Method for determining a connection parameter

Abstract

Method for determining a connection parameter of at least one electrical conductor element (2-5) in a conductor element receptacle (6), in particular a stator slot, of an electrical machine (7), wherein a fill level of a potting compound surrounding at least one conductor element (2-5) in the conductor element receptacle (6) at least sectionally is determined, in particular by optical detection of a cross-sectional image of the conductor element receptacle (6), wherein, by means of a detection device (8), at least one connection parameter is determined for at least two conductor elements (2-5) received in the conductor element receptacle (6) based on a detection of a fill level for each of the at least two conductor elements (2-5), in particular all conductor elements (2-5) received in the conductor element receptacle (6).

Description

[0001] The invention relates to a method for determining a connection parameter of at least one electrical conductor element in a conductor element receptacle, in particular a stator slot, of an electrical machine, wherein a fill level of a potting compound surrounding at least one conductor element in the conductor element receptacle at least sectionally is determined, in particular by optical detection of a cross-sectional image of the conductor element receptacle.

[0002] Electrical machines in which electrical conductor elements are mounted in conductor element receptacles, for example in stator slots, are generally known from the prior art. The electrical conductor elements are typically potted with a potting compound within the conductor element receptacle to connect them to it, for example to a laminated core of the stator of the electrical machine, in particular to ensure a mechanical and thermal connection of the electrical conductor elements within the conductor element receptacle.

[0003] It is further known that a connection parameter of at least one such electrical conductor element can be determined to ensure that the at least one electrical conductor element is adequately connected in the conductor element receptacle, for example, to confirm the mechanical securing of the conductor element and / or the thermal connection to the laminated core. To determine the connection parameter, a micrograph of the conductor element receptacle is typically examined, and the fill level of the potting compound is determined from this micrograph. In other words, the micrograph can be used to determine what proportion of the space or area of ​​the conductor element receptacle around the conductor elements is filled with potting compound.

[0004] This allows for consideration of whether air inclusions or unfilled areas form around the conductor elements, which cannot contribute to mechanical retention and thermal bonding. Since the fill level is usually determined as an overall value for the entire conductor element receptacle, for example, as a percentage compared to the volume of the receptacle or the area in the cross-section, the distribution of the potting compound within the conductor element receptacle is usually not considered at all or at least not sufficiently.

[0005] This means that the decision as to whether the connection of the electrical conductor elements held in the conductor element receptacle is adequate is usually made depending on a threshold value, which, however, is based on the overall fill level of the conductor element receptacle. If the conductor element receptacle has a comparatively high fill level, but the potting compound is very unevenly distributed within it, this can lead to some of the conductor elements being very well connected to the receptacle, while, for example, at least one electrical conductor element may be inadequately connected.

[0006] The invention is based on the objective of providing an improved method for determining a connection parameter, in which, in particular, the accuracy of the determination is improved.

[0007] The problem is solved by a method according to claim 1. The dependent claims relate to possible embodiments.

[0008] As described, the invention relates to a method for determining a connection parameter of at least one electrical conductor element in a conductor element receptacle, for example, a stator slot, of an electric machine. The electric machine can specifically be configured as a drive unit for a motor vehicle, so that, for example, torque for driving the motor vehicle can be generated or provided by means of the electric machine. In the method described herein, the degree of filling of a potting compound that at least partially surrounds the at least one conductor element in the conductor element receptacle is determined, specifically by optically capturing a cross-sectional image of the conductor element receptacle.

[0009] In other words, a micrograph of at least a part of the electrical machine can be produced, encompassing the conductor element receptacle with the electrical conductor elements arranged therein. The micrograph might, for example, depict a cross-section through the electrical machine, such as a lamination stack of the stator in which the conductor element receptacle is located. The micrograph thus captures the conductor element receptacle with the at least one electrical conductor element it contains and the potting compound surrounding the conductor element.

[0010] Using optical methods, such as an image analysis algorithm, the fill level of the potting compound can be determined, for example, the percentage of the conductor element receptacle that is filled with potting compound. The fill level is reduced accordingly by air inclusions or areas in the cross-sectional image where no potting compound is present between the electrical conductor elements and the conductor element receptacle. If the conductor element receptacle is completely filled with the potting compound, meaning that no air inclusions exist between the conductor elements and the conductor element receptacle, the fill level can be, for example, 100% or 1. Similarly, if there is no potting compound in the conductor element receptacle and therefore at least one conductor element in the receptacle is not surrounded by potting compound, the fill level can be, for example, 0% or 0.

[0011] The invention is based on the finding that, by means of a detection device, at least one connection parameter is determined for each of at least two conductor elements held in the conductor element receptacle, based on a measurement of the fill level for each of the at least two conductor elements, and in particular for all conductor elements held in the conductor element receptacle. The invention thus proposes that the fill level is not determined overall for the entire conductor element receptacle in the cross-sectional image, but rather that the fill level is determined for individual conductor elements. This allows consideration of how the individual conductor elements are connected in the conductor element receptacle by the potting compound, thus preventing the possibility that, despite a high fill level of the entire conductor element receptacle, individual conductor elements may be inadequately connected, for example, in certain areas.

[0012] In other words, the method proposed herein, particularly the measurement of the fill level for each of the at least two conductor elements, takes into account the distribution of the potting compound within the conductor element receptacle. This allows for a determination of whether the arrangement or connection of the electrical conductor elements within the receptacle is satisfactory by examining the individual connection of each conductor element. This effectively prevents defects from concentrating on a single conductor element, even with a comparatively high overall fill level of the conductor element receptacle (e.g., >80%), resulting in inadequate mechanical and / or thermal connections. Instead, the connection parameter for each conductor element is considered individually, enabling the measurement and consideration of the potting compound distribution, including any localized defects.

[0013] Advantageously, it is therefore possible to reduce the safety buffer for the fill quantity of the potting compound, or during the application of the potting compound, since the distribution of the potting compound is also taken into account in addition to determining the fill level. Accordingly, it can be ruled out that individual conductor elements are inadequately connected, as the fill level can be considered separately for each conductor element.

[0014] The method can be designed to use an image analysis algorithm to determine at least one connection parameter for at least two conductor elements based on a cross-sectional image of the conductor element receptacle filled with potting compound. As described, a cross-sectional image is generated, corresponding, for example, to a cross-section through the conductor element receptacle. Using an image analysis algorithm, for example, based on artificial intelligence and / or edge detection, it can be determined separately for the at least two conductor elements what proportion of the area around the conductor elements is filled with potting compound and in what proportion of the cross-sectional image area defects may occur.

[0015] The cross-sectional image can be divided, for example, into individual conductor element mounting segments or slot segments in which the individual conductor elements are arranged. For instance, four electrical conductor elements can be arranged in a single conductor element mounting segment, so that the mounting segment can be divided into four corresponding segments. The individual segments can then be evaluated separately, so that even if only a single conductor element is poorly connected, a corresponding negative result can be generated or displayed.

[0016] The individual conductor elements do not necessarily need to be arranged in fixed positions or uniformly distributed within the conductor element receptacle. The image analysis algorithm can, for example, detect the positions of the individual electrical conductor elements as well as the position of the edge of the conductor element receptacle, for instance, using edge detection. As described, areas within the conductor element receptacle filled with potting compound can be distinguished from those areas within the conductor element receptacle that are not filled with potting compound, for example, those filled with air or empty. Therefore, only those areas filled with potting compound are counted to determine the connection parameters of the conductor elements.

[0017] Following a further development of the method described herein, it can be provided that the connection parameter for at least one conductor element is determined based on at least two different filling parameters. Accordingly, the determination of the connection parameter can be further subdivided or executed in a more refined manner. For this purpose, the connection parameter for the at least one conductor element can be determined not only on a single filling parameter, but also on different filling parameters, which can be influenced differently in the determination of the connection parameter.

[0018] This allows, for example, consideration of the fact that different areas around the conductor element are suited to different levels of bonding. The potting compound that connects the conductor element to the conductor element receptacle achieves varying bond strengths in different areas around the conductor element, based, for example, on its proximity to or distance from the conductor element receptacle. Thus, areas where the conductor element is relatively close to the conductor element receptacle and surrounded by potting compound can contribute more to the bond than areas where the conductor element is relatively farther away from the conductor element receptacle and surrounded by potting compound. As described, only those areas filled with potting compound are considered when determining the fill level or fill parameter.

[0019] In a further embodiment of the method, the connection parameter for at least one conductor element can be determined based on a lamination stack fill parameter describing the connection of the conductor element to a lamination stack and / or based on a conductor element fill parameter describing the connection of the conductor element to an adjacent conductor element. For the described conductor element, for example, several conductor elements in the conductor element receptacle, it is thus possible, as previously described, to differentiate which type of connection the potting compound realizes in the different areas.

[0020] Specifically, a distinction can be made between connecting the conductor element to the laminated core and connecting the conductor element to at least one adjacent conductor element within the core receptacle. For example, the contribution of the laminated core fill parameter to the fill parameter or the connection parameter can be weighted more heavily than the conductor element fill parameter, since both the mechanical and thermal connections of the conductor element to the core receptacle within the laminated core have a greater impact than connections to an adjacent conductor element. In particular, heat dissipation from the conductor element occurs via the laminated core, making the connection of the conductor element to the laminated core, and thus defined by the laminated core fill parameter, crucial for this.

[0021] As described, a distinction can be made between the lamination stack fill parameter and the conductor element fill parameter based on an image evaluation algorithm. In other words, the area of ​​the conductor element receptacle around the at least one conductor element can be divided into at least two regions: lamination stack regions where the conductor element is or can be connected to the lamination stack via the potting compound, and conductor element regions where the conductor element is or can be connected to another conductor element.

[0022] The method can further provide for an even finer subdivision of the individual areas around the at least one conductor element in the conductor element receptacle. In one embodiment, the lamination stack filling parameter can be divided into a radius filling parameter in a radius region of at least one conductor element and an edge filling parameter in an edge region of the conductor element. As already described, the lamination stack filling parameter relates to that region of a specific conductor element that faces the conductor element receptacle and thus the lamination stack in the radial direction with respect to a longitudinal axis of the conductor element, or is located closer to the inner surface of the conductor element receptacle, for example, than the region with which the conductor element faces another conductor element adjacent to it in the conductor element receptacle.

[0023] The lamination stack filling parameter can thus be divided into at least two different parameters: the radius filling parameter and the edge filling parameter. The radius filling parameter describes an area filled with potting compound within a radius, for example, a curved or corner area of ​​a conductor element. The edge area, on the other hand, describes an uncurved, flat, or straight area, such as one located between two radius areas. The edge area can be weighted more heavily than the radius area because it is typically located closer to the lamination stack and can therefore ensure improved heat transfer and a better mechanical connection to the conductor element holder.

[0024] Furthermore, it can be taken into account that the radius area is more difficult to wet with the potting compound compared to the edge area, or that potting compound is more difficult to apply to the radius area, especially compared to the edge area. Radius areas and edge areas can be distinguished, for example, by their curvature. The edge area can extend as far as the edge of the conductor element is currently formed. If the curvature increases above a certain value, the radius area is defined within this range. The distinction between edge areas and radius areas can be made accordingly by edge detection using an image analysis algorithm.

[0025] As described, a distinction is made between the individual areas filled with potting compound around the at least one conductor element, since these contribute differently to the bonding and thus to the bonding parameter. The bonding parameter can therefore be composed of the individual filling parameters, in particular the lamination stack filling parameter and the conductor element filling parameter. The lamination stack filling parameter can be subdivided into, or formed by, the radius filling parameter and the edge filling parameter.

[0026] According to one embodiment of the method, at least two different filling parameters, in particular the lamination stack filling parameter and / or the conductor element filling parameter and / or the radius filling parameter and / or the edge filling parameter, can be weighted differently when determining the connection parameter. Accordingly, different weighting factors can result, for example, a lamination stack weight factor, a radius weight factor, an edge weight factor, and a conductor element weight factor. As already described, the lamination stack filling parameter is weighted more heavily than the conductor element filling parameter. The edge filling parameter is weighted more heavily than the radius filling parameter. Thus, the edge filling parameter is weighted more heavily than the radius filling parameter, which in turn is weighted more heavily than the conductor element filling parameter.

[0027] The individual weight factors can be machine-dependent, meaning they are determined or specified based on the specific electrical machine. For example, the weight factors can depend on the cooling capacity of the electrical machine. Specifically, the weight factors are determined based on a thermal simulation of the electrical machine or the conductor element mount with the conductor elements arranged within it.

[0028] The method can further provide for the determination of at least one connection parameter in at least two different axial planes of the conductor element holder. In principle, the determination of the connection parameter can be performed for different conductor element holders, which can be arranged circumferentially with respect to an axis of rotation of the electrical machine. For each of the conductor element holders, the described embodiment offers the possibility of additionally determining the connection parameter in at least one further axial plane. This means that for a specific conductor element holder, at least two cross-sectional images or metallographic images are generated, which lie in different axial planes along the axis of rotation of the electrical machine. Specifically, the determination of the connection parameter for a particular conductor element holder can be performed in exactly three axial planes.An axial plane can be located centrally in the axial direction, i.e., in a central region between two axial end faces of the laminated core, while the other two axial planes can be located in the direction of the axial end faces, for example, in one axial end region each. The described procedure can be carried out for at least one further conductor element holder, in particular for all conductor element holders.

[0029] By considering several axial planes of at least one conductor element receptacle, the determination of the connection parameter is further improved, as variations in the fill level of the potting compound in the axial direction of the conductor element receptacle can be taken into account.

[0030] Furthermore, the method may provide that at least one connection parameter, determined for at least one conductor element based on a lamination stack filling parameter, is compared with a first limit value, wherein, if the connection parameter is below the first limit value, a connection parameter, determined for the same conductor element based on the lamination stack filling parameter and the conductor element filling parameter, is compared with a second limit value, wherein a release parameter is determined based on the comparison between the connection parameters with the first or the second limit value.

[0031] Specifically, a first limit value can be defined that applies to a connection parameter determined based on a lamination stack fill parameter of at least one conductor element. This first limit value is therefore considered exclusively for the connection of the conductor element to the lamination stack. If this limit value is reached by the connection parameter determined based on the lamination stack fill parameter, a positive release parameter, for example "OK", can be output, or the electrical machine can be released.

[0032] If the first limit value is not reached (i.e., is undershot) by the connection parameter, which is determined solely based on the lamination stack fill parameter, the connection parameter for the same conductor element is recalculated based on the lamination stack fill parameter and the conductor element fill parameter. As previously described, the lamination stack fill parameter and the conductor element fill parameter are weighted differently in the determination of the connection parameter.

[0033] The lamination stack fill parameter can, in turn, be determined, particularly with different weightings, by the edge fill parameter and the radius fill parameter. This connection parameter, which is based on the lamination stack fill parameter and the conductor element fill parameter, is compared with the second limit value. If the connection parameter reaches the second limit value, a positive release parameter can be output. If the second limit value is also undershot, a negative release parameter can be output. Alternatively, as described below, the connection parameter can be considered in different axial planes.

[0034] Therefore, a multi-stage process is proposed, in which it is first checked whether the conductor element has a sufficient connection to the laminated core. If this is the case, further verification of the connection, for example in the direction of the adjacent conductor elements, is not necessary. However, if the limit value is not reached, it can be checked whether there is nevertheless a sufficient connection via the adjacent conductor elements. If this is also not the case, the electrical machine cannot be released accordingly, or it can be checked whether there is a balance in the other axial planes.

[0035] In the described embodiment, it can further be provided that if the connection parameter determined based on the lamination stack fill parameter and the conductor element fill parameter falls below the second limit value, the connection parameter for the same conductor element is determined in at least one further axial plane, in particular in at least two further axial planes, of the conductor element receptacle. If the connection parameters determined for the same conductor element in the at least one axial plane or the at least two further axial planes are above the second limit value, a positive enable parameter can be output. However, if the connection parameter falls below the second limit value in at least one further axial plane, the electrical machine can be evaluated as "not OK". This additionally takes into account that a connection of the conductor element in only one axial plane is insufficient.If the conductor element is connected in the other axial planes, the insufficient connection in one axial plane can be compensated for by heat conduction through the conductor element itself via a connection in another axial plane.

[0036] Optionally, a third limit value can be defined that the connection parameter must reach in each axial plane. This means that if the second limit value is not reached in one axial plane, but the second limit value is reached in the other axial planes, the connection parameter in the axial plane that did not reach the second limit value must be at least above the third limit value. This eliminates scenarios in which the connection of a conductor element in one axial plane is so faulty that the connection cannot be accepted regardless of the connections in other axial planes.

[0037] The prescribed procedure can be carried out for each individual conductor element in the conductor element holder. This ensures, in particular, that each conductor element is adequately thermally and / or mechanically connected.

[0038] Based on the determination of the connection parameter, at least one production parameter can be determined or set or changed on a production device, in particular a production parameter relating to the filling with potting compound, specifically a filling quantity of the potting compound.

[0039] In addition to the method, the invention relates to a device for determining a connection parameter of at least one electrical conductor element in a conductor element receptacle, in particular a stator slot, of an electrical machine, wherein the device is configured to determine a fill level of a potting compound that surrounds at least one conductor element in the conductor element receptacle at least sectionally, in particular by means of optical detection of a cross-sectional image of the conductor element receptacle, wherein the device is configured to determine, by means of a detection device for at least two conductor elements received in the conductor element receptacle, at least one connection parameter based on a detection of a fill level for each of the at least two conductor elements, in particular all conductor elements received in the conductor element receptacle.

[0040] The device is specifically designed to carry out the previously described method in all its details. The described method can therefore be carried out using the described device.

[0041] All advantages, details, designs and / or features described in relation to the method are fully transferable to the device and vice versa.

[0042] The invention is explained with reference to exemplary embodiments and the figures. The figures are schematic representations and show: Fig. 1. A schematic representation of a device for determining a connection parameter according to an exemplary embodiment; Fig. 2 a schematic representation of a conductor element mounting of an electrical machine according to an exemplary embodiment; and Fig. 3. A schematic representation of a flowchart of a procedure for determining a connection parameter.

[0043] Fig. Figure 1 shows a schematic representation of a device 1 which is used to determine a connection parameter of at least one conductor element 2-5 in a conductor element receptacle 6 (see Figure 1). Fig. 2) is formed. The conductor element holder 6 is, for example, a component of an electrical machine 7, for example, a laminated core of a stator of the electrical machine 7. In particular, in Fig. 1 a micrograph is shown in which the conductor element holder 6 is viewed in a cross-section, for example the stator of the electric machine 7 is cut in an axial plane that is perpendicular to the axis of rotation of the electric machine.

[0044] The device 1 includes a detection device 8, which is designed to capture the micrograph of the conductor element receptacle 6. Specifically, the detection device 8 is designed for optical detection. The detection device 8 can employ at least one image processing algorithm, or more generally, artificial intelligence, to detect the fill level of a potting compound, for example, a resin material, in the conductor element receptacle 6. In other words, it can detect which areas in the conductor element receptacle 6 are filled with the potting compound and which are empty or contain air inclusions.

[0045] From this, a connection parameter for the individual conductor elements 2-5 can be determined using the detection device 8. Specifically, the detection device 8 determines a separate connection parameter for each conductor element 2-5 received in the conductor element receptacle 6. The connection parameter can then be compared with a limit value to determine whether the connection of the conductor elements 2-5 in the conductor element receptacle 6 is adequately ensured.

[0046] Fig. 2 shows the conductor element receptacle 6, which is in Fig. Figure 1 shows a cross-sectional view, in plan view. As described, the conductor elements 2-5 are arranged in the conductor element receptacle 6, and are encased in a potting compound, for example a resin material, within the receptacle 6. The potting compound may contain irregularities, so that voids or air inclusions can form between the conductor elements 2-5 and between each conductor element 2-5 and the receptacle 6.

[0047] The device and method proposed herein for determining the connection parameter are based on the understanding that the connection of the conductor elements 2-5 is not considered for the entire conductor element receptacle 6 as a whole, but rather the connection of the individual conductor elements 2-5 is considered separately. For example, the micrograph in Fig. 2 is examined and image evaluation is used to determine which conductor elements 2-5 are connected to other conductor elements 2-5 and / or to the conductor element receptacle 6 and thus to the sheet metal package with potting compound at which areas.

[0048] For example, a conductor element 2 can be considered, and the fill level of the potting compound around the conductor element 2 can be evaluated. The bonding parameter can, for example, be derived from the proportion of the surface area filled with potting compound, such as a percentage value or a value between 0 and 1. The larger the proportion of the surface area around the conductor element 2 that is filled with potting compound, the higher the fill level and the larger the bonding parameter.

[0049] This example demonstrates that the connection parameter can be based on different filling parameters. For conductor elements 2-5, various groups of areas are shown, with their area proportions structured differently. This illustrates how the determination of the connection parameter can be based on different filling parameters. For conductor element 2, for example, the connection parameter can be determined based on a lamination stack filling parameter, which may consist of lamination stack areas 9 and 10, or based on a conductor element filling parameter, which may consist of conductor element area 11. Naturally, only those areas filled with potting compound are included in the connection parameter, the lamination stack filling parameter, and the conductor element filling parameter.

[0050] Potting compound located in conductor element area 11 defines the connection of conductor element 2 to conductor element 3, or more generally, between the individual conductor elements. Potting compound filled into the lamination stack areas 9 and 10 defines the connection of conductor element 2, or more generally, the individual conductor elements 2-5, to the lamination stack, specifically to the conductor element receptacle 6. This means that the connection parameter for conductor elements 2-5 can be determined based on the fill level of potting compound in lamination stack areas 9 and 10, as well as conductor element area 11. In this calculation of the connection parameter, the lamination stack fill parameter, which is based on the fill level of lamination stack areas 9 and 10, can be weighted more heavily than the conductor element fill parameter to account for the fact that connection to the lamination stack provides a better thermal connection than connection to adjacent conductor elements 2-5.

[0051] Furthermore, it is possible to examine the connection of the individual conductor elements 2-5 in even greater detail, in particular to determine the lamination stack fill parameter based on a radius fill parameter and an edge fill parameter. The radius fill parameter is determined based on the fill level of the potting compound in radius areas 12 of the conductor element 2-5, and the edge fill parameter is determined based on the fill level of the potting compound in edge areas 13. In other words, the lamination stack fill parameter is composed of, or rather, the sum of, the edge fill parameter and the radius fill parameter. Here, the edge fill parameter can again be weighted more heavily than the radius fill parameter to account for the fact that the thermal connection via the edge areas 13 of the conductor elements 2-5 allows for better heat dissipation than via the radius areas 12.

[0052] The procedure described for conductor element 2 is analogously applicable to the remaining conductor elements 3-5, so that the connection parameter is determined individually for each conductor element. It should be noted that conductor elements 3 and 4 are adjacent to other conductor elements 2-5 on both sides, meaning that two conductor element fill parameters are used to determine their connection parameters.

[0053] When determining the connection parameter for the conductor element 5, it must be taken into account that it has a particularly large contact area with the lamination stack or the conductor element receptacle 6. Accordingly, more lamination stack areas 9, 10, 14 must be considered for this conductor element 5.

[0054] The procedure for determining the connection parameter for the individual conductor elements 2-5 in the conductor element holder 6 is described below using the exemplary embodiment of Fig. 3 explained. The one relating to Fig. 1, Fig. 2. The device 1 described above can be designed to carry out the method, or the method can be carried out by Fig. 3 carried out by means of the device 1.

[0055] The process starts in block 15 and can be carried out individually for each of the conductor elements 2-5. In block 15, the fill level of potting compound around the conductor element 2-5 is recorded. In block 16, the connection parameter is determined based on the sheet metal stack fill parameter. In other words, the fill level, as it relates to... Fig. As described in section 2, the data is captured in the sheet metal stack areas 9, 10, and 14. Optionally, each of the sheet metal stack areas 9, 10, and 14 can be subdivided into radius area 12 and edge area 13, as also described. Furthermore, optionally, the radius area 12, or the radius fill parameters derived from it, can be weighted less heavily than the edge fill parameters, which are determined from the fill level in the edge area 13.

[0056] Once the connection parameter is determined, it is compared to an initial limit value. If the connection parameter is above the initial limit value, the process can branch from block 16 to block 17 and the connection of the corresponding conductor element 2-5 can be enabled or evaluated as "OK". The process can then continue with the next conductor element 2-5, or the connection parameters of conductor elements 2-5 can be determined in parallel.

[0057] If the specified connection parameter of conductor element 2-5 does not reach the first limit value, the process branches from block 16 to block 18. In block 18, the connection parameter for this conductor element 2-5 is determined based on the lamination stack fill parameter, as described in relation to block 16, whereby the conductor element fill parameter can also be taken into account. This includes the connection to the adjacent conductor elements 2-5.

[0058] As previously described, the edge areas 13 and radius areas 12 can optionally be weighted differently when determining the lamination stack fill parameter. In any case, the lamination stack fill parameter is weighted more heavily than the conductor element fill parameter. The edge fill parameter can have the highest weighting, which is higher than the weighting of the radius fill parameter, which in turn is weighted more heavily than the conductor element fill parameter. In block 19, the connection parameter determined in block 18 is then compared with a second limit value.

[0059] If the connection parameter, which is determined based on the lamination stack fill parameter and the conductor element fill parameter, reaches the second limit value, the process branches from block 19 to block 20, where the connection for conductor elements 2-5 can be evaluated as "OK" or the connection can be enabled. However, if the connection parameter also fails to reach the second limit value, the process branches from block 19 to block 21.

[0060] In block 21, the connection parameter for the same conductor element 2-5 in the conductor element holder 6 is determined in at least one further axial plane. In other words, the procedure of block 16 and, if applicable, blocks 18 and 19 is repeated for the at least one further axial plane. If the connection parameter reaches the first limit value or the second limit value in the at least one further axial plane, and in particular in at least two further axial planes, the connection for the conductor element 2-5 can be enabled and the process can branch from block 21 to block 22. If the second limit value is not reached in at least one further axial plane, the connection of the conductor element 2-5 is evaluated as "not OK", so that the process branches from block 21 to block 23.

[0061] As described, the procedure can be carried out for the individual conductor elements 2-5, so that their connection to the conductor element receptacle 6 can be individually considered in determining the connection parameters. Scenarios can be taken into account in which the conductor element receptacle 6 is filled with a comparatively large amount of potting material, but this material may be unfavorably distributed.

[0062] Based on the connection parameter or at least one of the defined connection parameters, the device 1 can generate a setting and / or change of at least one process parameter for the manufacture of electrical machines 7. Fig.Figure 1 illustrates, purely by way of example, that the process parameter can be used to adjust a manufacturing device 24 designed for the production of electrical machines 7, or that the process parameter of the manufacturing device 24 can be changed based on at least one connection parameter determined according to the described method. The manufacturing device 24 is specifically designed for potting conductor elements 2-5 in conductor element receptacles 6. The process parameter relates in particular to the fill quantity of the potting material.

[0063] The advantages, details and features described in the individual embodiments can be combined, interchanged and transferred to one another as desired. REFERENCE MARK LIST 1 Device 2-5 conductor element 6 conductor element attachment 7 electric machine 8 Recording device 9, 10 sheet metal package area 11 Conductor element area 12 radius range 13 edge area 14 Sheet metal package area 15-23 Block 24 Manufacturing device

Claims

Method for determining a connection parameter of at least one electrical conductor element (2-5) in a conductor element receptacle (6), in particular a stator slot, of an electrical machine (7), wherein a fill level of a potting compound surrounding at least one conductor element (2-5) in the conductor element receptacle (6) at least sectionally is determined, in particular by optical detection of a cross-sectional image of the conductor element receptacle (6), characterized in that, by means of a detection device (8), at least one connection parameter is determined for at least two conductor elements (2-5) received in the conductor element receptacle (6) based on a detection of a fill level for each of the at least two conductor elements (2-5), in particular all conductor elements (2-5) received in the conductor element receptacle (6). Method according to claim 1, characterized in that at least one connection parameter is determined for the at least two conductor elements (2-5) by means of an image evaluation algorithm based on a surface of a polished section of the conductor element receptacle (6) filled with potting compound. Method according to claim 1 or 2, characterized in that the connection parameter for at least one conductor element (2-5) is determined based on at least two different filling parameters. Method according to one of the preceding claims, characterized in that the connection parameter for at least one conductor element (2-5) is determined based on a lamination stack filling parameter describing a connection of the conductor element (2-5) to a lamination stack and / or based on a conductor element filling parameter describing a connection of the conductor element (2-5) to an adjacent conductor element (2-5). Method according to claim 4, characterized in that the sheet metal stack filling parameter is divided into a radius filling parameter in a radius area (12) of at least one conductor element (2-5) and into an edge filling parameter in an edge area (13) of the conductor element (2-5). Method according to one of claims 3 to 5, characterized in that at least two different filling parameters, in particular the sheet metal stack filling parameter and / or the conductor element filling parameter and / or the radius filling parameter and / or the edge filling parameter, are weighted differently when determining the connection parameter. Method according to one of the preceding claims, characterized in that the at least one connection parameter is determined in at least two different axial planes of the conductor element receptacle (6). Method according to one of the preceding claims, characterized in that at least one connection parameter of certain type for at least one conductor element (2-5) is compared with a first limit value based on a lamination stack filling parameter, wherein, if the connection parameter is below the first limit value, a connection parameter of certain type for the same conductor element (2-5) is compared with a second limit value based on the lamination stack filling parameter and the conductor element filling parameter, wherein a release parameter is determined based on the comparison between the connection parameters with the first or the second limit value. Method according to claim 8, characterized in that if the connection parameter determined on the basis of the sheet metal stack filling parameter and the conductor element filling parameter falls below the second limit value for the same conductor element (2-5), the connection parameter is determined in at least one further axial plane, in particular in two further axial planes, of the conductor element receptacle (6). Device (1) for determining a connection parameter of at least one electrical conductor element (2-5) in a conductor element receptacle (6), in particular a stator slot, of an electrical machine, wherein the device is configured to determine a fill level of a potting compound surrounding at least one conductor element (2-5) in the conductor element receptacle (6) at least sectionally, in particular by means of optical detection of a cross-sectional image of the conductor element receptacle (6), characterized in that the device is configured to determine, by means of a detection device (8), at least one connection parameter for at least two conductor elements (2-5) received in the conductor element receptacle (6) based on a detection of a fill level for each of the at least two conductor elements (2-5), in particular all conductor elements (2-5) received in the conductor element receptacle (6).

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