Polishing Pad

Abstract

This product is a polishing pad mainly used for polishing electronic devices and electronic components. This product is composed of a base layer and a polishing layer bonded together. In order to prevent the surface of the polished object from becoming wavy after polishing the object with the polishing pad, the centers of the concentric grooves formed in each layer of the polishing layer and base layer are slightly shifted from the center of each layer, eliminating an escape route for the polishing pressure. This suppresses the repulsion of the polishing layer and prevents the surface of the polished object from becoming wavy.

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