Circuit board assembly and vehicle

Abstract

The embodiment of the application relates to the technical field of electronic equipment, and discloses a circuit board assembly and a vehicle. The circuit board assembly comprises a circuit board, a main chip fixed to the circuit board, a secondary chip detachably connected to the circuit board, and a power supply arranged on the circuit board and electrically connected to the main chip and the secondary chip, and the power supply is used for supplying power to the main chip or the secondary chip. The circuit board assembly provided by the application has high disassembly and assembly maintenance convenience, avoids damage to the circuit board and electronic devices in the disassembly and assembly process, and improves the use experience of the car machine and the vehicle.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a circuit board assembly and a vehicle. Background Technology

[0002] In the field of electronic devices, especially in automotive systems, system-on-a-chip (SoC) serves as a core component and plays a crucial role.

[0003] In related technologies, system-on-a-chip (SoC) is fixedly mounted on a circuit board by soldering. During long-term use, SoCs may malfunction or require upgrades. When a SoC malfunctions or requires an upgrade, it needs to be removed from the circuit board for repair or replacement.

[0004] However, the replacement and repair of system-on-a-chip in the aforementioned technologies are quite complicated, and the disassembly and assembly process can easily damage the circuit board, thereby affecting the user experience of the vehicle's infotainment system and vehicle. Utility Model Content

[0005] In view of this, embodiments of this application provide a circuit board assembly and a vehicle to solve the technical problem in the above-mentioned related technologies that the replacement and repair of system-on-a-chip is cumbersome, and the disassembly and assembly process is prone to damage to the circuit board, thereby affecting the user experience of the vehicle and the in-vehicle system.

[0006] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0007] A first aspect of this application provides a circuit board assembly, comprising:

[0008] Circuit board;

[0009] The main chip is fixed to the circuit board;

[0010] A secondary chip is detachably connected to the circuit board.

[0011] A power supply is disposed on the circuit board and electrically connected to the main chip and the sub-chip. The power supply is used to supply power to the main chip or the sub-chip.

[0012] This application provides a circuit board assembly that includes a main chip and a secondary chip, with power supply switching between them. When the main chip fails, the power supply to the main chip is cut off, while power is supplied to the secondary chip. This allows for functional switching and maintenance of the main and secondary chips without power interruption or disassembly of the circuit board, ensuring the usability of the circuit board assembly and the normal operation of the vehicle's infotainment system and vehicle. The automatic power switching function reduces manual intervention and improves the maintenance efficiency of the circuit board assembly.

[0013] Furthermore, the secondary chip and the circuit board can be connected in a detachable manner, which allows the secondary chip to be installed and removed without using special tools to disassemble the circuit board, reducing the risk of accidental damage to surrounding components during maintenance.

[0014] In some embodiments of this application, the circuit board assembly further includes a protective cover that forms a first slot with the circuit board;

[0015] The sub-chip has multiple pins, and the area on the circuit board corresponding to the first slot is provided with multiple contacts that cooperate with the pins.

[0016] The sub-chip is inserted into the first slot, and each contact corresponds to a pin, with the pin pressed against the corresponding contact by the protective cover.

[0017] In some embodiments of this application, the circuit board assembly further includes a guiding structure;

[0018] The guide structure is disposed on the side of the protective cover facing the sub-chip, and the guide structure is used to guide the sub-chip to be inserted into the first slot along the first direction.

[0019] In some embodiments of this application, the guiding structure includes:

[0020] A first guide block is disposed on the surface of the protective cover facing the circuit board and extends toward the circuit board;

[0021] The second guide block is disposed on the surface of the protective cover facing the circuit board, and the second guide block and the first guide block are arranged at intervals along the second direction. The first guide block and the second guide block are used to restrict the displacement of the sub-chip in the second direction and guide the sub-chip to move along the first direction, the second direction being perpendicular to the first direction.

[0022] In some embodiments of this application, the protective cover is provided with a plurality of heat dissipation holes, and the interior of the first slot is connected to the outside through the heat dissipation holes.

[0023] In some embodiments of this application, the protective cover is a shielding cover, which is used to shield external electromagnetic signals.

[0024] In some embodiments of this application, the sub-chip includes interconnected chip bodies and multiple pins;

[0025] The circuit board has multiple sockets, each socket corresponding to a pin, and the pin is inserted into the socket by an interference fit.

[0026] In some embodiments of this application, the circuit board assembly further includes indicator lights;

[0027] The indicator light is electrically connected to the sub-chip. The indicator light emits green light when the sub-chip is working and emits red light when the sub-chip malfunctions.

[0028] In some embodiments of this application, the circuit board assembly further includes:

[0029] A first communication chip is disposed on the circuit board. The first communication chip is controlled to be connected to the sub-chip, and the first communication chip is used to be electrically connected to the screen assembly. The screen assembly controls the start and stop of the sub-chip through the first communication chip.

[0030] And / or,

[0031] A second communication chip is disposed on the circuit board. The second communication chip is connected to the sub-chip for control. The second communication chip is used for wireless communication with the mobile terminal. The mobile terminal can control the start and stop of the sub-chip through the second communication chip.

[0032] A second aspect of this application provides a vehicle including a body and a vehicle-mounted system, the vehicle-mounted system including a housing, a screen assembly, and a circuit board assembly as described above;

[0033] Both the screen assembly and the circuit board assembly are disposed within the housing, and the screen assembly and the circuit board assembly are electrically connected. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of a circuit board assembly provided in an embodiment of this application;

[0035] Figure 2 A schematic diagram of the power supply for the main chip and the sub-chip in a circuit board assembly provided in an embodiment of this application;

[0036] Figure 3 for Figure 1 A schematic diagram of the structure of the protective shield at point M;

[0037] Figure 4 for Figure 1 A schematic diagram of a structure in which a secondary chip is inserted at the protective cover at point M;

[0038] Figure 5 for Figure 1 The main view at point M;

[0039] Figure 6 for Figure 1 Top view at point M;

[0040] Figure 7 for Figure 1 Another main view at point M in the image.

[0041] Figure label:

[0042] 10. Screen components; 20. Mobile terminals;

[0043] 100. Circuit board;

[0044] 110. Contact;

[0045] 200. Main chip;

[0046] 300, secondary chip;

[0047] 310. Chip body; 320. First pin; 330. Second pin;

[0048] 400. Power supply;

[0049] 500, protective cover;

[0050] 510, First slot; 520, Heat dissipation hole;

[0051] 600. Guiding structure;

[0052] 610. First guide block; 620. Second guide block;

[0053] 700, indicator lights;

[0054] 800, the first communication chip;

[0055] 900, Second communication chip. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the specific technical solutions of this application will be further described in detail below with reference to the accompanying drawings of the embodiments of this application. The following embodiments are used to illustrate this application, but are not intended to limit the scope of this application.

[0057] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0058] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0059] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can mean a fixed connection, a detachable connection, or an integral part; it can mean a direct connection or an indirect connection through an intermediate medium.

[0060] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0061] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0062] The replacement and repair of system-on-a-chip (SoC) in the aforementioned technologies are quite cumbersome, affecting the usability of circuit board assemblies and consequently impacting the user experience of the vehicle's infotainment system and vehicle. This problem arises because, in existing technologies, when the main chip on the circuit board assembly inside the vehicle's infotainment system fails, the system's casing must be disassembled and the circuit board assembly removed before chip replacement can be performed. This process involves multiple disassembly steps, which can easily damage the circuit board or surrounding components. For example, repair personnel need to first remove the fixing structure and then use tools to pull out the faulty chip. This operation carries the risk of electrostatic interference or mechanical damage, increasing the probability of human error.

[0063] To address the aforementioned issues, this application provides a circuit board assembly and a vehicle. The circuit board assembly comprises a main chip and a sub-chip, with power supply switching between them via a power source. When the main chip fails, the power output to the main chip is cut off, while power is supplied to the sub-chip. This allows for functional switching and maintenance of the main and sub-chips without interrupting power or disassembling the circuit board, ensuring the usability of the circuit board assembly and the normal operation of the vehicle's infotainment system and vehicle. The automatic power switching function reduces manual intervention and improves the maintenance efficiency of the circuit board assembly.

[0064] Furthermore, the secondary chip and the circuit board can be connected in a detachable manner, which allows the secondary chip to be installed and removed without using special tools to disassemble the circuit board, reducing the risk of accidental damage to surrounding components during maintenance.

[0065] The circuit board assembly and vehicle provided in this application will now be described with reference to the accompanying drawings and specific embodiments.

[0066] Reference Figure 1 and Figure 2 This application provides a circuit board assembly, which may include a circuit board 100, a main chip 200, a secondary chip 300, and a power supply 400. Both the main chip 200 and the secondary chip 300 can be system-on-chips (SOCs). The power supply 400 can be a power supply chip.

[0067] The main chip 200 is fixed to the circuit board 100. The fixed installation of the main chip 200 means that the main chip 200 can form a semi-permanent connection with the circuit board 100 through soldering or bolting. This can be achieved using surface mount technology to ensure the reliability of the main chip in a vibration environment. This mounting method provides stronger connection stability between the main chip 200 and the circuit board 100, but the main chip 200 is not easily removed from the circuit board 100.

[0068] The secondary chip 300 is detachably connected to the circuit board 100. The detachable connection means that the secondary chip 300 and the circuit board 100 are electrically connected by mechanical plugging. Specifically, this can be achieved by using a slot and pin mating structure, with elastic contacts 110 provided in the slot to maintain contact stability.

[0069] Power supply 400 is located on circuit board 100 and electrically connected to main chip 200 and secondary chip 300. Power supply 400 is used to supply power to either main chip 200 or secondary chip 300. Power supply 400 refers to a circuit module with power switching function, which can be implemented using a multi-output power management chip. It automatically switches the power supply target by detecting the working status of main chip 200.

[0070] In some embodiments, the power supply 400 can monitor the working status of the main chip 200 and the sub-chip 300 in real time, so as to switch the power supply between the main chip 200 and the sub-chip 300 in a timely manner.

[0071] Specifically, when the main chip 200 malfunctions, the power supply 400 cuts off its power output and simultaneously supplies power to the secondary chip 300. The secondary chip 300 is connected to the circuit board 100 via a plug-in connection, allowing it to be directly removed and replaced during maintenance without disassembling the circuit board 100 or the main chip 200. The power supply 400 continuously monitors the operating status of both chips, and can switch the power supply path again once the main chip 200 recovers its function. The plug-in structure of the secondary chip 300 allows for multi-point contact between its pins and contacts 110, ensuring signal transmission integrity.

[0072] This application provides a circuit board assembly. The assembly includes a main chip 200 and a secondary chip 300, with a power supply 400 switching between them. When the main chip 200 fails, the power supply 400 cuts off the power output to the main chip 200 and simultaneously supplies power to the secondary chip 300. This allows for functional switching and maintenance of the main and secondary chips without interrupting power or disassembling the circuit board 100, ensuring the usability of the circuit board assembly and the normal operation of the vehicle's infotainment system and vehicle. The automatic switching function of the power supply 400 reduces manual intervention and improves the maintenance efficiency of the circuit board assembly.

[0073] Furthermore, the sub-chip 300 and the circuit board 100 can be connected in a detachable manner, which allows the sub-chip 300 to be installed and removed without using special tools to disassemble the circuit board 100, reducing the risk of accidental damage to surrounding components during maintenance.

[0074] Reference Figure 1 and Figure 2 In some embodiments, the circuit board assembly may further include an indicator light 700. The indicator light 700 is electrically connected to the sub-chip 300, and the indicator light 700 is used to emit green light when the sub-chip 300 is working, and to emit red light when the sub-chip 300 malfunctions.

[0075] The indicator light 700 is a light-emitting device used to display the operating status of the circuit. It can be implemented using dual-color LED beads, with its light color controlled by different voltages or signals. The electrical connection refers to achieving electrical conduction through wires or conductive lines on the circuit board 100. Specifically, the indicator light 700 can be connected to the detection signal output terminal of the sub-chip 300 by soldering or plugging. Green light emission means that when the sub-chip 300 is in normal working condition, the indicator light 700 activates its green light-emitting unit by receiving a specific level signal. Red light emission means that when the sub-chip 300 experiences a communication interruption or functional abnormality, the indicator light 700 triggers its red light-emitting unit by receiving a fault signal.

[0076] Specifically, the secondary chip 300 integrates a status detection module that continuously monitors its communication status and functional integrity. When the secondary chip 300 is working normally, the status detection module sends a low-level signal to the indicator light 700, driving the green light-emitting unit to turn on. When a communication interruption or hardware failure is detected, the status detection module switches to a high-level signal, triggering the red light-emitting unit to turn on. The indicator light 700 is directly integrated on the surface of the circuit board 100, and its power supply line shares the same power branch as the secondary chip 300. The status signal is isolated through a parallel resistor network.

[0077] This solution integrates a dual-color indicator light 700 on the circuit board 100, directly converting the status of the sub-chip 300 into a visual color signal, and achieving accurate indication of the fault status through dual-color switching.

[0078] Through the above technical solution, this application can reflect the operating status of the secondary chip 300 in real time. When the secondary chip 300 experiences communication failure or functional abnormality, a red light warning is immediately triggered, allowing maintenance personnel to quickly locate the fault without the need for specialized instruments. During normal operation of the secondary chip 300, a continuously lit green light verifies that the backup system is in standby and available state, avoiding redundant function failures due to misjudgment.

[0079] Reference Figure 1 and Figure 2 In some embodiments, the circuit board assembly may further include a first communication chip 800. The first communication chip 800 is disposed on the circuit board 100, and is controlled to be connected to the sub-chip 300. The first communication chip 800 is also used to be electrically connected to the screen assembly 10, and the screen assembly 10 controls the start and stop of the sub-chip 300 through the first communication chip 800.

[0080] The first communication chip 800 refers to a control module integrated on the circuit board 100 that has wired communication capabilities. Specifically, it can be implemented using a communication chip based on the CAN or LIN protocol, and is used to establish a signal transmission channel between the screen assembly 10 and the sub-chip 300. The screen assembly 10 refers to an electronic control screen fixedly installed inside the vehicle, which can send commands to the main chip 200, the sub-chip 300, and the first communication chip 800 via touch screen.

[0081] The circuit board assembly may also include a second communication chip 900 disposed on the circuit board 100. The second communication chip 900 is connected to the sub-chip 300 for control. The second communication chip 900 is used for wireless communication with the mobile terminal 20. The mobile terminal 20 can control the start and stop of the sub-chip 300 through the second communication chip 900.

[0082] The second communication chip 900 refers to a control module integrated on the circuit board 100 that has wireless communication capabilities. Specifically, it can be implemented using a Bluetooth or Wi-Fi communication chip, and is used to establish a wireless signal transmission channel between the mobile terminal 20 and the secondary chip 300. The mobile terminal 20 refers to a portable wireless electronic device, such as a mobile phone or tablet computer, capable of sending start / stop commands via the second communication chip 900 through a wireless communication path.

[0083] Specifically, the first communication chip 800 is connected to the screen assembly 10 via a wiring harness. Start / stop commands sent by the screen assembly 10 are transmitted to the sub-chip 300 via the first communication chip 800, thereby directly controlling its power supply state switching. The second communication chip 900 establishes a connection with the mobile terminal 20 via a wireless protocol. Start / stop commands sent by the mobile terminal 20 are transmitted to the second communication chip 900 via wireless signals, and then forwarded to the sub-chip 300 to control its power supply state switching. The two communication chips can exist independently or simultaneously on the circuit board 100, each corresponding to different control scenario requirements.

[0084] This solution integrates two communication chips, enabling the start / stop control of the secondary chip 300 to be implemented through fixed equipment or remotely operated through mobile devices, significantly improving the flexibility and adaptability of control.

[0085] Through the above technical solution, this application can support the screen component 10 to start and stop the sub-chip 300 through a wired communication path or the mobile terminal 20 through a wireless communication path, avoiding the problem of control failure due to a single communication path failure, while meeting the differentiated needs of control methods in different scenarios. For example, the chip state can be quickly switched through the mobile terminal 20 when the vehicle is under maintenance, or the screen component 10 can be used for stable control when the vehicle is in motion.

[0086] Reference Figure 1 , Figure 3 and Figure 4 In some embodiments, the circuit board assembly may further include a protective cover 500, which forms a first slot 510 with the circuit board 100.

[0087] The protective cover 500 refers to the shell structure covering the circuit board 100. It can be made of metal or plastic and is fixedly connected to the circuit board 100 by clips or screws. It is used to form the physical boundary of the first slot 510 and apply pressure to the sub-chip 300.

[0088] The first slot 510 refers to the space defined by the inner wall of the protective cover 500 and the surface of the circuit board 100. Specifically, different sizes of accommodating areas can be formed by adjusting the height and shape of the protective cover 500 to constrain the installation position of the sub-chip 300.

[0089] The sub-chip 300 has multiple first pins 320, and the circuit board 100 has multiple contacts 110 that mate with the first pins 320 in the area corresponding to the first slot 510. The sub-chip 300 is inserted into the first slot 510, and each contact 110 corresponds to one first pin 320. The first pin 320 is pressed against the corresponding contact 110 by the protective cover 500.

[0090] Contact 110 refers to a conductive area disposed on the surface of circuit board 100, which may be treated with gold plating or tin plating, and is used to form an electrical connection with the first pin 320 of sub-chip 300. The first pin 320 refers to a metal conductive component extending from the edge of sub-chip 300, which may be made of copper alloy material, and maintains contact pressure with contact 110 through elastic deformation.

[0091] Specifically, a gap of fixed width is formed between the bottom edge of the protective cover 500 and the circuit board 100, which constitutes the entrance to the first slot 510. When the first pin 320 of the sub-chip 300 is inserted into the first slot 510, it forms a one-to-one contact with the contact 110 on the circuit board 100. After the protective cover 500 is fixed, its inner wall applies vertical pressure to the upper surface of the sub-chip 300, forcing a stable elastic contact between the first pin 320 and the contact 110. This pressure is evenly distributed through the rigid structure of the protective cover 500, avoiding poor local contact.

[0092] Compared to existing technologies, chip replacement in existing technologies requires disassembling the casing and directly soldering it onto the circuit board 100, resulting in complex operations and easy damage to the solder pads. This solution, through the slot structure and the mechanical constraint of the protective cover 500, allows the replacement of the secondary chip 300 to be completed with only a plugging and unplugging action. At the same time, the clamping action of the protective cover 500 replaces the traditional soldering or screw fixing method, which maintains the reliability of electrical connection and avoids physical damage to the circuit board 100.

[0093] Through the above technical solution, this application achieves rapid assembly and disassembly of the sub-chip 300 without the need for soldering tools or disassembly of other components, significantly reducing the risk of human error. The continuous clamping force of the protective cover 500 on the sub-chip 300 ensures that the first pin 320 and the contact 110 maintain stable contact even under vibration, preventing signal interruption due to loosening. This structure is compatible with sub-chips 300 of different sizes; multiple models can be adapted simply by adjusting the slot size, expanding the applicability of maintenance scenarios.

[0094] Reference Figure 4 and Figure 5 In some embodiments, the circuit board assembly may further include a guide structure 600. The guide structure 600 is disposed on the side of the protective cover 500 facing the sub-chip 300, and the guide structure 600 is used to guide the sub-chip 300 along a first direction (e.g., Figure 4 (As shown in the Y direction) is inserted into the first slot 510.

[0095] The guide structure 600 refers to a physical limiting device installed on the inner wall of the protective cover 500. This can be implemented using a raised track or guide block, constraining the movement trajectory of the sub-chip 300 to ensure the uniqueness of the insertion path. The first direction refers to the axial movement trajectory of the sub-chip 300 to achieve electrical connection with the contact 110 of the circuit board 100. This can be implemented using a vertical insertion / removal direction or an inclined slide rail direction, limiting the single-degree-of-freedom movement to prevent lateral displacement between the first pin 320 and the contact 110.

[0096] Specifically, when the sub-chip 300 needs to be replaced, the operator brings the edge of the sub-chip 300 into contact with the physical limiting surface of the guide structure 600 and applies a pushing force along a preset first direction. The guide structure 600 restricts the sub-chip 300 in a second direction (e.g., through the constraint surfaces on both sides) Figure 5 The displacement in the X direction is only allowed to be linear along the first direction. As the sub-chip 300 is continuously inserted, the first pin 320 makes progressive contact with the contact 110 of the circuit board 100, and finally achieves a stable electrical connection under the pressing action of the protective cover 500.

[0097] refer to Figure 4 and Figure 6In some embodiments, as the sub-chip 300 slides into the first slot 510 along the first direction, the number of contacts between the first pin 320 and the contact 110 may change, and the different number of contacts between the first pin 320 and the contact 110 may cause the sub-chip 300 to perform different functions.

[0098] This solution uses mechanical limiters to forcibly constrain the movement trajectory of the chip, enabling the secondary chip 300 to automatically correct positional deviations during insertion and removal, ensuring precise alignment between the first pin 320 and the contact 110, eliminating the risk of positional deviations caused by manual operation, avoiding poor contact or hardware damage caused by incorrect installation angles, and shortening maintenance operation time.

[0099] Reference Figure 4 and Figure 5 In some embodiments, the guide structure 600 may include a first guide block 610 and a second guide block 620.

[0100] The first guide block 610 is disposed on the surface of the protective cover 500 facing the circuit board 100 and extends toward the circuit board 100.

[0101] The first guide block 610 refers to a protruding structure fixed on the surface of the protective cover 500 and extending toward the circuit board 100. It can be implemented by injection molding or metal stamping process and is used to limit the lateral displacement of the sub-chip 300 in the second direction.

[0102] The second guide block 620 is disposed on the surface of the protective cover 500 facing the circuit board 100, and the second guide block 620 and the first guide block 610 are along a second direction (e.g., Figure 5 The sub-chip 300 is arranged at intervals in the X direction. The first guide block 610 and the second guide block 620 are used to limit the displacement of the sub-chip 300 in the second direction and guide the sub-chip 300 to move along the first direction. The second direction is perpendicular to the first direction.

[0103] The second guide block 620 refers to a protruding structure that is parallel and spaced apart from the first guide block 610. It can be made using the same material and process as the first guide block 610 and is used to form a guide channel together with the first guide block 610. The first direction refers to the longitudinal movement direction of the sub-chip 300 inserted into the slot, and the second direction refers to the transverse direction perpendicular to the first direction.

[0104] Specifically, when the sub-chip 300 is inserted into the first slot 510 along the first direction, the first guide block 610 and the second guide block 620 are located on the lateral edge regions on both sides of the chip, respectively, to prevent the sub-chip 300 from shifting in the second direction through physical restraint on both sides. The spacing between the first guide block 610 and the second guide block 620 matches the lateral dimension of the sub-chip 300, so that the sub-chip 300 can only move along the first direction during insertion and cannot be displaced laterally. The extension height of the first guide block 610 and the second guide block 620 covers the entire chip insertion path, ensuring that the chip-sub-system-level chip is guided and constrained throughout the entire process from its initial position to full insertion.

[0105] This solution uses a simple layout of parallel first guide block 610 and second guide block 620 to form a guide channel of fixed width in the horizontal direction and provide an unobstructed insertion path in the vertical direction, which simplifies the structure and reduces the difficulty of alignment.

[0106] Through the above technical solution, this application can achieve accurate alignment and rapid installation of the sub-chip 300 in a low-cost manner, avoid the problem of poor contact of the contact 110 caused by chip misalignment, and at the same time reduce manual adjustment operations during installation and improve maintenance efficiency.

[0107] Reference Figure 4 In some embodiments, the protective cover 500 is a shielding cover used to shield external electromagnetic signals.

[0108] The shielding cover refers to a covering structure made of conductive material, specifically copper, aluminum, or galvanized steel. This shielding cover suppresses interference from external electromagnetic signals on the internal circuitry of the chip by absorbing or reflecting electromagnetic waves, ensuring the signal transmission stability of the sub-chip 300 in complex electromagnetic environments.

[0109] Specifically, the shield is configured to completely enclose the mounting area of ​​the sub-chip 300, forming a closed space between the shield 500 and the circuit board 100. When an external electromagnetic signal reaches the surface of the shield, the conductive material converts the electromagnetic energy into heat energy through the eddy current effect, while the remaining electromagnetic waves are reflected into the external space.

[0110] This solution uses a protective cover 500 with integrated electromagnetic shielding function to add an electromagnetic compatibility protection layer while maintaining the original mechanical protection performance, achieving anti-interference capability without the need to add additional shielding devices or filtering circuits.

[0111] Through the above technical solution, this application actively blocks external electromagnetic signals from interfering with the internal circuitry of the chip during the operation of the secondary chip 300, avoiding signal distortion, communication interruption or logic errors caused by electromagnetic interference. Especially in transient electromagnetic interference scenarios such as vehicle start-stop and high-voltage system charging and discharging, it ensures the signal integrity and functional reliability of the redundant chip when switching working states.

[0112] Reference Figure 6 In some embodiments, the protective cover 500 is provided with a plurality of heat dissipation holes 520, and the interior of the first slot 510 is connected to the outside through the heat dissipation holes 520.

[0113] Among them, the heat dissipation hole 520 refers to the through hole formed on the surface of the protective cover 500, which is used to establish a gas exchange channel between the internal space of the first slot 510 and the external environment. Specifically, it can be achieved by adopting a circular, square or array-type opening method, which promotes heat dissipation by increasing the heat dissipation surface area.

[0114] Specifically, when the protective cover 500 covers the sub-chip 300, it forms a relatively sealed first slot 510 structure. At this time, the heat dissipation hole 520 serves as the only communication channel, allowing the heat generated inside to dissipate outward through air convection. For example, when the sub-chip 300 is in operation, the heat generated in its heat-generating area is transferred to the circuit board 100 through the first pin 320. At the same time, the hot air accumulated inside the protective cover 500 is discharged through the heat dissipation hole 520, and external cold air enters through the heat dissipation hole 520 to form a circulating airflow, thereby reducing the operating temperature of the sub-chip 300.

[0115] This solution sets heat dissipation holes 520 on the protective cover 500, which maintains the protective function and improves the chip's heat dissipation capacity through passive heat dissipation, thus balancing the protection and heat dissipation requirements without the need for additional heat dissipation devices.

[0116] Through the above technical solution, this application can achieve heat exchange between the internal heat and the external environment through the heat dissipation hole 520 when the sub-chip 300 is working in the sealed first slot 510, so as to avoid the chip performance degradation or failure due to heat accumulation, while maintaining the physical protection of the protective cover 500 for the chip.

[0117] Reference Figure 7 In some embodiments, the sub-chip 300 may include an interconnected chip body 310 and a plurality of second pins 330. The circuit board 100 has a plurality of sockets, each socket corresponding to a second pin 330, and the second pin 330 is inserted into the socket by an interference fit.

[0118] The second pin 330 refers to a conductive connection component extending from the chip body 310, which can be made of copper alloy material by stamping, and is used to establish an electrical connection between the chip and the circuit board 100. The socket refers to a through-hole structure provided on the circuit board 100, the position of which corresponds to the spatial distribution of the second pin 330.

[0119] Specifically, the chip body 310 achieves physical connection and electrical conduction with the circuit board 100 through the second pin 330. During installation, the second pin 330 is directly pressed into the corresponding socket. Due to the interference fit design, the second pin 330 forms a tight contact with the inner wall of the socket, achieving mechanical fixation and circuit conduction without the need for soldering or screws. Therefore, the installation process of the sub-chip 300 only requires aligning it with the socket position and applying vertical pressure, while disassembly is achieved by pulling out the second pin 330 with reverse force. The operation process requires no auxiliary tools or complex procedures.

[0120] This solution, through the interference fit design between the second pin 330 and the socket, avoids the heat impact of the soldering process, eliminates the extra structural space required for screw fixing, and ensures connection stability.

[0121] Through the above technical solution, this application realizes the rapid installation and disassembly of the sub-chip 300 and the circuit board 100, reduces the maintenance difficulty caused by welding or mechanical fixation, reduces the possibility of human error, thereby improving chip replacement efficiency and extending the service life of the circuit board 100.

[0122] This application also provides a vehicle, which may include a body and a vehicle-mounted infotainment system. The infotainment system may include a housing, a screen assembly 10, and the aforementioned circuit board assembly. Both the screen assembly 10 and the circuit board assembly are disposed within the housing, and the screen assembly 10 is electrically connected to the circuit board assembly.

[0123] This application provides a vehicle in which the above-described circuit board assembly simplifies the disassembly and maintenance process of the vehicle's infotainment system, reduces the probability of damage to the system during disassembly and maintenance, and thus improves the user experience of the infotainment system and the vehicle.

[0124] In some embodiments, the vehicle may be a gasoline-powered vehicle, or it may be a new energy vehicle, such as a pure electric vehicle (PEV / BEV), a range-extended electric vehicle (REEV), a hybrid electric vehicle (HEV), or a fuel cell electric vehicle. The vehicle may also be any vehicle equipped with a battery.

[0125] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A circuit board assembly, characterized in that, include: Circuit board (100); The main chip (200) is fixed to the circuit board (100); A secondary chip (300) is detachably connected to the circuit board (100); A power supply (400) is disposed on the circuit board (100) and electrically connected to the main chip (200) and the sub-chip (300). The power supply (400) is used to supply power to the main chip (200) or the sub-chip (300).

2. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly further includes a protective cover (500), which, together with the circuit board (100), forms a first slot (510); The sub-chip (300) has a plurality of first pins (320), and the circuit board (100) has a plurality of contacts (110) that cooperate with the first pins (320) in the area corresponding to the first slot (510); The sub-chip (300) is inserted into the first slot (510), and each contact (110) corresponds to a first pin (320). The first pin (320) is pressed against the corresponding contact (110) under the action of the protective cover (500).

3. The circuit board assembly according to claim 2, characterized in that, The circuit board assembly also includes a guide structure (600); The guide structure (600) is disposed on the side of the protective cover (500) facing the sub-chip (300), and the guide structure (600) is used to guide the sub-chip (300) to be inserted into the first slot (510) along the first direction.

4. The circuit board assembly according to claim 3, characterized in that, The guide structure (600) includes: A first guide block (610) is disposed on the surface of the protective cover (500) facing the circuit board (100) and extends toward the circuit board (100); A second guide block (620) is disposed on the surface of the protective cover (500) facing the circuit board (100), and the second guide block (620) and the first guide block (610) are arranged at intervals along a second direction. The first guide block (610) and the second guide block (620) are used to restrict the displacement of the sub-chip (300) in the second direction and guide the sub-chip (300) to move along the first direction, the second direction being perpendicular to the first direction.

5. The circuit board assembly according to claim 4, characterized in that, The protective cover (500) has multiple heat dissipation holes (520), and the interior of the first slot (510) is connected to the outside through the heat dissipation holes (520).

6. The circuit board assembly according to claim 5, characterized in that, The protective cover (500) is a shielding cover, which is used to shield external electromagnetic signals.

7. The circuit board assembly according to claim 1, characterized in that, The sub-chip (300) includes interconnected chip bodies (310) and multiple second pins (330); The circuit board (100) has multiple sockets, each socket corresponding to a second pin (330), and the second pin (330) is inserted into the socket by an interference fit.

8. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes indicator lights (700); The indicator light (700) is electrically connected to the sub-chip (300). The indicator light (700) is used to emit green light when the sub-chip (300) is working, and the indicator light (700) is used to emit red light when the sub-chip (300) is malfunctioning.

9. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes: A first communication chip (800) is disposed on the circuit board (100). The first communication chip (800) is controlled to be connected to the sub-chip (300). The first communication chip (800) is used to be electrically connected to the screen assembly (10). The screen assembly (10) controls the start and stop of the sub-chip (300) through the first communication chip (800). And / or, A second communication chip (900) is disposed on the circuit board (100). The second communication chip (900) is connected to the sub-chip (300) for control. The second communication chip (900) is used for wireless communication with the mobile terminal (20). The mobile terminal (20) can control the start and stop of the sub-chip (300) through the second communication chip (900).

10. A vehicle, characterized in that, Includes a vehicle body and a vehicle infotainment system, the vehicle infotainment system including a housing, a screen assembly (10) and a circuit board assembly as described in any one of claims 1 to 9; Both the screen assembly (10) and the circuit board assembly are disposed within the housing, and the screen assembly (10) is electrically connected to the circuit board assembly.

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