The method of manufacturing a metal plate for current collector, supercapacitor having the same and method for manufacturing the same

Laser-processed holes on the current collector surface, combined with chemical cleaning, address contaminant issues, enhancing supercapacitor performance and wettability, achieving stable operation and cost-effectiveness.

KR102991659B1Active Publication Date: 2026-07-15ABC ENERGY
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Patent Information

Application Number
KR1020250125702
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-09-04
Publication Date
2026-07-15
Estimated Expiration
2045-09-04

AI Technical Summary

Technical Problem

Conventional methods for manufacturing supercapacitors face issues with contaminants on the current collector surface, leading to reduced adhesion and performance degradation due to side reactions and gas generation, necessitating a more effective cleaning method at a lower cost to improve wettability.

Method used

A method involving laser processing to form holes on the current collector surface with specific dimensions and densities, followed by cleaning with acidic and basic solutions, to enhance surface characteristics and adhesion.

Benefits of technology

The method improves supercapacitor performance by ensuring uniform hole spacing and cleaning, resulting in excellent charging and discharging capabilities, long cycle life, and stable operation up to high voltages while reducing process costs.

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Abstract

The present invention relates to a method for manufacturing a metal plate for a current collector, a supercapacitor including a current collector, and a method for manufacturing the same. A method for manufacturing a metal plate for a current collector according to one embodiment of the present invention comprises the steps of: preparing a metal plate for a current collector; forming a plurality of holes on the surface of the metal plate for a current collector by laser processing; and cleaning the metal plate for a current collector, wherein the distance between the outer circumference of the holes and the outer circumference of adjacent holes may be greater than 50 μm and less than 450 μm.
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Citation Information

Patent Citations

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