Display apparatus and test method therefor

By using the switching unit of an integrated circuit to control the impedance test signal in the display device, the high cost and time consumption of the probe detection method in the prior art are solved, and the display device can be made thinner and lighter with a narrow bezel design.

WO2025246005A1 Publication Date: 2025-12-04BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
PCT/CN2024/107963
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-05-30
Filing Date
2024-07-26
Publication Date
2025-12-04

AI Technical Summary

Technical Problem

Existing technologies require probe testing to inspect the bonding effect between flexible circuit boards and display substrates in display devices, resulting in high production costs, long processing times, and hindering the design of thinner and lighter display devices with narrower bezels.

Method used

The transmission of impedance test signals is controlled by the switching unit in the integrated circuit. The bonding effect between the flexible circuit board and the display substrate is detected through the detection path, avoiding the probe detection method, simplifying the structure of the flexible circuit board, and saving space and weight.

Benefits of technology

This has enabled the display device to be thinner and lighter with a narrower bezel design, reducing production costs and time costs, and improving production efficiency.

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Abstract

A display apparatus and a test method therefor. The display apparatus comprises a display substrate (11), and an integrated circuit (12) and a flexible circuit board (13) separately bound and connected to the display substrate (11). The display substrate (11) comprises multiple first substrate pads (111A) and multiple second substrate pads (111B). The integrated circuit comprises a test signal end and multiple first connection pads (121). The display substrate (11) or the integrated circuit (12) comprises a first switch unit (S1) and a second switch unit (S2). At least two first connection pads (121) are electrically connected to the test signal end by means of the first switch unit (S1), and at least two second substrate pads (111B) are electrically connected to the test signal end by means of the second switch unit (S2). The integrated circuit (12) detects the status of the binding connection between the integrated circuit (12) and the display substrate (11), or between the flexible circuit board (13) and the display substrate (11), by means of controlling the connection and disconnection of the first switch unit (S1) and the second switch unit (S2), respectively, such that an impedance test signal of the test signal end passes through test pathways in which the first switch unit (S1) and the second switch unit (S2) are located.
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