Anti-interference optical coupling package structure

Abstract

This utility model relates to the field of optocoupler technology, and in particular to an anti-interference optocoupler packaging structure. By placing the fifth pin completely inside the package, the creepage distance between the fifth pin and the adjacent high-voltage fourth and sixth pins is greatly increased. Under high-voltage conditions, the voltage difference between the fourth and sixth pins or the electric field generated by their voltage to ground must travel a longer distance through the interior of the package insulation material (such as epoxy resin) or along its outer surface to reach the fifth pin. This significantly increases the effective electrical insulation creepage distance and electrical clearance, thereby significantly improving the working stability and safety of the product. It solves the technical problem that the creepage distance between the fourth and sixth pins and the fifth pin in existing 6-pin optocouplers is too short, which makes the fifth pin and the circuit components mounted on its surface susceptible to interference or even leakage.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler technology, and in particular to an anti-interference optocoupler packaging structure. Background Technology

[0002] For existing 6-pin optocouplers, such as Figure 1 As shown, since pins 4 and 6 of the optocoupler are close to pin 5 and the distance between them is short, the creepage distance is short. Under high voltage operating conditions above 500V, the high voltage on pins 4 and 6 can easily cause current to be generated on pin 5, which can interfere with the pin or even cause leakage. This phenomenon will interfere with the working state of circuit components such as PT chips installed on pin 5. Especially for opto-relays and thyristor products that are extremely sensitive to current on pin 5, it will significantly reduce their stability and safety during application. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides an anti-interference optocoupler packaging structure, which solves the technical problem that the creepage distance between pins 4 and 6 and pin 5 in existing 6-pin optocouplers is too short, causing pin 5 and the circuit components mounted on its surface to be susceptible to interference or even leakage.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an anti-interference optocoupler packaging structure, including a package body, an input pin assembly and an output pin assembly are provided on the package body, the input pin assembly and the output pin assembly are respectively provided with a first signal transmission component and a second signal transmission component located in the package body for signal transmission, the output pin assembly includes a fourth pin, a fifth pin and a sixth pin disposed on the same side of the package body, one end of the fourth pin and the fifth pin is located in the package body and the other end is located outside the package body, the fifth pin is located between the fourth pin and the sixth pin and is entirely located in the package body.

[0005] Preferably, the fifth pin has a positioning part for positioning its end position at the end near the edge of the package.

[0006] Preferably, the positioning part is a weakening hole provided at the end of the fifth pin.

[0007] Preferably, the positioning part is a weakening groove formed at the end of the fifth pin, and the thickness of the weakening groove is less than the initial thickness of the fifth pin.

[0008] Preferably, the second signal transmission component is disposed on the base island of the fifth pin.

[0009] By employing the above technical solution, this utility model provides an anti-interference optical coupler packaging structure, which has at least the following beneficial effects: 1. This utility model significantly increases the creepage distance between the fifth pin and the adjacent high-voltage fourth and sixth pins by placing the fifth pin completely inside the package, so that its outer end face is not exposed outside the package. Under high voltage conditions, the electric field generated by the voltage difference between the fourth and sixth pins or its voltage to ground must pass through a longer path inside the package insulation material (such as epoxy resin) or along its outer surface to reach the fifth pin. This significantly increases the effective electrical insulation creepage distance and electrical clearance, greatly reducing the risk of interference current generated by the fifth pin due to induction or leakage under high voltage (such as above 500V) operating conditions, thereby significantly improving the working stability of this product and the overall safety of the optocoupler product.

[0010] 2. This utility model provides a key physical positioning reference for precise cutting operations during the packaging manufacturing process by setting a positioning part at the end of the fifth pin to be cut. The weakening hole and weakening groove are not only easy to be identified and positioned by the cutting mold or laser, ensuring the consistency of the cutting position and avoiding damage to the package body due to excessive cutting or exposure of the pin due to excessive cutting, but their structure itself also significantly weakens the mechanical strength of the pin material at that point. This makes the cutting action performed before the molding process easier to implement, requires less cutting force, and improves production yield and process stability.

[0011] 3. While maintaining the optimal layout of directly placing the second signal transmission component on the fifth pin base island, this utility model provides a double protection barrier for the sensitive core component by completely embedding the fifth pin. On the one hand, the embedded fifth pin itself greatly reduces the direct interference of the external high-voltage electric field. On the other hand, the encapsulating material on it forms a uniform and dense insulating layer, physically isolating the risk of surface leakage caused by environmental pollutants such as dust and moisture. At the same time, the required length of the connecting gold wire between the second signal transmission component and the fifth pin, the fourth pin, and the sixth pin is optimized, further reducing the probability of breakage caused by excessively long gold wires. This synergistically improves the reliability of signal transmission, the durability of the device in long-term use, and the ability to resist harsh environments. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 A schematic diagram of an existing product; Figure 2 This is a schematic diagram of the present invention; Figure 3 This is a schematic diagram of the positioning part of this utility model.

[0013] In the figure: 1. Package; 2. Input pin assembly; 3. Output pin assembly; 4. First signal transmission assembly; 5. Second signal transmission assembly; 6. Fourth pin; 7. Fifth pin; 8. Sixth pin; 9. Positioning part. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] To address the problem of short creepage distances between pins 4 and 6 and pin 5 in existing 6-pin optocouplers, which makes pin 5 and its surface-mounted circuit components susceptible to interference and even leakage, this invention provides an anti-interference optocoupler packaging structure. By concealing pin 5 within the plastic package 1 through methods such as cutting it out, the high-voltage creepage distance between pins 4 and 6 and pin 5 is increased, significantly reducing the probability of pin 5 being affected by interference and leakage, thus greatly improving product stability and safety. Figure 2 and Figure 3 As shown, an input pin assembly 2 and an output pin assembly 3 are provided on the encapsulated body 1. A first signal transmission component 4 and a second signal transmission component 5, located within the encapsulated body 1, are respectively provided on the input pin assembly 2 and the output pin assembly 3 for signal transmission. The first signal transmission component 4 and the second signal transmission component 5 realize the process of converting input electrical energy into light energy and then back into electrical energy. The first signal transmission component 4 is generally an IR chip, and the second signal transmission component 5 is generally a PT chip or a photosensitive silicon controlled rectifier (SCR) or similar component. Typically, to facilitate conductive connection between the second signal transmission component 5 and the fourth pin 6 and the sixth pin 8, a gold wire is used. To shorten the length of the gold wire and save costs... Furthermore, to reduce the risk of breakage due to excessively long gold wires, the second signal transmission component 5 is positioned on the base island of the fifth pin 7. The output pin component 3 includes a fourth pin 6, a fifth pin 7, and a sixth pin 8 located on the same side of the package 1. One end of the fourth pin 6 and the fifth pin 7 are located inside the package 1, and the other end is located outside the package 1. The fifth pin 7 is located between the fourth pin 6 and the sixth pin 8 and is entirely within the package 1, thereby completely hiding the fifth pin 7 within the package 1. This increases the high-voltage creepage distance between the fourth pin 6 and the sixth pin 8 and the fifth pin 7, greatly reducing the probability of interference and leakage at the fifth pin 7, and significantly improving the stability and safety of the product.

[0016] Before molding, the fifth pin 7 is usually shortened by cutting, so that the remaining fifth pin 7 can be completely hidden inside the package 1 after molding. However, in order to locate the cut position of the fifth pin 7, a positioning part 9 is provided at the end of the fifth pin 7 near the edge of the package 1 to locate its end position, so that it can be cut off at this point later.

[0017] To facilitate the cutting of the fifth pin 7 by the cutting tool during the cutting process and avoid adhesion, the positioning part 9 can be a weakening hole set at the end of the fifth pin 7. This reduces the amount of material that the cutting tool needs to remove and reduces the strength at the end of the fifth pin 7, making it easier for the cutting tool to cut the fifth pin 7. Alternatively, the positioning part 9 can be a weakening groove opened at the end of the fifth pin 7. The thickness of the weakening groove is less than the initial thickness of the fifth pin 7, which is the thickness after the optical coupler bracket is stamped. This also reduces the strength of the positioning part 9, making it easier for the cutting tool to cut the fifth pin 7.

[0018] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0019] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An anti-interference optocoupler packaging structure, comprising a package body (1), wherein an input pin assembly (2) and an output pin assembly (3) are disposed on the package body (1), and a first signal transmission component (4) and a second signal transmission component (5) for signal transmission are respectively disposed on the input pin assembly (2) and the output pin assembly (3) within the package body (1), characterized in that, The output pin assembly (3) includes a fourth pin (6), a fifth pin (7) and a sixth pin (8) disposed on the same side of the package (1). One end of the fourth pin (6) and the fifth pin (7) are located inside the package (1) and the other end is located outside the package (1). The fifth pin (7) is located between the fourth pin (6) and the sixth pin (8) and is entirely located inside the package (1).

2. The anti-interference optocoupler packaging structure according to claim 1, characterized in that, The fifth pin (7) has a positioning part (9) for positioning its end position at one end near the edge of the package (1).

3. The anti-interference optocoupler packaging structure according to claim 2, characterized in that, The positioning part (9) is a weakening hole provided at the end of the fifth pin (7).

4. The anti-interference optocoupler packaging structure according to claim 2, characterized in that, The positioning part (9) is a weakening groove opened at the end of the fifth pin (7), and the thickness of the weakening groove is less than the initial thickness of the fifth pin (7).

5. The anti-interference optocoupler packaging structure according to claim 1, characterized in that, The second signal transmission component (5) is disposed on the base island of the fifth pin (7).

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