Information processor, information processing method, program, exposure method, substrate processor and producing method of article

Abstract

To provide an information processor advantageous for calculating a positioning amount corresponding to each of a plurality of shot regions.SOLUTION: An information processor has a processing unit that generates a regression model using a first value based on a measurement result of a position of a mark provided for each of a plurality of shot regions on a first substrate, and based on a second value based on the measurement result of the position of the mark provided on a sample shot region among a plurality of shot regions on a second substrate and the regression model, and a positioning amount used for positioning of a plurality of non-sample shot regions different from the sample shot region among the plurality of shot regions on the second substrate is obtained, the number of the plurality of shot regions on the first substrate that performs the measurement of the position of the mark is more than the number of the sample shot regions.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an information processing apparatus, an information processing method, a program, an exposure method, a substrate processing apparatus, and a method for manufacturing an article. [Background technology]

[0002] In the manufacturing process of semiconductor devices, liquid crystal display devices, etc., there are cases where an alignment amount (correction amount) used when aligning each of a plurality of shot areas on a substrate is obtained. Patent Document 1 describes a method of measuring the positions of marks provided in sample shot areas and approximating the deformation of the substrate to obtain an alignment amount corresponding to each of a plurality of shot areas. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-103216 A Summary of the Invention [Problem to be solved by the invention]

[0004] Here, when the position of a mark provided in a sample shot area is measured and the alignment amount of a non-sample shot area obtained by approximating the deformation of the substrate is used for alignment, the alignment accuracy in the non-sample shot area may be reduced.

[0005] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, an object of the present invention is to provide an information processing apparatus that is advantageous in calculating the amount of alignment corresponding to each of a plurality of shot regions. [Means for solving the problem]

[0006] In order to achieve the above object, an information processing device as one aspect of the present invention has a processing unit that generates a regression model using a first value based on measurement results of a position of a mark provided in each of a plurality of shot areas on a first substrate, and determines an alignment amount used for aligning a plurality of non-sample shot areas different from the sample shot areas among the plurality of shot areas on the second substrate based on a second value based on measurement results of a position of a mark provided in a sample shot area among the plurality of shot areas on the second substrate and the regression model, and the number of the plurality of shot areas on the first substrate for measuring the position of the mark is greater than the number of the sample shot areas.

[0007] Further objects or other aspects of the present invention will become apparent from the embodiments described below with reference to the drawings. Effect of the Invention

[0008] According to the present invention, it is possible to provide an information processing apparatus that is advantageous in calculating the alignment amount corresponding to each of a plurality of shot regions. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic view showing a configuration of a substrate processing apparatus in a first embodiment. [Diagram 2] 5A and 5B are schematic diagrams showing a method for measuring the position of a fine movement stage by a laser interferometer system. [Diagram 3] This is an example in which positional deviation occurs in each of a plurality of shot areas on a substrate. [Figure 4] 4 is a flowchart for generating a regression model in advance in the first embodiment. [Diagram 5] 4 is a flowchart when exposing a substrate in the first embodiment. [Figure 6] 13 is an example of calculating the alignment amount of a non-sample shot area in the first embodiment. [Figure 7]10 is a flowchart of a method for manufacturing an article in a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the following embodiment does not limit the invention according to the claims. Although the embodiment describes a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] In addition, in this specification and drawings, directions are basically indicated by an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are mutually orthogonal. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

[0012] A specific configuration will be described below for each embodiment.

[0013] First Embodiment FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 in this embodiment. In this embodiment, the substrate processing apparatus 1 is a projection exposure apparatus that exposes a pattern of an original (mask, reticle) onto a substrate via a projection optical system by a step-and-repeat method or a step-and-scan method. However, the substrate processing apparatus 1 is not limited to a projection exposure apparatus. For example, the substrate processing apparatus 1 may be a drawing apparatus that draws on a substrate using an electron beam or an ion beam, etc., to form a pattern on the substrate. The substrate processing apparatus 1 may also be another lithography apparatus (substrate exposure apparatus), for example, an imprint apparatus that forms a pattern on the substrate by molding an imprint material on the substrate using a mold. Alternatively, the substrate processing apparatus 1 may be another apparatus for processing a substrate such as a semiconductor wafer or a glass plate, such as an ion implantation apparatus, a development apparatus, an etching apparatus, a film formation apparatus, an annealing apparatus, a sputtering apparatus, or a deposition apparatus. The substrate processing apparatus 1 may also be a planarization apparatus that planarizes a composition on a substrate using a flat plate.

[0014] The substrate processing apparatus 1 includes an illumination optical system 12 for irradiating light, a projection optical system 15, a reticle stage 14 for holding a reticle 13, a substrate stage 20 that can be driven (moved) while holding a substrate 16, and a measurement unit (detection unit) 30. The substrate processing apparatus 1 further includes a processing unit 40, a control unit 41, and a storage unit 42. The reticle 13 is, for example, an original plate on which a pattern to be transferred (for example, a circuit pattern) is formed on the surface of quartz glass with chromium. The substrate 16 is, for example, single crystal silicon, and when the substrate processing apparatus 1 is an exposure apparatus, the substrate 16 transported to the substrate processing apparatus 1 has a photosensitive material (resist) applied on its surface. Here, the illumination optical system 12 is a pattern forming unit that forms a pattern on the substrate 16. In this embodiment, an example of a lithography apparatus that forms a pattern using light is shown, and the pattern forming unit is the illumination optical system 12, but it may be a lithography apparatus that hardens a thermosetting material to which a pattern has been transferred by heat. In this case, the pattern forming section is, for example, a heating section that heats the thermosetting material. The processing section 40 is an information processing device (information processing section) that calculates an alignment amount (correction amount) to be described later.

[0015] The processing unit 40 may include a transmission unit 43, or may be communicably connected to the transmission unit 43. The transmission unit 43 transmits information on the alignment amount calculated by the processing unit 40 to the control unit 41. Here, the transmission unit 43 may transmit the information on the alignment amount calculated by the processing unit 40 to a display control unit (not shown) for controlling the display of a display unit (not shown) arranged in the substrate processing apparatus 1 or another device. In this case, the display control unit controls the display of the display unit based on the information on the alignment amount transmitted from the transmission unit 43 so that the user can visually recognize the calculated alignment amount. This display is displayed so as to correspond to the positions of multiple shot areas on the substrate 16, for example.

[0016] The control unit 41 controls each part in the substrate processing apparatus 1. The storage unit 42 stores programs and information used to perform exposure processing on the substrate 16. In this embodiment, the processing unit 40 is inside the substrate processing apparatus 1 and is separate from the control unit 41, but it may be inside the control unit 41 (or may be part of the control unit 41), or may be inside an information processing device outside the substrate processing apparatus 1. In addition, in this embodiment, the storage unit 42 is inside the substrate processing apparatus 1 and is separate from the control unit 41, but it may be inside the control unit 41 (or may be part of the control unit 41), or may be inside a storage device outside the substrate processing apparatus 1.

[0017] The processing unit 40 and the control unit 41 may be configured, for example, by a PLD such as an FPGA, or an ASIC, or a computer with a program built in, or a combination of all or part of these. FPGA is an abbreviation for Field Programmable Gate Array. PLD is an abbreviation for Programmable Logic Device. ASIC is an abbreviation for Application Specific Integrated Circuit. The processing unit 40 and the control unit 41 include a CPU, and each component functions according to a program stored in the storage unit 42. The CPU performs calculations for control according to the program. The storage unit 42 is also used as a temporary storage area for programs of the operating system (OS) of the processing unit 40 and the control unit 41, and data. It is preferable that the storage unit 42 is a non-volatile storage device that can store data as permanent data so that the data can be referenced for a long period of time. The storage device is mainly configured as a magnetic storage device (HDD), but may also be a device that reads and writes data by loading external media such as CDs, DVDs, and memory cards.

[0018] The substrate stage 20 has an XY stage 23 that can move in the XY plane, a fine movement stage 22 that is placed on the XY stage 23 and can be finely moved, and a substrate chuck 21 that holds the substrate 16 while being held by the fine movement stage 22. The fine movement stage 22 can be moved (driven) in the X-axis direction, the Y-axis direction, the Z-axis direction (the optical axis direction of the projection optical system 15), the θx-axis direction, the θy-axis direction, and the θz-axis direction. In other words, the fine movement stage 22 can be moved (driven) in six axial directions. Here, the θx-axis direction is the rotation direction around the X-axis, the θy-axis direction is the rotation direction around the Y-axis, and the θz-axis direction is the rotation direction around the Z-axis. Also, the position in the θx-axis direction means the rotation angle around the X-axis, the position in the θy-axis direction is the rotation angle around the Y-axis, and the θz-axis direction is the rotation angle around the Z-axis.

[0019] 2 is a schematic diagram showing a method for measuring the position of fine movement stage 22 by a laser interferometer system. The position of fine movement stage 22 in the X-axis direction is measured using X bar mirror 100 and laser interferometer 110. The position of fine movement stage 22 in the Y-axis direction is measured using Y bar mirror 200 and laser interferometer 210. X bar mirror 100 is provided on a side surface of fine movement stage 22 to extend in the Y-axis direction, and Y bar mirror 200 is provided on a side surface of fine movement stage 22 to extend in the X-axis direction.

[0020] First, a method for measuring the position of the fine movement stage 22 in the X-axis direction will be described. The laser interferometer 110 includes three laser interferometers. The laser interferometer 112 is disposed at the same horizontal position (same position in the X-axis and same position in the Y-axis) as the laser interferometer 111, and at a position spaced apart from the laser interferometer 111 in the height direction (Z-axis direction) by an interval Δz. From the measurement results of the laser interferometers 111 and 112, a deviation amount θy in the rotation direction around the Y-axis can be measured. The laser interferometer 113 is disposed at the same height (same position in the Z-axis) as the laser interferometer 111, and at a position spaced apart from the laser interferometer 111 in the horizontal direction (Y-axis direction) by an interval Δy. From the measurement results of the laser interferometers 111 and 113, a deviation amount θz in the rotation direction around the Z-axis in the XY plane can be measured.

[0021] Next, a method for measuring the position of the fine movement stage 22 in the Y-axis direction will be described. The laser interferometer 210 includes three laser interferometers. The laser interferometer 212 is disposed at the same horizontal position (same position in the X-axis and same position in the Y-axis) as the laser interferometer 211, and at a position spaced apart from the laser interferometer 211 in the height direction (Z-axis direction) by an interval Δz. From the measurement results of the laser interferometers 211 and 212, the deviation amount θx in the rotation direction around the X-axis can be measured. The laser interferometer 213 is disposed at the same height (same position in the Z-axis) as the laser interferometer 211, and at a position spaced apart from the laser interferometer 211 in the horizontal direction (X-axis direction) by an interval Δx. From the measurement results of the laser interferometers 211 and 213, the deviation amount θz in the rotation direction around the Z-axis in the XY plane can be measured. With the above-mentioned configuration, the position of the fine movement stage 22 is measured. In this embodiment, an example is shown in which a bar mirror is installed on the side of fine movement stage 22, but the bar mirror may be installed on the top of fine movement stage 22, and there are no particular limitations on the installation position. In this embodiment, an example is shown in which the position of fine movement stage 22 is measured by an interferometer system, but the position of fine movement stage 22 may be measured by another means such as an encoder.

[0022] The measurement unit 30 is, for example, an off-axis scope, and is used to position the substrate 16 and measure (detect) the positions of a plurality of pattern areas on the substrate 16. Specifically, it measures (detects) the relative position and attitude relationship between an alignment mark (not shown) provided in each of a plurality of shot areas on the substrate 16 and a reference mark (not shown) on the fine movement stage 22. In this embodiment, the relative position and attitude relationship between the reference mark measured by the measurement unit 30 and the alignment mark provided in the shot area may be referred to as the measurement result of the position of the mark provided in the shot area.

[0023] In the substrate processing apparatus 1, exposure light from a light source (not shown) passes through an illumination optical system 12 and illuminates a reticle 13 held on a reticle stage 14. The light transmitted through the reticle 13 passes through a projection optical system 15 and is irradiated onto a substrate 16. At this time, light from a pattern formed on the reticle 13 forms an image on the surface of the substrate 16, and the substrate 16 (photosensitive material) is exposed to the pattern image. The substrate processing apparatus 1 exposes a shot area on the substrate 16 in this manner, and performs similar exposure on each of a plurality of shot areas.

[0024] FIG. 3 shows an example in which a positional deviation occurs in each of a plurality of shot areas on the substrate 16. In the example of FIG. 3, a rectangular area shown by a dashed line is an ideal shot area 50, and a rectangular area shown by a solid line is an actual shot area 51. As shown in FIG. 3, the actual shot area 51 may be misaligned with respect to the ideal shot area 50. Since overlay accuracy is important in the exposure process, it is necessary to perform exposure while using an alignment amount for correcting the amount of positional deviation. Therefore, during exposure, an alignment amount is obtained based on the measurement result by the measurement unit 30 (measurement result of the position of a mark provided in the shot area), the target position of the mark (in the shot area), the amount of positional deviation, and the like. Then, using the obtained alignment amount, the substrate stage 20 (fine movement stage 22) is controlled (the substrate stage 20 is driven) based on the measurement result of the position of the substrate stage 20, and alignment is performed for each of the plurality of shot areas on the substrate 16.

[0025] Here, by obtaining the alignment amount for all shot areas (the positions of marks provided therein) in all substrates 16 to be exposed, it is possible to appropriately correct the misalignment of each of the multiple shot areas (the positions of marks provided therein). However, this method reduces the number of substrates processed per unit time. Therefore, for example, there is a method of measuring the positions of marks provided in sample shot areas (shot areas to be measured) included in the multiple shot areas, approximating the deformation of the substrate, and obtaining the alignment amount corresponding to each of the multiple shot areas. However, when the position of the mark provided in the sample shot area is measured and the alignment amount of the non-sample shot area obtained by approximating the deformation of the substrate is used for alignment, the alignment accuracy of the non-sample shot area may be reduced.

[0026] Therefore, in this embodiment, a method advantageous for calculating the alignment amount corresponding to each of the multiple shot areas is disclosed. Specifically, the positions of marks provided in multiple shot areas including a shot area at a position corresponding to a non-sample shot area of ​​a substrate (second substrate) to be exposed are measured in advance for one or multiple substrates (first substrate, third substrate). For example, when there is one substrate for which the position of the mark is measured in advance, the substrate is the first substrate, and when there are multiple substrates for which the position of the mark is measured in advance, the multiple substrates are the first substrate and the third substrate. Note that in this embodiment, even if there are multiple substrates for which the position of the mark is measured in advance, the first substrate and the third substrate may be collectively referred to as the first substrate. Also, a value based on the measurement result of the position of the mark provided in the multiple shot areas on the first substrate is the first value, and a value based on the measurement result of the position of the mark provided in the multiple shot areas on the third substrate is the third value. Here, in this embodiment, the first value and the third value may be collectively referred to as the first value. In addition, the first value and the third value in this embodiment are a numerical value group including a plurality of numerical values ​​that are values ​​based on the measurement results of the positions of marks provided in a plurality of shot areas.

[0027] Then, in this embodiment, a regression model is generated using values ​​(first value, third value) based on the measurement results. This first value (third value) may be a measurement result of the position of a mark provided in a plurality of shot areas including a shot area at a position corresponding to a non-sample shot area of ​​the second substrate. Alternatively, this first value (third value) may be an alignment amount of a plurality of shot areas including a shot area at a position corresponding to a non-sample shot area of ​​the second substrate, which is obtained based on the measurement result. Alternatively, this first value (third value) may be a plurality of positional deviation amounts, which are differences between the target position and the measurement result of a mark provided in a shot area at a position corresponding to a non-sample shot area of ​​the second substrate.

[0028] Next, the amount of alignment of the non-sample shot area of ​​the substrate (second substrate) to be exposed is calculated based on the regression model and a value (second value) based on the measurement result of the position of the mark provided in the sample shot area of ​​the substrate (second substrate) to be exposed. This second value may be the measurement result of the position of the mark provided in the sample shot area of ​​the second substrate. Alternatively, this second value may be the amount of alignment of the sample shot area of ​​the second substrate calculated based on the measurement result. Alternatively, this second value may be the amount of misalignment which is the difference between the target position of the mark provided in the sample shot area and the measurement result. The regression model is generated according to the type of the first value and the second value (measurement result, alignment amount, or misalignment amount). Note that the second value in this embodiment is a numerical value group including a plurality of numerical values ​​which are values ​​based on the measurement result of the position of the mark provided in the sample shot area.

[0029] Here, it is assumed that the arrangement of the sample shot areas and non-sample shot areas set on the substrate (second substrate) to be exposed is the same as the arrangement of the multiple shot areas on the substrate (first substrate) for which the mark positions are measured in advance. In other words, the positions of the multiple shot areas on the first substrate match any of the positions of the multiple shot areas on the second substrate.

[0030] Furthermore, it is assumed that the substrate processing conditions (exposure processing conditions, recipe) of the substrate that will be exposed and the substrate processing conditions (exposure processing conditions, recipe) of the substrate for which the mark positions are measured in advance are the same.

[0031] In this embodiment, a first value based on a measurement result of the position of a mark provided in a shot area on a first substrate corresponding to a non-sample shot area on a second substrate is used to generate a regression model used to calculate the alignment amount of a non-sample shot area. Specifically, a first value based on a measurement result of the position of a mark provided in a shot area on a first substrate corresponding to at least one non-sample shot area among a plurality of non-sample shot areas on a second substrate is used to generate a regression model. Then, a value input to the regression model is a second value based on a measurement result of the position of a mark provided in a sample shot area of ​​the second substrate. In this way, the regression model of this embodiment is generated using a first value including a value based on a measurement result of a shot area corresponding to a non-sample shot area. Therefore, the method of calculating the alignment amount of a non-sample shot area of ​​this embodiment has a higher accuracy of the alignment amount than a method of calculating the alignment amount of a non-sample shot area by approximating the deformation of a substrate based on the measurement result of the position of a mark provided in a sample shot area. Therefore, by performing alignment of each of a plurality of shot areas using the alignment amount calculated by this embodiment, the alignment accuracy (overlay accuracy) can be improved.

[0032] FIG. 4 is a flow chart for generating a regression model in advance in this embodiment. First, the processing unit 40 selects a substrate (first substrate) for which the measuring unit 30 measures (detects) the position of a mark provided in a shot region in order to generate a regression model (S110). Then, the measuring unit 30 measures the position of a mark provided in each of the multiple shot regions on the substrate selected in step S110 (S120). Here, in step S120, the positions of all shot regions corresponding to the sample shot region of the substrate (second substrate) to be exposed from now are measured. Furthermore, in step S120, the positions of at least one of the multiple shot regions corresponding to multiple non-sample shot regions different from the sample shot region of the second substrate are measured. That is, the number of multiple shot regions on the first substrate for measuring the position of the mark is greater than the number of sample shot regions. Note that it is preferable to measure the positions of all shot regions on the substrate. In addition, when multiple alignment marks are provided in one shot region, measurement may be performed for each alignment mark. Furthermore, when the measurement results of a plurality of shot areas on the first substrate are used as the first value for generating the regression model, step S130 is not performed, and step S140 is performed after step S120.

[0033] Next, the processing unit 40 obtains an alignment amount (first value) for the shot area on the first substrate based on the measurement result of step S120 (S130). This alignment amount is a value based on the measurement result of the position of the mark provided in the shot area in step S120 (positional deviation of the mark provided in the shot area), and is a value for correcting the positional deviation of the mark. The alignment amount of the mark provided in the shot area is performed using this first value. That is, the alignment amount is the same as the positional deviation amount. Here, when a plurality of alignment marks are provided in one shot area, the alignment amount may be obtained based on the measurement result of each alignment mark. Alternatively, one value obtained based on the measurement result of each alignment mark may be set as one alignment amount corresponding to one shot area. Note that, when the measurement results of the plurality of shot areas of the first substrate are used as the first value, step S120 is the first acquisition step, and when the alignment amount (positional deviation amount) of the first substrate is used as the first value, step S130 is the first acquisition step.

[0034] Here, if there is a shot area for which the first value could not be obtained, the first value of the target shot area is interpolated (estimated). For example, this is the case when the position measurement is not performed for all shot areas on the substrate in step S120. Alternatively, there is a shot area for which the measurement unit 30 has not normally measured the position of the mark provided in the shot area. Alternatively, there is a shot area for which no mark is provided. In these cases, the first value of a shot area located close to (for example, adjacent to) the target shot area is used. Alternatively, when step S120 is performed for multiple substrates, the first value of a shot area located at the same position as the target shot area on another substrate or the average value thereof is used. Alternatively, a regression model may be generated based on the target position of the alignment of the shot area on another substrate and the first value of the shot area, and the first value of the target shot area may be obtained from the generated regression model. This regression model is a regression model in which the target position of the alignment of the target shot area is an explanatory variable and the first value of the target shot area is an objective variable.

[0035] Next, the processing unit 40 judges whether or not the first values ​​used to generate the regression model have been acquired for all the target substrates (S140). In other words, it judges whether or not the substrate for which the first value was acquired immediately before is the final substrate among the substrates for which the first value is to be acquired. For example, if there is one substrate (first substrate) for which the first value is to be acquired, the process proceeds to step S150. For example, if there are 25 substrates for which the first value is to be acquired, and first values ​​have been acquired for 20 substrates, the process returns to step S110 until first values ​​have been acquired for 25 substrates.

[0036] Next, one shot area is selected from the multiple shot areas of the first substrate corresponding to the non-sample shot area of ​​the second substrate (S150). Then, a regression model is generated for the selected shot area (S160, generation step). The regression model is generated based on a first value acquired for one or more substrates on which the position of the mark is measured in advance. The regression model may be generated in consideration of the characteristics (e.g., the tendency of the substrate to be distorted at the outer periphery) of the selected shot area at the position (coordinate) on the substrate. This regression model uses a second value based on the measurement result of the position of the mark provided in the sample shot area of ​​the substrate (second substrate) to be exposed from now as an input value (explanatory variable), and uses the alignment amount of the non-sample shot area of ​​the second substrate as an output value (objective variable, predicted value). Here, for example, when multiple alignment marks are provided in one shot area, each of the second values ​​based on the measurement result of each alignment mark may be used as an input value (explanatory variable). Alternatively, one value obtained from these second values ​​may be used as an input value (explanatory variable).

[0037] Next, the processing unit 40 determines whether or not regression models have been generated for all of the shot areas of the first substrate that correspond to the non-sample shot areas of the second substrate (S170). If regression models have been generated for all of the shot areas, the process ends. If regression models have not been generated for all of the shot areas, the process returns to step S150. In this manner, in this embodiment, a regression model for determining the alignment amount for each of the non-sample shot areas on the second substrate is generated in advance.

[0038] 5 is a flow chart for exposing a substrate in this embodiment. First, the position of a mark provided in a sample shot area of ​​the substrate 16 (second substrate) to be exposed is measured (S210). If multiple alignment marks are provided in one shot area, each alignment mark may be measured. Here, the measurement result of this step S210 may be used as a second value to be input to the regression model.

[0039] Next, the processing unit 40 obtains an alignment amount (second value) for each measurement result of step S210 (S220). That is, an alignment amount (misalignment amount) is obtained for the sample shot area. Here, when a plurality of alignment marks are provided in one shot area, the alignment amount may be obtained based on the measurement result of each alignment mark. Alternatively, one alignment amount obtained based on the measurement result of each alignment mark may be one alignment amount corresponding to one shot area. Note that, when the measurement result of the sample shot area of ​​the second substrate is used as the second value, step S210 is the second acquisition step, and when the alignment amount (misalignment amount) of the second substrate is used as the second value, step S220 is the second acquisition step.

[0040] Here, the second value of the target shot area for which the second value could not be obtained is interpolated (estimated). For example, the second value of a shot area at the same position as the target shot area on a substrate under the same exposure processing conditions measured in the past or their average value is used. Alternatively, a regression model may be generated based on the target positions of alignment of other sample shot areas and the second values ​​of the other sample shot areas, and the second value of the target shot area may be obtained from the generated regression model. This regression model is a regression model in which the target positions of alignment of the target shot area are the explanatory variable and the second value of the target shot area is the objective variable.

[0041] Next, the processing unit 40 selects one non-sample shot area from the non-sample shot areas (S230). Then, the processing unit 40 calculates the alignment amount of the non-sample shot area based on the regression model and the second value (S240, calculation step).

[0042] Here, the regression model used in step S240 is a regression model that corresponds to the position (coordinates) of the selected non-sample shot area on the substrate. This regression model uses a second value based on the measurement result of the position of the mark provided in the sample shot area of ​​the second substrate to be exposed as an input value (explanatory variable), and uses the alignment amount of the non-sample shot area as an output value (objective variable).

[0043] Here, step S240 will be described with reference to FIG. 6. FIG. 6 is an example of obtaining the alignment amount of a non-sample shot area in this embodiment. The substrate 16 (second substrate) to be exposed contains 16 shot areas, each of which is indicated by a number from 1 to 16. Here, the numbers 1, 4, 6, 11, 12, and 13 are sample shot areas, and the other shot areas are non-sample shot areas. For each of the non-sample shot areas, a regression model is obtained by the above-mentioned method. For example, a case of obtaining the alignment amount for the non-sample shot area numbered 2 will be described. In this case, a second value based on the measurement result of the positions of the marks provided in the sample shot areas numbered 1, 4, 6, 11, 12, and 13 is input to the regression model corresponding to the numbered 2 to obtain the alignment amount for the numbered 2.

[0044] Next, the processing unit 40 determines whether or not the alignment amounts have been obtained for all non-sample shot areas on the substrate 16 (second substrate) to be exposed (S250). If the alignment amounts have been obtained for all non-sample shot areas, the process proceeds to step S260. If the alignment amounts have not been obtained for all non-sample shot areas, the process returns to step S230. As described above, in this embodiment, the alignment amounts of the non-sample shot areas of the substrate 16 to be exposed are obtained. Note that steps S130 to S170 in the flowchart of FIG. 4 and steps S220 to S250 in the flowchart of FIG. 5 are information processing methods performed by the processing unit 40 in accordance with a program stored inside.

[0045] Next, while performing alignment using the obtained alignment amount (with the control unit 41 controlling the alignment with respect to the substrate stage 20), each of the multiple shot areas on the substrate is exposed (S260, exposure process), and the process ends. Note that before starting the exposure process, the control unit 41 acquires the alignment amount of the sample shot area obtained in step S220 and the alignment amount of the non-sample shot area obtained in step S240. Note that if the substrate processing apparatus 1 is not an exposure apparatus, the process performed in step S260 is not a process for forming a pattern, but a process performed by the substrate processing apparatus 1.

[0046] In the case where a regression model corresponding to the arrangement of the shot areas and the exposure processing conditions (recipe) of the second substrate to be exposed has not been generated, a regression model is generated by the first substrate corresponding to the arrangement of the shot areas and the exposure processing conditions (recipe) of the second substrate, and the storage unit 42 stores the regression model generated for each of the arrangement of the shot areas and the exposure processing conditions (recipe) in correspondence with the arrangement of the shot areas and the exposure processing conditions (recipe). Then, when processing the second substrate having the arrangement of the shot areas and the exposure processing conditions corresponding to the arrangement of the shot areas and the exposure processing conditions for which the regression model was generated, the alignment amount of the non-sample shot areas of the second substrate may be obtained using the regression model stored in the storage unit 42. Alternatively, for each substrate for which there is no suitable regression model, a regression model may be generated based on the target position of the alignment of the sample shot areas and the second value of the sample shot areas, and the alignment amount of the non-sample shot areas may be obtained from the generated regression model. This regression model is a regression model in which the target position of the alignment of the non-sample shot areas is an explanatory variable, and the alignment amount of the alignment of the non-sample shot areas is an objective variable.

[0047] Next, the regression model will be described in detail. In the following explanation, the regression model will be described as a multiple regression that predicts one objective variable with multiple explanatory variables. Let x1, x2, ..., xs be explanatory variables (alignment amount of sample shot areas on the second substrate), and w0, w1, ..., ws be coefficients that can be calculated from the first value acquired in advance. In addition, if s is the number of sample shot areas on the second substrate and y' is the objective variable (alignment amount of target non-sample shot areas on the second substrate), the regression model can be expressed as in formula (1). y'=w0+w1x1+w2x2+···+w s x s Formula (1)

[0048] The coefficient w can be calculated by the formula (2), where T represents the transposed matrix. w=(X T X) -1 X T y Equation (2)

[0049] Here, the coefficient w obtained by the formula (2) is a vector shown in the formula (3). w = (w0, w1, w2, , w s ) T Formula (3)

[0050] Furthermore, X in formula (2) is expressed by formula (4), and is a matrix that lists the first values ​​for the sample shot areas on the second substrate and the corresponding shot areas of the N substrates (first substrate, third substrate, etc.) for which the first values ​​have been calculated in advance. The constant 1 in the matrix is ​​a constant that is multiplied by the intercept w0 of the coefficients w0, w1, ..., ws.

[0051]

number

[0052] Furthermore, y in equation (2) is expressed by equation (5), and is a vector that lists the first values ​​of the target non-sample shot areas and the corresponding shot areas on the second substrate for N substrates (first substrates) for which the first values ​​have been calculated in advance. y=(y (1) ,y(2) ,···,y (N) ) T Formula (5)

[0053] In addition to multiple regression, other regression methods such as n-th order polynomial regression, linear regression, Ridge regression, Lasso regression, Gaussian process regression, and support vector regression may be used as the regression model. n-th order polynomial regression is a method in which explanatory variables of a regression model are expanded by n-th order polynomials to create new features, and multiple regression is performed based on the features. This method has a higher expressive power than multiple regression. Linear regression is a method in which explanatory variables of a regression model are passed through a feature conversion function Φ to create new features, and multiple regression is performed based on the features. This method has a higher expressive power than multiple regression. Ridge regression is a learning method that applies an L2 norm constraint to the coefficient values ​​of a linear regression model, and is expected to have an effect of suppressing overfitting. Lasso regression is a learning method that applies an L1 norm constraint to the coefficient values ​​of a linear regression model, and is expected to have an effect of suppressing overfitting and speeding up inference time. Gaussian process regression is a method that assumes that the relationship between explanatory variables and objective variables follows a Gaussian process, and does not have positive coefficients for the regression model. By expressing the relationship between data samples using a kernel function, it has high expressive power as a regression model. In addition, since the output probability distribution can be obtained by Bayesian estimation, not only the average but also the variance of the output can be obtained, making it possible to quantify the uncertainty of the inference. Like Gaussian process regression, support vector regression expresses the relationship between data samples using a kernel function, and has high expressive power as a regression model. In addition, since a dead zone is set for the regression error, the effect of noise in the data can be suppressed.

[0054] The same regression method may be used for all of the multiple shot areas on the substrate 16, or a different regression method may be used for each shot area. When a different regression method is used for each shot area, it is advisable to consider, for each shot area, a regression method capable of calculating an alignment amount that can achieve high alignment accuracy.

[0055] Although an example of generating a regression model for each non-sample shot area has been shown, a multi-output regression model that outputs multiple objective variables by inputting multiple explanatory variables may be used. For example, a regression model that outputs the alignment amounts of multiple non-sample shot areas of a substrate to be exposed when the alignment amounts of multiple sample shot areas of the substrate to be exposed are input may be used. In other words, a multi-output regression model may be generated that outputs the first alignment amount and the second alignment amount corresponding to the first non-sample shot area and the second non-sample shot area on the second substrate, respectively, by inputting a second value. In this case, the alignment amount of multiple non-sample shot areas can be obtained by one regression model, and it is not necessary to perform a calculation to obtain the alignment amount for each non-sample shot area. For example, a neural network is used as a multi-output regression model that takes multiple objective variables. Since the neural network learns to simultaneously minimize the errors of multiple objective variables, regression that captures the relationship between those variables can be realized, and improvement in accuracy can be expected.

[0056] As described above, by performing alignment using the alignment amount of the non-sample shot area calculated by the method according to this embodiment, it is possible to improve alignment accuracy (overlay accuracy).

[0057] <Second embodiment> 7 is a flowchart of a method for manufacturing an article in this embodiment. First, an exposure process is performed in which each of the multiple shot areas on a second substrate is exposed to light while performing alignment for each of the multiple shot areas (S310). Next, a manufacturing process is performed in which an article is manufactured from the second substrate exposed in the exposure process (S320).

[0058] Here, the alignment amount used for aligning non-sample shot areas different from the sample shot areas among the multiple shot areas on the second substrate is found based on a regression model and a second value. The regression model is a model generated using a first value based on the measurement results of the positions of marks provided in each of the multiple shot areas on the first substrate, which number is greater than the number of sample shot areas on the second substrate. The second value is a value based on the measurement results of the positions of marks provided in the sample shot areas on the second substrate.

[0059] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, and the like.

[0060] The manufacturing process includes, for example, developing a substrate (photosensitive material) on which a pattern is formed, etching the developed substrate, removing the resist, dicing, bonding, and packaging. According to this manufacturing method, it is possible to manufacture products of higher quality than conventional methods.

[0061] The disclosure of this specification includes the following information processing apparatus, information processing method, program, exposure method, substrate processing apparatus, and method for manufacturing an article.

[0062] [Item 1] a processing unit that generates a regression model using a first value based on a measurement result of a position of a mark provided in each of a plurality of shot areas on a first substrate, and obtains an alignment amount used for alignment of a plurality of non-sample shot areas different from the sample shot areas among the plurality of shot areas on the second substrate based on a second value based on a measurement result of a position of a mark provided in a sample shot area among the plurality of shot areas on the second substrate and the regression model, the number of the plurality of shot areas on the first substrate for measuring the positions of the marks is greater than the number of the sample shot areas; 23. An information processing apparatus comprising:

[0063] [Item 2] The information processing device described in item 1, characterized in that the first value and the second value are a measurement result of the position of the mark, a positional deviation amount which is the difference between the measurement result of the position of the mark and a target position of the mark, or an alignment amount used to align a shot area in which the position of the mark is measured.

[0064] [Item 3] 3. The information processing apparatus according to item 1 or 2, wherein the alignment amount is used to control a stage that can be driven while holding the second substrate.

[0065] [Item 4] 4. The information processing device according to any one of items 1 to 3, wherein the processing unit generates the regression model for each of the plurality of non-sample shot regions.

[0066] [Item 5] The information processing device described in any one of items 1 to 3, wherein the processing unit generates the regression model with multiple outputs, which outputs a first alignment amount and a second alignment amount corresponding to a first non-sample shot region and a second non-sample shot region, respectively, included in the plurality of non-sample shot regions, by inputting the second value.

[0067] [Item 6] The information processing device described in any one of items 1 to 5, characterized in that the positions of the multiple shot areas on the first substrate coincide with any of the positions of the multiple shot areas on the second substrate.

[0068] [Item 7] The information processing device of any one of items 1 to 6, wherein the processing unit generates the regression model using a first value based on a measurement result of a position of a mark provided in a shot area that corresponds to at least one non-sample shot area among a plurality of shot areas on the first substrate.

[0069] [Item 8] The information processing device described in any one of items 1 to 7, characterized in that the processing unit generates the regression model using a third value based on measurement results of positions of marks provided in each of a plurality of shot areas on a third substrate and the first value.

[0070] [Item 9] 9. The information processing apparatus according to any one of items 1 to 8, wherein the first substrate and the second substrate are subjected to the same exposure processing conditions.

[0071] [Item 10] 10. The information processing apparatus according to item 9, characterized in that the processing unit has a storage unit that stores the regression model generated for each of the exposure processing conditions.

[0072] [Item 11] 11. The information processing device according to any one of items 1 to 10, wherein the second value is an explanatory variable of the regression model, and the alignment amount is a response variable of the regression model.

[0073] [Item 12] The information processing device according to any one of items 1 to 11, further comprising a control unit that controls a stage that can be driven while holding the second substrate, or a transmission unit that transmits information regarding the alignment amount for display on a display unit.

[0074] [Item 13] a first acquisition step of acquiring a first value based on a measurement result of the position of a mark provided in each of a plurality of shot areas on a first substrate; a generating step of generating a regression model based on the first value acquired in the first acquiring step; a second acquisition step of acquiring a second value based on a measurement result of a position of a mark provided in a sample shot area among a plurality of shot areas on a second substrate different from the first substrate; a calculation step of determining an alignment amount used for alignment of a non-sample shot area, which is different from the sample shot area, among a plurality of shot areas on the second substrate, based on the second value acquired in the second acquisition step and the generated regression model, the number of the plurality of shot areas on the first substrate for measuring the positions of the marks is greater than the number of the sample shot areas; 23. An information processing method comprising:

[0075] [Item 14] a first acquisition step of acquiring a first value based on a measurement result of the position of a mark provided in each of a plurality of shot areas on a first substrate; a generating step of generating a regression model based on the first value acquired in the first acquiring step; a second acquisition step of acquiring a second value based on a measurement result of a position of a mark provided in a sample shot area among a plurality of shot areas on a second substrate different from the first substrate; a calculation step of determining an alignment amount used for alignment of a non-sample shot area, which is different from the sample shot area, among a plurality of shot areas on the second substrate, based on the second value acquired in the second acquisition step and the generated regression model, the number of the plurality of shot areas on the first substrate for measuring the positions of the marks is greater than the number of the sample shot areas; A program characterized by:

[0076] [Item 15] an exposure step of exposing each of a plurality of shot areas on a second substrate while performing alignment for each of the plurality of shot areas on the second substrate; An alignment amount used to control a stage that holds the second substrate in order to align a non-sample shot area different from a sample shot area among the multiple shot areas on the second substrate is is obtained based on a regression model generated using a first value based on measurement results of positions of marks provided in each of a plurality of shot areas, the number of which is greater than the number of the sample shot areas, on a first substrate different from the second substrate, and a second value based on measurement results of positions of marks provided in the sample shot areas. 13. An exposure method comprising:

[0077] [Item 16] a stage capable of holding and moving a substrate; a control unit that controls driving of the stage to perform alignment for each of a plurality of shot areas on a second substrate, An alignment amount used to control the stage for alignment of a non-sample shot area different from a sample shot area among the plurality of shot areas on the second substrate is is obtained based on a regression model generated using a first value based on measurement results of positions of marks provided in each of a plurality of shot areas, the number of which is greater than the number of the sample shot areas on a first substrate different from the second substrate, and a second value based on measurement results of positions of marks provided in the sample shot areas. The substrate processing apparatus according to claim 1,

[0078] [Item 17] an exposure step of exposing each of a plurality of shot areas on a second substrate while performing alignment for each of the plurality of shot areas on the second substrate; a manufacturing step of manufacturing an article from the second substrate exposed in the exposure step, An alignment amount used to control a stage that holds the second substrate in order to align a non-sample shot area different from a sample shot area among the multiple shot areas on the second substrate is is obtained based on a regression model generated using a first value based on measurement results of positions of marks provided in each of a plurality of shot areas, the number of which is greater than the number of the sample shot areas on a first substrate different from the second substrate, and a second value based on measurement results of positions of marks provided in the sample shot areas. A method for producing an article.

[0079] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. The processing unit generates a regression model using a first value based on the measurement results of the positions of marks provided in each of the multiple shot regions on the first substrate, and determines an alignment amount used for aligning multiple non-sample shot regions on the second substrate that are different from the sample shot region, based on a second value based on the measurement results of the positions of marks provided in the sample shot region among the multiple shot regions on the second substrate, and the regression model. The number of multiple shot regions on the first substrate used to measure the position of the marks is greater than the number of sample shot regions. The regression model includes a regression model corresponding to each of the plurality of non-sample shot regions, An information processing device characterized by the following:

2. The information processing apparatus according to claim 1, characterized in that the first value and the second value are the measurement result of the position of the mark, or the positional displacement amount which is the difference between the measurement result of the position of the mark and the target position of the mark, or the positional adjustment amount used for aligning the shot area in which the position of the mark was measured.

3. The information processing apparatus according to claim 1, characterized in that the aforementioned alignment amount is used to control a stage that can be driven while holding the second substrate.

4. The information processing apparatus according to claim 1, characterized in that the processing unit generates a regression model corresponding to each of the plurality of non-sample shot regions.

5. The information processing apparatus according to claim 1, characterized in that the processing unit generates a multi-output regression model in which, upon input of the second value, it outputs a first alignment amount and a second alignment amount corresponding to a first non-sample shot region and a second non-sample shot region included in the plurality of non-sample shot regions.

6. The information processing apparatus according to claim 1, characterized in that the positions of the plurality of shot regions on the first substrate on the first substrate coincide with any of the positions of the plurality of shot regions on the second substrate on the second substrate.

7. The information processing apparatus according to claim 1, characterized in that the processing unit generates the regression model using a first value based on the measurement result of the position of a mark provided in a shot region that corresponds to at least one non-sampled shot region among the plurality of non-sampled shot regions on the first substrate.

8. The information processing apparatus according to claim 1, characterized in that the processing unit generates the regression model using a third value based on the measurement result of the position of marks provided in each of a plurality of shot regions on the third substrate, and the first value.

9. The information processing apparatus according to claim 1, characterized in that the exposure processing conditions are the same for the first substrate and the second substrate.

10. The information processing apparatus according to claim 9, characterized in that the processing unit has a storage unit that stores the regression model generated for each of the exposure processing conditions.

11. The information processing apparatus according to claim 1, characterized in that the second value is an explanatory variable of the regression model and the alignment amount is the dependent variable of the regression model.

12. The information processing apparatus according to claim 1, further comprising a transmitting unit that transmits information relating to the alignment amount to a control unit or display unit that controls a stage capable of being driven while holding the second substrate.

13. A first acquisition step involves obtaining a first value based on the measurement results of the positions of marks provided in each of a plurality of shot regions on the first substrate, A generation step that generates a regression model based on the first value obtained in the first acquisition step, A second acquisition step involves acquiring a second value based on the measurement result of the position of a mark provided in a sample shot region among a plurality of shot regions on a second substrate different from the first substrate, The calculation step includes determining the alignment amount used to align a plurality of non-sample shot regions on the second substrate that are different from the sample shot region, based on the second value obtained in the second acquisition step and the generated regression model, The number of multiple shot regions on the first substrate used to measure the position of the marks is greater than the number of sample shot regions. The regression model includes a regression model corresponding to each of the plurality of non-sample shot regions, An information processing method characterized by the following:

14. A program for causing a computer to execute the information processing method described in Claim 13.

15. The process includes an exposure step in which each of the multiple shot regions on the second substrate is exposed while aligning each of the multiple shot regions on the second substrate, For the purpose of aligning multiple non-sample shot regions on the second substrate that are different from the sample shot region, the alignment amount used to control the stage that holds the second substrate is: Based on a first value generated using a first value based on the measurement results of the positions of marks provided in each of the multiple non-sampled shot regions on the first substrate, which is different from the second substrate, and which is greater than the number of sampled shot regions, the regression model corresponding to the non-sampled shot region for which the alignment amount is to be determined and the second value based on the measurement results of the positions of marks provided in the sampled shot region, A method of exposure characterized by the following features.

16. A stage that can drive while holding the substrate, The system includes a control unit that controls the drive of the stage in order to perform alignment with each of a plurality of shot regions on the second substrate, For aligning multiple non-sample shot regions on the second substrate that are different from the sample shot regions, the alignment amount used to control the stage is determined based on a first value, which is generated using a first value based on the measurement results of the positions of marks provided in each of the multiple non-sample shot regions, and a second value based on the measurement results of the positions of marks provided in the sample shot regions. A substrate processing apparatus characterized by the following:

17. An exposure step in which each of the multiple shot regions on the second substrate is exposed while aligning each of the multiple shot regions on the second substrate, A manufacturing step comprising manufacturing an article from the second substrate exposed in the exposure step, For the alignment of multiple non-sample shot regions on the second substrate that are different from the sample shot regions, the alignment amount used to control the stage that holds the second substrate is determined based on a first value, which is generated using a first value based on the measurement results of the positions of marks provided in each of the multiple non-sample shot regions, and a second value based on the measurement results of the positions of marks provided in the sample shot regions. A method for manufacturing an article, characterized by the following:

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