Electronic assemblies for medical devices

Abstract

The electronic assembly (100) for the medical device (10) may include a circuit board. The electronic assembly may also include an imaging device (210) attached to the first edge of the first portion of the circuit board, and illumination elements (212a, 212b) attached to the second edge of the second portion of the circuit board.

Description

Technical Field

[0001] The present disclosure generally relates to electronic assemblies for medical devices and methods related thereto. More specifically, aspects of the present disclosure relate to assemblies that include components disposed at the distal tip of a medical device, such as an endoscope.

Background Art

[0002] In a medical procedure, an operator can insert a medical device, such as an endoscope or other type of scope, into the lumen of a subject's body. The operator can guide the distal tip to the location where the procedure is to be performed. The operator can pass an accessory device (e.g., an instrument) through the working channel of the medical device to assist in performing a particular diagnostic or therapeutic procedure. The distal tip of the medical device can include elements for providing visualization of the lumen of the human body, such as a lighting element and / or an imaging device. The distal tip of the medical device can further include other features, such as an opening of the working channel, an opening for air / water and suction, and / or an elevating portion. It may be desirable to increase the dimensions of the working channel and its associated openings or to introduce additional elements to the distal tip of the medical device without increasing the outer diameter of the medical device. Further, it may be desirable to provide high-quality images to the operator. Accordingly, there is a need for an electronic assembly for the distal tip of a medical device.

Summary of the Invention

[0003] Each aspect disclosed herein may include one or more of the features described in relation to any other disclosed aspect. An electronic assembly for a medical device can include a circuit board, an imaging device attached to a first edge of a first portion of the circuit board, and a lighting element attached to a second edge of a second portion of the circuit board.

[0004] Any embodiment disclosed herein may include any combination of the following features: The illumination element may be a first illumination element, and the electronic assembly may further include a second illumination element attached to the third edge of the third portion of the circuit board. The first illumination element may be oriented substantially perpendicular to the second illumination element. The circuit board may include an arm portion. The arm portion may include a second portion of the circuit board. At least one portion of the arm portion may be a flexible portion. The flexible portion may include at least one bend. The first edge portion may be the distal edge of the first portion. The first edge portion may be positioned between two contacts of the imaging device. The second edge portion may be positioned between two contacts of the illumination element. The imaging device may be oriented substantially parallel to the plane of the first portion of the circuit board. The circuit board may include a proximal extension portion configured to extend through at least a portion of the shaft of the medical device. The proximal extension portion may extend into the handle of the medical device. The proximal extension portion may include at least one winding portion. The proximal extension may include at least one coplanar waveguide. The proximal extension may further include a ground plane. The proximal extension may include a copper plane. At least a portion of the copper plane may be cross-hatched.

[0005] In another embodiment, an electronic assembly for a medical device may include a distal portion configured to be located within the distal tip of the medical device, at least one component attached to a circuit board of the distal portion, and a proximal extension configured to be located within the shaft of the medical device. The proximal extension may include a circuit board.

[0006] Any embodiment disclosed herein may have any combination of the following features: The distal circuit board and the proximal extension circuit board may be a single, integrated structure. The proximal extension may include at least one winding portion. At least one component may be attached to the edge of the distal circuit board.

[0007] In another embodiment, the electronic assembly of a medical device may include a distal portion configured to be located within the distal tip of the medical device, and a proximal extension configured to extend through the shaft of the medical device into the handle portion. A portion of the proximal extension within the shaft may include a circuit board. [Brief explanation of the drawing]

[0008] The accompanying drawings, incorporated into and constituting parts of this specification, illustrate examples of the disclosure and, together with the specification, provide an explanation of the principles of the disclosure. [Figure 1A] Figure 1A shows an exemplary medical device. [Figure 1B] Figure 1B shows an exemplary medical device. [Figure 2] Figure 2 shows an exemplary electronic assembly used with medical devices, such as the medical devices shown in Figures 1A and 1B. [Figure 3A] Figure 3A shows another exemplary electronic assembly used with medical devices, such as the medical devices shown in Figures 1A and 1B. [Figure 3B] Figure 3B shows another exemplary electronic assembly used with medical devices, such as the medical devices shown in Figures 1A and 1B. [Figure 4A] Figure 4A shows yet another exemplary electronic assembly used with medical devices, such as the medical devices shown in Figures 1A and 1B. [Figure 4B] Figure 4B shows yet another exemplary electronic assembly used with medical devices, such as the medical devices shown in Figures 1A and 1B. [Figure 5A] Figure 5A shows an additional exemplary electronic assembly for use with medical devices, such as the medical devices shown in Figures 1A and 1B. [Figure 5B] Figure 5B shows an additional exemplary electronic assembly for use with medical devices, such as the medical devices shown in Figures 1A and 1B. [Figure 6A] Figure 6A shows another exemplary electronic assembly used with medical devices, such as the medical devices shown in Figures 1A and 1B. [Figure 6B] Figure 6B shows another exemplary electronic assembly used with medical devices, such as the medical devices shown in Figures 1A and 1B. [Modes for carrying out the invention]

[0009] It should be understood that both the general description above and the detailed description below are illustrative and descriptive only and do not limit the claimed invention. The terms “equipped,” “included,” “inclusion,” or any other variations thereof as used herein are intended to include non-exclusive inclusion, such that a process, method, article, or apparatus comprising a list of elements does not include only those elements, but may include other elements not expressly listed in the process, method, article, or apparatus, or other elements specific to the process, method, article, or apparatus. The term “exemplary” is used to mean “example,” not “ideal.” The term “distal” refers to the direction away from the operator / towards the treatment site, and the term “proximal” refers to the direction towards the operator. Drawings may include arrows labeled “P” and “D” indicating the proximal and distal directions, respectively. The term “abbreviated,” or similar terms (e.g., “substantially”), includes values ​​within ±10% of the stated values.

[0010] Medical devices such as endoscopes may be inserted into the lumens of a patient's body to perform medical procedures. The distal end of a medical device may include an electronic assembly containing various components, such as illumination elements (e.g., light-emitting diodes (LEDs), optical fibers or other light guides, or combinations thereof), imaging elements (e.g., cameras, other components having image sensors, or other optical elements (e.g., lenses)), and associated electronic components (e.g., capacitors, diodes, resistors, etc.). The electronic components may include a circuit board (e.g., a printed circuit board) on which various elements are mounted.

[0011] It is sometimes desirable for electronic assemblies to occupy less space while maintaining performance and manufacturing quality. One exemplary method for saving space while maintaining performance and manufacturing quality is to include various components mounted perpendicular to the edge of a circuit board. The circuit board may be rigid, flexible, or a combination thereof. Depending on the requirements of the medical device, various arrangements of the circuit board and the components mounted thereon are possible. In addition, or alternatively, the electronic assembly may include a circuit board extending from the distal tip of the medical device through the shaft of the medical device to the proximal end of the medical device (e.g., between the distal tip and the handle). Such assemblies may include circuit boards having a helical or other coiled shape extending through the shaft of the medical device. Furthermore, these assemblies may include circuit boards having features for controlling impedance and / or providing electromagnetic shielding.

[0012] Figures 1A and 1B show exemplary embodiments of the medical device 10. Figure 1A shows the proximal portion of the medical device 10. Figure 1B shows the distal tip 44 of the medical device 10. The medical device 10 may include a handle portion 12 for holding and manipulating by an operator, and an insertion portion 14 for at least partial insertion into the body of a patient (e.g., a lumen of the body). As shown in Figures 1A and 1B, the medical device 10 may include an endoscope. While this disclosure may refer to endoscopes in different places, it should be understood that, unless otherwise expressly stated, duodenoscopes, endoscopes, gastroscopes, endoscopic ultrasound ("EUS") scopes, colonoscopes, ureteroscopes, bronchoscopes, laparoscopes, cystoscopes, suction scopes, sheaths, catheters, or any other suitable delivery devices or medical devices may be used in connection with the elements and assemblies described herein.

[0013] The handle portion 12 may include, for example, a lever 22 at its proximal end. The lever 22 may contribute to facilitating the bending / steering of the insertion portion 14, including its distal end 44. Although the lever 22 is shown in Figure 1A, it is understood that in addition to or in place of the lever 22, any suitable actuator such as one or more knobs, buttons, sliders, or joysticks may be used. A port 24 of the handle portion 12 (for example, located at its proximal end) may provide access for the medical device 10 to the lumen or working channel. The operator may insert the instrument or other device into the port 24 and extend the instrument or other device distally through the working channel. The working channel may extend longitudinally throughout the entire length of the insertion portion 14. The handle portion 12 may also include, for example, a suction valve 26 at its proximal end, opposite to the lever 22. The operator may connect the suction valve 26 to a suction source, and may also operate the suction valve 26 to generate suction via the insertion section 14 (for example, through the working channel). The handle section 12 may also, or alternatively, include other types of valves, such as valves for air and / or water, or valves that perform combined functions.

[0014] The image capture button 28 on the handle portion 12 may allow the operator to acquire still images from the imaging device 52 (shown in Figure 1B and described in further detail below) during a procedure. The image capture button 28 may be located, for example, proximal to the handle portion 12 adjacent to the suction valve 26. In addition, or alternatively, the image capture button 28 may allow the operator to acquire video or perform other functions for controlling the medical device 10. The umbilical 30 may extend from the handle portion 12 (for example, distal to the handle portion 12) and may carry, for example, wires, cables, and / or conduits for supplying power, signals, or fluids to and from the handle portion 12. For example, the umbilical 30 may connect the handle portion 12 to one or more user interfaces, monitors, displays, etc.

[0015] The insertion portion 14 may include a shaft 42 extending distally from the handle portion 12. The shaft 42 may have any suitable properties. For example, the shaft 42 may be flexible, allowing wires, tubes, or other features to pass through it. The distal tip portion 44 of the medical device 10 shown in Figure 1B may be located at the distal end of the shaft 42. As shown in Figure 1B, the distal tip portion 44 may include a distal surface 46. The distal surface 46 may define a working channel opening 48. The working channel may extend between the port 24 and the working channel opening 48 so that an instrument or other device can pass through the port 24, through the working channel, and out of the working channel opening 48. An instrument extending distal to the working channel opening 48 may be used to perform a medical procedure on a patient.

[0016] The distal tip 44 may also include imaging components such as one or more illumination elements 50 and one or more imaging devices (e.g., cameras) 52. Although two illumination elements 50 and one imaging device 52 are shown in Figure 1B, it is understood that a different number of illumination elements 50 and imaging devices 52 may be used. Alternatively, the illumination elements 50 and imaging devices 52 may be integrated into a single device. The illumination elements 50 may include LEDs or any suitable alternative light source. The imaging device 52 may be configured to capture moving and / or still images. The imaging device 52 may also provide a signal to a monitor (not shown) so that the operator can observe the visual image provided by the imaging device 52 while guiding the medical device 10 through the lumen of the patient's body.

[0017] As shown in FIG. 1B and as described above, the medical device 10 can be a “forward view” type. In other words, the features of the distal tip 44 (e.g., the working channel opening 48, the illumination element 50, and the imaging device 52) can face distally (i.e., in front of the most distal plane 46). The present disclosure also encompasses other components of the distal tip 44. For example, the medical device 10 can be a “side view” type. In a side view type embodiment, the working channel opening 48, the illumination element 50, and / or the imaging device 52 can be disposed radially outward of the distal tip 44, such that they can face radially outward substantially orthogonal to the longitudinal axis of the insertion portion 14. The medical device 10 can further include forward view type components and other side view type components.

[0018] FIG. 2 shows an exemplary electronic assembly 100 that can be disposed at least partially within the distal tip 44 (FIG. 1B). The electronic assembly 100 can include a substrate 102, which can be, for example, a printed circuit board (PCB). The substrate 102 can include one or more connection points (e.g., pads or leads) for various components attached to the substrate and / or for connecting wires and / or cables (not shown) that extend proximally from the substrate 102 through the shaft 42 to the handle portion 12. The substrate 102 can also include traces for connecting components to each other and / or for connecting a component to a wire or cable. As shown in FIG. 2, the substrate 102 can be substantially flat / plane-like. However, the substrate 102 can have any alternative configuration (e.g., a bent configuration and / or a curved configuration). The substrate 102 can be flexible, rigid, or a combination of both.

[0019] The electronic assembly 100 may include an imaging device 110 coupled thereto. The imaging device 110 may include a camera, or may be a camera, and may have any of the characteristics of the imaging device 52. For example, the imaging device 110 may include an image sensor and / or one or more lenses. The electronic assembly 100 may also include one or more illumination elements, such as the two illumination elements 112a and 112b shown in Figure 2. The illumination elements 112a and 112b may be, for example, light-emitting diodes (LEDs), and may have any of the characteristics of the illumination element 50.

[0020] As shown in Figure 2, one or more of the imaging device 110 or the illumination elements 112a, 112b may be mounted normal to / orthogonal to the substrate 102. In other words, the imaging device 110 and / or the illumination elements 112a, 112b may be oriented perpendicular to / orthogonal to the normal direction (e.g., the normal) of a portion of the plane of the substrate 102 to which each element (imaging device 110 and / or illumination elements 112a, 112b) is attached. In other words, the imaging device 110 and / or the illumination elements 112a, 112b may be oriented substantially parallel to a portion of the plane of the substrate 102 to which each element is attached. When it is said that the imaging device 110 and / or the illumination elements 112a, 112b "orient" in a certain direction, it means that the operating part of the component is oriented in that direction.

[0021] As shown in FIG. 2, the imaging device 110 and / or the illumination elements 112a, 112b can be fixed to an edge (e.g., one or more distal edges) of the substrate 102. The edge can extend between the surfaces of the substrate 102 (e.g., between the first surface 104 and a second surface / back surface (not shown) opposite the first surface 104). Generally, a given portion of the substrate 102 or other substrates described herein have two surfaces (a top surface and a bottom surface) together with a plurality of edges extending between the two surfaces. Although the imaging device 110 and the illumination elements 112a, 112b are shown as being attached to the edges of the substrate 102, it is understood that other components can be further attached to the edges of the substrate 102, or that one or more of the imaging device 110 and / or the illumination elements 112a, 112b can be attached to a surface of the substrate 102 (e.g., the first surface 104).

[0022] Components such as the imaging device 110 and / or illumination elements 112a, 112b may be coupled (e.g., electrically coupled) to the substrate 102 via one or more connectors 120 (e.g., solder fillets). In one example, components such as the imaging device 110 and / or illumination elements 112a, 112b may include contacts 122 for forming the connectors 120. For example, the imaging device 110 and / or illumination elements 112a, 112b (or other components) may include solder balls (e.g., made of SAC305 solder) or solder bumps (e.g., made of gold) used to form the connectors 120 on one side of the component (e.g., the back side). For example, components such as the imaging device 110 and / or illumination elements 112a, 112b may include a ball grid array (BGA). Such examples of contacts 122 are merely illustrative, and other structures may be used. The contact 122 may be connected to a component of the substrate 102 (e.g., a pad on the substrate 102) to form a connection 120, for example, via hot air reflow, other soldering methods, and / or conductive epoxy. In some examples, the strength of the connection 120 may be improved by using conductive or non-conductive epoxy or adhesive. One or more components (e.g., an imaging device 110 and / or illumination elements 112a, 112b) may be overmolded and / or sealed together with part (or all) of the substrate 102. Overmolding and / or sealing may provide protection from fluids, increase strength, and / or promote biocompatibility.

[0023] Other connection points on the substrate 102 for connecting to pads or components (not individually visible in Figure 2, but integrated into the connection portion 120) may be located on or near the edge to which the component is attached. Such pads / connection points may be located on one or more faces of the substrate 102 (for example, the first face 104 or the opposite face). In one example, the pads / connection points may be located at corresponding positions on the opposite face of the substrate 102. In such an example, the normal vector penetrating the substrate 102 may pass through two pads / connection points (one on each face). Thus, the connection portion 120 may be formed on both the upper and lower sides of the substrate 102. Components may be additionally or alternatively fixed to the substrate 102 by using adhesive, through sealing, etc.

[0024] Components fixed to the substrate 102 may have different numbers of contacts 122, and the substrate 102 may have a corresponding number of connection points / pads. For example, lighting element 112a may have two contacts 122, one on each side of the substrate 102. Each face of the substrate 102 (e.g., the first face 104 and the opposite face) may include one connection point for connecting to the corresponding contacts 122 of lighting element 112a. Similarly, lighting element 112b may have two contacts 122, one on each side of the substrate 102. Each face of the substrate 102 (e.g., the first face 104 and the face opposite the first face 104) may include one connection point for connecting to the corresponding contacts 122 of lighting element 112b. Thus, for each lighting element 112a, 112b, two connection points 120 may be formed for electrically coupling the contacts 122 of lighting elements 112a, 112b to the connection points of the substrate 102. The imaging device 110 may include four contacts 122. In the example shown in Figure 2, the imaging device 110 may have two contacts 122 on each side of the substrate 102, as will be described later. For example, the four contacts 122 of the imaging device 110 may be arranged in two rows (parallel to the plane of the first surface 104) and two columns (perpendicular to the plane of the first surface 104). One row of contacts 122 may be on the side of the substrate 102 facing the first surface 104, and the other row of contacts 122 may be on the opposite side of the substrate 102. Four connection points 120 may be formed between the contacts 122 of the imaging device 110 and the connection points of the substrate 102. As shown in Figure 2, the first surface 104 may include a total of four connection points 120 formed on that surface: one for illumination element 112a, two for the imaging device 110, and one for illumination element 112b. The side of the substrate 102 opposite to the first surface 104 may have four corresponding connection points 120. The above arrangement is merely illustrative, and the components fixed to the substrate 102 may have any suitable arrangement of contacts 122.

[0025] The substrate 102 and / or components fixed to the substrate (e.g., the imaging device 110 and / or illumination elements 112a, 112b) may be configured to facilitate attachment of the components to the edges of the substrate 102. For example, the thickness of the substrate 102 (i.e., the length of the edges of the substrate 102, which may be the distance between the first surface 104 and the second surface opposite the first surface 104) may be such that the distance between the contacts 122 of the components (e.g., the imaging device 110 and / or illumination elements 112a, 112b) and the pads / connection points of the substrate 102 is not excessively large, while also accommodating the connection structures (e.g., balls or bumps) of the components. The thickness of the substrate 102 may vary along the width of the substrate 102 to accommodate components having different characteristics. For example, some components may be larger and / or have greater distances between multiple contacts 122, and the substrate 102 may have a first thickness to accommodate such arrangements. Other components may be smaller and / or have smaller distances between multiple contacts 122, and the substrate 102 may have a second thickness smaller than the first thickness to accommodate such arrangements. The thickness of the substrate 102 may be adjusted depending on the arrangement of the contacts 122 to optimize manufacturability, yield, and / or reliability.

[0026] The substrate 102 may also have other components fixed to its edges (i.e., mounted orthogonally) or mounted on its surfaces. For example, as shown in Figure 2, the substrate 102 may have one or more components 116 fixed to the first surface 104. In one example, component 116 may be one or more components, such as a capacitor (e.g., a decoupling capacitor) or other components (e.g., a transient suppression diode) configured to operate with the imaging device 110 or otherwise function with the imaging device 110. Component 116 may alternatively be a sensor, such as a pressure, temperature, position, or orientation sensor. Component 116 may alternatively be any suitable type of electronic element for use with the distal tip 44. Component 116 may be mounted to the substrate 102 by any suitable method to electrically couple component 116 to conductors of the substrate 102, to the imaging device 110, to illumination elements 112a, 112b, or to other elements.

[0027] As shown in Figure 2, the distal end of the substrate 102 may have a first arm 130a and a second arm 130b extending distally from the body 105 of the substrate 102. The first illumination element 112a may be attached to the distal edge of the first arm 130a, and the second illumination element 112b may be attached to the distal edge of the second arm 130b. The width of the arms 130a, 130b (width in the plane of the first surface 104 and perpendicular to the longitudinal proximal-distal axis) may be configured to accommodate the illumination elements 112a, 112b. For example, as shown in Figure 2, the arms 130a, 130b may be slightly narrower than the illumination elements 112a, 112b. The substrate 102 may also have a projection 132 between the arms 130a, 130b. The projection 132 may have an imaging device 110 attached to its distal edge. The width of the projection 132 may be configured to accommodate the imaging device 110. For example, as shown in Figure 2, the projection 132 may be slightly narrower than the imaging device 110. The distal edges of the arms 130a, 130b and the projection 132 may be substantially aligned with each other (they may extend distally by approximately the same distance). As shown in Figure 2, the distal ends of the illumination elements 112a, 112b may be recessed relative to the distal end of the imaging device 110 (i.e., they may be located proximal). Such recesses of the illumination elements 112a, 112b may result from the short length of the illumination elements 112a, 112b along the proximal-distal axis compared to, for example, the length of the imaging device 110 and / or the length of the arms 130a, 130b and the projection 132.

[0028] The substrate 102 may also have a proximal projection 140. The proximal projection 140 may be located in the center of the width direction of the body 105, or alternatively, it may be located in any suitable manner. The proximal projection 140 may include a pad or other connection (not shown) for connecting to, for example, a wire or cable extending through the shaft 42. Alternatively, the proximal projection may extend proximal through the shaft 42, for example, as described in relation to Figures 4A-4B below.

[0029] The above configuration is merely illustrative. Arms 130a, 130b, projection 132, or projection 140 may be omitted. Other components may be additionally or alternatively fixed to the substrate 102. The above-mentioned components may be omitted. For example, lighting elements 112a and 112b may be omitted, or optical fiber elements may be used instead. Although the substrate 102 is shown as flat, the substrate 102 may be bent into any desired configuration.

[0030] As with any assemblies disclosed herein, the electronic assembly 100 may be at least partially positioned at the distal tip of a medical device, such as a medical device 10. For example, the electronic assembly 100 may be inserted into and fixed inside the distal tip 44.

[0031] Figures 3A-3B show another electronic assembly 200 which may have any of the characteristics of electronic assembly 100 unless otherwise specified. Where feasible, similar structures are indicated by adding 100 to the reference number associated with electronic assembly 100. Electronic assembly 200 may include a substrate 202 which may have any of the characteristics of substrate 102. Similar to electronic assembly 100, electronic assembly 200 may include an imaging device 210 (which may have any of the characteristics of imaging device 110) and illumination elements 212a, 212b (which may have any of the characteristics of illumination elements 112a, 112b) which may be fixed to the edge of substrate 202. The imaging device 210 may be coupled to the distal end edge of a body 205 (which may have any of the characteristics of body 105). Also, similar to the electronic assembly 100, the substrate 202 may include arms 230a and 230b, and the lighting elements 212a and 212b may be attached to the edges of arms 230a and 230b, respectively, via connecting parts 220 having any of the characteristics of the connecting parts 120. One or more components 216, which may have any of the characteristics of the components 116, may be coupled to the main body 205.

[0032] The imaging device 210 may be directly coupled to the distal end of the main body 205, and the electronic assembly 200 may lack a structure similar to the protrusion 132. The imaging device 210 may be positioned in the center along the width of the main body 205. Since any of the configurations for connecting the imaging device 110 are applicable to the imaging device 210, the connection of the imaging device 210 will not be described in detail.

[0033] Arm 230a, like arm 130a, may extend distally from the main body 205 of the substrate 202 and may have any of the characteristics of arm 130a. Arm 230a may also have a segment 250 that extends laterally outward from the main body 205. The inner surface 231 of arm 230a may be adjacent to the imaging device 210. Arm 230a may be dimensioned such that the distal end of the illumination element 212a is recessed proximally relative to the distal end of the imaging device 210.

[0034] The arm 230b may include one or more flexible sections, and as a result, the arm 230b may be bent at one or more locations. Although Figures 3A and 3B show only the arm 230b as flexible / bent, such arrangement is merely illustrative, and it should be understood that any part of the substrate 202 may be flexible and / or bent. The following description of how the arm 230b is bent is merely illustrative, and any other arbitrary shape may be used for the arm 230b. As best shown in Figure 3B, the arm 230b may include a first section 234a, a second section 234b, a third section 234c, and a fourth section 234d. The first section 234a may extend from the first side surface 205a of the body 205 at the first joint 235a. As shown in Figure 3B, the first joint 235a may include a bend of about 90 degrees such that the plane of the first portion 234a may be substantially perpendicular to the plane of the body 205. In the illustrated example, the first portion 234a may extend substantially along the normal direction extending from the first surface 204. The first joint 235a may be flexible to accommodate such a bend (for example, it may be made from a flexible circuit board). Other portions of the first portion 234a may be flexible or rigid.

[0035] The second portion 234b may be joined to the first portion 234a at the second joint 235b. The second joint 235b may include a bend of about 90 degrees such that the plane of the second portion 234b is substantially perpendicular to the plane of the first portion 234a and substantially parallel to the plane of the main body 205. The second joint 235b may be flexible to accommodate such a bend. Other portions of the second portion 234b may be flexible or rigid. As shown in Figure 3B, the second portion 234b may extend toward the second side surface 205b (opposite to the first side surface 205a) of the main body 205 such that the normal to the first surface 204 may extend through the second portion 234b.

[0036] The third portion 234c may be joined to the second portion 234b at the third joint 235c. The third joint 235c may include a bend of about 90 degrees such that the plane of the third portion 234c is substantially perpendicular to the plane of the second portion 234b and substantially parallel to the plane of the first portion 234a. Similar to the first portion 234a, the third portion 234b may extend along the normal direction extending from the first surface 204. The fourth portion 234d may be substantially coplanar with the third portion 234c and may extend distally from the third portion 234c. The arrangement of segments of the second arm 230b described above is merely illustrative, and any suitable arrangement may be used.

[0037] The width (for example, the lateral width) of the second portion 234b may be approximately half the width of the main body 205, such that the third portion 234c extends along the central longitudinal axis of the main body 205. The heights of the first portion 234a and the third portion 234c may be such that the lower edge of the fourth portion 234d is positioned slightly above the top surface of the imaging device 210. Thus, the fourth portion 234d may be positioned approximately in the center above the imaging device 210. In one example, the plane of the fourth portion 234d may bisect the imaging device 210.

[0038] As shown in Figures 3A and 3B, the first illumination element 212a and the second illumination element 212b may be mounted substantially perpendicular to each other. In other words, in Figure 3B, the contacts 222 of the second illumination element 212a may be arranged horizontally, while in Figure 3B, the contacts 222 of the first illumination element 212a may be arranged vertically. As shown in Figures 3A and 3B, the illumination elements 212a and 212b may be substantially rectangular. Illumination element 212a may have two long sides 214a and two short sides 214b. Illumination element 212b may have two long sides 215a and two short sides 215b. One of the long sides 214a of the first illumination element 212a may be adjacent to the first side surface 210a of the imaging device 210. One of the long sides 215a of the second illumination element 212b may be adjacent to the second side surface 210b of the imaging device 210. The first side surface 210a and the second side surface 210b are substantially perpendicular to each other and may be adjacent to each other, for example, the ends of the sides 210a and 210b may be connected or otherwise in contact. The long sides 214a and 215b may be substantially perpendicular to each other. Such an arrangement may result from the arrangement of the fourth portion 234d of the first arm 230a and the second arm 230b. The distal edge of the first arm 230a may be substantially perpendicular to the distal edge of the second arm 230b (i.e., the distal edge of the fourth portion 234d), and the distal end of the second illumination element 212b may be substantially aligned with the distal end of the first illumination element 212a in the proximal / distal direction.

[0039] The arrangement of the electronic assembly 200 may be useful for medical devices (e.g., medical device 10) where it is desirable to arrange the illumination elements 212a, 212b on adjacent sides of the imaging device 210 (e.g., sides 210a, 210b). Additionally or alternatively, the electronic assembly 200 can facilitate the arrangement of various other elements at the distal end of the medical device (e.g., one or more working channels, fluid channels, lifting parts, etc.). As stated above, the specific arrangement of the electronic assembly 200 is merely illustrative, and alternative arrangements / components may be used within the scope of this disclosure.

[0040] Figures 4A-4B show another exemplary electronic assembly 300. Electronic assembly 300 may include any embodiment of electronic assemblies 100 and 200. For example, electronic assembly 300 may include a substrate 302 on which an imaging device 310 and illumination elements 312a, 312b are mounted. As shown in Figures 4A-4B, the arrangement of the substrate 302, imaging device 310, and illumination elements 312a, 312b may be similar to that of electronic assembly 200. Alternatively, the arrangement of electronic assembly 100, or any other alternative arrangement, may be used.

[0041] The electronic assembly 300 may include a proximal extension 360 that extends proximal to the main body 305 of the substrate 302 (which may have the characteristics of either the main body 105 or 205). When the electronic assembly 300 is placed within the medical device 10, the main body 305 may be located at least partially within the distal tip 44, and the proximal extension 360 may extend within the shaft 42. In one embodiment, the proximal extension 360 may extend throughout the entire shaft 42. For example, the proximal extension 360 may extend from the distal tip 44 to the handle portion 12. Although the proximal extension 360 is described as being located within the shaft 42, it is understood that the proximal portion of the main body 305 may also be located within the shaft 42.

[0042] In one example, the proximal end of the proximal extension 360 may be located within the handle portion 12, or may be otherwise coupled to the handle portion 12. In another example, the proximal extension 360 may extend through the umbilical 30 (for example, toward or to a main device to which the end of the umbilical 30 may be connected). The proximal extension 360 may be a flexible circuit board, a rigid circuit board, or a circuit board that is a combination of flexible and rigid, or may include these. The proximal portion 368 of the proximal extension 360 may include further components attached to that portion (for example, an integrated circuit, a button for controlling the imaging device 310 (for example, an image acquisition button 28), a capacitor, a resistor, a diode, or any other suitable component), and / or the proximal extension 360 may be coupled to other elements via wires and / or cables.

[0043] As shown in Figures 4A-4B, the proximal extension 360 may have a coiled / spiral / helical / solenoidal shape. The proximal extension 360 may include a plurality of winding sections 364. As shown in Figures 4A-4B, the winding sections 364 may be spaced apart from each other, resulting in gaps between consecutive winding sections 364. Alternatively, the winding sections 364 may be adjacent / contacting each other. The winding sections 364 may be of any suitable dimensions. For example, the diameter / width of the winding section 364 may be such that the winding section 364 fits within the shaft 42 (e.g., a suitable diameter of about 2 mm or less, or larger). For example, the winding section 364 may extend into the interior of the shaft 42 through a lumen defined within the shaft 42. The winding section 364 may float freely within the shaft 42, or it may be fixed to the shaft 42 (e.g., to the inner wall of the shaft 42). Alternatively, the winding portion 364 may be laminated within the wall of the shaft 42, or it may extend outside at least several layers of the wall of the shaft 42. The winding portion 364 may provide flexibility to the proximal extension portion 360, so that the proximal extension portion may bend along the shaft 42 and may not affect the stiffness of the shaft 42. In an alternative embodiment, the proximal extension portion 360 may be used to change the stiffness of the shaft 42 in order to obtain a desired stiffness.

[0044] In an alternative embodiment, the winding portion 364 may be omitted or may extend only along a portion of the proximal extension portion 360. In some embodiments, the spacing between the winding portions 364 may be uniform, variable, or a combination thereof. In yet another alternative embodiment, the proximal extension portion 360 may be twisted axially or have other shapes. The proximal extension portion 360 or other parts of the electronic assembly 300 may be folded or bent. For example, as shown in Figures 4A-4B, the proximal extension portion 360 may include a segment 362 extending between the body 305 and the first (most distal) winding portion 365. The segment 362 may be perpendicular to both the body 305 and the most distal portion 366 of the first winding portion 365. The segment 362 may form a bridge between the body 305 and the winding portion 364. The electronic assembly 300 (including the main body 305 and the proximal extension 360) may be formed from a single, integrated component (e.g., a printed circuit board). In an alternative embodiment, the electronic assembly 300 may be formed from multiple components. For example, the main body 305 may be a first component and the proximal extension 360 may be a second component. In an alternative embodiment, the proximal extension 360 may be formed from multiple components.

[0045] The winding portion 364 may be formed by cutting a flexible PCB into a predetermined pattern (e.g., having curved sides of different curvature and / or lengths) such that the flexible printed circuit board is wound into the winding portion 364. Additionally or alternatively, the winding portion 364 may be formed by winding a PCB (e.g., a flexible PCB) around a mandrel. The winding portion 364 may alternatively be formed by any suitable method.

[0046] The electronic assembly 300, including the proximal extension 360, may eliminate the need to connect wires and / or cables to a substrate (e.g., substrates 102, 202, 302). Connecting such wires and / or cables (e.g., microcoaxial cables) to pads on a substrate may require specialized personnel, equipment, etc. Furthermore, assembling such connections can be very time-consuming and / or may result in assembly errors requiring correction or discard. Instead, the distal portion of the electronic assembly 300, including the main body 305, imaging device 310, and illumination elements 312a, 312b, may be located within the distal tip 44 of the medical device 10, and the proximal extension 360 may pass through the shaft 42 toward the handle portion 12. The proximal portion of the proximal extension 360 may be fixed within the handle portion 12 and / or pass through the umbilical 30.

[0047] Figures 5A to 5B show electronic assemblies 400 and 500 that may have features that can be used in combination with any of the electronic assemblies described above. While the features may be described individually, it is understood that any of the embodiments described herein can be combined in any way.

[0048] Figures 5A and 5B show an electronic assembly 400 which may include one or more coplanar waveguides 470 (Figure 5A) with an optional grounding surface 490 (Figure 5B). Figure 5A shows the upper side of the electronic assembly 400, and Figure 5B shows the lower side of the electronic assembly 400. The electronic assembly 400 may include waveguides or buried coplanar striplines to achieve desired characteristic impedance and / or shielding. The striplines of the electronic assembly 400 may or may not be buried. The exemplary waveguides / striplines described herein are merely illustrative, and any suitable features may be utilized. The electronic assembly 400 may further include any of the above-described components (e.g., imaging devices, lighting elements, capacitors, diodes, resistors, etc.).

[0049] As shown in Figure 5A, the electronic assembly 400 may include a substrate 402 which may have any of the features of substrates 102, 202, and 302. The distal portion 401 of the substrate 402 may be configured to be located on or near the distal tip portion 44 of the medical device 10. The distal portion of the substrate 402 may have an imaging device 410 mounted on the substrate which may have any of the features of imaging devices 110, 210, and 310. The imaging device 410 is shown mounted on the surface of the substrate 402 rather than on the edge of the substrate 402, but as described above and / or illustrated with respect to the electronic assemblies 100, 200, and 300, it is understood that the imaging device 410 may alternatively be mounted perpendicular to the edge of the substrate. The electronic assembly 400 may further include one or more illumination elements 412 mounted on the assembly. The lighting element 412 may have any of the characteristics of lighting elements 112a, 112b, 212a, 212b, and 312a, 312b. The electronic assembly 400 may also include a component 416 mounted on the substrate 402. Component 416 may be a resistor (e.g., a termination resistor) or any other type of component as listed above (e.g., a capacitor such as a decoupling capacitor).

[0050] The electronic assembly 400 may further include a proximal extension 460 which may have any of the characteristics of the proximal extension 360. Although the proximal extension 460 is shown as flat, the proximal extension 460 may include any of the configurations of the proximal extension 360 (e.g., a winding portion). The proximal extension 460 may be rigid, flexible, or a combination thereof. As described with respect to the proximal extension 360, the proximal extension 460 may be configured to extend through the shaft 42 of the medical device 10.

[0051] The proximal extension 460 may include one or more coplanar waveguides 470. The coplanar waveguides 470 may include any of the coplanar waveguide features known to those skilled in the art, and may provide impedance matching among various functions. For example, each coplanar waveguide 470 may include a conductive track 472 printed on a dielectric substrate, along with a pair of return conductors 474 on either side of the conductive track 472. The conductive track 472 and the return conductors 474 may each be formed on the same side of the substrate 402. The return conductors 474 may be separated by the conductive track 472 in a gap 476 of uniform width along its length. The dimensions of the coplanar waveguides 470 may be selected to provide desired characteristics (e.g., impedance). Figure 5A shows three coplanar waveguides 470, but the number is merely illustrative. The proximal extension 460 may also include additional conductors, such as ground conductors or return conductors, to provide additional shielding from other traces / waveguides 470. Such additional conductors may, for example, be the outer edge of the proximal extension 460.

[0052] The distal end of the conductive track 472 or other types of conductors (e.g., microstrips) may be electrically connected to one or more electronic components of the distal section 401 (e.g., imaging device 410, illumination element 412, and component 416). The proximal section 403 of the electronic assembly 400 may include a circuit 480. For example, the circuit 480 may include an integrated circuit (chip) or any other suitable element. The circuit 480 may include leads 482 for connecting to the conductive track 472 or other types of conductors of the substrate 402. The circuit 480 may perform any desired function. In one example, the circuit 480 may be located within the handle section 12 or at the distal or proximal end of the umbilical 30 (e.g., within the connector of the umbilical 30). Alternatively, the circuit 480 may be located within the shaft 42. In a further example, the circuit 480 may be located in the distal section 401.

[0053] The electronic assembly 400 may also include a grounding surface 490, as shown in Figure 5B, and as a result, the electronic assembly may utilize a conductor-backed coplanar waveguide (CBCPW). The grounding surface 490 may include a conductive body, which may function as a node at any potential or as a common return path for current. The conductive body may be a zero reference point or a zero-volt point. As shown in Figure 5B, the grounding surface 490 may be on the opposite side (back side) of the substrate 402 from the coplanar waveguide 470. The grounding surface 490 may have any of the features of a grounding surface known to those skilled in the art, and may interact with the coplanar waveguide 470 in any way known to those skilled in the art.

[0054] Figures 6A and 6B show further electronic assemblies 500. Figure 6A shows the upper side of the electronic assembly 500, and Figure 6B shows the lower side of the electronic assembly 500. The electronic assembly 500 may have any of the features of the electronic assemblies described above, and elements of the electronic assembly 500 similar to those provided above will not be described below.

[0055] The electronic assembly 500 may include a substrate 502 having a distal portion 501 (which may have the characteristics of any of the substrates 102, 202, 302, or 402). The distal portion 501 may include various components attached to it (including any of the components of the electronic assemblies 100, 200, 300, or 400). Although the components of the electronic assembly 500 are shown attached to the surface of the substrate 502, it is understood that any of the components may be attached to the edge of the substrate 502 instead, as described with respect to the electronic assemblies 100, 200, or 300. The distal portion 501 may include an imaging device 510 (which may have the characteristics of any of the imaging devices 110, 210, 310, or 410), a component 516 (which may have the characteristics of any of the components described herein), and a component 518 (which may have the characteristics of any of the components described herein). Component 516 may be, for example, a capacitor, and component 518 may be, for example, a resistor.

[0056] As shown in Figure 6A, the substrate 502 may include a coplanar waveguide 570 having any of the features described above with respect to the electronic assembly 400. As shown in Figure 6B, the substrate 502 may include a ground plane 590 having any of the features of the ground plane 490. The top surface of the electronic assembly 500 may further include a top plane 592. The top plane 592 may provide shielding to facilitate mitigation or reduction of electromagnetic interference. The top plane 592 may additionally or alternatively provide impedance matching for certain signals to provide improved image quality.

[0057] As shown in Figure 6A, the top plane 592 may be a copper plane and may include a grid pattern 594 (e.g., made of copper or any other suitable material / conductor). Alternatively, the top plane 592 may include another pattern (e.g., another type of cross-hatch pattern). The pattern of the top plane 592 may include regular openings 596 (e.g., rectangular or rhomboid openings) within the grid pattern 594. The lines of the grid pattern 594 may be connected to one another (e.g., by edges 598). The top plane 592 may provide a controlled impedance while maintaining flexibility (e.g., if the proximal extension 560 is flexible, as in the example of the proximal extension 360). The grounding surface 590 is shown as solid (not hatched with a grid pattern), but it is understood that the grounding surface 590 may include such a pattern in addition to, or alternatively to (the grounding surface 490 as well). The top plane 592 and the ground plane 590 are illustrated as being used in combination with the coplanar waveguide 570, but it is understood that the coplanar waveguide 570 may be omitted. In one example, the top plane 592 and the ground plane 590 may sandwich a conductor carrying a signal to and from the distal section 501, and thus may provide the benefit of shielding.

[0058] Embodiments of the electronic assemblies 400, 500 (e.g., coplanar waveguides 470, 570, ground planes 490, 590, and / or top plane 592) can, individually or in combination, provide impedance matching and / or shielding. Such features can, for example, improve signals from imaging devices 410, 510. Furthermore, such features may reduce electromagnetic radiation emitted from medical equipment 10 and limit interference from external energy sources.

[0059] The principles of this disclosure are described herein with reference to exemplary examples for specific applications, but it should be understood that this disclosure is not limited thereto. Those skilled in the art who have access to the teachings provided herein will recognize that additional modifications, applications, and substitutions of equivalents are all within the scope of the examples described herein. Therefore, the present invention should not be considered limited by the foregoing description.

Claims

1. An electronic assembly for medical devices, Circuit board and An imaging device attached to the first edge of the first portion of the circuit board, Including a lighting element attached to the second edge of the second portion of the circuit board, Electronic assembly.

2. The aforementioned lighting element is a first lighting element, The electronic assembly further includes a second lighting element attached to the third edge of the third portion of the circuit board. The electronic assembly according to claim 1.

3. The first lighting element is positioned substantially perpendicular to the second lighting element. The electronic assembly according to claim 2.

4. The circuit board includes an arm portion, The arm portion includes the second portion of the circuit board. The electronic assembly according to any one of claims 1 to 3.

5. At least a portion of the arm is a flexible part, The flexible portion includes at least one bent portion, The electronic assembly according to claim 4.

6. The first margin is the distal margin of the first portion. The electronic assembly according to any one of claims 1 to 5.

7. The first edge is positioned between the two contacts of the imaging device. The second edge is positioned between the two contact points of the lighting element. The electronic assembly according to any one of claims 1 to 6.

8. The imaging device is oriented so as to be substantially parallel to the plane of the first portion of the circuit board. The electronic assembly according to any one of claims 1 to 7.

9. The circuit board includes a proximal extension configured to extend through at least a portion of the shaft of the medical device, The electronic assembly according to any one of claims 1 to 8.

10. The aforementioned proximal extension extends into the handle of the medical device. The electronic assembly according to claim 9.

11. The proximal extension includes at least one winding portion, The electronic assembly according to claim 9 or 10.

12. The proximal extension includes at least one coplanar waveguide. The electronic assembly according to any one of claims 9 to 11.

13. The aforementioned proximal extension further includes a contact surface, The electronic assembly according to claim 12.

14. The aforementioned proximal extension includes a copper plane. The electronic assembly according to any one of claims 9 to 13.

15. At least a portion of the copper plane is cross-hatched. The electronic assembly according to claim 14.

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