method of using tilt acceleration data to correct the settlement data will be explained later.

[0070] In this embodiment, the static leveling component is connected to the measurement unit via a connector on the connector mounting plate. This can be achieved using a two-core wire with a connector. One end of the wire connects to the connector on the connector mounting plate corresponding to the measurement unit, and the other end connects to the displacement sensor and tilt acceleration sensor on the static leveling component. In this way, the measurement unit inside the RTU can acquire the liquid level data collected by the displacement sensor and the tilt acceleration data collected by the tilt acceleration sensor.

[0071] As can be seen from the above embodiments, this embodiment improves upon the traditional hydrostatic level by embedding an angular acceleration sensor inside the upper cover of the hydrostatic level. In this way, even if the hydrostatic level tilts, the settlement data can be corrected based on the angular acceleration data collected by the angular acceleration sensor, ensuring the accuracy of the settlement data and enabling timely and accurate settlement early warning for settlement-sensitive structures (such as bridges, dams, subways, and nuclear power plants).

[0072] Example 3

[0073] In one embodiment of this utility model, the minimum system unit includes: a micro control unit (MCU), a storage unit, and a peripheral interface expansion unit;

[0074] The external communication units include a wireless communication unit, an RS232 communication unit, and an RS485 communication unit;

[0075] The measurement unit includes: multiple vibrating wire analog measurement units and multiple 485 digital acquisition units;

[0076] The power supply unit includes: voltage regulation units at various levels and power supply units.

[0077] In this embodiment, the MCU is the brain of the static leveling system. Essentially, it is a microcontroller. Each unit in the static leveling system needs to be directly or indirectly connected to the MCU. The MCU can process the acquired data according to different requirements and send it to the target unit through an external interface. The target unit can be a data reader, a host computer, etc. The MCU has various interface resources such as IIC, UART, SPI, IO, RGMII, etc. In this embodiment, existing chips can be used in the MCU, such as Espressif's ESP32-U4WDH chip (packaged as QFN-48-EP(5x5)).

[0078] The storage unit is used to store the data processed by the MCU and retrieve it when needed. The storage unit can be a non-volatile memory, such as Flash or e2prom.

[0079] Peripheral interface expansion units can be I / O expansion chips. When the MCU interface resources are insufficient and the speed requirements for expansion interfaces are not high, peripheral interface expansion units can be used to enhance the resource scalability of the MCU.

[0080] The smallest system unit may also include an RTC, which is a real-time clock chip. Its function is to ensure that the MCU can obtain an accurate clock again when the system is powered on and then disconnected from the network.

[0081] In this embodiment, the connection relationships between the units included in the minimum system unit are as follows: the storage unit is connected to the MCU via an Inter-Integrated Circuit (IIC) bus or a Serial Peripheral Interface (SPI). For example, the storage unit is connected to pins 25, 27, 30, 31, 32, and 33 of the MCU via the SPI bus; one end of the peripheral interface expansion unit is connected to the MCU via the IIC bus, and the other end is connected to the peripheral via a general-purpose UART or I / O bus. For example, the I / O expansion chip is connected to pins 21 and 24 of the MCU via the IIC bus, and the other end is connected to the peripheral via a UART or I / O bus. The peripheral can be any level of unit in the aforementioned hydrostatic leveling system, or it can be an external device, such as a debugging device; the RTC is connected to the MCU via the IIC or SPI bus. For example, the RTC is connected to pins 44 and 45 of the MCU via the IIC or SPI bus.

[0082] In this embodiment, each unit of the external communication unit is connected to the MCU or peripheral interface expansion unit in the minimum system unit to realize the connection between the external communication unit and the minimum system unit.

[0083] The connection relationships between the various units included in the external communication unit and the MCU or peripheral interface expansion unit in the minimum system unit are as follows: the wireless communication unit is connected to the MCU or peripheral interface expansion unit, and by default, the communication unit is connected to the MCU via the UART interface; the RS232 communication unit and the RS485 communication unit are connected to the MCU or peripheral interface expansion unit via the UART bus. It should be noted that the wireless communication unit, RS232 communication unit, and RS485 communication unit can be directly connected to the MCU. When the interfaces on the MCU are insufficient, the wireless communication unit, RS232 communication unit, and RS485 communication unit can be connected to the peripheral interface expansion unit to achieve indirect connection to the MCU.

[0084] In this embodiment, the wireless communication unit can be one of the following: a 4G communication unit, a LoRa communication unit, a WiFi communication unit, or a BeiDou-3 short message communication unit. Its main function is to serve as a channel for information exchange between the RTU and an external platform.

[0085] In this embodiment, the measurement unit includes a vibrating wire analog measurement unit and a 485 digital acquisition unit. The specific number of the vibrating wire analog measurement unit and the 485 digital acquisition unit can be set according to actual needs. For example, the number of vibrating wire analog measurement units is one, and the number of 485 digital acquisition units is seven.

[0086] In this embodiment, the function of the vibrating wire simulation measurement unit is to calculate the stress by using the frequency data and temperature data transmitted back by the vibrating wire sensor through high-pressure or low-pressure excitation of the sensor; the function of the 485 digital measurement unit is to calculate accurate settlement data by using the liquid level data and tilt acceleration data read from the hydrostatic level sensor.

[0087] In this embodiment, each unit of the measurement unit is connected to the MCU or peripheral interface expansion unit in the minimum system unit to realize the connection between the external communication unit and the minimum system unit.

[0088] The connection relationship between each unit included in the measurement unit and the MCU or peripheral interface expansion unit in the minimum system unit is as follows: one end of the vibrating wire analog measurement unit is connected to the MCU or peripheral interface expansion unit through UART or SPI, and the other end of the vibrating wire analog measurement unit is connected to the vibrating wire sensor through a 5-core wire. The 5 wires in the 5-core wire are: frequency +, frequency -, temperature +, temperature -, and protective ground; one end of the 485 digital acquisition unit is connected to the MCU or peripheral interface expansion unit through the 485 bus, and the other end of the 485 digital acquisition unit is connected to the hydrostatic leveling component.

[0089] In this embodiment, the vibrating wire simulation measurement unit consists of an excitation component, a conversion component, and a vibration pickup unit; the excitation component, the conversion component, and the vibration pickup unit are all connected to the MCU, where connection means direct or indirect connection.

[0090] The MCU sends a digital excitation signal, which is then converted into an analog excitation signal by a power MOSFET. The MCU then controls a conversion component to output the analog excitation signal to the frequency+ and frequency- pins of the vibrating wire sensor. The vibrating wire sensor receives the analog excitation signal and feeds back a resonance signal. The MCU then connects the frequency+ and frequency- pins of the vibrating wire sensor to the vibration pickup unit via the conversion component. Finally, the signal is connected to the MCU's ADC interface to complete the measurement closed loop. The conversion component uses the MCU to control a double-pole double-throw relay or a MOSFET to select the frequency+ and frequency- pins of the vibrating wire sensor for connection to the excitation component or the vibration pickup unit.

[0091] In this embodiment, the power supply unit includes: voltage regulation units at various levels and a power supply unit. The voltage regulation units at various levels are connected to the power supply unit before their respective stages, and to the power supply pins of each unit in the hydrostatic leveling system after their respective stages. The voltage regulation units at various levels are used to provide appropriate voltages to each unit. Specifically, each voltage regulation unit can be a DC-DC / LDO boost or buck unit.

[0092] Each voltage control unit can be directly connected to the power supply pins of each unit in the hydrostatic leveling system, thus providing the appropriate voltage directly to each unit in the hydrostatic leveling system. Alternatively, each voltage control unit can be connected to the power supply pins of the MCU in the minimum system unit, thus indirectly providing the appropriate voltage to each unit in the hydrostatic leveling system.

[0093] The power supply unit may include an external 12VDC power supply or a battery, with the external 12VDC power supply being preferred, and battery power being used when there is no external power supply (such as in the field).

[0094] As can be seen from the above embodiments, in this embodiment, the static leveling system consists of an RTU and a static leveling component. By reasonably connecting the various units inside the RTU and integrating them onto a single circuit board, the integrated and miniaturized design of the RTU is achieved.

[0095] Example 4

[0096] In one embodiment of this invention, an indicator light panel is provided on the top of the RTU's main housing, and the indicator light panel includes a power indicator, a 4G communication indicator, and an operation alarm indicator. This design facilitates the understanding of the RTU's operating status by the staff. The internal structure of the RTU is similar to that of the aforementioned embodiments and will not be described in detail further.

[0097] Example 5

[0098] In one embodiment of this invention, the RS232 communication unit inside the RTU can be a debugging serial port for use by field maintenance personnel. The debugging equipment is connected to the RS232 communication unit via an aviation connector on the aviation connector mounting plate. It should be noted that in this embodiment, the RS232 communication unit is only reserved as a debugging serial port, and the RS232 communication unit is not necessarily always connected to the debugging equipment.

[0099] Specifically, an aviation connector mounting plate is installed on the outside of the RTU main casing. When the RTU needs to be debugged, the connector of the debugging cable is plugged into the aviation connector corresponding to the RS232 communication unit on the aviation connector mounting plate on the outside of the main casing, and the other end of the debugging cable is connected to the debugging equipment. In this way, when debugging the RTU in the hydrostatic leveling system, it is not necessary to disassemble the RTU casing, reducing the potential hazards introduced into the RTU by the external environment (high humidity, high salt, high sulfur, etc.), improving the service life of the RTU and reducing the probability of RTU failure.

[0100] In this embodiment, the RS485 communication unit is an expansion interface with two functions: (1) to connect to a handheld reader and read instrument data through the interface; (2) to reserve connection to LoRa communication equipment and BeiDou-3 short message communication equipment.

[0101] As can be seen from the above embodiments, this embodiment achieves the integrated design of the RTU in the hydrostatic leveling system while reserving a debugging serial port for the RTU. This way, when the RTU needs to be debugged, there is no need to disassemble the RTU casing, reducing the potential hazards caused by external environment (high humidity, high salt, high sulfur, etc.) to the RTU, improving the service life of the RTU and reducing the probability of RTU failure.

[0102] Example 6

[0103] In one embodiment of this utility model, the external structure of the main housing in the RTU includes an IP66 waterproof and dustproof design, a miniaturized and integrated external design, and a DFx design.

[0104] The IP66 design is dust-proof, preventing dust from entering even at low pressures of 20 mbar.

[0105] The miniaturized, integrated design is for ease of installation and maintenance;

[0106] Design for FX (Design for FX) is a design approach that addresses each stage of the product lifecycle, where X represents a specific stage or characteristic of the product lifecycle. It is a new design technology that considers factors such as product performance, quality, manufacturability, assemblability, testability, product service, and price as early as possible in the design phase.

[0107] The main housing structure of the RTU is shown in Table 1 below.

[0108] Table 1. Shell Structure Components of the Static Leveling System

[0109]

[0110] The top cover and bottom shell are made of aluminum alloy, which helps with electromagnetic shielding.

[0111] The sealing gasket is made of silicone, which has good heat resistance and can work at very low temperatures. It also has excellent oxidation resistance and its main functions are waterproofing, moisture-proofing, and dustproofing.

[0112] Structural components can secure parts while preventing short circuits on circuit boards;

[0113] A 4G antenna is used for transmitting and receiving 4G signals in an RTU.

[0114] Waterproof SMA terminals + internal RF cable with IPEX male connector are structural components for the antenna inside the housing;

[0115] The 4G communication unit is used to send the monitoring data and status data of the RTU to the host computer or platform;

[0116] Waterproof connectors (for testing instruments) are used in the interface of testing instruments, mainly for waterproofing, moisture protection, and dust protection;

[0117] The ER34615 series-connected battery housing provides a casing for the batteries and directly outputs 10.8VDC@2000mA to the RTU for easy battery replacement.

[0118] Vibrating wire sensor test leads: These are 5-core cables with aviation connectors connecting the vibrating wire sensor to the vibrating wire analog measurement unit. The aviation connectors connect to the test instrument.

[0119] The battery power cable is a 2-core power cable, and the battery box cable leads to the battery interface of the tester.

[0120] RS485 line: This is a 4-core cable with an aviation connector reserved between the handheld tester / LoRa / BeiDou 3 short message equipment. The aviation connector is connected to the tester (static leveling component).

[0121] The waterproof aviation RJ45 interface (dual female connector) has one aviation RJ45 connector cable reserved for the combined console port and 100M Ethernet port. The aviation connector is connected to the tester using a dual-ended RJ45 cable.

[0122] It should be noted that the above-mentioned structural components and their quantities can be adjusted according to actual needs.

[0123] Example 7

[0124] In one embodiment of this utility model, combined with Figure 3 and Figure 4 An example illustration is provided for the miniaturization and integrated design of the RTU.

[0125] See Figure 3 This is a schematic diagram of the connection between the various units of an RTU provided by this utility model.

[0126] from Figure 3 As can be seen from the data, the RTU in this hydrostatic leveling system is based on an MCU and integrates modules such as power management, stress / settlement data acquisition, multi-serial communication (RS232 / RS485 / 4G), and IO expansion. It is mainly used in industrial monitoring and other scenarios to realize the full-process function of "sensor data acquisition → data processing → remote transmission → status display".

[0127] The connection relationship on the left side of the diagram can be simply summarized as follows: Input power +V1 → Electronic switch → Three-way output: The first output, +V1, goes to the MCU; the second output, after being boosted by the boost module, sends +V2 to the RS232 / RS485 module; the third output, after being boosted by the boost module, sends +V3 to the WS2114 / CH4232S module (general-purpose remote I / O expansion chip); the fourth output, after being boosted by the boost module and the LDO (buck) module, powers the vibrating string module.

[0128] Here, +V1 is the system's total input power output, which can be, for example, a 12V DC power supply; the electronic switch is used to control the power on and off, realizing the power-on / power-off of the RTU; the voltage is regulated by the boost module and LDO module to provide the appropriate voltage for each unit, such as inputting +V2 to the RS232 / RS485 communication unit and inputting +V1 to the MCU to power these units and ensure that these units operate normally.

[0129] One end of the vibrating string module is connected to the MCU, and the other end is connected to an external vibrating string sensor (not shown in the figure), which is used to convert the frequency signal into a digital signal (such as a pulse signal) that can be processed by the MCU.

[0130] The MCU is the "brain" of the system, responsible for signal processing, logic control, and communication management. All modules are directly or indirectly connected to the MCU.

[0131] The MCU connects to the RS232 communication unit via the UART0 interface. The RS232 communication unit is connected to the Phoenix terminal (3.5mm x 3 x 2). The Phoenix terminal is an RS232 wiring terminal used to connect to a host computer (such as a laptop computer) to achieve debugging (such as program downloading, data viewing) or short-distance data transmission.

[0132] The MCU connects to a UART expansion module via the UART1 interface, which expands the interface to four serial ports (UART1_1-UART1_4) for connecting multiple serial devices. These four serial ports connect to the RS485 communication unit, the vibrating wire analog measurement unit, the 4G communication unit, and the RS485 data acquisition unit, respectively. The other end of the RS485 data acquisition unit connects to external hydrostatic leveling components (base station and stations 1-6).

[0133] The MCU connects to the I / O expansion module via the I / O1 interface, expanding to 8 inputs (IO*8) and 16 outputs (IO*16) to provide more I / O interfaces. The MCU receives button signals through the I / O expansion chip, enabling manual intervention such as parameter modification and alarm triggering. The MCU also controls indicator lights through the I / O expansion interface, providing status feedback such as normal power, normal communication, and alarm status, allowing users to easily monitor the RTU's operating status.

[0134] In addition, there is a 12VDC presence / absence detection unit to detect the presence of a 12V DC power supply (such as an internal or external power supply), and transmit the data to the MCU for power status monitoring to prevent power failure. The 12V voltage presence / absence detection checks the presence of 12V in the input power supply, supplementing the power monitoring function of the I / O extension and improving reliability.

[0135] The encryption IC communicates with the MCU through the IIC2 interface for data encryption (such as communication data between the MCU and the 4G module or the host computer), preventing data tampering or theft and ensuring communication security.

[0136] See Figure 4The figure shows a schematic diagram of the external shape of an RTU provided by this utility model. As can be seen from the figure, the circuit board built into the main housing of the RTU is equipped with a minimum system unit, an external communication unit, a measurement unit, and a power supply unit, realizing the integrated and miniaturized design of the RTU.

[0137] Based on the above description of the embodiments, the beneficial effects that this utility model can achieve are as follows:

[0138] (1) A miniaturized and integrated static leveling system, which is convenient to install and maintain due to its small size;

[0139] (2) The integrated design makes it easy for engineers to install and maintain the equipment. When debugging the equipment, the equipment is connected to the serial port, which basically eliminates the influence of the external environment on the equipment.

[0140] (3) The static leveling component is equipped with an inclination acceleration sensor. If the static leveling instrument tilts, the inclination acceleration data can be used to correct the settlement data, which greatly improves the accuracy of the settlement data.

[0141] (4) The integrated design of the RTU can reach the IP66 level, which greatly increases the reliability and stability of the equipment.

[0142] Below, in conjunction with Figures 5-9 The working principle of the static leveling system provided by this utility model is explained below:

[0143] See Figure 5 The following is a flowchart of the workflow of a static leveling system provided by this utility model embodiment. The overall workflow is as follows: The RTU of the static leveling system is powered on, the main chip (MCU) inside the RTU is initialized, the default parameters are updated, and after the peripheral module initialization and self-test are successful, data acquisition is performed. When the data is found to be abnormal, the abnormal state working mode is started, that is, abnormal acquisition is adopted and the reporting frequency is increased, and the abnormal flag is set. When the data is found to be normal, the data is stored (using the first-in-first-out mode, generally storing 7 days of data), the 4G module power is turned on, and the 4G module and / or LoRa module are initialized. When the initialization is successful, the RTU can communicate with the external cloud platform and maintain RTC time synchronization so that the MCU can obtain an accurate clock, realize data reporting, remote parameter setting, remote telemetry, and remote upgrade, etc. When the initialization fails, RTC time synchronization is started and the external module power is turned off. At this time, the main chip goes into sleep mode. When the main chip needs to be restarted, it is woken up by pressing a button on the RTU and by the RTC, and then returns to the step of judging whether the peripheral module initialization and self-test are successful.

[0144] The key steps are explained below:

[0145] 1. Vibrating Wire Information Acquisition: Based on the acquisition frequency received by the external communication unit, the equipment periodically initiates acquisition commands to the vibrating wire signal unit. See also... Figure 6 The following is a flowchart illustrating the operation of a vibrating wire simulation measurement unit according to an embodiment of the present invention:

[0146] a. The MCU sends an excitation signal, and the excitation component in the vibrating wire analog measurement unit sends a high-voltage or low-voltage excitation at the response frequency to the frequency lines (2 lines: frequency + and frequency -) of the vibrating wire sensor.

[0147] b. Switch the interface of the frequency line (2 lines: frequency + and frequency -) to switch from the excitation port to the frequency receiving port.

[0148] c. The response signal from the vibrating wire sensor passes through a protection circuit at the frequency receiving port and then enters the vibration pickup assembly (also called the vibration pickup unit). The internal structure diagram of the vibration pickup unit is shown below. Figure 7 As shown, the vibration pickup unit consists of four parts: a primary amplifier, a bandpass filter, a final amplifier, and a shaping circuit. The signal to be measured in the vibration pickup unit first passes through the primary amplifier. The original response signal of about 2mV is filtered out by a capacitor of more than 1uF to remove the DC component and allow the AC component to pass through. Then it is amplified by 6 times and passed through a positive feedback active bandpass filter. Since the feedback frequency of the vibrating wire sensor is between 400 and 6000Hz, the bandpass filter only allows signals within this frequency range to pass through. The signal is amplified by 2 times in the bandpass filter. Then it passes through the final amplifier to amplify the signal by 200 times. This amplifies the initial mV level signal to a V level signal, and also provides a good precondition for the final shaping circuit. Finally, it enters the shaping circuit. The shaping circuit sets a threshold through a comparator. When the signal is higher than this threshold, it outputs a high potential; when the signal is lower than this threshold, it outputs a low potential. In this way, the final output is a square wave signal, which is easy for the MCU to identify. Finally, the frequency signal is output to the MCU via the ADC module.

[0149] Not every excitation signal will be followed by a response signal. If the frequency of the excitation signal is not near the natural frequency f0 of the object being measured and located by the sensor, the response signal will be essentially zero. Conversely, if the frequency of the excitation signal is near the natural frequency of the object being measured and located by the sensor, the aforementioned vibration pickup process will occur.

[0150] 2. Vibrating Wire Acquisition Frequency Sweep Process

[0151] See Figure 8This diagram illustrates the vibrating wire frequency sweep process in a hydrostatic leveling system provided by this invention. After the vibrating wire sensor is initially installed, since the natural frequency f0 of the object being measured is unknown, a sweep range needs to be input. An exemplary sweep range is 400–6000 Hz. If the frequency is outside this range, the process ends directly. If it is within the range of 400–6000 Hz, excitation sweeping begins, and resonance is assessed. If resonance occurs, the frequency is read, and the sweeping process ends. If no resonance occurs, the sweep frequency is adjusted, and the process returns to the initial sweep input step. For example, starting from 400 Hz, a sweep is performed every 10 Hz (i.e., F = f + N, in this case, f = 400 Hz, N = 10), each sweep taking 200 ms, requiring a total of 560 sweeps to complete the full frequency band scan. This process takes less than 2 minutes. The final measured natural frequency f0 of the object is then used to calculate the temperature T0 using the voltage values ​​of the temperature + and temperature - (NTC thermistors connected in series on the vibrating wire sensor) at the vibrating wire sensor interface. The voltage is divided by the NTC thermistor, the voltage value is measured by the ADC, the resistance value of the NTC is calculated from the voltage value, and finally the current temperature T0 is obtained by referring to the NTC resistance value and temperature.

[0152] In subsequent tests, it is only necessary to compare the previous temperature T0. If the current temperature T is greater than T0, i.e. the temperature has increased, then the test should start from f0-10. Conversely, if the current temperature T is less than T0, i.e. the temperature has decreased, then the test should start from f0+10. The test frequency F and the current temperature T are obtained. The stress change of the tested object is calculated according to the following formulas (1) and (2):

[0153] εm=k×△F+b′×△T=k×(F-F0)+(b-α)×(T-T0) (1)

[0154] In the above formula, εm represents the stress-strain of the measured structure, with units of 10. -6 ;k represents the sensitivity coefficient of the surface strain gauge, in units of 10. -6 / F; b represents the temperature correction factor for the surface strain gauge, in units of 10. -6 / ℃; α represents the coefficient of linear expansion of the measured structure, in units of 10. -6 / ℃; △T represents the change in real-time temperature measurement relative to the reference value, in ℃; T represents the real-time temperature measurement, in ℃; T0 represents the reference temperature value, in ℃; α represents the linear expansion coefficient of the measured structure, in 10. -6 At / ℃, the coefficient of linear expansion of concrete is taken as: α≈8~12×10 -6 / ℃;

[0155] σ=(k×(F-F0)+(b-α)×(T-T0))×E (2)

[0156] In the above formula, σ represents the stress value of the tested structure, in MPa; E represents the elastic modulus of the tested structure, in MPa.

[0157] Specifically, the stress value can be calculated by reading the serial number and inherent parameters of the vibrating wire sensor. The inherent parameters include the calibration coefficient k, the temperature correction coefficient b, the linear expansion coefficient α of the measured structure, and the elastic modulus E of the measured structure.

[0158] 3. Data acquisition of static leveling components.

[0159] See Figure 9 This is a schematic diagram of a static leveling component provided in an embodiment of the present invention. The static level instrument in the component operates based on the principle of communicating vessels, determining the settlement of the ground or building by measuring the height difference between two points. The static level instrument consists of a measuring rod, an electronic chamber, and a non-contact magnetic levitation ball fitted onto the measuring rod. The measuring circuit emits a starting pulse, which is transmitted in a waveguide. When the pulse encounters the magnetic levitation ball, a return pulse is generated. The electronic energy pickup mechanism senses the return pulse and measures the time difference between the two pulses to accurately determine the liquid level value. The specific method for calculating settlement data is as follows:

[0160] d. Benchmark point settlement calculation method

[0161] The settlement change ΔHj of the hydrostatic leveling instrument reference point is linearly related to the measured value F, and the calculation formula is shown in equation (3) below:

[0162] △Hj = Kj*(Fj - Foj) (3)

[0163] In the above formula: △Hj represents the change in liquid level at the reference point, in mm; Kj represents the sensitivity coefficient of the reference point of the hydrostatic level, in mm; Fj represents the real-time liquid level measurement value of the reference point of the hydrostatic level, in mm; Foj is the reference value of the liquid level at the reference point of the hydrostatic level, in mm.

[0164] e. Settlement calculation method at measurement points

[0165] The change in settlement ΔHx at the hydrostatic leveling point is linearly related to the measured value F, and the calculation formula is as follows (4):

[0166] △Hx = Kx*(Fx - Fox) (4)

[0167] In the formula, △Hx represents the change in liquid level at the measurement point, in mm; Kx represents the sensor coefficient at the hydrostatic level measurement point, in mm (mA); Fx represents the real-time liquid level measurement value at the hydrostatic level measurement point, in mm (mA); and Fox represents the liquid level reference value at the hydrostatic level measurement point, in mm (mA).

[0168] f. System Settlement Calculation Method

[0169] The settlement change ΔH of each measuring point relative to the reference point is linearly related to the measured value F, and the calculation formula is as follows (5):

[0170] △H = △Hx - △Hj = Kx*(Fx - Fox) - Kj*(Fj - Foj) (5)

[0171] Wherein, a positive value of ΔH indicates settlement, and a negative value of ΔH indicates uplift (bulging).

[0172] g. Liquid level correction method

[0173] When the hydrostatic level is tilted, the liquid level data can be corrected using the tilt acceleration data. Specifically, the tilt acceleration sensor data can be the tilt angle between the hydrostatic level sensor (displacement sensor) and the horizontal plane. The calculation formula is as follows (6):

[0174] Ft = R*|tan(a)|+h (6)

[0175] In the above formula, Ft represents the liquid level correction value, a represents the tilt angle between the hydrostatic level sensor and the horizontal plane, R represents the radius of the non-contact magnetic buoy on the hydrostatic level, and h represents the liquid level measurement value obtained by the displacement sensor.

[0176] 4. Data Processing

[0177] After the above calculations, the current stress change and settlement change of the tested item are obtained. These can be timestamped by RTC and stored in FLASH / EEPROM. Once the upload cycle is over, the new data, i.e. the data that has not been uploaded, will be uploaded to the platform immediately. The data stored in FLASH / EEPROM is retained for 7 days and will be overwritten by the new data after 7 days.

[0178] 5. The RTU interacts with the platform via a 4G module.

[0179] The platform and equipment (RTU) can realize timed data collection and reporting, online upgrades, remote parameter setting and telemetry functions; it facilitates remote maintenance by maintenance personnel and saves customers' labor costs.

[0180] 6. RTU operating modes

[0181] The RTU has two operating modes, and the RTU's acquisition frequency and upload frequency can be set separately in each mode:

[0182] The first working module, namely the normal working mode, collects and uploads data at a preset frequency;

[0183] The second working module, namely the alarm mode, will activate the alarm state when the collected data exceeds the alarm threshold. The device will collect data and report once per minute (the collection frequency can be adjusted flexibly).

[0184] 7. RS232 interface

[0185] RS232 can use an RJ45 interface, see [link / reference] Figure 10 The diagram shows the pin assignment of the RJ45 in a static leveling system provided by this utility model (all pin names shown in the diagram are for this device). RS232 is the debug serial port of the RTU, through which the device is debugged and programmed.

[0186] 8. RS485 interface

[0187] The default function of the RS485 interface is to automatically output processed data via RS485 after the RTU collects data, which can be directly connected to a handheld data reader. This port can also connect to LoRa and Beidou-3 short message devices as an alternative external communication solution when the 4G module cannot communicate.

[0188] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the scope of protection of the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model are included within the scope of protection of the present utility model.

Claims

1. A hydrostatic leveling system, characterized in that, include: Minimum system unit, external communication unit, measurement unit, power supply unit, main housing and hydrostatic leveling assembly; The circuit board built into the main housing is equipped with the minimum system unit, the external communication unit, the measurement unit, and the power supply unit; The minimum system unit is connected to the external communication unit, the measurement unit, and the power supply unit, respectively; An aerial insertion mounting plate is provided on the outside of the main housing, and the static leveling component is connected to the measuring unit based on the aerial insertion on the aerial insertion mounting plate.

2. The system according to claim 1, characterized in that, The static leveling assembly includes a static level instrument and an inclination acceleration sensor, wherein the inclination acceleration sensor is fixed inside the upper cover of the static level instrument based on a fixing component.

3. The system according to claim 1, characterized in that, The minimum system unit includes: a microcontroller unit (MCU), a storage unit, and a peripheral interface expansion unit; The storage unit is connected to the MCU via an integrated circuit bus (IIC) or a serial peripheral interface (SPI). One end of the peripheral interface expansion unit is connected to the MCU via IIC, and the other end of the peripheral interface expansion unit is connected to the peripheral via a universal asynchronous transceiver (UART) or an I / O bus.

4. The system according to claim 3, characterized in that, The external communication unit includes: a wireless communication unit, an RS232 communication unit, and an RS485 communication unit; The wireless communication unit is connected to the MCU or the peripheral interface expansion unit via UART; The RS232 communication unit and the RS485 communication unit are connected to the MCU or the peripheral interface expansion unit via UART.

5. The system according to claim 4, characterized in that, The wireless communication unit is one of the following: 4G communication unit, LoRa communication unit, WiFi communication unit, or BeiDou-3 short message communication unit.

6. The system according to claim 4, characterized in that, The debugging equipment is connected to the RS232 communication unit via the aviation connector on the aviation connector mounting plate.

7. The system according to claim 3, characterized in that, The measurement unit includes: a vibrating wire analog measurement unit and multiple 485 digital acquisition units; One end of the vibrating wire simulation measurement unit is connected to the MCU or the peripheral interface expansion unit via UART or SPI, and the other end of the vibrating wire simulation measurement unit is connected to the vibrating wire sensor via a 5-core wire. The 5 wires in the 5-core wire are: frequency +, frequency -, temperature +, temperature -, and protective ground. One end of the 485 digital acquisition unit is connected to the MCU or the peripheral interface expansion unit via a 485 bus, and the other end of the 485 digital acquisition unit is connected to the hydrostatic leveling component.

8. The system according to claim 7, characterized in that, The vibrating wire simulation measurement unit includes: an excitation component, a conversion component, and a vibration pickup unit; The excitation component, the conversion component, and the vibration pickup unit are all connected to the MCU.

9. The system according to claim 3, characterized in that, The power supply unit includes: voltage regulation units at various levels and a power supply unit; The voltage regulation units at each stage are connected to the power supply unit at the front end and to the power supply pins of each unit in the hydrostatic leveling system at the rear end; the voltage regulation units at each stage are used to provide the appropriate voltage for each unit.

10. The system according to any one of claims 1-9, characterized in that, The top of the main housing is equipped with an indicator light panel, which includes a power indicator, a 4G communication indicator, and an operation alarm indicator.

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