Sheet-like bonding material, method for manufacturing a bonded body, and bonded body

Abstract

Provided is a sheet-like joining material comprising: copper particles that are cores; and a shell that contains one or more slightly oxidized copper selected from Cu64O and Cu8O; the one or more slightly oxidized copper selected from Cu64O and Cu8O including slightly oxidized copper-coated copper particles being slightly oxidized copper particles having an average particle diameter of 1 nm to 20 nm inclusive and a medium, wherein the content of the slightly oxidized copper-coated copper particles is greater than 85 mass %.

Claims

1. The core consists of copper particles and Cu ６４ O and Cu ８ A shell comprising one or more trace copper oxides from O, and the Cu ６４ O and Cu ８ One or more of the O molecules are copper oxide particles with an average particle size of 1 nm to 20 nm, and are copper oxide coated copper particles. Including a medium, A sheet-like bonding material having a content of more than 85% by mass of the aforementioned copper particles coated with a small amount of copper oxide.

2. The sheet-like bonding material according to claim 1, wherein the copper particles that constitute the core have an average particle size of 20 nm or more and less than 2 μm.

3. The sheet-like bonding material according to claim 1, wherein the thickness is 1 μm or more and 1 mm or less.

4. A laminate is obtained by placing the sheet-like bonding material described in any one of claims 1 to 3 between a first member and a second member, and The laminate is heated to 100 to 500°C, and the first member and the second member are joined via the sintered sheet-like bonding material. A method for manufacturing a composite body, including the above.

5. The method for manufacturing a bonded body according to claim 4, wherein the heating of the laminate is performed under pressure of 40 kPa or more.

6. The method for manufacturing a bond according to claim 4, wherein at least one of the first member and the second member is a semiconductor element, and the bond is a semiconductor device.

7. A joint comprising a first member, a second member, and a sintered sheet-like joining material according to any one of claims 1 to 3 for joining the first member and the second member.

8. The junction according to claim 7, wherein at least one of the first member and the second member is a semiconductor element, and the junction is a semiconductor device.

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