Electrical / Electronic-Components

By metallurgically bonding the heat conducting element to the electrical/electronic component using a solder gap and heating device, the method addresses thermal resistance issues, enhancing cooling efficiency and reducing failure rates in vehicle components.

DE102024137328A1Pending Publication Date: 2026-06-18BAYERISCHE MOTOREN WERKE AG
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Patent Information

Application Number
DE102024137328
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2026-06-18

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Abstract

The disclosure relates to an electrical / electronic component (1) for a motor vehicle, comprising at least one electrical or electronic component (2) and a heat-conducting element (4) which is arranged on at least one surface (6) of the component (2) to be cooled and is designed to conduct heat away from the component (2), wherein the heat-conducting element (4) is connected to the at least one surface (6) to be cooled via a metallurgical bond. Furthermore, the disclosure relates to a method for manufacturing an electrical / electronic component (1) according to the disclosure.
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Citation Information

Patent Citations

  • Electrical / electronic component for a motor vehicle and method for cooling an electrical or electronic component of an electrical / electronic component for a motor vehicle

    DE102024118149A1

  • Circuit configuration has two construction elements with contact surface in each element and contact surfaces is roughened and construction element is galvanically or mechanically connected

    DE102007021073A1

  • Cooling device for an electrical component for a power converter and electrical component

    DE102023203521A1

  • Cooling unit for tempering heat-generating components of a power module

    DE102024201508A1

  • Semiconductor device having metallic plate with groove

    US20070057373A1