Detection of probabilistic process windows
The physics-based inverse line scanning model addresses biased roughness measurements in SEMs by analyzing frequency dependence, offering unbiased and precise roughness estimation to enhance semiconductor manufacturing accuracy.
JP7875607B2Inactive Publication Date: 2026-06-18FRACTILIA LLC
Patent Information
- Application Number
- JP2023539333
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-09-10
- Filing Date
- 2022-09-09
- Publication Date
- 2026-06-18
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
A method, system, and computer readable medium for configuring a lithography tool to manufacture semiconductor devices, the method including: selecting a first variable, selecting a second variable, selecting at least one response variable that is a function of the first variable and the second variable, determining a measurement uncertainty for each response variable, determining a plurality of probabilities representing a plurality of indications of whether a plurality of points associated with a lithography process meet a specification requirement for each response variable based on measurements of the response variables and the measurement uncertainties of the response variables, where the plurality of probabilities represent a process window, and configuring the lithography tool to manufacture the semiconductor device based on the process window.
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Citation Information
Patent Citations
Method for designing mask pattern, method for manufacturing semiconductor device and semiconductor design program
JP2008262014A
Patterning stack optimization
JP2019533202A
Edge detection system
US10176966B1
Detection of probabilistic process windows
US12142454B2
Lithography improvement based on defect probability distributions and critical dimension variations
WO2021062040A1