A bernoulli arm

Abstract

The utility model provides a kind of Bernoulli arm, including intermediate arm, C type support arm, multiple jet air holes, sensing component and a pair of pressure sensors, wherein, C type support arm includes the middle part being connected with intermediate arm and two branch parts extending in the direction away from intermediate arm, multiple jet air holes are interval arranged in the bottom surface of branch part, and at least one support block fixed in the bottom surface of branch part is provided between every two jet air holes;Sensing component includes first proximity sensing sensor and second proximity sensing sensor, first proximity sensing sensor is fixed in the bottom surface of middle part, second proximity sensing sensor is fixed in the bottom surface of the end of branch part away from intermediate arm, a pair of pressure sensors are respectively arranged in the end of two branch parts away from intermediate arm and interval preset distance between jet air hole, and the distance between every pressure sensor and intermediate arm is greater than half of branch length.The Bernoulli arm of the utility model can find the adsorption anomaly of wafer in time, to avoid wafer drop and breakage.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor integrated circuit manufacturing technology and relates to a Bernoulli arm. Background Technology

[0002] In the semiconductor device manufacturing process, high-precision wafer transfer is one of the key steps to ensure production yield and efficiency. To avoid scratches, contamination, and other damage to the wafer surface during transfer, non-contact adsorption devices are widely used in wafer transfer scenarios. Among them, the Bernoulli arm, based on the Bernoulli effect, has become the mainstream choice due to its non-physical contact suspension adsorption characteristics.

[0003] However, in actual production, wafers are prone to localized or overall warping due to process characteristics. This warping disrupts the uniformity of the gap between the wafer and the arm's adsorption surface. Existing Bernoulli arms only have a set of proximity sensors at the base of the arm. The function of these sensors is limited to detecting the presence of a wafer in the base region and cannot monitor the adsorption status of the wafer's tip. When the wafer detaches at the tip due to warping, its base may still be within the sensor's detection range, causing the system to fail to recognize the abnormal detachment and issue an alarm.

[0004] Therefore, how to provide a Bernoulli arm to detect wafer adsorption anomalies in a timely manner, thereby preventing the wafer from falling and breaking, has become an important problem that urgently needs to be solved by those skilled in the art.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a Bernoulli arm to solve the problem that the prior art cannot detect wafer detachment due to warping.

[0007] To achieve the above and other related objectives, this utility model provides a Bernoulli arm comprising:

[0008] Intermediate arm;

[0009] A C-shaped support arm includes a central section connected to the intermediate arm and two branches extending away from the intermediate arm, the two branches being symmetrically distributed on both sides of the central axis of the intermediate arm;

[0010] Multiple injection holes are spaced apart on the bottom surface of the support, and at least one support block fixed to the bottom surface of the support is provided between every two injection holes.

[0011] The sensing component includes a first proximity sensor and a second proximity sensor. The first proximity sensor is fixed to the bottom surface of the middle part, and the second proximity sensor is fixed to the bottom surface of the support away from the middle arm. The first proximity sensor and the second proximity sensor are spaced at a predetermined distance from the injection port.

[0012] A pair of pressure sensors are respectively disposed at the ends of the two supports away from the intermediate arm and at a predetermined distance from the injection port, and the distance between each pressure sensor and the intermediate arm is greater than half the length of the support.

[0013] Optionally, it also includes a transmission air passage, which includes a main air passage disposed inside the intermediate arm and branch air passages disposed inside the two branches, the branch air passages being connected to the plurality of injection ports.

[0014] Optionally, the support block has a cushioning pad on the side away from the C-shaped support arm.

[0015] Optionally, the intermediate arm has multiple fixing holes.

[0016] Optionally, it also includes an air supply device, which is externally connected to the side of the intermediate arm away from the C-shaped support arm to blow air into the transmission air passage.

[0017] Optionally, the height of the support block ranges from 5 to 50 μm.

[0018] Optionally, the height of the pressure sensor is the same as the height of the support block.

[0019] Optionally, the heights of both the first proximity sensor and the second proximity sensor are less than the height of the support block.

[0020] Optionally, the maximum spacing between the two branches is less than the diameter of the wafer to be adsorbed.

[0021] Optionally, the cross-sectional shape of the support block includes a circle, a rectangle, an ellipse, and a trapezoid.

[0022] As described above, the Bernoulli arm of this invention includes a central arm, a C-shaped support arm, multiple air jets, a sensing component, and a pair of pressure sensors. The C-shaped support arm includes a central section connected to the central arm and two branches extending away from the central arm. The two branches are symmetrically distributed on both sides of the central axis of the central arm. Multiple air jets are spaced apart on the bottom surface of the branches, and at least one support block fixed to the bottom surface of the branch is provided between every two air jets. The sensing component includes a first proximity sensor and a second proximity sensor. The first proximity sensor is fixed to the bottom surface of the central section, and the second proximity sensor is fixed to the bottom surface of the branch away from the central arm. The first and second proximity sensors are spaced a predetermined distance from the air jets. Pressure sensors are respectively located at the ends of the two branches away from the central arm and spaced a predetermined distance from the air jets. The distance between each pressure sensor and the central arm is greater than half the length of the branch. By adding the sensing component and pressure sensors, the Bernoulli arm of this invention can promptly detect abnormal wafer adsorption, thereby preventing the wafer from falling and breaking. Attached Figure Description

[0023] Figure 1 The image shown is a bottom view of the Bernoulli arm structure of this utility model.

[0024] Figure 2 The diagram shown illustrates the working principle of the Bernoulli arm structure of this invention.

[0025] Figure 3 The diagram shows the working state of the Bernoulli arm structure of this utility model.

[0026] Figure 4 Displayed as Figure 3 Cross-sectional view along the PP' direction.

[0027] Explanation of reference numerals in the attached figures

[0028] 1. Intermediate arm

[0029] 2nd Branch

[0030] 3. Injection port

[0031] 4 support blocks

[0032] 5. Sensing components

[0033] 501 First Proximity Sensor

[0034] 502 Second Proximity Sensor

[0035] 6. Pressure sensor

[0036] Distance between L1 pressure sensor and intermediate arm

[0037] Length of L2 branch Detailed Implementation

[0038] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0039] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0040] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0041] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0042] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more layers in between.

[0043] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0044] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0045] Please see Figure 1 The image shows a Bernoulli arm according to this invention, comprising a central arm 1, a C-shaped support arm, multiple air jets 3, a sensing assembly, and a pair of pressure sensors 6. The C-shaped support arm includes a central section connected to the central arm 1 and two branches 2 extending away from the central arm 1. The two branches 2 are symmetrically distributed on both sides of the central axis of the central arm 1. The multiple air jets 3 are spaced apart on the bottom surface of the branches 2, and at least one support block 4 fixed to the bottom surface of the branch 2 is provided between every two air jets 3. The sensing assembly includes a first proximity sensor 501 and a second proximity sensor 501. The sensor 502 includes a first proximity sensor 501 fixed to the bottom surface of the middle part, a second proximity sensor 502 fixed to the bottom surface of the support 2 away from the intermediate arm 1, and the first proximity sensor 501 and the second proximity sensor 502 are spaced apart from the injection port 3 by a predetermined distance. The pressure sensors 6 are respectively disposed at the two ends of the support 2 away from the intermediate arm 1 and spaced apart from the injection port 3 by a predetermined distance. The distance L1 between each pressure sensor 6 and the intermediate arm 1 is greater than half the length L2 of the support 2.

[0046] Please see Figure 2 The adsorption principle of this Bernoulli arm is to inject high-pressure gas through blowing points on its adsorption surface, causing the airflow between the arm's adsorption surface and the wafer to form a gas film of a specific thickness. According to the Bernoulli effect, an increase in the airflow velocity within the gas film leads to a decrease in pressure in the gas film region. The pressure difference between the gas film and atmospheric pressure is used to achieve the adsorption and suspension of the wafer.

[0047] For details, please refer to Figure 3 and Figure 4 When the Bernoulli arm is working, the wafer ( Figure 3 and Figure 4 (As shown by the dashed line A) is located directly below the branch 2. Figure 3To better demonstrate the structure, the bottom surface of the Bernoulli arm is facing upwards. During actual operation, the side containing the injection port 3 faces downwards, used to inject high-speed gas onto the wafer. When the wafer warps, the first proximity sensor 501 can sense the adsorption state at the rear end of the arm in real time, and the first proximity sensor 501 can sense the adsorption state at the front end of the arm in real time. If the adsorption state of the wafer changes at either end, an anomaly can be detected promptly, and an alarm can be triggered to notify the operator, thereby preventing the wafer from falling and breaking. Furthermore, when the wafer is normally adsorbed, the air pressure of the Bernoulli arm remains stable. The pressure sensor 6 provides real-time feedback of the measured pressure value. When the pressure of the Bernoulli arm changes, the resulting pressure changes accordingly. The pressure sensor 6, through pressure changes, can reflect the adsorption effect of the Bernoulli arm, further detecting the adsorption state of the wafer, promptly detecting adsorption anomalies, improving equipment anomaly detection and error prevention, and ensuring the stability of machine production.

[0048] As an example, it also includes a transmission air passage, which includes a main air passage disposed inside the intermediate arm 1 and branch air passages disposed inside the two branches 2, the branch air passages being connected to the plurality of injection ports 3.

[0049] As an example, the side of the support block 4 away from the C-shaped support arm is provided with a buffer pad to prevent the wafer from being damaged when it collides with the support block 4.

[0050] As an example, the intermediate arm 1 has multiple fixing holes for fixing the Bernoulli arm to the machine platform for operation.

[0051] As an example, it also includes an air supply device, which is externally connected to the side of the intermediate arm 1 away from the C-shaped support arm to blow air into the transmission air passage, and then transmits it to the jet air hole 3 to jet airflow onto the wafer.

[0052] As an example, the height of the support block 4 is in the range of 5 to 50 μm, which prevents the wafer from colliding with the bottom surface of the support 2 and protects the wafer.

[0053] For example, please see again Figure 4 The height of the pressure sensor 6 is the same as the height of the support block 4. In other embodiments, the height of the pressure sensor 6 may be lower than the height of the support block 4.

[0054] As an example, the heights of the first proximity sensor 501 and the second proximity sensor 502 are both less than the height of the support block 4.

[0055] As an example, the maximum distance between the two branches 2 is less than the diameter of the wafer to be adsorbed, so as to ensure that the airflow blown out by the jet hole 3 is located on the surface of the wafer.

[0056] As an example, the cross-sectional shape of the support block 4 includes circular, rectangular, elliptical, and trapezoidal shapes.

[0057] In summary, the Bernoulli arm of this invention includes a central arm, a C-shaped support arm, multiple air jets, a sensing component, and a pair of pressure sensors. The C-shaped support arm comprises a central section connected to the central arm and two branches extending away from the central arm. These two branches are symmetrically distributed on both sides of the central axis of the central arm. Multiple air jets are spaced apart on the bottom surface of the branches, with at least one support block fixed to the bottom surface of each branch between every two air jets. The sensing component includes a first proximity sensor and a second proximity sensor. The first proximity sensor is fixed to the bottom surface of the central section, and the second proximity sensor is fixed to the bottom surface of the branch at the end away from the central arm. The first and second proximity sensors are spaced a predetermined distance from the air jets. Pressure sensors are respectively located at the ends of the two branches away from the central arm and spaced a predetermined distance from the air jets. The distance between each pressure sensor and the central arm is greater than half the length of the branch. By adding the sensing component and pressure sensors, the Bernoulli arm of this invention can promptly detect abnormal wafer adsorption, thereby preventing the wafer from falling and breaking. Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0058] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A Bernoulli arm, characterized in that, include: Intermediate arm; A C-shaped support arm includes a central section connected to the intermediate arm and two branches extending away from the intermediate arm, the two branches being symmetrically distributed on both sides of the central axis of the intermediate arm; Multiple injection holes are spaced apart on the bottom surface of the support, and at least one support block fixed to the bottom surface of the support is provided between every two injection holes. The sensing component includes a first proximity sensor and a second proximity sensor. The first proximity sensor is fixed to the bottom surface of the middle part, and the second proximity sensor is fixed to the bottom surface of the support away from the middle arm. The first proximity sensor and the second proximity sensor are spaced at a predetermined distance from the injection port. A pair of pressure sensors are respectively disposed at the ends of the two supports away from the intermediate arm and at a predetermined distance from the injection port, and the distance between each pressure sensor and the intermediate arm is greater than half the length of the support.

2. The Bernoulli arm according to claim 1, characterized in that: It also includes a transmission air passage, which includes a main air passage disposed inside the intermediate arm and branch air passages disposed inside the two branches, the branch air passages being connected to the plurality of injection air holes.

3. The Bernoulli arm according to claim 2, characterized in that: It also includes an air supply device, which is externally connected to the side of the intermediate arm away from the C-shaped support arm to blow air into the transmission air passage.

4. The Bernoulli arm according to claim 1, characterized in that: The support block has a buffer pad on the side away from the C-shaped support arm.

5. The Bernoulli arm according to claim 1, characterized in that: The intermediate arm has multiple fixing holes.

6. The Bernoulli arm according to claim 1, characterized in that: The height range of the support block is 5~50 µm.

7. The Bernoulli arm according to claim 1, characterized in that: The height of the pressure sensor is the same as the height of the support block.

8. The Bernoulli arm according to claim 1, characterized in that: The heights of both the first proximity sensor and the second proximity sensor are less than the height of the support block.

9. The Bernoulli arm according to claim 1, characterized in that: The maximum distance between the two branches is less than the diameter of the wafer to be adsorbed.

10. The Bernoulli arm according to claim 1, characterized in that: The cross-sectional shape of the support block includes circular, rectangular, elliptical, and trapezoidal shapes.

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