Multilayer structure and method for manufacturing the same, as well as protective sheet and electronic device using the same
A multilayer structure with controlled thickness and composition addresses the challenge of water vapor barrier and peel strength in electronic device protective sheets, ensuring flexibility and adhesion through a substrate with metal oxide and inorganic phosphorus compound layers.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- KURARAY CO LTD
- Filing Date
- 2021-11-02
- Publication Date
- 2026-06-19
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Conventional multilayer structures for protective sheets in electronic devices fail to provide sufficient water vapor barrier properties and peel strength while maintaining flexibility, leading to increased thickness and compromised performance in flexible electronic devices.
A multilayer structure comprising a substrate with at least two layers containing a reaction product of a metal oxide and an inorganic phosphorus compound, laminated with thermoplastic resin layers via adhesive layers, achieving a total thickness of 15-120 μm and moisture permeability of 1.0 × 10⁻⁶ g/m²/day, with controlled thermal shrinkage to maintain peel strength and flexibility.
The multilayer structure exhibits excellent water vapor barrier properties and peel strength from sealing materials, while maintaining flexibility, by balancing layer thickness and thermal shrinkage to enhance adhesion and durability.
Smart Images

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