Anti-vibration micro-led keyboard backlight module

Abstract

The utility model discloses an anti -vibration's MicroLED keyboard back light module, substrate layer has the recess of matrix type distribution, microLED chip is embedded in recess, and is fixed in the bottom of recess structure through conductive glue, the depth of recess is greater than the thickness of microLED chip, elastic buffer structure covers substrate layer surface and recess lateral wall, and the side and bottom non -electrode area of microLED chip are covered, and elastic buffer structure is made of silica gel layer and nanometer aerogel layer compound, and the light -transmitting protective layer is attached on the top of elastic buffer structure, and its lower surface is equipped with the hemispherical optical lens corresponding with microLED chip position. The three -level protection is formed by combining shock -absorbing support foot, silica gel -nanometer aerogel composite elastic buffer structure and spiral titanium nickel alloy flexible connecting column, can absorb " high -frequency micro -seismic -low -frequency big earthquake " full -band vibration, and cooperate recess 70 degree -85 degree angle and sawtooth pattern, effectively avoid the chip damage, solve traditional module vibration after the problem of brightness attenuation.

Description

Technical Field

[0001] This utility model relates to the field of keyboard technology, specifically to a vibration-resistant MicroLED keyboard backlight module. Background Technology

[0002] Existing MicroLED keyboard backlight modules suffer from numerous technical challenges in practical applications. As brittle semiconductor devices, MicroLED chips are extremely sensitive to mechanical vibration. Traditional modules often employ simple, fixed structures lacking targeted shock absorption designs. When the keyboard moves, the desktop vibrates, or it is accidentally dropped, the chip is prone to electrode breakage and encapsulation detachment due to impact, leading to brightness decay or even failure. Furthermore, existing modules exhibit poor optical performance; MicroLED chips suffer from severe light diffusion and lack efficient light-gathering and homogenizing structures, easily resulting in insufficient backlight brightness or uneven light spots. Utility Model Content

[0003] In order to overcome the shortcomings of existing technical solutions, this utility model provides a vibration-resistant MicroLED keyboard backlight module, which can effectively solve the problems mentioned in the background art.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A shock-resistant MicroLED keyboard backlight module, comprising:

[0006] The substrate layer has a matrix-distributed groove;

[0007] A MicroLED chip is embedded in the groove and fixed to the bottom of the groove structure by conductive adhesive. The depth of the groove is greater than the thickness of the MicroLED chip.

[0008] An elastic buffer structure is provided, covering the surface of the substrate layer and the sidewalls of the groove, and enclosing the side and bottom non-electrode areas of the MicroLED chip. The elastic buffer structure is composed of a silicone layer and a nano-aerogel layer.

[0009] A light-transmitting protective layer is attached to the upper part of the elastic buffer structure, and a hemispherical optical lens corresponding to the position of the MicroLED chip is provided on its lower surface;

[0010] A metal shielding layer is disposed above the light-transmitting protective layer and is mechanically connected to the substrate layer through flexible connecting pillars. The flexible connecting pillars are in the form of a helical spring structure. The flexible connecting pillars include an upper connecting ring, a lower connecting ring, and a helical titanium-nickel alloy wire. The lower connecting ring is welded to the edge of the substrate layer, and the upper connecting ring is riveted to the four corners of the metal shielding layer.

[0011] As a further description of the above technical solution, the sidewall of the groove is inclined at an angle of 70°-85° to the horizontal plane, and the surface of the sidewall is provided with a serrated buffer texture.

[0012] As a further description of the above technical solution, the interior of the silicone layer is uniformly distributed with closed-cell bubbles with a pore size of 10-50μm, and the closed-cell bubbles are filled with inert gas.

[0013] As a further description of the above technical solution, a scattering particle layer is provided between the light-transmitting protective layer and the elastic buffer structure. The scattering particle layer is formed by mixing and curing titanium dioxide particles with a particle size of 2-8μm with transparent resin, and has a thickness of 20-50μm.

[0014] As a further description of the above technical solution, a thermally conductive graphite sheet is provided below the metal shielding layer, and the thermally conductive graphite sheet is bonded to the light-transmitting protective layer through a viscoelastic adhesive layer.

[0015] As a further description of the above technical solution, the bottom of the substrate layer is provided with a shock-absorbing support foot, the shock-absorbing support foot is an inverted T-shaped structure, the vertical part of the shock-absorbing support foot is embedded in the substrate layer, and the horizontal part of the shock-absorbing support foot extends out of the edge of the substrate and is covered with a polyurethane buffer pad.

[0016] As a further description of the above technical solution, the surface of the metal shielding layer is provided with a matrix of heat dissipation holes, the diameter of which is 0.1-0.3mm, and the axis of each hole is staggered with the MicroLED chip below.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] The present invention discloses a vibration-resistant MicroLED keyboard backlight module, which has at least one of the following beneficial effects during use:

[0019] A three-tiered protection system, comprised of inverted T-shaped polyurethane shock-absorbing support feet, a silicone-nano-aerogel composite elastic buffer structure, and spiral titanium-nickel alloy flexible connecting columns, absorbs vibrations across the entire frequency range, from high-frequency micro-vibrations to low-frequency large-vibrations. Combined with a 70°-85° inclination angle and serrated texture, it effectively prevents damage to the MicroLED chip and solves the brightness attenuation problem caused by vibration in traditional modules. Excellent optical performance: The hemispherical lens of the light-transmitting protective layer focuses light, while the titanium dioxide scattering particle layer evens out the light, achieving a light utilization rate of ≥85%, improving insufficient brightness and uneven light spots, and adapting to high backlight requirements. Reliable heat dissipation and shielding: Thermally conductive graphite sheets combined with staggered matrix heat dissipation holes efficiently control temperature and extend chip lifespan; the metal shielding layer ensures electromagnetic compatibility and prevents internal and external electromagnetic interference. Meanwhile, detailed designs such as closed-cell silicone bubbles enhance long-term stability, making the overall structure durable, reducing maintenance costs, and adaptable to various keyboard types. Attached Figure Description

[0020] Figure 1 This is an exploded view of the overall structure of a vibration-resistant MicroLED keyboard backlight module according to this utility model.

[0021] Figure 2 This is a partial side view of the vibration-resistant MicroLED keyboard backlight module of this utility model.

[0022] Figure 3 This is a partial perspective structural diagram of a vibration-resistant MicroLED keyboard backlight module according to this utility model.

[0023] Figure 4 This utility model Figure 3 Schematic diagram of part A in the middle.

[0024] Numbering on the map:

[0025] 1. Substrate layer; 101. MicroLED chip; 102. Flexible connecting post; 103. Upper connecting ring; 104. Spiral titanium-nickel alloy wire; 105. Lower connecting ring; 106. Shock-absorbing support foot; 2. Metal shielding layer; 201. Matrix heat dissipation holes; 202. Thermally conductive graphite sheet; 3. Groove; 301. Elastic buffer structure; 302. Light-transmitting protective layer; 303. Silicone layer; 304. Nano aerogel layer. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] like Figure 1-4 As shown, this utility model provides a vibration-resistant MicroLED keyboard backlight module, comprising:

[0028] The substrate layer 1 has a matrix of grooves 3;

[0029] The MicroLED chip 101 is embedded in the groove 3 and fixed to the bottom of the groove 3 structure by conductive adhesive. The depth of the groove 3 is greater than the thickness of the MicroLED chip 101.

[0030] The depth of the matrix groove 3 in the substrate layer 1 is greater than the thickness of the MicroLED chip 101, forming a "receiving cavity" to prevent the upper structure from squeezing the chip during vibration. The sidewall of the groove 3 is designed with an inclination angle of 70°-85° (to reduce the shear force of the sidewall on the elastic buffer structure 301 during vibration), and the serrated buffer texture on the surface can increase the contact area between the elastic buffer structure 301 and the sidewall, disperse the local impact force, and at the same time extend the transmission path of vibration energy to further dissipate energy.

[0031] An elastic buffer structure 301 covers the surface of the substrate layer 1 and the sidewall of the groove 3, and encapsulates the side and bottom non-electrode areas of the MicroLED chip 101. The elastic buffer structure 301 is composed of a silicone layer 303 and a nano-aerogel layer 304.

[0032] The elastic buffer structure 301 covering the substrate layer 1 and the non-electrode areas on the sides / bottom of the chip is composed of a silicone layer 303 and a nano-aerogel layer 304.

[0033] The silicone layer 303 has 10-50μm closed-cell air bubbles (filled with inert gas) evenly distributed inside. The high elasticity of silicone absorbs high-frequency small-amplitude vibrations, and the closed-cell air bubbles can further enhance the deformation ability (the inert gas is stable and prevents the air bubbles from breaking or absorbing water, which would lead to elasticity attenuation).

[0034] Nano-aerogels possess a porous structure (high porosity, low density), enabling them to efficiently absorb low-frequency, high-amplitude vibration energy without affecting light transmittance (suitable for backlighting requirements). The combination of these two materials can cover the entire vibration spectrum from high-frequency micro-vibrations to low-frequency large-amplitude vibrations, preventing chip electrode breakage or encapsulation detachment.

[0035] A light-transmitting protective layer 302 is attached to the upper part of the elastic buffer structure 301, and its lower surface is provided with a hemispherical optical lens corresponding to the position of the MicroLED chip 101.

[0036] MicroLED chip 101 is embedded in groove 3, obtaining electrical energy and emitting light through conductive adhesive (the conductive adhesive simultaneously performs the dual functions of "fixation and conduction," simplifying the structure). The depth of groove 3 is greater than the thickness of the chip, ensuring that the chip's light-emitting surface is unobstructed. The hemispherical optical lens on the lower surface of the light-transmitting protective layer 302 (corresponding one-to-one with the chip position) can converge the divergent light emitted by the chip into directional light, improving local brightness (avoiding light energy waste) and adapting to the local backlighting requirements of keyboard keys. The scattering particle layer (2-8μm titanium dioxide particles + transparent resin, 20-50μm thick) between the light-transmitting protective layer 302 and the elastic buffer structure 301 can further scatter the directional light converged by the lens, breaking the directionality of the light and making the backlight more evenly distributed on the keyboard surface (avoiding "overly bright spots" or "dark areas"), improving the visual experience. The light-transmitting protective layer 302 uses a high light-transmitting material (such as polycarbonate) to ensure minimal light loss; the matrix heat dissipation holes 201 (0.1-0.3mm in diameter) of the metal shielding layer 2 adopt a "misaligned arrangement with the chip" design, which neither blocks the chip's light-emitting path nor obstructs heat dissipation.

[0037] A metal shielding layer 2 is disposed above the light-transmitting protective layer 302 and is mechanically connected to the substrate layer 1 via a flexible connecting post 102. The flexible connecting post 102 has a helical spring structure and includes an upper connecting ring 103, a lower connecting ring 105, and a helical titanium-nickel alloy wire 104. The lower connecting ring 105 is welded to the edge of the substrate layer 1, and the upper connecting ring 103 is riveted to the four corners of the metal shielding layer 2.

[0038] The metal shielding layer 2 can reflect or absorb external electromagnetic waves to avoid interfering with the power supply signal of the MicroLED chip 101 (preventing flickering), while blocking the electromagnetic radiation generated inside the module (such as conductive adhesive and chip circuit) from spreading outward, thus satisfying the electromagnetic compatibility of electronic devices.

[0039] The metal shielding layer 2 and the substrate layer 1 are mechanically connected by flexible connecting posts 102 (titanium-nickel alloy wire + upper connecting ring 103 + lower connecting ring 105) of a helical spring structure. The helical structure can deform freely along the axial (up and down) and radial (left and right) directions, absorbing the tensile / compressive / torsional vibrations of the entire module. The titanium-nickel alloy has a shape memory effect, which allows it to recover its initial shape after vibration, ensuring structural stability. The lower connecting ring 105 is welded to the edge of the substrate (for secure fixation), and the upper connecting ring 103 is riveted to the four corners of the metal shielding layer 2 (to distribute stress), avoiding local stress concentration that could lead to structural damage.

[0040] This embodiment adopts a multi-layer collaborative design, which consists of the following layers from bottom to top (including functional extension structures): substrate layer 1 (with matrix groove 3 + bottom shock-absorbing support foot 106) → MicroLED chip 101 (conductive adhesive fixed to groove 3) → elastic buffer structure 301 (silicone layer 303 + nano aerogel layer 304 composite) → scattering particle layer (optional) → light-transmitting protective layer 302 (with hemispherical optical lens embedded below) → thermally conductive graphite sheet 202 (adhesive layer of viscoelastic adhesive) → metal shielding layer 2 (with matrix heat dissipation holes). The substrate layer 1 and the metal shielding layer 2 are mechanically connected by a spiral titanium-nickel alloy flexible connecting post 102, forming an integrated structure of "shock absorption-light transmission-heat dissipation-shielding".

[0041] Furthermore, the sidewall of the groove 3 is inclined at an angle of 70°-85° to the horizontal plane, and the surface of the sidewall is provided with a serrated buffer texture.

[0042] From the bottom support foot (macro-level shock absorption) → elastic buffer structure 301 (chip-level shock absorption) → flexible connecting column 102 (overall structure shock absorption), a "three-level protection" is formed, which can adapt to various scenarios such as laptop movement, desktop vibration, and accidental drops, effectively protecting the MicroLED chip 101 (brittle device) from mechanical damage and solving the problem of "brightness decay or failure to light up after vibration" in traditional backlight modules.

[0043] Furthermore, the silicone layer 303 has uniformly distributed closed-cell bubbles with a pore size of 10-50 μm inside, and the closed-cell bubbles are filled with inert gas.

[0044] Details such as the 70°-85° inclination angle of the groove 3 sidewalls (reducing shear force), serrated texture (dispersing impact), and silicone closed-cell bubbles (inert gas to prevent elastic decay) further enhance the long-term stability of vibration resistance and avoid "decreased shock absorption effect after long-term use".

[0045] Furthermore, a scattering particle layer is provided between the light-transmitting protective layer 302 and the elastic buffer structure 301. The scattering particle layer is formed by mixing and curing titanium dioxide particles with a particle size of 2-8 μm with transparent resin, and has a thickness of 20-50 μm.

[0046] A hemispherical lens focuses light (enhancing brightness) while a scattering particle layer evens out the light (optimizing uniformity), solving the problems of insufficient brightness or uneven light spots in traditional backlights. This makes it particularly suitable for scenarios with high backlight requirements, such as mechanical keyboards and gaming keyboards. The high light transmittance of the 302 light-transmitting protective layer and the staggered arrangement of heat dissipation holes ensure the light output efficiency of the MicroLED chip 101 (light utilization rate ≥85%, based on test data of similar structures), reducing energy consumption.

[0047] Furthermore, a thermally conductive graphite sheet 202 is provided below the metal shielding layer 2, and the thermally conductive graphite sheet 202 is bonded to the light-transmitting protective layer 302 through a viscoelastic adhesive layer.

[0048] The thermally conductive graphite sheet 202 and the light-transmitting protective layer 302 are bonded together by a viscoelastic adhesive layer, which ensures close contact (reducing thermal resistance) and also cushions minor vibrations.

[0049] Furthermore, the bottom of the substrate layer 1 is provided with a shock-absorbing support foot 106. The shock-absorbing support foot 106 has an inverted T-shaped structure. The vertical part of the shock-absorbing support foot 106 is embedded in the substrate layer 1, and the horizontal part of the shock-absorbing support foot 106 extends out of the edge of the substrate and is covered with a polyurethane buffer pad.

[0050] The inverted T-shaped shock-absorbing support feet 106 at the bottom of the module serve as the primary line of defense against vibration: the vertical part is embedded in the substrate layer 1 to ensure structural stability, while the horizontal part extends out of the substrate edge and is covered with a polyurethane cushioning pad. When the keyboard is subjected to impact from the bottom or vibration from the desktop, the polyurethane pad absorbs most of the low-frequency, high-amplitude vibration energy through its own elastic deformation, preventing the vibration from being directly transmitted to the substrate layer 1. At the same time, the inverted T-shaped structure can prevent the entire module from shifting.

[0051] Furthermore, the surface of the metal shielding layer 2 is provided with matrix-type heat dissipation holes 201, the diameter of which is 0.1-0.3mm, and the axis of each hole is staggered with the MicroLED chip 101 below.

[0052] The heat dissipation holes of the metal shielding layer 2 can promote air circulation and discharge the heat inside the module through convection, thereby enhancing the heat dissipation effect; the gap between the substrate layer 1 and the shock-absorbing support foot 106 can also form local airflow to assist in heat dissipation.

[0053] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A vibration-resistant MicroLED keyboard backlight module, characterized in that, include: The substrate layer has a matrix-distributed groove; A MicroLED chip is embedded in the groove and fixed to the bottom of the groove structure by conductive adhesive. The depth of the groove is greater than the thickness of the MicroLED chip. An elastic buffer structure is provided, covering the surface of the substrate layer and the sidewalls of the groove, and enclosing the side and bottom non-electrode areas of the MicroLED chip. The elastic buffer structure is composed of a silicone layer and a nano-aerogel layer. A light-transmitting protective layer is attached to the upper part of the elastic buffer structure, and a hemispherical optical lens corresponding to the position of the MicroLED chip is provided on its lower surface; A metal shielding layer is disposed above the light-transmitting protective layer and is mechanically connected to the substrate layer through flexible connecting pillars. The flexible connecting pillars are in the form of a helical spring structure. The flexible connecting pillars include an upper connecting ring, a lower connecting ring, and a helical titanium-nickel alloy wire. The lower connecting ring is welded to the edge of the substrate layer, and the upper connecting ring is riveted to the four corners of the metal shielding layer.

2. The vibration-resistant MicroLED keyboard backlight module according to claim 1, characterized in that: The sidewall of the groove is inclined at an angle of 70°-85° to the horizontal plane, and the surface of the sidewall is provided with a serrated buffer texture.

3. The vibration-resistant MicroLED keyboard backlight module according to claim 1, characterized in that: The silicone layer has uniformly distributed closed-cell bubbles with a pore size of 10-50μm inside, and the closed-cell bubbles are filled with inert gas.

4. The vibration-resistant MicroLED keyboard backlight module according to claim 1, characterized in that: A scattering particle layer is provided between the light-transmitting protective layer and the elastic buffer structure. The scattering particle layer is formed by mixing and curing titanium dioxide particles with a particle size of 2-8μm with transparent resin, and has a thickness of 20-50μm.

5. The vibration-resistant MicroLED keyboard backlight module according to claim 1, characterized in that: A thermally conductive graphite sheet is disposed below the metal shielding layer, and the thermally conductive graphite sheet is bonded to the light-transmitting protective layer by a viscoelastic adhesive layer.

6. The vibration-resistant MicroLED keyboard backlight module according to claim 1, characterized in that: The bottom of the substrate layer is provided with a shock-absorbing support foot. The shock-absorbing support foot has an inverted T-shaped structure. The vertical part of the shock-absorbing support foot is embedded in the substrate layer, and the horizontal part of the shock-absorbing support foot extends out of the edge of the substrate and is covered with a polyurethane buffer pad.

7. The vibration-resistant MicroLED keyboard backlight module according to claim 1, characterized in that: The surface of the metal shielding layer is provided with a matrix of heat dissipation holes, the diameter of which is 0.1-0.3mm, and the axis of each hole is staggered with the MicroLED chip below.

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