Identification label, identification system, and method for manufacturing identification label

Abstract

The identification label (1) comprises an RFID transponder (3) with an RFID chip (5) and an antenna structure (6) which are signal-technically connected to one another, and a sealing layer (2, 4) which covers the RFID transponder (3). The sealing layer (2, 4) is material-bondedly connected to the substrate (4, 8, 13) by welding. The RFID chip (5) and / or the antenna structure (6) are thus surrounded by a welded seam (7) and are encapsulated between the sealing layer (2, 4) and the substrate (4, 8, 13).

Description

[Technical Field]

[0001] The present invention relates to an identification label that allows reliable and durable labeling of objects in a simple and cost-effective manner. The present invention also relates to a labeling system having such an identification label and a method for producing such an identification label. [Background technology]

[0002] Labels can be used for authentication or proof of origin wherever identification or verification of an object is required. Some labels are equipped with electronic components, such as RFID transponders, which allow information on the label and its bearer to be conveniently located and recorded electronically. Summary of the Invention

[0003] The problem that the present invention aims to solve is to provide an identification label that can be produced in a simple and cost-effective manner and that allows reliable and durable labeling of objects.

[0004] This problem is solved by the features of the independent patent claims. Advantageous further developments are set out in the respective dependent patent claims.

[0005] According to one aspect of the invention, an identification label comprises an RFID transponder having an RFID chip and an antenna structure that are signal-technically coupled to one another, and a sealing layer that covers the RFID transponder, the sealing layer being materially connected to the substrate by welding in such a way that the RFID chip and / or the antenna structure are surrounded by a weld seam and are enclosed between the sealing layer and the substrate.

[0006] Identification labels are a simple and cost-effective way to provide secure and reliable electronic labeling for objects. Thanks to the sealed welded seam, the identification label is reliably protected from unwanted external influences, such as moisture. For example, they can be designed as RFID labels with welded edges and are used in the medical or pharmaceutical sector to label syringes or containers that are typically processed using sterilization processes such as autoclaving. The described structure of the identification label reliably prevents steam or liquids from penetrating the RFID transponder area, allowing the identification label to remain on the object without significantly impairing its functionality.

[0007] In connection with the present invention, it has been discovered that conventional electronic labels with RFID functionality are susceptible to corrosion and performance degradation due to moisture penetration. Despite the use of a protective film, moisture can penetrate laterally through the adhesive layer and reach the sensitive areas of the RFID function, sooner or later adversely affecting its functionality. Therefore, the use of such labels on products that must be sterilized is either impossible or poses a high risk to their functionality.

[0008] The described identification label and sealing weld seam provide the desired moisture barrier so that RFID functionality is maintained after the autoclave process and ensures overall reliable protection of the RFID transponder against chemical and / or physical influences.

[0009] According to a further development of the identification label, the RFID transponder comprises a carrier layer on which the RFID chip and the antenna structure are arranged, the carrier layer forming a sealing layer that is material-bondedly connected to the substrate by a welded seam. Alternatively, such a carrier layer of the RFID transponder can form the substrate to which the sealing layer is connected by a welded seam. The carrier layer is designed, for example, as a polyethylene (PE) or polyethylene terephthalate (PET) film element and is connected to the substrate by melting. Furthermore, other thermoplastics or plastics or materials in general are also possible, which can be material-bondedly connected to the substrate by welding, sealing or melting. The carrier layer can form a component of the RFID transponder and also function as a sealing layer. Alternatively, the carrier layer can form a support for the RFID chip and antenna and can be covered with a further sealing layer, for example in the form of a film-based top layer. Furthermore, the RFID transponder with the carrier layer can be arranged and encapsulated between these components, freely movable, so to speak, floating freely, without any fixed connection to the top layer, the sealing layer and / or the substrate.

[0010] Furthermore, the identification label can have a lower layer forming a substrate that is materially connected to the sealing layer by a welded seam. The lower layer can be realized as a film element, such as a PET or PE film, and can be welded to the carrier layer of the RFID transponder described above. Insofar as there is an upper layer that also forms a sealing layer, the lower layer can be welded to the upper layer and, optionally, to the carrier layer, and surround the RFID transponder.

[0011] Preferably, films of the same type are welded together. For example, the sealing layer is a PET film and the substrate is a lower layer in the form of another PET film. Alternatively, different weldable materials can be applied to the sealing layer and the substrate. For example, semi-crystalline and amorphous films can be mixed or materially connected. In either case, a composite can be formed between at least one meltable or hermetically sealable sealing layer and the substrate, which serves as the carrier material for the RFID transponder. Furthermore, other layers can be incorporated into the structure of the identification label, thereby realizing, for example, a multi-layer composite system with different functional layers.

[0012] The sealing layer and / or substrate processed film has a thickness of, for example, 15 μm to 500 μm in order to provide defined properties such as high flexibility, high resistance to mechanical influences, or light protection. This thickness refers to the lamination direction transverse to the main extension plane of the identification label, which, when applied to an object, essentially corresponds to the surface normal of the object.

[0013] The aforementioned bottom layer can form a component of the identification label or can be attached to the object to which the label is to be applied. For example, the bottom layer can be formed by a film element, such as an already applied label or a shrink film applied by a syringe. Thus, the label or the shrink film can form the bottom layer, which is materially connected to the sealing layer of the identification label by welding.

[0014] Alternatively, the object itself can form a lower layer or substrate to which the sealing layer of the identification label is materially bonded by welding. For example, a plastic syringe or injector is provided, the surface of which forms a weldable substrate. A sealing layer is provided on this substrate or on such a surface, and materially bonded by welding. That is, the RFID chip and antenna structure can be applied directly to a solid substrate or component by means of a carrier material or sealing layer. The carrier material serves to self-protect the RFID transponder. Thus, the electronic identification label is provided only in a preliminary step with the RFID transponder and sealing layer, and is formed as a final product by materially bonded welding to a given substrate.

[0015] The identification labels can be realized using a particularly simple and clear structure, and do not require additional barrier elements, protective bodies, or additional layers to ensure reliable sealing of the RFID function, especially against moisture and corrosion. Corrosion due to excessive moisture occurs, for example, in the area of ​​the RFID chip, which usually has metal or metal contacts. The antenna structure of an RFID transponder, formed, for example, by conductor tracks made of silver, aluminum, or copper, can suffer significant loss of functionality due to corrosion. The described identification labels allow for flexible adhesive labels that reliably block moisture penetration and prevent corrosion, or at least significantly reduce the risk of corrosion, based, for example, on the material bonding effects of the RFID chip and / or RFID antenna structure. Therefore, there is no need to protect the RFID function using complex and costly methods, such as fully molding the RFID, which would not be as flexible and versatile as flexible adhesive labels.

[0016] According to a further development of the identification label, the sealing layer is connected to the substrate by an adhesive layer, so that the adhesive layer is at least partially enclosed within the weld seam and sealed between the sealing layer and the substrate. In this way, the adhesive layer is also protected from the effects of moisture and can contribute to a secure connection between the components of the identification label. For example, the adhesive layer is applied locally to the underside of the sealing layer facing the RFID transponder and the substrate. Such an adhesive layer can be applied partially or form a closed ring or frame. Preferably, the adhesive layer is formed over the entire underside of the sealing layer, and the weld seam displaces the adhesive layer to the inside or outside of the material-bonding area during formation. Therefore, the adhesive layer can also be present in the area where the weld seam and material-bonding connection are formed. Alternatively or additionally, the adhesive layer or further adhesive layer can be arranged outside the area of ​​the welded seam in order to first connect the sealing layer to the substrate in its adhesive end area and then form a welded seam within the adhesive area.

[0017] The adhesive layer is preferably provided so that it remains completely or largely in the region of the joining zone where the welded seam will be formed. The joining zone can thus be designed adhesive-free, allowing the sealing layer to be reliably welded to the substrate. The adhesive layer can be formed only in the inner region of the RFID antenna structure and surrounded by the welded seam. Alternatively or additionally, the adhesive layer or an additional adhesive layer can also be arranged in the outer edge region adjacent to the welded seam. Thus, the identification label can have two or more adhesive portions separated by a purposefully formed adhesive-free region. The adhesive-free region is provided for forming the welded seam and is particularly adapted to the shape of the RFID antenna structure. For example, the RFID antenna structure and the adhesive-free region can be formed in a rectangular, square, or circular shape. Alternatively, they can also be formed in other geometric shapes.

[0018] According to a further development of the identification label, the weld seam extends and closes along the label edge of the identification label. The weld seam, for example, forms a ring or frame around the RFID transponder, or at least around the RFID chip or RFID antenna structure. For example, it would be beneficial for the identification label to reliably seal the RFID chip as a sensitive electronic semiconductor component and allow different antenna structures to be coupled to the welded RFID chip. While RFID chips often have similar structures, the antenna structures can have different shapes and configurations depending on the application and functional specifications. The weld seam extends over a portion of the antenna structure that is connected to the RFID chip. However, even at such overlapping locations, the weld seam is reliably formed and materially connected to the antenna structure, which may be made of or contain silver, aluminum, or copper, for example.

[0019] The identification label can be assigned a stacking direction and a main extension surface, the stacking direction being substantially perpendicular to the main extension surface. The identification label, in particular, like most labels, is flat, so that the label width and label length clearly exceed the label thickness. The label width and label length span the main extension surface, while the label thickness is along the stacking direction. For example, then along the stacking direction, a top layer is applied, followed by an RFID transponder with or without its own carrier layer, followed by a bottom layer or substrate.

[0020] The weld seam is preferably designed with a predetermined structural profile and a predetermined width relative to the main extension plane, for example, between 0.2 mm and 10 mm. Such a weld seam can be easily and reliably formed, in particular by ultrasonic welding. Alternatively, the weld seam can be formed using laser welding and can be even thinner or narrower, having a width of 0.1 mm. However, wider weld seams can also be formed by welding or sealing, so the weld seam of the identification label can be wider than 10 mm. A predetermined wide weld seam creates a corresponding inherent rigidity of the weld seam, which contributes to improving the rigidity of the identification label and can counteract undesired wrinkles on the identification label. The height or thickness of the weld seam can also be designed depending on the RFID function involved.

[0021] The identification label can also be designed so that the welded seam has a predetermined two-dimensional structure relative to its main extension plane, such as a wavy, zigzag, and / or waffle structure. In this way, the welded seam can be effectively widened, increasing the inherent rigidity and strength of the welded connection compared to a narrow, straight welded seam, contributing to increased rigidity of the identification label and preventing undesired wrinkling of the identification label. The described options for designing the two-dimensional structure contribute to the stability of the identification label bond, for example, ensuring distortion-free subsequent application of the identification label on or to an object. The welded seam can be formed in sections or closed continuously in a single operation.

[0022] The weld seam can be formed locally or circumferentially around the RFID chip and / or antenna structure, thereby reliably sealing the RFID chip and / or antenna structure. Such a material-bonding connection does not necessarily have to be self-sealing, but can also cooperate with one or more auxiliary elements and / or adjacent structures of the identification label and / or substrate. At least the material-bonding connection by the weld seam formed between the sealing layer and the substrate contributes to a reliable sealing of the RFID transponder or RFID chip and / or antenna structure.

[0023] According to a further development of the identification label, the sealing layer and / or substrate are pre-connected by a welded seam in a material-bonding manner so that the identification label forms a predetermined curved labeling medium. The welded seam can thus be formed in a predetermined three-dimensional configuration so that the shape of the identification label conforms to the contours of the object to be labeled. This conformity has a beneficial effect on the ease of application and secure retention of the identification label, since the restoring forces that would force the identification label into a flat position are reduced compared to flat labels that must be applied to curved surfaces. For example, the identification label is formed by ultrasonic welding a sonotrode and a support in the form of an anvil, and is intended for use with cylindrical containers, such as syringes with a cylindrical syringe body. Particularly preferably, the anvil has a contact surface with the sonotrode that has a curvature that corresponds to the circumferential curvature of the syringe body.

[0024] The identification label may further comprise a film element bonded to the RFID transponder and / or the sealing layer and / or the substrate and designed to counteract moisture absorption into the enclosed area carrying the RFID chip and / or antenna structure. For example, the sealing layer may be combined with a film material having special properties, which film material forms the top material, intermediate layer and / or inlay substrate and establishes an additional barrier effect against, for example, oxygen and / or water vapor, and also against corrosive gases and / or liquids, or counteracts the absorption of oxygen and / or moisture or corrosive gases and / or liquids into the area of ​​the RFID transponder.

[0025] According to a further development, the identification label has a functional element connected to, attached to, or applied to the RFID transponder and / or the sealing layer and / or the substrate, and designed to provide mechanical protection for the RFID chip and / or antenna structure. For example, an additional fleece layer can be inserted to provide mechanical protection for the RFID transponder. Alternatively or additionally, foam elements and / or rubber-elastic film elements can be provided, which serve as upper and / or lower cover layers for the RFID transponder and jointly form the sandwich structure of the identification label.

[0026] The functional element and / or the aforementioned film element can be positioned inside and / or outside the welded seam and, in some cases, can be welded to the sealing layer. This provides reliable mechanical, physical, and / or chemical protection for the inside or area of ​​the RFID transponder. On the outside of the RFID transponder or on the opposite side of the welded seam, the functional element and / or film element can act as a spacer to define a predetermined height for the identification label. Alternatively or additionally, distance designations can be implemented on the inside, for example, by placing paint dots around the RFID chip and printing them on the carrier layer. Furthermore, a ferrite film can be provided as a functional element of the identification label, improving the RFID functionality of the RFID transponder even on metal substrates.

[0027] The desired barrier properties and security features can be achieved by modifying the identification label with a film and / or functional layer. Furthermore, the label structure can also include the modification of rubberized or non-rubberized films for fixing or further processing the identification label. Functional elements can be designed in the form of, for example, a voided layer or can include such a layer. The voided layer provides a void effect that provides protection against manipulation. For example, the voided layer can be realized with two or more different adhesive structures or release gradients. For example, a more adhesive structure in the form of lettering can be realized in the voided structure, while other parts of the voided structure have a weaker adhesive property. When an identification label having a void structure or void layer is applied to an object to be labeled, for example, upon peeling the identification label, the more adhesive lettering remains attached to the object, while the less adhesive portion is removed along with the identification label or label portion that is peeled from the object. Alternatively, the described structures can be designed inversely with respect to adhesive strength, e.g., structures in the form of lettering have weak adhesive strength.

[0028] Alternatively or additionally, security features can be provided in the form of punched holes that provide a predetermined weakening structure in the label layers of the identification label. In this way, for example, tear points can be provided that cause the label to tear in a predetermined manner in the event of an attempt at tampering. Alternatively or additionally, perforations can be provided in one or more layers of the identification label, which perforations allow the respective layers to be cut or separated in a predetermined manner.

[0029] According to a further development of the identification label, the sealing layer and / or the substrate are designed as transparent film elements. The transparent film allows the RFID transponder to be visible in the enclosed label structure and allows optical inspection. Alternatively or additionally, colored and / or non-transparent film elements can be provided to hide the RFID transponder and the internal structure of the identification label.

[0030] According to a further aspect of the present invention, an identification system includes the above-mentioned identification label attached to an object. In particular, the surface of the object can form the substrate of the identification label to which the sealing layer is materially connected by a welded seam. The surface of the object can be provided, for example, by the outer surface of a container made of a weldable, soluble and / or bondable material. Alternatively, an element such as a film or label placed on the surface of the object can form the weldable substrate for the sealing layer.

[0031] Since the labeling system includes the described identification label embodiments, the described properties and characteristics of the identification label are also disclosed for the identification system, and vice versa.

[0032] According to a further aspect of the present invention, a method for producing an identification label includes the steps of providing an RFID transponder having an RFID chip and an antenna structure signal-technically coupled to each other, and providing a sealing layer. The method further includes the steps of applying the RFID transponder and the sealing layer to a substrate, so that the RFID chip and / or antenna structure are disposed between the sealing layer and the substrate. The application of the RFID transponder and the sealing layer can be performed simultaneously in one step or separately in time. The method also includes the step of forming a welded seam by welding the sealing layer, so that the RFID chip and / or antenna structure are surrounded by the welded seam and encapsulated between the sealing layer and the substrate.

[0033] The formation of welded seams can be performed cost-effectively and quickly, particularly by ultrasonic welding. Torsional and / or longitudinal ultrasonic welding can be performed using a sonotrode and anvil as welding tools. The sonotrode is moved and vibrated, acting as a support for the anvil, which acts to melt the sealing layer material. The anvil and sonotrode are positioned on opposite sides of the layers to be welded. The anvil can be a separate tool or can be an object itself, such as a syringe. In longitudinal ultrasonic welding, the sonotrode acts as a hammer, striking the sealing layer and the substrate to be welded. In torsional ultrasonic welding, the sonotrode rubs along a predetermined path to form the welded seam. Alternatively or additionally, the welded seam can be formed by heat welding and / or sealing and / or laser welding. Sealing includes heat sealing and cold sealing.

[0034] According to a further development of the method, the welding seam is performed by a sonotrode and anvil having complementary curvature surfaces that face each other during operation, so that the welding seam is designed with a predetermined curvature relative to the stacking direction of the identification label, resulting in the identification label being formed with a predetermined curvature relative to its main extension plane. The shape or working surface of the sonotrode and anvil is preferably selected to correspond to the contour of the object to which the identification label is to be attached.

[0035] The method may include the steps of performing a punching and / or cutting process and a process for forming the contours of the identification labels. The identification labels are preferably formed in plurality on a continuous material web and processed into a label roll. The punching and / or cutting process may in particular be performed simultaneously with the welding of the sealing layer in a common work step.

[0036] According to a further development, the method comprises providing a substrate, in the form of a carrier layer of the RFID transponder and / or in the form of a bottom layer and / or in the form of a surface of an object to be labeled with an identification label, to be welded to the sealing layer (2, 4). For example, multiple weld seams can be formed in the described method, such that a top layer is welded as a sealing layer to the carrier layer of the RFID transponder and to the bottom layer forming the substrate. In this way, a particularly reliable and secure encapsulation of the RFID transponder in the identification label can be achieved.

[0037] Each method is specifically designed to produce the aforementioned identification label embodiments, and therefore the properties and characteristics of the identification label are also disclosed for the methods of manufacture, and vice versa.

[0038] A large number of identification labels can be processed, in particular in a quasi-static, clocked roll-to-roll process with a front-end and a back-end. Several sonotrodes can also be provided, for example clocked in a line, to carry out several welding processes simultaneously. In this way, the roll-to-roll process can be carried out by dynamically changing the belt speed and by permanently introducing vibrations via the sonotrode. Alternatively, the roll-to-roll process can be carried out continuously without dynamic changes, for example if the sonotrode and / or the anvil are designed as roller sonotrodes or roller anvils.

[0039] They can also be processed in a part picking process to be permanently applied to individual parts. The inlay or RFID transponder process can also be set up to form loose parts and place them in a container loose, for example to track an entire collection of parts on a pallet.

[0040] The processing frequency can be in the range of 20 kHz to 100 kHz, and in particular the welding process can be combined with the punching process in a single operation. The separation process can be carried out in a previous or subsequent stage by carrying out the cutting step using a laser, ultrasonic knife, cutting knife, roll knife and / or punching profile or die.

[0041] Furthermore, the positioning of the articles to be welded, i.e., the sealing layer relative to the RFID transponder and / or the sealing layer relative to the substrate, can be achieved by web-like feeding of the respective web material. Individual applications can also be set up at defined locations. In connection with ultrasonic welding, the RFID transponder and sealing layer can be placed directly on the sonotrode by clamping the welded articles onto the sonotrode and / or anvil via vacuum. Alternatively or additionally, the welded articles can be locally or entirely clamped onto the substrate by applying a rubber coating to the underside of the RFID transponder and / or the top and / or bottom layers.

[0042] The described manufacturing options allow the RFID inlay film to be reliably protected against moisture penetration and the associated corrosion, for example by being materially welded to a top film or between two films. Alternatively, the RFID transponder with its carrier layer can be directly fixed to the component by welding. [Brief explanation of the drawings]

[0043] Hereinafter, an embodiment of the present invention will be described with reference to the schematic drawings. [Figure 1] 1-4 are side views showing various embodiments of identification labels. [Figure 2] 1-4 are side views showing various embodiments of identification labels. [Figure 3] 1-4 are side views showing various embodiments of identification labels. [Figure 4] 1-4 are side views showing various embodiments of identification labels. [Figure 5] FIG. 5 shows an example of process steps for forming an identification label according to FIGS. [Figure 6] 6-7 show examples of identification labels in their respective top views. [Figure 7]6-7 show examples of identification labels in their respective top views. [Figure 8] 8-10 are top views showing various embodiments of welded seams for identification labels. [Figure 9] 8-10 are top views showing various embodiments of welded seams for identification labels. [Figure 10] 8-10 are top views showing various embodiments of welded seams for identification labels. [Figure 11] FIG. 11 is a flowchart showing a method for manufacturing the identification labels according to FIGS. DETAILED DESCRIPTION OF THE INVENTION

[0044] Elements or features of the same structure or function are labeled with the same reference numerals throughout the drawings. For clarity, not all elements or features shown in every figure are labeled with corresponding reference numerals.

[0045] 1 to 4 each show a schematic side view of various embodiments of an electronic identification label 1. The identification label 1 comprises an RFID transponder 3 having an RFID chip 5 and an antenna structure 6 that are signal-technically coupled to one another. Furthermore, the identification label 1 comprises a sealing layer, which is realized as a separate upper layer 2 (see FIGS. 1, 2 and 5) or as a carrier layer 4 of the RFID transponder 3 (see FIGS. 3 and 4). The sealing layer covers the RFID transponder 3 and is materially connected to a substrate by welding, so that the RFID chip 5 and / or the antenna structure 6 are surrounded by a welded seam 7 and are enclosed between the sealing layer and the substrate. The substrate is realized as a separate lower layer 8 (see FIGS. 1 and 4), as the surface 13 of the object 10 (see FIG. 3), or as the carrier layer 4 of the RFID transponder 3 (see FIGS. 2, 5 and 6).

[0046] The identification label 1 allows a safe and reliable electronic label to be attached to the object 10 in a simple and cost-effective manner. The sealing weld seam 7 reliably protects the identification label 1 from unwanted external influences, for example in the form of moisture. The identification label 1 is designed, for example, as a sealed RFID label with a welded edge 12 and can be used, in particular in the medical or pharmaceutical field, to identify syringes or containers that are to be treated by a sterilization process, such as an autoclave. The described structure of the identification label 1 reliably prevents the penetration of steam or liquids into the area of ​​the RFID transponder 3, so that the identification label 1 remains on the object 10 without impairing its functionality.

[0047] The identification label 1 shown in FIG. 1 has a bottom layer 8 as a substrate, which forms a bottom cover layer or support for the RFID transponder 3 and / or the top layer 2. The top layer 2 in this embodiment serves as a sealing layer. At the label edge 12 of the identification label 1, the top layer 2 and the bottom layer 8 are materially connected by a weld seam 7, so that the RFID transponder 3, which includes the RFID chip 5, the antenna structure 6, and the carrier layer 4 according to FIG. 1, is welded to a type of label pocket. Preferably, the RFID transponder 3 is bonded to the top layer 2 and / or the bottom layer 8 and fixed in position. Alternatively, the RFID transponder 3 with the carrier layer 4 can be freely movable within the labeling pocket, or, as it were, floating freely, without being bonded to the top layer 2 and / or the bottom layer 8. Furthermore, the identification label 1 has an adhesive layer 9, which is arranged underneath or on the outside of the bottom layer 8, allowing the identification label 1 to be easily and reliably applied to an object.

[0048] As used herein, terms such as "top," "bottom," "top layer," "bottom layer," and "substrate" refer to the alignment and orientation of the components of the identification label 1 as shown in the figures. Additionally, the stacking direction R of the identification label 1 is shown and corresponds to the vertical line in the figures. When applied to an object, the stacking direction R generally corresponds to the normal to the surface of the object to which the identification label 1 is to be applied. Thus, the bottom layer 8 faces the object, and the sealing layers 2, 4 rest on top and face away from the object.

[0049] The welded seam 7 forms a material bond between the top layer 2 and the bottom layer 8, forming a sealing surface within which the RFID transponder 3 is placed. The RFID transponder 3 forms a completely encapsulated or surrounded inlay.

[0050] 2 shows a further embodiment of the identification label 1, in which the carrier layer 4 of the RFID transponder 3 forms the weldable substrate of the upper layer 2. The upper layer 2 is welded to the inlay substrate of the RFID transponder 3 itself. This allows the identification label 1 to be realized in a particularly flat manner. Particularly advantageously, the upper layer 2 and the lower layer 4, as well as the lower layer 8 according to FIG. 1, are designed as thin, flexible film elements, and preferably they are made of the same material. In this way, a reliable welded connection can be formed, and a flexible, particularly flat identification label can be designed.

[0051] FIG. 3 shows a further embodiment of the identification label 1, in which the substrate is provided by the surface 13 of the object 10 itself. The surface 13, for example as the outer surface of a plastic injection molding, provides a solid substrate to which the sealing layers 2, 4 can be welded. For example, as shown in FIG. 3, the sealing layer is realized by the carrier layer 4 of the RFID transponder 3, which is attached by welding to a predetermined position on the periphery of a plastic syringe, thereby forming the identification label 1. Alternatively, the object 10 can realize a pharmaceutical package or label to be attached to an injection bottle or vial. In either case, the surface 13 is configured as a substrate to which the sealing layers 2, 4 can be welded.

[0052] 4 shows a further embodiment of the identification label 1, in which it is shown that the sealing layers 2, 4 can also be connected to the substrates 4, 8, 13 by means of an adhesive layer 11. The adhesive layer 11 is preferably arranged on the inside of the welded seam 7 so as to be protected from external chemical and / or physical influences as well. In particular, the adhesive layer 11 can be used to position the sealing layers 2, 4 before they are materially connected to the substrates 4, 8, 13 by welding.

[0053] Alternatively or additionally, adhesive layer 11 or a further adhesive layer can be arranged outside the area of ​​the welded seam 7 in order to adhere the sealing layer 2, 4 with its adhesive edge area to the substrate 4, 8, 13 and then form the welded seam 7 in the adhesive area (see also Figure 7). Adhesive layer 11 is shown by way of example in Figure 4 but can also be provided in other embodiments. In particular, adhesive layer 11 can also be formed over the entire underside of the sealing layer 2, 4 and serve to fix the inlay.

[0054] Figure 5 is a schematic diagram illustrating how an identification label 1 can be formed by ultrasonic welding using a sonotrode 14 and anvil 15. In this context, reference is made in particular to the description of Figure 10 below.

[0055] FIG. 6 shows a schematic diagram of an identification label 1. It shows that the antenna structure 6 is designed in the form of a conductive track and is connected to the RFID chip 5. For example, the antenna structure 6 is printed on the carrier layer 4 in the form of a copper, silver, or aluminum track. The RFID chip 5 can also be applied to the carrier layer 4 using a printing process. Both the antenna structure 6 and the RFID chip 5 are surrounded by a welded seam 7, laterally sealed by this welded seam 7, and are particularly protected against the ingress of moisture. Alternatively, only the RFID chip 5 can be surrounded by the welded seam 7. Alternatively, further welded seams can be formed so that the identification label 1 has at least one welded seam 7. For example, the RFID chip 5 can be surrounded by the welded seam 7, and the antenna structure 6 can also be surrounded by a further welded seam 7. Correspondingly, a particularly reliable and secure barrier can be formed against the ingress of moisture in the area of ​​the antenna structure 6 and / or the RFID chip 5. The welded seam 7 can also be designed to lie on the antenna structure 6 or to cross the antenna structure 6 .

[0056] FIG. 7 is a top view diagrammatically illustrating a further example of an identification label 1. The adhesive layer 11 has a large surface area and can have two separate adhesive sections spaced apart from each other. A non-adhesive area 16, which separates the two adhesive sections, is located between the two adhesive sections of the adhesive layer 11. The adhesive layer 11 is therefore absent in the non-adhesive area 16. The non-adhesive area 16 provides a joining area for forming the welded seam 7. According to the example embodiment shown in FIG. 7, the adhesive layer 11 is not continuous, but is located in the inner area of ​​the RFID antenna structure 6 and in the outer edge area adjacent to the welded seam 7. The adhesive-free area 16 conforms to the shape of the RFID antenna structure 6 and, according to the example embodiment shown in FIG. 7, is essentially rectangular.

[0057] The welded seam 7 can also be formed in a predetermined two-dimensional configuration, as shown in Figures 8 to 10. Figures 8 to 10 each show schematic diagrams of possible designs of the welded seam 7 extending substantially in the main extension plane of the identification label 1. The welded seam 7 can have a wavy or zigzag configuration (see Figure 8), a sunray configuration (see Figure 9), or a waffle configuration (see Figure 10). In all cases, the welded seam 7 is intentionally made wider to increase the inherent rigidity of the welded seam and contribute to improving the rigidity of the identification label 1 compared to a narrow, straight welded seam. This welded seam configuration also helps to counteract undesired wrinkling of the identification label 1, allowing for subsequent distortion-free application of the identification label 1 to or on an object. The welded seam 7 can be formed in sections, have several starting and ending points, or can be closed in one continuous operation. The illustrated line sections of FIGS. 9 and 10 can thus realize respective weld seams which coherently form or at least contribute to the illustrated weld seam 7 in the form of a frame.

[0058] 11 is a flowchart of the process for producing the design of the identification label 1. The production can be carried out, for example, by ultrasonic welding using the device shown in FIG.

[0059] In step S1, the components of the identification label 1 are provided: the RFID transponder 3 comprises an RFID chip 5, an antenna structure 6 and a carrier layer 4 on which the RFID chip 5 and the antenna structure 6 are arranged. Furthermore, a sealing layer is provided in the form of a top layer 2.

[0060] In a further step S2, the RFID transponder 3 and the top layer 2 are arranged relative to each other such that the RFID chip 5 and / or antenna structure 6 is arranged between the top layer 2 and the carrier layer 4.

[0061] In a further step S3, the weld seam 7 is formed by ultrasonic welding. The sonotrode 14 and the anvil 15 are guided towards each other and brought into contact so that the top layer 2 and the carrier layer 4 are pressed together and fused together. The sonotrode 14 can, for example, hammer the anvil 15, so that the top layer 2 and the backing layer 4 are joined by longitudinal ultrasonic welding. Alternatively or additionally, the sonotrode 14 rubs against the anvil 15, so that the top layer 2 and the carrier layer 4 are joined by torsional ultrasonic welding. By forming the weld seam 7, the RFID chip 5 and / or the antenna structure 6 are surrounded by the weld seam 7 and are encapsulated between the top layer 2 and the carrier layer 4 (see Figures 2 and 4).

[0062] Alternatively or additionally, the welded seam 7 may be formed by heat welding and / or laser welding and / or sealing.

[0063] In step S4, a punching and / or cutting process can be carried out to form the outer shell of the identification label 1. Preferably, steps S3 and S4 can be carried out in a single operation. For example, welding of the top layer 2 to the carrier layer 4 can be carried out in combination with punching and / or laser cutting.

[0064] 5, the welded seam 7 can also be formed with a predetermined three-dimensional contour, in order to introduce a base radius into the identification label 1 and form it with a predetermined curvature. The sonotrode 14 and the anvil 15 have complementary curved surfaces at their contact points and face each other during operation. This means that the welded seam 7 can be formed with a predetermined curvature relative to the stacking direction R, and therefore the identification label 1 can be formed with a predetermined curvature relative to its main extension plane.

[0065] The shape or working surface of the sonotrode 14 and anvil 15 is preferably selected to correspond to the contour of the object 10 to which the identification label 1 is to be applied, for example the circumferential shape of a syringe. Compared to a flat label to be applied to a curved surface, the restoring force biasing the identification label 1 into a flat position is reduced. This makes it particularly easy to apply the identification label 1 to the syringe and improves the retention of the syringe.

[0066] The formation of the identification labels 1 can be carried out continuously, in particular from one or more webs of material, so that large numbers of identification labels 1 can be produced easily and cost-effectively.

[0067] The RFID inlay is enclosed within the identification label 1 and protected from moisture by materially bonding the upper and lower materials together. The upper material or upper layer 2 can be directly welded to the inlay substrate or to the carrier layer 4 of the RFID transponder 3. According to a further embodiment, the upper material can be welded to the lower cover layer or lower layer 8. In both cases, a completely sealed space is formed that protects the RFID chip 5, the antenna structure 6, and possibly the adhesive points 11 from moisture. Furthermore, it is also possible to only perform local welding directly around the RFID chip 5 or around the antenna structure 6. In particular, local welding can be performed along the label edge 12 in the shape of the label format. [Explanation of symbols]

[0068] 1 Identification label (Kennzeichnungsetikett) 2 Sealing layer / top layer (Versiegelungsschicht / Oberschicht) 3 RFID Transponder 4 Sealing layer / Underlayer / Carrier layer for RFID transponders 5 RFID chips in RFID transponders 6 Antenna structure of RFID transponders 7 Welded seam (Schweissnaht) 8 Base material / underlayer (Untergrund / Unterschicht) 9 Adhesive layer (Klebeschicht) 10 Object (Gegenstand) 11 Adhesive layer (Klebeschicht) 12 Label edge (Etikettenrand) 13 Substrate / surface of object (Untergrund / Oberflaeche des Gegenstandes) 14 Sonotrode 15 Amboss 16 Adhesion-free area / bonding zone R Stacking direction of identification labels (Stapelrichtung des Kennzeichnungsetiketts) S(i) Steps in the manufacturing method of the identification label

Claims

1. 1. An identification label comprising: - an RFID transponder having an RFID chip and an antenna structure that are signal-technically coupled to one another; a sealing layer covering the RFID transponder and materially connected to the substrate by welding, so that the RFID chip and / or the antenna structure are surrounded by a welded seam and encapsulated between the sealing layer and the substrate, the sealing layer being a flexible film element; An identification label comprising:

2. the RFID transponder comprises a carrier layer on which the RFID chip and the antenna structure are disposed; the carrier layer forms a sealing layer and is materially connected to the substrate by the welded seam; The identification label according to claim 1.

3. the RFID transponder comprises a carrier layer on which the RFID chip and the antenna structure are disposed; the carrier layer forms a substrate, and the sealing layer is materially connected to the substrate by the welded seam. The identification label according to claim 1.

4. a lower layer forming the substrate, the sealing layer being materially connected to the substrate by the welded seam; The identification label according to claim 1.

5. the sealing layer is connected to the substrate by an adhesive layer, and thus the adhesive layer is at least partially within and surrounded by the weld seam and is encapsulated between the sealing layer and the substrate; The identification label according to claim 1.

6. The welded seam is formed with a predetermined width within a range of 0.2 mm to 10 mm relative to the main extending surface of the identification label. The identification label according to claim 1.

7. the welded seam is formed in a predetermined structural path relative to a main extension surface of the identification label, and has a wave structure, a zigzag structure, and / or a waffle structure; The identification label according to claim 1.

8. the welded seam is formed locally or circumferentially around the RFID chip and / or the antenna structure; The identification label according to claim 1.

9. the sealing layer and / or the substrate are materially connected to each other by the welded seam, so that the identification label forms a predetermined curved identification medium; The identification label according to claim 1.

10. a film element bonded to the RFID transponder, the sealing layer and / or the substrate, the film element being adapted to prevent moisture absorption into an encapsulated area having the RFID chip and / or the antenna structure; The identification label according to claim 1.

11. - comprising a functional element bonded to the RFID transponder, the sealing layer and / or the substrate and adapted to provide mechanical protection for the RFID chip and / or the antenna structure; The identification label according to claim 1.

12. The functional element comprises a nonwoven layer and / or a foam and / or a rubber element; The identification label according to claim 11.

13. The sealing layer and / or the substrate are formed as transparent film elements; The identification label according to claim 1.

14. 1. An identification system comprising: - with the object; - an identification label according to any one of claims 1 to 13, which is coupled to the object; An identification system comprising:

15. a surface of the object forming the substrate; the sealing layer of the identification label is form-fittingly connected to the substrate by the welded seam; 15. The identification system of claim 14.

16. 1. A method for producing an identification label, comprising: providing an RFID transponder having an RFID chip and an antenna structure signal-technically coupled to one another; - providing a sealing layer; applying the RFID transponder and the sealing layer to a substrate, so that the RFID chip and / or the antenna structure are located between the sealing layer and the substrate; - forming a welded seam by welding the sealing layer, so that the RFID chip and / or the antenna structure are surrounded by the welded seam and encapsulated between the sealing layer and the substrate, the sealing layer being a flexible film element; A method comprising:

17. The welded seam is formed by ultrasonic welding, heat welding and / or laser welding.

17. The method of claim 16.

18. the welding seam is performed by a sonotrode and anvil having complementary curvature surfaces that face each other during operation, so that the welding seam is designed with a predetermined curvature relative to the stacking direction of the identification label, so that the identification label is formed with a predetermined curvature relative to its main extension plane; 18. The method of claim 16 or 17.

19. performing a punching and / or cutting process and a process for forming the outer contour of the identification label; The welding of the sealing layer and the punching and / or cutting process are carried out in one work step.

18. The method of claim 16 or 17.

20. providing a substrate to be welded with said sealing layer in the form of a carrier layer of said RFID transponder and / or in the form of a bottom layer and / or in the form of a surface of an object to be labeled with an identification label, 18. The method of claim 16 or 17, comprising:

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