A heat dissipation structure for a micro inverter

Abstract

This utility model relates to the field of heat dissipation structure technology, and more particularly to a heat dissipation structure for a micro inverter. A heat dissipation structure for a micro inverter includes a mounting plate, a placement component on the mounting plate, an inverter body placed on the placement component, a limiting component on the mounting plate for limiting and fixing the inverter body, and a heat dissipation component on the limiting component for dissipating heat from the inverter body. This utility model achieves internal gas circulation heat dissipation through the cooperation of an air pump and a semiconductor cooling chip, preventing the entry of outside air, effectively preventing the intrusion of dust, moisture, and other impurities, protecting electronic components, improving performance and service life. Simultaneously, the unique installation method eliminates the need for bolt fixing, making it convenient and quick, saving internal space of the inverter body, and facilitating subsequent maintenance.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, and in particular to a heat dissipation structure for micro inverters. Background Technology

[0002] As a key component in photovoltaic power generation systems, microinverters typically have a power output of no more than 1000 watts and feature module-level maximum power point tracking (MPPT) functionality. They are generally small in size and lightweight, making them easy to install and apply.

[0003] However, the heat dissipation structure design of some micro-inverters currently on the market has certain drawbacks. These heat dissipation structures are located inside the inverter, not only occupying a significant amount of valuable internal space but also causing considerable inconvenience for maintenance of the heat dissipation structure or the inverter itself. More importantly, these heat dissipation structures are directly connected to the outside air, drawing outside air into the inverter during operation. In this process, moisture, dust, and other impurities from the outside air can easily enter, damaging the electronic components inside the inverter and affecting its performance and lifespan. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the present invention provides a heat dissipation structure for micro inverters.

[0005] A heat dissipation structure for a micro inverter includes a mounting plate, a placement component, an inverter body, a limiting component, and a heat dissipation component. The mounting plate is provided with the placement component, and the inverter body is placed on the placement component. The mounting plate is provided with a limiting component for limiting and fixing the inverter body, and the limiting component is provided with a heat dissipation component for cooling the inverter body.

[0006] To further explain, the placement assembly includes a trapezoidal bracket, a U-shaped placement plate, and a limiting plate. The trapezoidal brackets are symmetrically fixedly connected to the upper side of the mounting plate, and the U-shaped placement plate is fixedly connected between the lower sides of the two trapezoidal brackets. The limiting plate is symmetrically fixedly connected to the front side of the U-shaped placement plate.

[0007] To further explain, the limiting assembly includes a mounting bracket, a ramp, guide rods, a screw, a sliding plate, a connecting pipe, and a fixing pipe. The mounting bracket is fixedly connected to the middle of the mounting plate, and the ramp is fixedly connected to the top of the mounting bracket. Guide rods are fixedly connected to both sides of the ramp, and a screw is rotatably connected to the middle of the ramp. A sliding plate is slidably arranged between the two guide rods. The screw passes through the sliding plate and is threaded into it. Connecting pipes are fixedly connected to both ends of the sliding plate, and fixing pipes are fixedly connected to the inverter body corresponding to the two connecting pipes.

[0008] To further explain, the heat dissipation assembly includes an air pump, an extraction pipe, an exhaust pipe, and a hollow tube. An air pump is installed on the underside of the mounting plate, and an extraction pipe is connected to the front of the air pump. The end of the extraction pipe away from the air pump is connected to a connecting pipe located on the right side. An exhaust pipe is connected to the left side of the air pump, and the end of the exhaust pipe away from the air pump is connected to a connecting pipe located on the left side. The middle part of the extraction pipe is spiral-shaped, and a hollow tube is fixedly installed in the middle of the spiral-shaped extraction pipe. A semiconductor cooling chip is embedded in the outer wall of the hollow tube, and the semiconductor cooling chip is attached to the inner side of the spiral-shaped extraction pipe.

[0009] To further explain, it also includes sealing rings; sealing rings are installed on the outer walls of both connecting pipes.

[0010] To further explain, it also includes a drying block, which is installed on the exhaust pipe.

[0011] The beneficial effects of this utility model are as follows: This utility model uses an air pump in conjunction with a semiconductor cooling chip to achieve gas circulation and heat dissipation inside the inverter, preventing outside air from entering, effectively preventing dust and moisture and other impurities from intruding, protecting electronic components, improving performance and service life. At the same time, the unique installation method does not require bolt fixing, which is convenient and quick, saves internal space of the inverter body, and facilitates subsequent maintenance. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0013] Figure 2 This is a three-dimensional structural diagram of the trapezoidal bracket, U-shaped placement plate, and limiting plate of this utility model.

[0014] Figure 3 This is a three-dimensional structural diagram of the inclined plate, guide rod, and screw of this utility model.

[0015] Figure 4 This is a three-dimensional structural diagram of the air pump, suction pipe, and exhaust pipe of this utility model.

[0016] The markings in the attached diagram are as follows: 1: Mounting plate, 2: Trapezoidal bracket, 21: U-shaped placement plate, 22: Limiting plate, 001: Inverter body, 31: Mounting bracket, 32: Inclined plate, 33: Guide rod, 34: Screw, 35: Sliding plate, 36: Connecting pipe, 37: Fixing pipe, 41: Air pump, 42: Suction pipe, 43: Exhaust pipe, 44: Hollow pipe, 5: Sealing ring, 6: Drying block. Detailed Implementation

[0017] The present invention will be further described below with reference to specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.

[0018] Example: A heat dissipation structure for a micro inverter, such as Figures 1-4 As shown, it includes a mounting plate 1, a placement component, an inverter body 001, a limiting component, and a heat dissipation component. The mounting plate 1 is provided with a placement component, on which the inverter body 001 is placed. The mounting plate 1 is provided with a limiting component for limiting and fixing the inverter body 001, and the limiting component is provided with a heat dissipation component for dissipating heat from the inverter body 001.

[0019] like Figure 1 and Figure 2 As shown, the placement assembly includes a trapezoidal bracket 2, a U-shaped placement plate 21, and a limiting plate 22. The trapezoidal bracket 2 is symmetrically welded and fixed on the upper side of the mounting plate 1. The U-shaped placement plate 21 is welded and fixed between the lower sides of the two trapezoidal brackets 2. The limiting plate 22 is symmetrically welded and fixed on the front side of the U-shaped placement plate 21.

[0020] like Figure 1 , Figure 2 and Figure 3 As shown, the limiting assembly includes a mounting bracket 31, an inclined plate 32, a guide rod 33, a screw 34, a sliding plate 35, a connecting pipe 36, and a fixing pipe 37. The mounting bracket 31 is welded and fixed in the middle of the mounting plate 1. The inclined plate 32 is welded and fixed in the top of the mounting bracket 31. The guide rods 33 are welded and fixed in the left and right sides of the inclined plate 32. The screw 34 is rotatably connected in the middle of the inclined plate 32. The sliding plate 35 is slidably arranged between the two guide rods 33. The screw 34 passes through the sliding plate 35 and is threadedly engaged with it. The connecting pipes 36 are welded and fixed in the left and right ends of the sliding plate 35. The fixing pipe 37 is integrally formed and fixed in the inverter body 001 corresponding to the two connecting pipes 36. The fixing pipe 37 is connected to the internal space of the inverter body 001.

[0021] like Figure 1 and Figure 4 As shown, the heat dissipation assembly includes an air pump 41, an extraction pipe 42, an exhaust pipe 43, and a hollow tube 44. The air pump 41 is bolted to the lower side of the mounting plate 1. The extraction pipe 42 is connected to the front of the air pump 41. The end of the extraction pipe 42 away from the air pump 41 is connected to the connecting pipe 36 located on the right side. The exhaust pipe 43 is connected to the left side of the air pump 41. The end of the exhaust pipe 43 away from the air pump 41 is connected to the connecting pipe 36 located on the left side. The middle part of the extraction pipe 42 is spiral-shaped. A hollow tube 44 is bonded and fixed in the middle of the spiral extraction pipe 42. A semiconductor cooling chip is embedded in the outer wall of the hollow tube 44. The semiconductor cooling chip is attached to the inner side of the spiral extraction pipe 42 to achieve heat exchange with the gas inside the extraction pipe 42.

[0022] In use, the operator first aligns the back of the inverter body 001 with the front of the trapezoidal bracket 2, then inserts it downwards into the space between the limiting plate 22 and the trapezoidal bracket 2, ensuring the bottom of the inverter body 001 aligns with the U-shaped placement plate 21. Next, the screw 34 is turned; as the screw 34 rotates, it causes the sliding plate 35 to move backward under the guidance of the guide rod 33, thereby causing the two connecting pipes 36 to be inserted into the adjacent fixing pipes 37, thus achieving the limiting and fixing of the micro-inverter. This installation method eliminates the need for bolts or other means to fix the inverter body 001, making it convenient and quick. When the micro inverter is working, the operator starts the air pump 41 and powers the semiconductor cooling chip installed on the hollow tube 44. When the air pump 41 is working, it will extract the hot air inside the inverter body 001 through the suction pipe 42. When the hot air passes through the spirally arranged suction pipe 42, it will exchange heat with the semiconductor cooling chip, thereby cooling down. The cooled gas is then injected into the inverter body 001 by the air pump 41 through the exhaust pipe 43. In this way, the gas inside the inverter body 001 is circulated for heat dissipation, while preventing outside air from entering the inverter body 001 and preventing the introduction of dust or moisture.

[0023] like Figure 4 As shown, it also includes a sealing ring 5, and a sealing ring 5 is embedded on the outer wall of both connecting pipes 36.

[0024] By setting the sealing ring 5, the airtightness between the connecting pipe 36 and the fixed pipe 37 is enhanced, further preventing external moisture from entering the inverter body 001.

[0025] like Figure 4 As shown, it also includes a drying block 6. The exhaust pipe 43 is equipped with a drying block 6. By setting the drying block 6, when the gas injected into the inverter body 001 through the exhaust pipe 43 passes through the drying block 6, the water vapor that it may carry will be absorbed by the drying block 6, thereby ensuring that the gas injected into the inverter body 001 is dry gas.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that variations may be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure for a micro-inverter, characterized by: It includes a mounting plate (1), a placement component, an inverter body (001), a limiting component, and a heat dissipation component. The mounting plate (1) is provided with a placement component, on which the inverter body (001) is placed. The mounting plate (1) is provided with a limiting component for limiting and fixing the inverter body (001), and the limiting component is provided with a heat dissipation component for dissipating heat from the inverter body (001).

2. The heat dissipation structure for micro-inverter according to claim 1, characterized in that: The placement assembly includes a trapezoidal bracket (2), a U-shaped placement plate (21), and a limiting plate (22). The upper side of the mounting plate (1) is symmetrically and fixedly connected to the trapezoidal bracket (2). The lower side of the two trapezoidal brackets (2) is fixedly connected to the U-shaped placement plate (21). The front side of the U-shaped placement plate (21) is symmetrically and fixedly connected to the limiting plate (22).

3. The heat dissipation structure for a micro inverter according to claim 2, characterized in that: The limiting assembly includes a mounting bracket (31), a ramp (32), a guide rod (33), a screw (34), a sliding plate (35), a connecting pipe (36), and a fixing pipe (37). The mounting bracket (31) is fixedly connected to the middle of the mounting plate (1). The ramp (32) is fixedly connected to the top of the mounting bracket (31). The guide rods (33) are fixedly connected to both sides of the ramp (32). The screw (34) is rotatably connected to the middle of the ramp (32). The sliding plate (35) is slidably arranged between the two guide rods (33). The screw (34) passes through the sliding plate (35) and is threadedly engaged with it. The connecting pipes (36) are fixedly connected to both ends of the sliding plate (35). The fixing pipes (37) are fixedly connected to the inverter body (001) corresponding to the two connecting pipes (36).

4. The heat dissipation structure for a micro inverter according to claim 3, characterized in that: The heat dissipation assembly includes an air pump (41), an air extraction pipe (42), an exhaust pipe (43), and a hollow tube (44). An air pump (41) is installed on the lower side of the mounting plate (1). An air extraction pipe (42) is connected to the front side of the air pump (41). The end of the air extraction pipe (42) away from the air pump (41) is connected to a connecting pipe (36) located on the right side. An exhaust pipe (43) is connected to the left side of the air pump (41). The end of the exhaust pipe (43) away from the air pump (41) is connected to a connecting pipe (36) located on the left side. The middle part of the air extraction pipe (42) is spiral-shaped. A hollow tube (44) is fixedly installed in the middle part of the spiral-shaped air extraction pipe (42). A semiconductor cooling chip is embedded in the outer wall of the hollow tube (44). The semiconductor cooling chip is attached to the inner side of the spiral-shaped air extraction pipe (42).

5. A heat dissipation structure for a micro inverter according to claim 4, characterized in that: It also includes a sealing ring (5), and a sealing ring (5) is provided on the outer wall of both connecting pipes (36).

6. A heat dissipation structure for a micro inverter according to claim 5, characterized in that: It also includes a drying block (6), which is installed on the exhaust pipe (43).

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