Device for the diagnosis, analysis, optimization and stress testing of electronic assemblies

Abstract

(Main claim): Device for diagnosing, analyzing, optimizing and stress testing electronic assemblies, comprising: 1.1 one or more near-field probes and / or 1.2 one or more sensors for current or voltage monitoring, including Hall effect sensors, and / or 1.3 one or more sensors for temperature or heat measurement, and / or 1.4 one or more needle adapters or pogo pin contacts, and / or 1.5 mechanical and / or acoustic sensors, including strain gauges or acoustic emission sensors, and / or 1.6 Humidity or optical sensors, and / or 1.7 Integration into climate chambers or vibration test benches, and / or 1.8 a shield or defined electromagnetic environment, e.g. in an absorber chamber or GTEM cell, wherein the selection, combination and sequence of the components depends on the complexity of the assembly and the desired test depth, 1.9 a data acquisition unit that simultaneously or sequentially acquires and stores the selected sensor signals, whereby different measurement systems can be used individually or in combination, as well as 1.10 an evaluation unit that compares the collected data with stored reference patterns or enables manual analysis.

Description

Title of the invention:

[0001] Device for the diagnosis, analysis, optimization and load testing of electronic assemblies using combined near-field, current, temperature and optional additional sensors. 2. Technical field

[0002] The invention relates to the field of fault diagnosis, analysis, quality control and stress testing of electronic printed circuit boards, in particular for repair centers, service workshops, series production, development and qualification tests. 3. State of the art

[0003] Current solutions require circuit diagrams, software access, or invasive measurements (e.g., soldering at test points). Non-invasive or minimally invasive diagnostics, simple analysis of functioning assemblies, and observation of behavior under load have so far only been possible with considerable effort. 4. Object of the invention

[0004] The aim is to provide a device that enables simple, flexibly adaptable diagnosis and analysis of electronic assemblies, even without a circuit diagram or software access.

[0005] The device is intended to allow, among other things: 1. To record the sequence in which functional areas are activated after switching on, 2. to identify faulty or inactive areas, 3. To record power consumption, activity patterns or temperature behavior during operation, 4. To save boot and operating sequences of functioning assemblies as reference patterns, 5. To identify functional dependencies between assembly areas, 6. To examine assemblies under targeted stress or aging conditions, 7. To characterize assemblies under defined electromagnetic conditions. 5. Solution to the task

[0006] The task is solved by a device with the following features: • one or more near-field probes for detecting electromagnetic activity, • Sensors for current or voltage monitoring (e.g. shunt, Hall sensor, current clamp), • Optional sensors for temperature or heat measurement (e.g. thermocouple, IR camera), • Optional electrical contact measurement via needle adapter or pogo pins, • optional mechanical and acoustic sensors (e.g. strain gauges, vibration sensors), • optional humidity or optical sensors, • Optional integration into climate chambers or vibration test benches, • optional shielding or defined electromagnetic environment conditions (e.g. absorber chamber or GTEM cell), • a data acquisition unit for recording the sensor signals simultaneously or sequentially, an evaluation unit for analysis and comparison with reference patterns. 6. Types of Design 6.1 Hardware

[0007] The device comprises at least one near-field probe, sensors for current or voltage monitoring, and a data acquisition unit.

[0008] Extensions can be added as desired (temperature, vibration, humidity or optical sensors, integration into test benches, EMC-optimized environments).

[0009] Examples of data acquisition units include oscilloscopes, spectrum analyzers, logic analyzers, or software-defined radios.

[0010] The device is designed so that a first assembly (reference assembly) and a second assembly (test specimen) can be operated successively on the same device, with all sensors remaining in their original positions.

[0011] The evaluation unit compares the stored reference data with the measurement data of the second assembly and determines characteristic deviations for the localization of defects.

[0012] A mechanical mount or an XY(Z) system ensures that the sensors always occupy the same positions. 6.2 Evaluation • Manually: through visual analysis of the time diagrams and comparison with known patterns. • Optionally automated: through software with pattern recognition, e.g. AI-supported. 7. Advantages • Flexible - can be used with few or many sensors depending on requirements • Non-invasive or minimally invasive • Usable without schematics or debug ports • Suitable for repair centers, refurbishing, mass production and development • Also enables stress tests, climate tests and vibration analyses • Creation of reference data sets for quality control, batch variation and long-term observation

Claims

[1] (Main claim): Device for diagnosing, analyzing, optimizing and stress testing electronic assemblies, comprising: 1.1 one or more near-field probes and / or 1.2 one or more sensors for current or voltage monitoring, including Hall effect sensors, and / or 1.3 one or more sensors for temperature or heat measurement, and / or 1.4 one or more needle adapters or pogo pin contacts, and / or 1.5 mechanical and / or acoustic sensors, including strain gauges or acoustic emission sensors, and / or 1.6 Humidity or optical sensors, and / or 1.7 Integration into climate chambers or vibration test benches, and / or 1.8 a shield or defined electromagnetic environment, e.g. in an absorber chamber or GTEM cell, wherein the selection, combination and sequence of the components depends on the complexity of the assembly and the desired test depth, 1.9 a data acquisition unit that simultaneously or sequentially acquires and stores the selected sensor signals, whereby different measurement systems can be used individually or in combination, as well as 1.10 an evaluation unit that compares the collected data with stored reference patterns or enables manual analysis. [2] Device according to claim 1, characterized by, that deviations or characteristic patterns in activity, current consumption, temperature behavior, mechanical vibrations, humidity or EM behavior are used to locate faulty or inactive functional areas, assess quality, optimize operational processes or evaluate long-term stability. [3] Device according to any one of the preceding claims, characterized by that it is set up for the sequential operation of a reference assembly and a test assembly, with all sensors remaining in unchanged position and the evaluation unit comparing the measurement results of the two assemblies. [4] Device according to any one of the preceding claims, characterized by that the sensors are mounted on adjustable support arms or an XY(Z) movement system, which enables automated scanning of different positions of the electronic assembly. [5] Device according to any one of the preceding claims, characterized by that the device includes a power supply with programmable current and voltage control to set defined operating and load conditions of the assembly. [6] (Use claim): Use of a device according to one of the preceding claims for the creation of reference data sets for quality control, serial variation or long-term stability analysis of electronic assemblies.