Modular cuff system for adaptive thermal coupling to cylindrical and prismatic thermal conductors
DE202026002121U1Undetermined Publication Date: 2026-07-16TOPNIK MICHAEL
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Patent Information
- Application Number
- DE202026002121
- Authority / Receiving Office
- DE · DE
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2026-04-23
- Publication Date
- 2026-07-16
- Estimated Expiration
- 2036-04-30
Abstract
Modular cuff system for adaptive thermal coupling to cylindrical and prismatic thermal conductors, characterized in that the cuff consists of a plurality of articulated segments (10) which enable a positive-locking adaptation to different conductor geometries.
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