SINTER-READY Silver FILMS

Abstract

A method for manufacturing a combined sintered-prepared silver film and a carrier (1), a) a step of creating a carrier (2) including a designed opening (5); b) a step of casting a silver film layer (7) into the designed opening (5), for example, a step of casting a silver paste; and c) a method comprising the step of drying the carrier (2) and the silver film layer (7) to form a combined sintered-prepared silver film and carrier (1). The carrier (2) may comprise a plastic carrier, which may be produced by permanently bonding two plastic films using a plasma bonding process or using a temperature-stable adhesive. The carrier (2) may comprise a stencil layer (3) and a backing layer (4). The stencil layer (3) may define a designed opening (5). The backing layer (4) may be configured to seal the bottom of the designed opening (5), wherein, at the beginning of step b), the top of the designed opening (5) may be open to receive a cast silver film layer (7). The combined sintered-prepared silver for the substrate (10) a) a step of positioning a combined sintered-prepared silver film and carrier (1) of the type comprising a carrier (2) including a designed opening (5) and a silver film layer (7) cast into the designed opening (5) on the upper surface of a substrate (10) such that the silver film layer (7) faces downward; b) a step of transferring a silver film layer (7) onto a substrate (10) by lamination; c) a step of removing the carrier (2) of the combined sintered-prepared silver film and the carrier (1); d) a step of forming an assembly by placing the component (22) on the substrate (10) so as to be in contact with the transferred silver film layer (7); and e) includes the step of sintering the assembly to create a silver bond between the component (22) and the substrate (10). In step b) of the method of assembling the component (22) to the substrate (10), lamination is performed using a lamination press (11+12) at a pressure of 3 to 8 MPa, optionally 3 to 6 MPa, optionally 8 MPa, and a temperature of 130 to 150°C, optionally 130°C. In step e) of this method, sintering is performed at a pressure of 10 MPa and a temperature of 250°C.

Description

Technology Field

[0001] This specification relates to a method for combining electrical or mechanical components, and more specifically, to a method for attaching electronic components and related devices onto a circuit board. Background Technology

[0002] A sinter-ready silver film that can be used to attach dies combines the physical properties and chemical composition of nano-silver powder to become a product that enables the bonding of various electronic devices to create a thermal and electrically conductive interface.

[0003] US20120114927A1, according to its abstract, mentions that a method for attaching multichips and single components to dies may involve printing a sintering paste onto a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or dispensing processes. The paste may be printed on the back side of an entire wafer or on the back side of individual dies prior to dicing. A sintering film may also be manufactured and transferred to a wafer, die, or substrate. Post-sintering steps may increase throughput.

[0004] In the first aspect, the present disclosure relates to a method for manufacturing a combined sintered-prepared silver film and a carrier, wherein

[0005] a) a step of creating a carrier including a designed opening;

[0006] b) a step of casting a silver film layer into a designed opening; and

[0007] c) A method comprising the step of drying a carrier and a silver film layer to form a combined sintered-prepared silver film and a carrier.

[0008] This method

[0009] d) may additionally include a step of rolling or cutting the combined sintered-prepared silver film and carrier into individual sheets prepared for industrial use.

[0010] In some embodiments, the carrier may include a plastic carrier.

[0011] In some embodiments, the carrier can be produced by permanently bonding two plastic films. In some embodiments, the two plastic films can be bonded using a plasma bonding process. In some other embodiments, the two plastic films can be bonded using a temperature-stable adhesive.

[0012] The carrier may include a stencil layer and a backing layer.

[0013] In some embodiments, the stencil layer may limit the designed opening.

[0014] In some embodiments, the stencil layer may have a thickness of 100 to 200 micrometers, optionally 150 micrometers. Additionally or alternatively, the stencil layer may comprise a PET film.

[0015] In some embodiments, the stencil layer may be die-cut to create a designed opening. In some embodiments, the designed opening may be rectangular or square.

[0016] The backing layer can be configured to seal the bottom of the designed opening.

[0017] In some embodiments, the backing layer may have a thickness of 50 micrometers. Additionally or alternatively, the backing layer may include a PET film.

[0018] In some embodiments, the backing layer may be pretreated with oxygen plasma.

[0019] In some embodiments, the stencil layer and the backing layer can be bonded using a laminator press, optionally under a pressure of 5 MPa and at a temperature of 150°C.

[0020] At the start of step b), the upper part of the designed opening can be opened to receive a cast silver film layer.

[0021] In some embodiments, the step of casting a silver film layer may include the step of casting a silver paste.

[0022] In some embodiments, the silver film layer in step b) may contain a solvent. After step c), the amount of solvent is reduced, and the solvent is preferably substantially absent from the combined sintered-prepared silver film and carrier. However, some residue of the solvent may remain.

[0023] In some embodiments, the step of drying the carrier and the silver film layer to form a combined sintered-prepared silver film and carrier can be performed in an oven, optionally at 130°C for 20 minutes.

[0024] In a second aspect, the present disclosure provides a combined sintered-prepared silver film and a carrier comprising a carrier having a designed opening and a silver film layer cast into the designed opening.

[0025] In some embodiments, the carrier may include a plastic carrier.

[0026] In some embodiments, the carrier may include two permanently bonded plastic films.

[0027] The carrier may include a stencil layer and a backing layer.

[0028] In some embodiments, the stencil layer may limit the designed opening.

[0029] In some embodiments, the stencil layer may have a thickness of 100 to 200 micrometers, optionally 150 micrometers. Additionally or alternatively, the stencil layer may comprise a PET film.

[0030] In some embodiments, the designed opening may be rectangular or square.

[0031] The backing layer can seal the bottom of the designed opening.

[0032] In some embodiments, the backing layer may have a thickness of 50 micrometers. Additionally or alternatively, the backing layer may include a PET film.

[0033] A silver film layer can be formed by casting silver paste. The silver film layer may contain a solvent when cast.

[0034] In a third aspect, the present disclosure relates to a method of assembling a component onto a substrate,

[0035] a) a step of positioning a combined sintered-prepared silver film and carrier of the type comprising a carrier including a designed opening and a silver film layer cast into the designed opening on the upper surface of a substrate such that the silver film layer faces downward;

[0036] b) a step of transferring a silver film layer onto a substrate by lamination;

[0037] c) A step of removing the carrier from the combined sintered-prepared silver film and the carrier;

[0038] d) a step of forming an assembly by placing the component on a substrate so as to be in contact with a transferred silver film layer; and

[0039] e) A method is provided comprising the step of sintering the assembly to create a silver bond between the component and the substrate.

[0040] In some embodiments, in step b), the lamination may be performed using a lamination press at a pressure of 3 to 8 MPa, optionally 3 to 6 MPa, optionally 8 MPa, and a temperature of 130 to 150°C, optionally 130°C.

[0041] In some embodiments, in step e), sintering may be performed at a pressure of 10 MPa and a temperature of 250°C.

[0042] In some embodiments, the substrate may include direct bonded copper (DBC), a lead-frame, a clip or clip array, a wafer, or any other component having a metallized surface used for assembling electronic devices.

[0043] In some embodiments, the component may include a Si or SiC device and / or die.

[0044] In some embodiments, the combined sintered-prepared silver film and carrier may be the same as those limited in the second aspect described above.

[0045] In a fourth aspect, the present disclosure provides an assembly of a component and a substrate joined together by a sintered silver bonding portion, wherein the assembly is an assembly of a component and a substrate that can be obtained by the method of the third aspect described above. Brief explanation of the drawing

[0046] Now, one or more embodiments of the present disclosure will be described merely as examples with reference to the accompanying drawings. FIGS. 1a to 1c are schematic examples of a manufacturing process for a combined sintered-prepared silver film and a carrier according to the present disclosure. Figures 2a and 2b are schematic examples of a lamination process. FIG. 3a is a photograph of a carrier formed of a PET film having a square opening. Fig. 3b is a photograph of the carrier of Fig. 3a after casting the silver film layer into the opening. FIG. 3c is a drawing illustrating the flatness profile of a silver film layer. FIGS. 4a and 4b are drawings illustrating a direct bond copper (DBC) substrate laminated with a patterned silver film according to the present disclosure. Figure 5 is a photograph showing a die placed on the silver film of Figures 4a and 4b and sintered on a DBC substrate. Specific details for implementing the invention

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by a reader skilled in the art to which the claimed subject matter belongs. It should be understood that the foregoing summary of the disclosure and the following examples are merely illustrative and illustrative and are not intended to limit any of the claimed subject matter.

[0048] The following description relates to embodiments of the present disclosure. The description of the embodiments is not intended to include all possible embodiments of the present disclosure as claimed in the appended claims. Many modifications, improvements, and equivalents not explicitly mentioned in the following embodiments may fall within the scope of the appended claims. Features described as part of one embodiment may be combined with features of one or more other embodiments unless the context clearly requires otherwise.

[0049] In certain cases, a preferred method of using a sintered-prepared silver film is to laminate it onto a substrate such as direct bond copper (DBC), lead frames, or clips. The present disclosure describes an extension of existing sintered film technology for forming a uniquely patterned silver film to provide selective lamination on specific areas of a substrate. The process is suitable for mass manufacturing of various power modules and individual packages through a sintering process. The process ensures precise positioning and reliable connection of components by utilizing the capabilities of the sinterable silver film and a specialized patterning process.

[0050] FIGS. 1a through 1c illustrate schematic examples of a patterning process. First, a carrier (2) is created by permanently bonding two plastic films (3, 4). In some embodiments, the carrier (2) may consist of two layers of polyethylene terephthalate (PET) films bonded together.

[0051] Two plastic films may include a stencil layer (3) and a backing layer (4) as shown in FIG. 1a. The stencil layer (3) may be referred to as 'layer 1' and the backing layer (4) may be referred to as 'layer 2'.

[0052] The upper plastic film, i.e., the stencil layer (3), is pre-cut through to form an opening / hole (5) according to a desired pattern design. The opening / hole (5) may also be referred to as the designed opening (5). The body of the stencil layer (3) is referenced by the number 6 in FIG. 1a. The hole (5) may be stamped through the stencil layer (3). The opening / hole (5) may be square, rectangular, or have other shapes. The stencil layer (3) may be formed of PET and may have a thickness of 100 to 200 micrometers. In one non-limiting embodiment, the stencil layer (3) of the carrier (2) is composed of a 150 micrometer-thick PET film that is die-cut to create a square opening / hole (5) of 13x13 mm².

[0053] The lower plastic film, i.e., the backing layer (4), can be formed of PET and can have a thickness of 50 micrometers. The backing layer (4) can be formed from a PET film on a roll.

[0054] The stencil layer (3) and the backing layer (4) are bonded together using a conventional plasma bonding process or a temperature-stable adhesive to form a carrier (2) as shown in FIG. 1b. A non-limiting example of the carrier (2) is shown in FIG. 3a.

[0055] In some embodiments, oxygen plasma pretreatment may be performed on the backing layer (4), or on both the stencil layer (3) and the backing layer (4). In one non-limiting embodiment, oxygen plasma pretreatment is performed with oxygen plasma for 10 minutes.

[0056] In some embodiments, the stencil layer (3) and the backing layer (4) can be bonded together under pressure and temperature. In one non-limiting embodiment, bonding is performed using a laminator press under a pressure of 5 MPa and at a temperature of 150°C.

[0057] Once the carrier (2) is formed, a special silver paste is cast into the opening / hole (5) of the carrier (2). The silver paste may contain a solvent. In one non-limiting embodiment, the silver paste may be Argomax (trademark) paste available from MacDermid Alpha - Assembly Solutions, Somerset, New Jersey, USA.

[0058] A carrier (2) having silver paste is dried in an oven to form a pattern of a sintered-prepared silver film (7) as shown in FIG. 1c. In one non-limiting embodiment, the carrier (2) and the silver paste were dried at 130°C for 20 minutes. The drying step may remove at least some of the solvent from the silver paste. After the drying step is completed, the amount of solvent is reduced, and the solvent is preferably substantially absent from the sintered-prepared silver film (7). However, some residue of the solvent may remain.

[0059] The carrier (2) and the sintered-prepared silver film (7) are referred to together in this disclosure as the combined sintered-prepared silver film and carrier (1). The combined sintered-prepared silver film and carrier (1) may be rolled into individual sheets or cut to be prepared for industrial use. A non-limiting example of the combined sintered-prepared silver film and carrier (1) is illustrated in FIG. 3b.

[0060] In one non-limiting embodiment, as shown in the flatness profile of FIG. 3c, the silver film thickness of the sintered-prepared silver film (7) was about 100 micrometers and was uniform over the entire pattern.

[0061] To use the combined sintered-prepared silver film and carrier (1) in an application, a patterned sintered-prepared silver film (7) is laminated onto a substrate (10). The substrate (10) may be a DBC, lead-frame, clip or clip array, wafer, or any other part having a metallized surface used for assembling electronic devices. Once the sintered-prepared silver film (7) is laminated onto the substrate (10), the part is ready to be assembled using a sintering process.

[0062] An exemplary lamination process is schematically illustrated in FIGS. 2a and 2b. Lamination can be performed using a lamination press schematically illustrated in FIG. 2a. The lamination press may include an upper platen (11) and a lower platen (12) used to apply compressive pressure to a combined sintered-prepared silver film, a carrier (1), and a substrate (10). The upper platen (11) and the lower platen (12) may be heated to 130°C.

[0063] A graphite sheet (13) may be interposed between a sintered-prepared silver film and a carrier (1) combined with an upper platen (11). The combined sintered-prepared silver film and carrier (1) are positioned on top of a substrate (10) (e.g., DBC) with the sintered-prepared silver film (7) facing downward. The sintered-prepared silver film (7) is transferred from the carrier (2) onto the substrate (10) in a lamination press under a pressure of 5 MPa, alternatively 8 MPa, and at a temperature of 130°C, as schematically illustrated in FIG. 2b. Non-limiting examples of the resulting substrate (10) (in this example, DBC) laminated with the sintered-prepared silver film (7) are illustrated in FIG. 4a and FIG. 4b.

[0064] Subsequently, the component can be bonded to the substrate (10) by sintering a sinter-prepared silver film to form a silver bond. A non-limiting example illustrated in FIG. 5, in which a die (22) is mounted on a laminated sinter-prepared silver film (7) and sintered onto the substrate (10) in a sintering press at 10 MPa and 250°C.

[0065] Industrial applicability

[0066] The patterned combined sintered-prepared silver film and carrier (1) may consist of a plastic carrier (2) having a designed opening (5) and a sintered-prepared silver film layer (7) cast into the opening (5). The layout of the pattern of the sintered-prepared silver film (7) is advantageously determined by the design of the electronic device to be assembled. The patterned sintered-prepared silver film (7) is used in the manufacture of a two-step process. In the first step, the sintered-prepared silver film (7) is transferred from the carrier (2) onto a substrate (10) by lamination at a typical pressure of 3 to 6 MPa and a temperature of 130 to 150°C. Typical substrates used are ceramic DBCs, lead frames, clips, and wafers having Si or SiC devices. In the second step, the components are placed on the substrate (10), and the assembly is sintered at a typical pressure of 10 MPa and a temperature of 250°C to produce a very reliable silver bond. Advantageously, this process is very suitable for mass manufacturing of power modules, individual components, and various other devices.

[0067] The combined sintered-prepared silver film and carrier (1) of the present disclosure can advantageously be positioned to fit existing manufacturing equipment and processes to enable mass production. In one example, the sintered-prepared silver film (7) may be laminated onto individual dies or wafers, followed by dicing. The laminated dies may then be placed on a substrate and sintered under applied heat and pressure. The resulting bond between the die and the substrate is metallic silver having the structure and properties shown below:

[0068] Typical Argomax (registered trademark) joint

[0069] Composition: Sintered silver particles

[0070] Density: 85 to 95%

[0071] Thermal conductivity: Approximately 200 WmK

[0072] Electrical conductivity: Approximately 3 μΩ·cm

[0073] Young's Modulus: Approximately 20 GPa

[0074] The combined sintered-prepared silver film and carrier (1) of the present disclosure can be used for attaching components in a wide variety of devices and applications, ranging from large-area thyristors and power modules for electric and automotive products to small discrete components for mobile technology and LED lighting. The present technology can improve the performance of existing devices by increasing power or optical output or reliability by more than 5 to 30 times compared to traditional bonding techniques. The film enables the use of new high-temperature SiC and GaN semiconductors and new device designs that generate electrical efficiencies that cannot be achieved with existing technologies.

[0075] Additional aspects of the present disclosure are presented in the following items.

[0076] Items:

[0077] Item 1. A method for manufacturing a combined sintered-prepared silver film and a carrier,

[0078] a) a step of creating a carrier including a designed opening;

[0079] b) a step of casting a silver film layer into the designed opening; and

[0080] c) a step of drying the carrier and the silver film layer to form a combined sintered-prepared silver film and carrier, comprising a method.

[0081] Item 2. Regarding Item 1,

[0082] d) a method further comprising the step of rolling or cutting the combined sintered-prepared silver film and carrier into individual sheets prepared for industrial use.

[0083] Item 3. In Item 1 or Item 2, the carrier comprises a plastic carrier.

[0084] Item 4. A method in which, in any one of Items 1 to 3, the carrier is produced by permanently bonding two plastic films.

[0085] Item 5. A method in which two plastic films are bonded using a plasma bonding process, in accordance with Item 4.

[0086] Item 6. A method according to Item 4 in which two plastic films are bonded using a temperature-stable adhesive.

[0087] Item 7. A method according to any one of Items 1 to 6, wherein the carrier comprises a stencil layer and a backing layer.

[0088] Item 8. In Item 7, a method in which the stencil layer defines the designed opening.

[0089] Item 9. The method of Item 7 or Item 8, wherein the stencil layer has a thickness of 100 to 200 micrometers, optionally 150 micrometers.

[0090] Item 10. A method according to any one of Items 7 to 9, wherein the stencil layer comprises a PET film.

[0091] Item 11. A method in any one of Items 7 through 10, wherein the stencil layer is die-cut to create a designed opening.

[0092] Item 12. A method in which, in any one of Items 7 through 11, the designed opening is rectangular or square.

[0093] Item 13. A method in any one of Items 7 to 12, wherein the backing layer is configured to seal the bottom of the designed opening.

[0094] Item 14. A method in any one of Items 7 to 13, wherein the backing layer has a thickness of 50 micrometers.

[0095] Item 15. A method in which, in any one of Items 7 to 14, the backing layer comprises a PET film.

[0096] Item 16. A method in which, in any one of Items 7 to 15, the backing layer is pretreated with oxygen plasma.

[0097] Item 17. A method in which, in any one of Items 7 to 16, the stencil layer and the backing layer are joined using a laminator press, optionally under a pressure of 5 MPa and at a temperature of 150°C.

[0098] Item 18. In any one of Items 7 to 17, at the start of Step b), the upper part of the designed opening is opened to receive a cast silver film layer.

[0099] Item 19. A method according to any one of Items 1 to 18, wherein the step of casting a silver film layer comprises the step of casting a silver paste.

[0100] Item 20. A method according to any one of Items 1 to 19, wherein the silver film layer comprises a solvent.

[0101] Item 21. A method according to any one of Items 1 to 20, wherein the step of drying the carrier and the silver film layer to form a combined sintered-prepared silver film and carrier is performed in an oven, optionally at 130°C for 20 minutes.

[0102] Item 22. Combined sintered-prepared silver film and carrier comprising a carrier including a designed opening and a silver film layer cast into the designed opening.

[0103] Item 23. In Item 22, the carrier comprises a combined sintered-prepared silver film and a carrier, wherein the carrier comprises a plastic carrier.

[0104] Item 24. In Item 22 or Item 23, the carrier comprises a combined sintered-prepared silver film and a carrier comprising two permanently bonded plastic films.

[0105] Item 25. In any one of Items 22 to 24, the carrier comprises a combined sintered-prepared silver film and a carrier, wherein the carrier comprises a stencil layer and a backing layer.

[0106] Item 26. In Item 25, the stencil layer defines the designed opening, and the combined sintered-prepared silver film and carrier.

[0107] Item 27. In Item 25 or Item 26, the stencil layer has a thickness of 100 to 200 micrometers, optionally 150 micrometers, a combined sintered-prepared silver film and a carrier.

[0108] Item 28. In any one of Items 25 to 27, the stencil layer comprises a PET film, and the combined sintered-prepared silver film and carrier.

[0109] Item 29. A combined sintered-prepared silver film and carrier, wherein, in any one of Items 25 through 28, the designed opening is rectangular or square.

[0110] Item 30. In any one of Items 25 to 29, the backing layer is a combined sintered-prepared silver film and a carrier that seals the bottom of the designed opening.

[0111] Item 31. In any one of Items 25 to 30, the backing layer has a thickness of 50 micrometers, and the combined sintered-prepared silver film and carrier.

[0112] Item 32. A combined sintered-prepared silver film and carrier, wherein the backing layer comprises a PET film in any one of Items 25 to 31.

[0113] Item 33. In any one of Items 22 to 32, a combined sintered-prepared silver film and a carrier, wherein the silver film layer is formed by casting a silver paste.

[0114] Item 34. A combined sintered-prepared silver film and a carrier, wherein the silver film layer comprises a solvent when cast.

[0115] Item 35. As a method of assembling a component onto a substrate,

[0116] a) a step of positioning a combined sintered-prepared silver film and carrier of the type comprising a carrier including a designed opening and a silver film layer cast into the designed opening on the upper surface of a substrate such that the silver film layer faces downward;

[0117] b) a step of transferring a silver film layer onto a substrate by lamination;

[0118] c) A step of removing the carrier from the combined sintered-prepared silver film and the carrier;

[0119] d) a step of forming an assembly by placing the component on a substrate so as to be in contact with a transferred silver film layer; and

[0120] e) A method comprising the step of sintering the assembly to create a silver bond between the component and the substrate.

[0121] Item 36. In Item 35, in step b), the lamination is performed using a lamination press at a pressure of 3 to 8 MPa, optionally 3 to 6 MPa, optionally 8 MPa, and a temperature of 130 to 150°C, optionally 130°C.

[0122] Item 37. In Item 35 or Item 36, in step e), the sintering is performed at a pressure of 10 MPa and a temperature of 250°C.

[0123] Item 38. A method according to any one of Items 35 through 37, wherein the substrate comprises direct bonded copper (DBC), a lead-frame, a clip or clip array, a wafer, or any other part having a metalled surface used in the assembly of an electronic device.

[0124] Item 39. A method according to any one of Items 35 through 38, wherein the component comprises a Si or SiC device and / or die.

[0125] Item 40. A method according to any one of Items 35 to 39, wherein the combined sintered-prepared silver film and carrier are as defined in any one of Items 22 to 34.

[0126] Item 41. An assembly of a component and a substrate joined together by a sintered silver bonding portion, wherein the assembly is an assembly of a component and a substrate that can be obtained by the method of any one of items 35 to 40.

[0127] At least some parts of the drawings and descriptions of the present disclosure have been simplified to focus on relevant elements for a clear understanding of the present disclosure, while it should be understood that, for clarity, other elements that a reader skilled in the art would recognize may also be required to be removed. Since such elements are well known to a reader skilled in the art and because their absence does not necessarily enable a better understanding of the present disclosure, descriptions of such elements are not provided in this specification.

Claims

Claim 1 A method for manufacturing a combined sinter-ready silver film and a carrier, comprising: a) a step of creating a carrier including a designed opening; b) a step of casting a silver film layer into the designed opening; c) a step of drying the carrier and the silver film layer to form the combined sinter-ready silver film and carrier; and d) a step of rolling or cutting the combined sinter-ready silver film and carrier into individual sheets prepared for industrial use, wherein the carrier is created by permanently bonding two plastic films. Claim 2 A method according to claim 1, wherein the carrier comprises a stencil layer and a backing layer. Claim 3 In paragraph 2, the method wherein the stencil layer limits the designed opening. Claim 4 In paragraph 2, the method wherein the backing layer is configured to seal the bottom of the designed opening. Claim 5 A method according to paragraph 2, wherein at the start of step b), the upper part of the designed opening is opened to receive the cast silver film layer. Claim 6 A method according to any one of claims 1 to 5, wherein the step of casting the silver film layer includes the step of casting a silver paste. Claim 7 A combined sintered-prepared silver film and carrier comprising a carrier including a designed opening and a silver film layer cast into said designed opening, wherein the carrier is composed of two layers of polyethylene terephthalate film bonded together. Claim 8 In claim 7, the carrier comprises a combined sintered-prepared silver film and a carrier, wherein the carrier comprises a stencil layer and a backing layer. Claim 9 In claim 8, the stencil layer comprises a combined sintered-prepared silver film and a carrier that defines the designed opening. Claim 10 In claim 8, the stencil layer is a combined sintered-prepared silver film and a carrier having a thickness of 100 to 200 micrometers or 150 micrometers. Claim 11 A method for assembling a component onto a substrate, comprising: a) positioning a combined sintered-prepared silver film and carrier of the type including a carrier having a designed opening and a silver film layer cast into said designed opening on the upper surface of the substrate such that said silver film layer faces downward; b) transferring said silver film layer onto the substrate by lamination; c) removing said carrier of said combined sintered-prepared silver film and carrier; d) forming an assembly by placing said component on the substrate so as to be in contact with said transferred silver film layer; and e) sintering said assembly to create a silver bond between said component and said substrate. Claim 12 In claim 11, in step b), the lamination is performed using a lamination press at a pressure of 3 to 8 MPa, 3 to 6 MPa, or 8 MPa and a temperature of 130 to 150°C, or 130°C. Claim 13 In claim 11, the method wherein, in step e), the sintering is performed at a pressure of 10 MPa and a temperature of 250°C. Claim 14 In claim 11, the method comprises a substrate including direct bonded copper (DBC), a lead-frame, a clip or clip array, a wafer, or any other component having a metallized surface used in the assembly of an electronic device. Claim 15 In claim 11, the method wherein the component comprises a Si or SiC device and / or die. Claim 16 A method according to any one of claims 11 to 15, wherein the combined sintered-prepared silver film and carrier are those claimed in any one of claims 7 to 10. Claim 17 An assembly of a component and a substrate joined together by a sintered silver bonding portion, wherein the assembly is an assembly of a component and a substrate that can be obtained by the method of any one of claims 11 to 15. Claim 18 delete Claim 19 delete Claim 20 delete

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