A daughter board docking structure in semiconductor testing

Abstract

The utility model discloses a kind of semiconductor test daughter-motherboard docking structure, it is characterized in that, including: motherboard structure, daughterboard structure, lower pressing plate, locking structure;The locking structure is installed in the motherboard structure, the locking structure is installed in the lower pressing plate, the daughterboard structure is located between the motherboard structure and the lower pressing plate, the locking structure can drive the lower pressing plate to compress the daughterboard structure, the daughterboard structure and the motherboard structure are docked. Through the application of the utility model, a kind of semiconductor test daughter-motherboard docking structure is provided, without changing the structure of motherboard structure and daughterboard structure, increase a lower pressing plate, and locking structure is installed on the PCB board of motherboard structure, the lower pressing plate is driven downward by locking structure, the lower pressing plate is pressed daughterboard structure downward, so that daughterboard structure and motherboard structure are docked, docking mode is simple and fast, can effectively speed up work efficiency, and daughterboard structure will not be damaged.

Description

Technical Field

[0001] This utility model relates to the technical field of circuit board interconnection, and in particular to a mother-daughter board interconnection structure in semiconductor testing. Background Technology

[0002] Currently, in semiconductor testing, when aligning the daughter board and mother board of a circuit board, the daughter board is usually held by hand, and the alignment position of the daughter board and mother board is observed by the naked eye. Then, manual alignment is performed. However, aligning the daughter board and mother board manually requires repeated alignment during the alignment process, which results in low alignment efficiency and is time-consuming and labor-intensive. Furthermore, it is difficult to control the force during manual alignment, which can easily damage the PCB board of the daughter board during the docking process. Utility Model Content

[0003] In view of this, and to solve the above problems, the purpose of this utility model is to provide a mother-daughter board docking structure for semiconductor testing, comprising:

[0004] Mother plate structure, daughter plate structure, lower pressure plate, locking structure;

[0005] The locking structure is installed on the mother plate structure and is locked onto the lower pressure plate. The sub-plate structure is located between the mother plate structure and the lower pressure plate. The locking structure can drive the lower pressure plate to press the sub-plate structure, and the sub-plate structure and the mother plate structure are connected.

[0006] In the aforementioned semiconductor testing mother-daughter board docking structure, the outer wall of the lower pressure plate is fitted with a bearing.

[0007] In the aforementioned semiconductor testing motherboard docking structure, the locking structure includes: a handle, a long connecting rod, a short connecting rod, a slider, and fixing members; two fixing members are engaged at both ends of the bearing, and each of the opposite ends of the two fixing members is provided with a guide rail; the two sliders are slidably disposed on the two guide rails; one end of each of the two short connecting rods is mounted to the two fixing members via a first connecting shaft; the other end of each of the two short connecting rods is mounted to one end of each of the two long connecting rods via a second connecting shaft; and the other ends of the two long connecting rods are connected via the handle.

[0008] In the aforementioned semiconductor testing mother-daughter board docking structure, each of the two fixing members has an inclined sliding groove at one end facing the bearing.

[0009] The aforementioned semiconductor testing mother-daughter board docking structure further includes: a fixing plate, which is mounted on the mother board structure, and the two sliders are mounted on the fixing plate.

[0010] In the aforementioned semiconductor testing mother-daughter board docking structure, the fixed plate is provided with two first limiting blocks, the two first limiting blocks and the two first connecting shafts are located on the same straight line, and the two first limiting blocks restrict the displacement of the two first connecting shafts.

[0011] In the aforementioned semiconductor testing motherboard docking structure, two second limiting blocks are installed on the fixing plate.

[0012] The aforementioned semiconductor testing motherboard docking structure further includes: two limiting pins, which pass through two long connecting rods and are fixed to two second limiting blocks.

[0013] In the aforementioned semiconductor testing mother-daughter board docking structure, the lower pressure plate is provided with several through holes.

[0014] In the aforementioned semiconductor testing mother-daughter board docking structure, the upper end of the lower pressure plate is provided with two reinforcing ribs.

[0015] The positive effects of the above technical solution compared with the existing technology are:

[0016] By applying this utility model, a motherboard-daughterboard docking structure for semiconductor testing is provided. Without changing the structure of the motherboard and daughterboard, a lower pressure plate is added, and a locking structure is installed on the PCB of the motherboard. The locking structure drives the lower pressure plate to press down, which in turn presses down the daughterboard structure, allowing the daughterboard structure to dock with the motherboard structure. The docking method is simple and fast, which can effectively speed up the work efficiency and will not damage the daughterboard structure. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a motherboard-daughterboard docking structure in semiconductor testing according to the present invention.

[0018] Figure 2 This is a perspective view of the lower pressure plate and locking structure in this utility model.

[0019] Figure 3 This is a side view of the lower pressure plate and locking structure in this utility model.

[0020] 1. Mother plate structure; 2. Daughter plate structure; 3. Locking structure; 4. Lower pressure plate; 5. Handle; 6. Long connecting rod; 7. Short connecting rod; 8. Slider; 9. Fixing component; 10. Guide rail; 11. First limiting block; 12. Second limiting block; 13. Fixing plate; 14. Limiting pin; 15. Through hole; 16. Reinforcing rib; 17. First connecting shaft; 18. Second connecting shaft. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0022] The structures, proportions, and sizes illustrated in the accompanying drawings are merely for illustrative purposes and to aid those skilled in the art. They are not intended to limit the scope of this invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, provided they do not affect the effectiveness or purpose of this invention, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0023] like Figures 1 to 3 As shown, a preferred embodiment of a motherboard-daughterboard mating structure in semiconductor testing is illustrated, which includes: a motherboard structure 1, a daughterboard structure 2, a pressure plate 4, and a locking structure 3.

[0024] The locking structure 3 is installed on the mother plate structure 1 and is locked in the lower pressure plate 4. The sub-plate structure 2 is located between the mother plate structure 1 and the lower pressure plate 4. The locking structure 3 can drive the lower pressure plate 4 to press the sub-plate structure 2, and the sub-plate structure 2 and the mother plate structure 1 are connected.

[0025] In actual use, without changing the structure of the motherboard structure 1 and the daughterboard structure 2, a lower pressure plate 4 is added, and the locking structure 3 is installed on the PCB board of the motherboard structure 1. The locking structure 3 drives the lower pressure plate 4 to press down, and the lower pressure plate 4 presses down on the daughterboard structure 2, so that the daughterboard structure 2 and the motherboard structure 1 are connected.

[0026] Based on the above, this utility model also has the following embodiments:

[0027] Furthermore, in a semiconductor testing mother-daughter board docking structure, a bearing is sleeved on the outer wall of the lower pressure plate 4.

[0028] Furthermore, in a semiconductor testing mother-daughter board docking structure, the locking structure 3 includes: a handle 5, a long connecting rod 6, a short connecting rod 7, a slider 8, and a fixing member 9; two fixing members 9 are engaged at both ends of the bearing, and each of the opposite ends of the two fixing members 9 is provided with a guide rail 10; two sliders 8 are slidably disposed on the two guide rails 10; one end of each of the two short connecting rods 7 is mounted to the two fixing members 9 via a first connecting shaft 17; the other end of each of the two short connecting rods 7 is mounted to one end of each of the two long connecting rods 6 via a second connecting shaft 18; and the other end of each of the two long connecting rods 6 is connected via the handle 5. Specifically, when the user holds the handle 5 and moves it in the Z-axis direction, the handle 5 drives the fixing member 9 to move along the guide rail 10, i.e., along the X-axis direction, via the long connecting rod 6 and the short connecting rod 7, thereby causing the lower pressure plate 4 to move towards the daughter board structure 2, i.e., towards the Z-axis direction, thus docking the daughter board structure 2 and the mother board structure 1.

[0029] Furthermore, in a semiconductor testing mother-daughter board docking structure, each of the two fixing members 9 has an inclined sliding groove at one end, which is engaged with a bearing. Specifically, due to the inclined sliding groove, the movement of the fixing member 9 in the X-axis direction can be converted into the movement of the lower pressure plate in the Z-axis direction, thereby causing the lower pressure plate 4 to press against the daughter board structure 2, thus docking the daughter board structure 2 and the mother board structure 1.

[0030] Furthermore, a semiconductor testing motherboard-daughterboard mating structure further includes: a fixing plate 13, which is mounted on the motherboard structure 1, and two sliders 8 mounted on the fixing plate. Specifically, the fixing plate 13 is mounted on the PCB board of the motherboard structure 1.

[0031] Furthermore, in a semiconductor testing mother-daughter board docking structure, a fixed plate 13 is provided with two first limiting blocks 11. The two first limiting blocks 11 and the two first connecting shafts 17 are located on the same straight line, and the two first limiting blocks 11 restrict the displacement of the two first connecting shafts 17. Specifically, the two first limiting blocks 11 are mainly used to limit the movement distance of the two first connecting shafts 17.

[0032] Furthermore, in a semiconductor testing motherboard docking structure, two second limiting blocks 12 are installed on the fixing plate 13.

[0033] Furthermore, a semiconductor testing motherboard docking structure further includes two limiting pins 14, which pass through two long connecting rods 6 and are fixed to two second limiting blocks 12. Specifically, when the locking structure 3 is not needed, the two limiting pins 14 fix the locking structure 3 in place, preventing it from moving.

[0034] Furthermore, in a semiconductor testing mother-daughter board docking structure, the lower pressure plate 4 is provided with a plurality of through holes 15. Specifically, the through holes 15 of the lower pressure plate 4 can avoid the PCB board of the daughter board structure 2, preventing damage to the PCB board of the daughter board structure 2.

[0035] Furthermore, in a semiconductor testing mother-daughter board docking structure, the upper end of the lower pressure plate is provided with two reinforcing ribs.

[0036] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A mother-daughter board docking structure for semiconductor testing, characterized in that, include: Mother plate structure, daughter plate structure, lower pressure plate, locking structure; The locking structure is installed on the mother plate structure and is locked onto the lower pressure plate. The sub-plate structure is located between the mother plate structure and the lower pressure plate. The locking structure can drive the lower pressure plate to press the sub-plate structure, and the sub-plate structure and the mother plate structure are connected.

2. The semiconductor testing mother-daughter board docking structure according to claim 1, characterized in that, The outer wall of the lower pressure plate is fitted with a bearing.

3. The semiconductor testing mother-daughter board docking structure according to claim 2, characterized in that, The locking structure includes: a handle, a long connecting rod, a short connecting rod, a slider, and fixing members; two fixing members are engaged at both ends of the bearing, and each of the opposite ends of the two fixing members is provided with a guide rail; the two sliders are slidably disposed on the two guide rails; one end of each of the two short connecting rods is mounted to the two fixing members through a first connecting shaft; the other end of each of the two short connecting rods is mounted to one end of each of the two long connecting rods through a second connecting shaft; and the other end of each of the two long connecting rods is connected through the handle.

4. The semiconductor testing mother-daughter board docking structure according to claim 3, characterized in that, Both of the aforementioned fasteners have inclined sliding grooves at their opposite ends, and the sliding grooves are engaged with the bearings.

5. The semiconductor testing mother-daughter board docking structure according to claim 3, characterized in that, Also includes: A fixing plate is installed on the mother plate structure, and the two sliders are installed on the fixing plate.

6. The semiconductor testing mother-daughter board docking structure according to claim 5, characterized in that, The fixed plate is provided with two first limiting blocks, which are located on the same straight line as the two first connecting shafts. The two first limiting blocks restrict the displacement of the two first connecting shafts.

7. The semiconductor testing mother-daughter board docking structure according to claim 5, characterized in that, Two second limiting blocks are installed on the fixed plate.

8. The semiconductor testing mother-daughter board docking structure according to claim 7, characterized in that, Also includes: Two limiting pins pass through the two long connecting rods and are fixed to the two second limiting blocks.

9. The semiconductor testing mother-daughter board docking structure according to claim 1, characterized in that, The lower pressure plate has several through holes.

10. The semiconductor testing mother-daughter board docking structure according to claim 1, characterized in that, The upper end of the lower pressure plate is provided with two reinforcing ribs.

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