Wearable electronic apparatus comprising reinforcement structure

Abstract

According to an embodiment disclosed herein, a wearable electronic apparatus can be provided. The wearable electronic apparatus may comprise: a window member including a first surface that is provided toward the outside of the wearable electronic apparatus and a second surface that is provided toward a face of a user wearing the wearable electronic apparatus and is opposite to the first surface; and a housing that forms the exterior of the wearable electronic apparatus and that includes a supporting structure disposed facing the second surface of the window member and a side frame structure disposed along an edge of the supporting structure and having a curved surface. The side frame structure may include a metal part and at least one injection part disposed on a portion of an inner side surface of the metal part facing a space surrounded by the housing, and at least one of the metal part or the at least one injection part may include at least one rib structure.

Description

Wearable electronic device including a reinforcing structure

[0001] The present disclosure relates to a reinforcing structure and an electronic device including the same.

[0002] Portable electronic devices, such as electronic notebooks, portable multimedia players, mobile communication terminals, or tablet PCs, are generally equipped with a display component and a battery, and have had bar-type, folder-type, or sliding-type appearances due to the shape of the display component or battery. Recently, as the performance of display components and batteries has improved and they have become smaller, wearable electronic devices that can be worn on parts of the body, such as the wrist or head, have reached commercialization. Since wearable electronic devices are worn directly on the body, portability and / or user accessibility can be improved.

[0003] Wearable electronic devices may include electronic devices that can be worn on the face, such as head-mounted devices (HMDs). Head-mounted devices can be usefully utilized for implementing virtual reality or augmented reality. For example, a wearable electronic device can implement virtual reality by providing three-dimensional images of a virtual space within a game enjoyed through a television or computer monitor, while blocking images of the actual space where the user is located. Another type of wearable electronic device can provide augmented reality, which provides various visual information to the user by implementing virtual images while providing an environment where the user can visually perceive the actual images of the space where the user is located.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, a wearable electronic device may be provided. The device may include a window member comprising a first surface configured to face the outside of the wearable electronic device and a second surface configured to face the face of a user wearing the wearable electronic device and opposite to the first surface; a housing forming the exterior of the wearable electronic device comprising a support structure disposed facing the second surface of the window member and a side frame structure disposed along the edge of the support structure and including a curved surface. The side frame structure comprises a metal part and at least one injection part disposed on a portion of an inner surface of the metal part facing the space enclosed by the housing, and at least one of the metal part or the at least one injection part may comprise at least one rib structure.

[0006] According to one embodiment of the present disclosure, a manufacturing method for forming a side frame structure of a housing of a wearable electronic device may be provided. The manufacturing method may include the steps of preparing a metal part of the side frame structure by processing a metal material, forming an injection molded part along the inner surface of the metal part, cutting the outer surface opposite to the inner surface of the metal part, and removing at least a portion of the injection molded part to form an injection part.

[0007] According to one embodiment of the present disclosure, a manufacturing method for forming a side frame structure of a housing of a wearable electronic device may be provided. The manufacturing method may include the operation of preparing a side frame structure of the housing by hydraulically processing a rod-shaped metal material, the operation of forming an injection molded part along the inner surface of the side frame structure, and the operation of performing at least one of cutting the injection molded part or at least partially removing the injection molded part.

[0008] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a perspective view of a wearable electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is an exploded perspective view of a wearable electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4a is a plan view of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure.

[0013] FIG. 4b is a front view of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure.

[0014] FIG. 4c is a bottom view of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure.

[0015] FIG. 5a is a drawing showing a part of the injection molding portion of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure.

[0016] FIG. 5b is a drawing showing a part of the injection molding portion of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure.

[0017] FIG. 6a is part of a front view of a wearable electronic device according to one embodiment of the present disclosure.

[0018] FIG. 6b is a perspective view of a side frame structure according to one embodiment of the present disclosure, viewed from direction A of FIG. 6a.

[0019] FIG. 6c is a perspective view of a side frame structure according to one embodiment of the present disclosure, viewed from direction B of FIG. 6a.

[0020] FIG. 6d is a perspective view of a side frame structure according to one embodiment of the present disclosure, viewed from direction C of FIG. 6a.

[0021] FIG. 7a is a view of a second injection part having an air vent hole formed in a side frame structure according to one embodiment of the present disclosure, viewed from the outside of the frame structure.

[0022] FIG. 7b is a view of a second injection part having an air vent hole formed in a side frame structure according to one embodiment of the present disclosure, viewed from the inside of the frame structure.

[0023] FIG. 8a is a view of a second injection part having an air vent hole formed in a side frame structure according to one embodiment of the present disclosure, viewed from the inside of the frame structure.

[0024] FIG. 8b is a drawing of a second injection part having an air vent hole formed in a side frame structure according to one embodiment of the present disclosure, viewed from the outside and inside of the frame structure.

[0025] FIG. 9a is a perspective view looking at the inner side of a side frame structure of a conventional wearable electronic device.

[0026] FIG. 9b is a perspective view looking at the inner side of a side frame structure of a conventional wearable electronic device.

[0027] FIG. 9c is a cross-sectional perspective view showing the inner surface of a side frame structure of a conventional wearable electronic device being processed using a tool.

[0028] FIG. 10a is a flowchart of a procedure relating to a method for manufacturing a side frame structure according to one embodiment of the present disclosure.

[0029] FIG. 10b is a flowchart of a procedure relating to a method for manufacturing a side frame structure according to one embodiment of the present disclosure.

[0030] FIG. 11a is a drawing showing the manufacturing process of a side frame structure according to one embodiment of the present disclosure.

[0031] FIG. 11b is a perspective view of a side frame structure according to one embodiment of the present disclosure manufactured according to FIG. 11a.

[0032] FIG. 12 is a drawing showing the manufacturing process of a side frame structure according to one embodiment of the present disclosure.

[0033] FIG. 13 is a drawing showing the manufacturing process of a side frame structure according to one embodiment of the present disclosure.

[0034] FIG. 14 is a drawing showing the manufacturing process of a side frame structure according to one embodiment of the present disclosure.

[0035] FIG. 15 is a drawing showing the manufacturing process of a side frame structure according to one embodiment of the present disclosure.

[0036] FIG. 16 is a drawing showing the manufacturing process of a side frame structure according to one embodiment of the present disclosure.

[0037] FIG. 17 is a drawing showing the manufacturing process of a side frame structure according to one embodiment of the present disclosure.

[0038] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0039] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes various specific details to aid understanding, they should be considered merely as examples. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Additionally, descriptions of known functions and configurations may be omitted for the sake of clarity and brevity.

[0040] The terms and words used in the following description and claims are not limited to their bibliographic meanings and are used by the inventor merely to ensure a clear and consistent understanding of the disclosure. Accordingly, it will be apparent to those skilled in the art that the following description of various embodiments of the invention is provided for illustrative purposes only and not to limit the invention as defined by the appended claims and their equivalents.

[0041] The singular forms "a," "an," and "the" should be understood to include multiple referents unless the context clearly indicates otherwise. Thus, for example, a reference to "part surfaces" includes a reference to one or more of these surfaces.

[0042] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0043] Referring to FIG. 1, in a network environment (100), an electronic device (101) (or a wearable electronic device) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through the server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In one embodiment, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In one embodiment, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0044] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0045] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0046] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0047] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0048] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0049] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0050] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area-gram device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0051] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0052] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0053] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0054] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0056] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0057] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0058] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0059] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0060] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0061] An antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to one embodiment, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0062] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0063] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0064] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0065] In the following detailed description, the length direction, width direction, and / or thickness direction of the electronic device may be mentioned, and the length direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, regarding the direction in which the component is oriented, 'negative / positive (- / +)' may be mentioned together with the Cartesian coordinate system illustrated in the drawings. For example, the front of the electronic device or housing may be defined as the 'face facing the +Z direction', and the rear may be defined as the 'face facing the -Z direction'. In one embodiment, the side of the electronic device or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and / or an area facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the Cartesian coordinate system described in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the embodiments of the present disclosure. For example, the direction in which the aforementioned front or rear faces may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0066] FIG. 2 is a perspective view of an electronic device according to various embodiments of the present disclosure.

[0067] According to one embodiment, the electronic device (101) may be a body-worn device. For example, the electronic device (or wearable electronic device) (101) may be a head-mounted device (or head-mounting device, HMD) capable of providing images (e.g., virtual reality (VR) images, augmented reality (AR) images), mixed reality (MR), or extended reality (XR) directly in front of the user's eyes. As an example, the electronic device (101) may be a head-mounted device that provides the images in a video-see-through (VST) manner.

[0068] Referring to FIG. 2, the electronic device (101) may include a housing (200) that forms the exterior of the electronic device (101). According to one embodiment, the housing (200) forms the exterior of the electronic device (101) and may provide a space in which components of the electronic device (101) can be placed. For example, the housing (200) may include a first housing (210) that can surround at least a portion of a user's head. According to one embodiment, the first housing (210) may include a first surface (200a) facing the outside of the electronic device (101) and a second surface (200b) in which at least a portion may face the user's body (e.g., face) while the user is wearing the electronic device (101). According to one embodiment, at least a portion of the second surface (200b) may be located in the opposite direction of the first surface (200b).

[0069] For example, the second surface (200b) may surround at least a portion of the user's face while the user is wearing the electronic device (101). As an example, the first housing (210) may further include a nose pad configured to be seated on the user's nose. According to one embodiment, the second surface (200b) may surround a space (S) into which the user's body is inserted.

[0070] According to one embodiment, the first housing (210) may include an outer surface (200c) facing the outside of the electronic device (101) and surrounding at least a portion between the first surface (200a) and the second surface (200b).

[0071] According to one embodiment, the housing (200) may include a second housing (220) that can be placed on the user's face. According to one embodiment, the second housing (220) may include a third surface (200d) that can be placed on the user's face (e.g., the user's forehead). According to one embodiment, the second housing (220) may be placed on at least a portion of the second surface (200b). For example, the second housing (220) may include a fourth surface (e.g., the fourth surface (200e) of FIG. 7) facing the second surface (200b). According to one embodiment, the second housing (220) may be formed integrally with the first housing (210) or omitted.

[0072] According to one embodiment, the housing (200) may include a third housing (230) that can be seated on the back of the user's head. According to one embodiment, at least a portion of the third housing (230) may be placed on a second surface (200b) of the first housing (210). According to one embodiment, a battery (e.g., battery (189) of FIG. 1) capable of supplying power to an electronic component (e.g., processor (120) of FIG. 1) of the electronic device (101) may be placed in the third housing (230). According to one embodiment, the third housing (230) may be formed integrally with the first housing (210) or omitted.

[0073] As described above, according to one embodiment, the wearable electronic device (101) may have a form factor for being worn on a user's head. The wearable electronic device (101) may further include a strap and / or a wearing member for being secured on a part of the user's body. The wearable electronic device (101) may provide a user experience based on augmented reality, virtual reality, and / or mixed reality while being worn on the user's head.

[0074] FIG. 3 is an exploded perspective view of a wearable electronic device according to one embodiment of the present disclosure.

[0075] All or part of the configuration of the wearable electronic device (101) of FIG. 3 may be the same or similar to the configuration of the electronic device (101) of FIG. 1 and the wearable electronic device (101) of FIG. 2.

[0076] According to one embodiment, the wearable electronic device (101) may include a window member (311) and a housing (301) supporting the window member (311). According to one embodiment, the wearable electronic device (101) may further include a wearable member (360) connected to the housing (310).

[0077] According to one embodiment, the window member (311) may include a first surface (311a) facing the outside of the wearable electronic device (101) and a second surface (311b) facing the user's face while the user is wearing the wearable electronic device (101). At least a portion of the second surface (311b) may be located on the opposite side of the first surface (311a).

[0078] According to one embodiment, when a user is wearing a wearable electronic device (101), the window member (311) may be positioned substantially corresponding to the user's face and both eyes. In one embodiment, the window member (311) may include a projector and an optical waveguide structure. For example, the window member (311) may output visual information using a projector and provide it to the user's eyes through the optical waveguide structure. In another embodiment, the window member (311) may include a flat display panel, for example, a liquid crystal display panel (LCD), an organic light emitting diode (OLED), and / or a micro-LED, and may output visual information through the flat display panel and provide it to the user's eyes. In yet another embodiment, the window member (311) may include a structure capable of mounting an external electronic device, for example, a smartphone, thereby positioning the smartphone corresponding to the user's eyes. For example, it is noted that although a configuration in which a window member (311) includes a projector and a flat-panel display panel has been mentioned, the present invention is not limited thereto, and according to the embodiment, the wearable electronic device (101) may be used by mounting an external electronic device.

[0079] According to one embodiment, the window member (311) can substantially block the actual image of the surrounding environment and provide visual information (e.g., an image or video implementing a virtual space) output through a projector or a flat-panel display panel to the user. For example, the wearable electronic device (101) can implement virtual reality and provide it to the user. In one embodiment, the window member (311) may include a camera module and can capture the surrounding environment in the direction the user is looking and provide it to the user through a projector or a flat-panel display panel. In one embodiment, the wearable electronic device (101) can extract information regarding images or videos captured in real time from data stored in itself or data collected through a network environment (e.g., the first network (198) and / or the second network (199) of FIG. 1), and combine the captured images or videos with the extracted information to provide them to the user. For example, the wearable electronic device (101) can implement augmented reality or mixed reality and provide it to the user. In one embodiment, the window member (311) transmits an actual image of the surrounding environment to the user and can visually provide information regarding an image or video captured through the camera module (211) to the user.

[0080] According to one embodiment, the housing (301) may form the exterior of the wearable electronic device (101) and provide a space for mounting electronic components of the wearable electronic device (101). According to one embodiment, the housing (301) may include a support structure (320), a side frame structure (303), and a rear cover (350).

[0081] According to one embodiment, the support structure (320) may include a first support structure (321) and a second support structure (322) that support electronic components of a wearable electronic device (101). For example, the first support structure (321) and the second support structure (322) may be placed in a space enclosed by a window member (311), a side frame structure (303), and a rear cover (350). According to one embodiment, the first support structure (321) may be placed between the window member (311) and the second support structure (322), and may be placed facing the second surface (311b) of the window member (311). For example, the first support structure (321) and the second support structure (322) may be connected to each other or formed integrally. For example, electronic components such as a circuit board on which a processor (e.g., the processor (120) of FIG. 1) is placed may be placed on the second support structure (322).

[0082] According to one embodiment, the side frame structure (303) may be positioned along the edge of the support structure (320). The side frame structure (303) may form the side exterior of the wearable electronic device (101) and may include a curved surface.

[0083] According to one embodiment, the housing (301) may further include a window support member (312) disposed between the window member (311) and the first support structure (321). The window support member (312) may be disposed on the second surface (311b) of the window member (311) and may reinforce or support the window member (311).

[0084] For example, the rear cover (350) may come into direct contact with or come into contact with the user's face while the user is wearing the wearable electronic device (101). For example, the rear cover (350) may include an opening formed at a position corresponding to the user's eyes. For example, the rear cover (350) may have a curved three-dimensional shape corresponding to the curve of the user's face (e.g., the bridge of the nose).

[0085] FIG. 4a is a plan view of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure. FIG. 4b is a front view of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure. FIG. 4c is a bottom view of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure. FIG. 5a is a drawing showing a part of an injection molded portion of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure. FIG. 5b is a drawing showing a part of an injection molded portion of a side frame structure of a wearable electronic device according to one embodiment of the present disclosure. FIG. 6a is a part of a front view of a wearable electronic device according to one embodiment of the present disclosure. FIG. 6b is a perspective view of a side frame structure according to one embodiment of the present disclosure viewed from direction A of FIG. 6a. FIG. 6c is a perspective view of a side frame structure according to one embodiment of the present disclosure viewed from direction B of FIG. 6a. FIG. 6d is a perspective view of a side frame structure according to one embodiment of the present disclosure, viewed from direction C of FIG. 6a.

[0086] The side frame structure (303) of FIGS. 4a to 4c can be referred to as the side frame structure (303) of FIG. 3.

[0087] According to one embodiment, the side frame structure (303) may include a curved surface. For example, the side frame structure (303) may have a curved three-dimensional shape that corresponds to the curved portion of the user's face (e.g., the bridge of the nose) overall.

[0088] According to one embodiment, the side frame structure (303) may include a metal part (330) and an injection part (340). As described below, according to one embodiment of the present disclosure, the metal part (330) is formed as a thin film to contribute to the lightweighting of the side frame structure (303), and the injection part (340) can reinforce the rigidity of the metal part (330) and simplify the structure of the inner surface (330a) of the metal part (330). According to one embodiment of the present disclosure, the metal part (330) may be formed with a thickness of 0.28 mm or more and about 0.32 mm or less, preferably about 0.3 mm or more and 0.32 mm or less (e.g., d1 in FIG. 6b and FIG. 6c).

[0089] Referring to FIGS. 4a through 6c, according to one embodiment, the metal part (330) may include an outer surface (330b) that is at least partially exposed to the outside of the wearable electronic device (101) and an inner surface (330a) opposite to the outer surface (330b).

[0090] Referring to FIGS. 4a through 6c, according to one embodiment, the metal part (330) may include a first part (330-1) placed on the bridge of the user's nose, a second part (330-2) extending from one end (e.g., right end) of the first part (330-1), a third part (330-3) extending from the other end (e.g., left end) of the first part (330-2), and a fourth part (340-4) placed between the second part (330-2) and the third part (330-3). For example, the first part (330-1) corresponds to the area indicated by the dotted box in FIG. 7b, and the second part (330-2), third part (330-3), and fourth part (340-4) may be separated by the dotted lines shown in FIG. 7b for convenience. The first part (330-1), second part (330-2), third part (330-3), and fourth part (340-4) of the metal part (330) are separated for convenience of explanation and are not limited, and for example, the metal part (330) may be divided into more detailed parts.

[0091] For example, when a user is wearing the wearable electronic device (101), the first part (330-1) may be positioned on the bridge of the user's nose, the second part (330-2) may be positioned on the right cheek of the user's face, the third part (330-3) may be positioned on the left cheek of the user's face, and the fourth part (340-4) may be positioned on the forehead of the user's face. However, the placement of the first part (330-1), the second part (330-2), the third part (330-3), and the fourth part (340-4) on the user's wearing area is not limited and may be set or changed differently depending on the user's wearing method or the structure of the body part (e.g., face).

[0092] Referring to FIG. 4a, FIG. 6b, and FIG. 6c, according to one embodiment, the metal part (330) may include a first through hole (331) and a second through hole (332) formed through from the outer surface (330b) to the inner surface (330a).

[0093] According to one embodiment, at least a portion of a key assembly (e.g., input module (170) of FIG. 1) may be disposed in the first through hole (331). According to one embodiment, an input portion of the key assembly (e.g., a physical key or button) may be disposed in the first through hole (331), and a portion of the input portion may be exposed to the outside of the wearable electronic device (101) through the first through hole (331). For example, according to one embodiment, the first through hole (331) may be formed in a portion of the fourth portion (330-4). However, the number and location of the first through hole (331) are not limited, and it may be formed in a portion of the second portion (330-2) and / or the third portion (330-3).

[0094] According to one embodiment, a second injection portion (344) including air vent holes (e.g., air vent holes (3441) of FIG. 8a to FIG. 8b) may be disposed on the inner surface (330a) of the metal portion (330) corresponding to the second through hole (332) and the surrounding area. The second injection portion (344) may be exposed to the outside of the wearable electronic device (101) through the second through hole (332). According to one embodiment, the second through hole (332) may be formed in a part of the second portion (330-2) and / or the third portion (330-3). However, the number and location of the second through hole (332) are not limited and may be formed in a part of the fourth portion (330-4).

[0095] According to one embodiment, the metal part (330) may include a lightweight metal such as aluminum or an aluminum alloy. The thickness (d1) of the metal part (330) may be formed within a defined range. Referring to FIGS. 6b and 6c, according to one embodiment, the thickness (d1) of the metal part (330) may be approximately 0.29 mm or more and approximately 0.32 mm or less, and preferably may be formed to be approximately 0.3 mm or more and 0.31 mm or less. According to one embodiment, if the thickness (d1) of the metal part (330) is smaller than the lower limit of the defined range (e.g., approximately 0.29 or more and approximately 0.3 or less), the manufacturing difficulty of the side frame structure (303) increases (e.g., when the metal part (330) is processed by cutting (CTC), the defect rate of the metal part (330) may increase), and it may be difficult to sufficiently secure the rigidity of the side frame structure (303). Referring to FIGS. 4a through 6c, according to one embodiment, the injection portion (340) may include a first injection portion (341), a rib structure (or a second rib structure) (343), and a second injection portion (344) disposed on the inner surface (330a) of the metal portion (330). For example, the injection portion (340) may be formed of a synthetic resin material (e.g., polybutylene terephthalate (PBT)).

[0096] According to one embodiment, the first injection portion (341) may be disposed on a portion of the inner surface (330a) of the metal portion (330). According to one embodiment, the first injection portion (341) may be formed to accommodate a portion of the electronic component of the wearable electronic device (101). Referring to FIGS. 5A and 5B, according to one embodiment, the first injection portion (341) may include a receiving space (3411a, 3411b). For example, the first injection portion (341) may include a pocket structure that is open to one side and forms a receiving space (3411a, 3411b) on the inside. According to one embodiment, an electrical / electronic component in the form of a thin film, such as a circuit board, may be accommodated in the receiving space (3411a, 3411b), and the shape of the receiving space (3411a, 3411b) may correspond to an electrical / electronic component in the form of a thin film, such as a circuit board. According to one embodiment, at least a part (e.g., a circuit board and / or a key bracket) of a key assembly (e.g., an input module (170) of FIG. 1) may be placed in the receiving space (3411a, 3411b) of the first injection part (341). According to one embodiment, the input part of the key assembly (e.g., an input module (170) of FIG. 1) is placed in the first through hole (331), and a circuit board and / or a key bracket on which the circuit board is placed, which are electrically connected to the input part, may be accommodated in the receiving space (3411a, 3411b).

[0097] Referring to FIGS. 4a through 6c, according to one embodiment, the first injection part (341) may include a first-1 injection part (341a) and a first-2 injection part (341b). For example, according to one embodiment, the first-1 injection part (341a) and / or the first-2 injection part (341b) may be formed in a part of the fourth part (330-4). However, the number and location of the first injection part (341) are not limited and may be formed in a part of the second part (330-2) and / or the third part (330-3).

[0098] Referring to FIG. 5a, according to one embodiment, the first-1 injection portion (341a) may include a first receiving space (3411a). For example, at least a portion (e.g., a circuit board and / or a key bracket) of a key assembly (e.g., an input module (170) of FIG. 1) may be placed in the first receiving space (3411a). For example, the wearable electronic device (101) may be configured to detect user input (e.g., a click or a touch) when said input is provided to the key assembly and to perform a feature function (e.g., volume control or power drive). For example, the key assembly may include a volume key and / or a power key for controlling the volume of sound output from the wearable electronic device (101).

[0099] Referring to FIG. 5b, according to one embodiment, the first-second injection portion (341b) may include a second receiving space (3411b). For example, at least a portion (e.g., a circuit board and / or a key bracket) of a key assembly (e.g., the input module (170) of FIG. 1) (e.g., a volume key or a power key) may be placed in the second receiving space (3411b).

[0100] According to one embodiment, a rib structure (343) may be disposed around the first-1 injection portion (341a) and / or the first-2 injection portion (341b). According to one embodiment, at least a portion of the first-1 injection portion (341a) and / or the first-2 injection portion (341b) may be connected to the rib structure (343).

[0101] FIG. 7a is a view of a second injection part having an air vent hole formed in a side frame structure according to one embodiment of the present disclosure, viewed from the outside of the frame structure. FIG. 7b is a view of a second injection part having an air vent hole formed in a side frame structure according to one embodiment of the present disclosure, viewed from the inside of the frame structure. FIG. 8a is a view of a second injection part having an air vent hole formed in a side frame structure according to one embodiment of the present disclosure, viewed from the inside of the frame structure. FIG. 8b is a view of a second injection part having an air vent hole formed in a side frame structure according to one embodiment of the present disclosure, viewed from the outside and inside of the frame structure.

[0102] The second injection portion (344) of FIGS. 7a to 8d may be referred to as the second injection portion (344) of FIGS. 4a to 4c and FIGS. 6a to 6d. The metal portion (330) of FIGS. 7a to 8d may be referred to as the metal portion (330) of FIGS. 4a to 6d.

[0103] Referring to FIG. 7a, FIG. 7b and FIG. 8a, according to one embodiment, the second through hole (332) of the metal part (330) may be a single circular hole. Referring to FIG. 8b, according to one embodiment, the second through holes (332) of the metal part (330) may include a plurality of elongated holes or slits spaced apart from each other. However, the number, shape, and arrangement of the second through holes (332) in the present disclosure are not limited and may have various shapes, for example (e.g., polygonal, irregular).

[0104] Referring to FIGS. 7a through 8b, according to one embodiment, a second injection portion (344) may be disposed on the inner surface (330a) of a metal portion (330) corresponding to the second through hole (332) and the surrounding area. At least a portion of the second injection portion (344) may be exposed to the outside of the wearable electronic device (101) through the second through hole (332). According to one embodiment, the second injection portion (344) may be disposed on a portion of the second portion (330-2) and / or the third portion (330-3). However, the number and location of the second injection portion (344) are not limited and may be formed on a portion of the fourth portion (330-4).

[0105] According to one embodiment, the second injection part (344) may include a plurality of air vent holes (3441). Air and heat inside and outside the wearable electronic device (101) can be exchanged through the air vent holes (3441). The air vent holes (3441) may have a shape in which a plurality of fine holes are arranged in a continuous manner, such as a mesh structure.

[0106] Referring to FIGS. 7a and 7b, according to one embodiment, the air vent holes (3441) of the second injection part (344) may include circular holes spaced apart from each other. According to one embodiment, a rib structure (343) may be disposed around the second injection part (344). According to one embodiment, at least a portion of the second injection part (344) may be connected to the rib structure (343).

[0107] Referring to FIG. 8a, according to one embodiment, the air vent holes (3441) of the second injection part (344) may include circular holes spaced apart from each other. Referring to FIG. 8b, according to one embodiment, the air vent holes (3441) may include elongated holes spaced apart from each other. According to one embodiment, the direction in which the air vent holes (3441) extend (or the longitudinal direction) may be different from the direction in which a plurality of elongated second through holes (332) extend (or the longitudinal direction). For example, the direction in which the air vent holes (3441) extend (or the longitudinal direction) may intersect with the direction in which a plurality of elongated second through holes (332) extend (or the longitudinal direction). However, the number, shape, and arrangement of the air vent holes (3441) of the second injection part (344) in the present disclosure are not limited and may have various shapes, for example (e.g., polygonal, irregular).

[0108] Referring to FIGS. 8a and 8b, according to one embodiment, the second injection portion (344) may further include an extension area (3442) disposed around a portion of the second injection portion (344) in which air vent holes (3441) are formed. For example, the extension area (3442) may support the inner surface (330a) of the metal portion (330) to reinforce the metal portion (330). According to one embodiment, the extension area (3442) may be omitted, and a rib structure (343) that supports the inner surface (330a) of the metal portion (330) to reinforce the metal portion (330) may be disposed around the second injection portion (344) as in the embodiment of FIGS. 7a and 7b.

[0109] FIG. 9a is a perspective view of the inner surface of a side frame structure of a conventional wearable electronic device. FIG. 9b is a perspective view of the inner surface of a side frame structure of a conventional wearable electronic device. FIG. 9c is a cross-sectional perspective view showing the inner surface of a side frame structure of a conventional wearable electronic device being processed using a tool.

[0110] FIGS. 9a to 9c are drawings for explaining a conventional side frame structure (80) that can be applied to a wearable electronic device (e.g., the wearable electronic device (101) of FIG. 2) described above with reference to FIG. 3. FIGS. 9a to 9c are drawings for explaining that the side frame structure (303) of the wearable electronic device (101) according to one embodiment of the present disclosure is improved compared to the conventional side frame structure (80).

[0111] Referring to FIGS. 9a and 9b, for example, a conventional side frame structure (80) may include a receiving portion (84) for receiving electrical / electronic components. For example, the receiving portion (84) may be formed to receive a first through hole (81) in which an input portion (e.g., physical key) of a key assembly (e.g., volume key and / or power key) is placed, and a circuit board and / or key bracket of the key assembly. A side frame structure (303) according to one embodiment of the present disclosure may replace the receiving portion (84) of the conventional side frame structure (80) with a receiving space (3411a, 3411b) of a first injection portion (341). Since the existing side frame structure (80) is formed entirely of a metal material, the difficulty of manufacturing may be higher compared to the receiving space (3411a, 3411b) of the first injection part (341) formed by injection molding, by processing the metal material to form the receiving portion (84). Therefore, the receiving space (3411a, 3411b) of the first injection part (341) of the side frame structure (303) according to one embodiment of the present disclosure can have the advantage of lower time and cost in the manufacturing process compared to forming a portion for receiving electrical / electronic components in a metal material, such as the receiving portion (84) of the existing side frame structure (80), by replacing the receiving portion (84) of the existing side frame structure (80).

[0112] For example, the existing side frame structure (80) may include a second through hole (82) to which an air vent member (83) having air vent holes formed therein is attached. In one embodiment of the present disclosure, the side frame structure (303) may replace the air vent member (83) of the existing side frame structure (80) with a second injection part (344). For example, the air vent member (83) may be formed from a material different from a metal material, such as a synthetic oil, and may be formed, for example, by injection molding. For example, the air vent member (83) may be attached to the existing side frame structure (80) through an adhesive or a fastening member. Referring to FIGS. 7a through 8b, a second injection portion (344) according to one embodiment of the present disclosure can be formed integrally in a single process with an injection portion (340) (e.g., a rib structure (343) and / or a surrounding area (3442)) formed in another area of ​​the metal portion (330). Accordingly, according to the second injection portion (344) according to one embodiment of the present disclosure, the process of attaching an air vent member (83) to the existing side frame structure (80) can be omitted, thereby simplifying the manufacturing process.

[0113] Referring to FIG. 9a and FIG. 9c, for example, the conventional side frame structure (80) may be formed entirely of a metal material. Referring to FIG. 9a, the inner surface (80a) of the conventional side frame structure (80) may be formed with a more complex and sophisticated structure compared to the inner surface (330a) of the metal part (330) of the side frame structure (303) according to one embodiment of the present disclosure. Referring to FIG. 9a, the conventional side frame structure (80) may include an under-cut structure and / or a machined portion (81a) machined into a curved surface among the inner surface (80a). According to one embodiment of the present disclosure, the structure of the inner surface (330a) of the metal part (330) can be simplified by at least partially replacing the cutting portion (81a) of the existing side frame structure (80) of the metal material with the injection portion (340), and accordingly, the manufacturing difficulty and processing time of the metal part (330) can be reduced compared to the existing side frame structure (80) of the metal material, thereby reducing manufacturing costs. For example, the cutting portion (81a) can be machined (e.g., CNC machining) using a tool (T) having a thin and long tip as shown in FIG. 9c. Referring to FIG. 9b, the tip of the tool (T) interferes unnecessarily with a part (e.g., edge) of the inner surface (80a) in addition to the cutting portion (81a), thereby causing vibration or resistance to be applied to the existing side frame structure (80). Therefore, it may be difficult to form the thickness (t2) of the existing side frame structure (80) into a thin film of a certain thickness (e.g., 0.7 mm) or less to withstand vibration or resistance caused by the tool (T). According to one embodiment of the present disclosure, when the inner surface (330a) of the metal part (330) is processed into an under-cut structure and / or a curved surface (e.g., CNC machining), the injection material including the injection part (340) reinforces the inner surface (330a), thereby making it more resistant to vibration or resistance caused by the tool (T) compared to the existing side frame structure (80).Accordingly, the thickness of the metal part (330) (e.g., t1 in FIG. 6c) can be formed thinner than the thickness (t2) of the existing side frame structure (80). According to one embodiment of the present disclosure, the thickness of the metal part (330) (e.g., t1) is minimized to less than half the thickness (t2) of the existing side frame structure (80), thereby reducing the total weight by more than 20% and contributing to the lightweighting of the wearable electronic device (101).

[0114] As described above, the embodiments of the present disclosure are intended to solve the problems and / or disadvantages of the existing side frame structure (80) described above with reference to FIGS. 9a through 9c, and to provide the effects or advantages described above that are exerted by the side frame structure (303) of the present disclosure. However, the problems to be solved by the present disclosure are not limited to the problems mentioned above and may be determined in various ways without departing from the spirit and scope of the present disclosure. The effects obtainable by the present disclosure are not limited to the effects mentioned above, and various effects that can be identified directly or indirectly through the present disclosure may be provided.

[0115] FIG. 10a is a flowchart illustrating a method for manufacturing a side frame structure according to an embodiment of the present disclosure. FIG. 10b is a flowchart illustrating a method for manufacturing a side frame structure according to an embodiment of the present disclosure. FIG. 11a is a diagram illustrating the manufacturing process of a side frame structure according to an embodiment of the present disclosure. FIG. 11b is a perspective view of a side frame structure according to an embodiment of the present disclosure manufactured according to FIG. 11a. FIG. 12 is a diagram illustrating the manufacturing process of a side frame structure according to an embodiment of the present disclosure. FIG. 13 is a diagram illustrating the manufacturing process of a side frame structure according to an embodiment of the present disclosure. FIG. 14 is a diagram illustrating the manufacturing process of a side frame structure according to an embodiment of the present disclosure. FIG. 15 is a diagram illustrating the manufacturing process of a side frame structure according to an embodiment of the present disclosure. FIG. 16 is a diagram illustrating the manufacturing process of a side frame structure according to an embodiment of the present disclosure. FIG. 17 is a diagram illustrating the manufacturing process of a side frame structure according to an embodiment of the present disclosure.

[0116] Hereinafter, with reference to FIGS. 10a to 17 and FIGS. 4a to 8b, a method for manufacturing a side frame structure (e.g., side frame structure (303) of FIGS. 3 to 4c) of a housing (301) (e.g., housing (301) of FIGS. 4) of a wearable electronic device (e.g., wearable electronic device (101) of FIGS. 1 to 3) described above will be explained.

[0117] Referring to FIGS. 10a and FIGS. 11a through 16, according to one embodiment, a manufacturing method (500) for forming a side frame structure (303) of a housing (301) of a wearable electronic device (101) comprises: an operation (501) of preparing a metal part (330) of the side frame structure (303) by processing a metal material (10; 10-1; 10-2) (e.g., FIGS. 11a (a) through (c), FIGS. 12 (a) through (c), FIGS. 13 (a)), an operation (502) of forming an injection molded product along an inner surface (330a) of the metal part (330) (e.g., FIG. 11a (d)), FIG. 12 (d), FIG. 13 (b)), and cutting (e.g., CNC machining) the outer surface (330b) opposite the inner surface (330a) of the metal part (330). The process may include a processing operation (503) (e in FIG. 11a, c in FIG. 13, c in FIG. 14) and a process (505) (e in FIG. 11b) for removing at least a portion of the injection molded part to form an injection portion (340). For example, the process (505) for removing at least a portion of the injection molded part to form (or complete) the injection portion (340) can contribute to the weight reduction of the entire side frame structure (303) by removing unnecessary parts of the injection molded part formed by the process (502) of molding the injection molded part along the inner surface (330a) of the metal part (330) through a process such as cutting (e.g., CNC machining).

[0118] According to one embodiment, the operation (501) of preparing the metal part (330) of the side frame structure (303) may include the operation of cutting (e.g., CNC machining) the inner surface (330a) of the metal part (330) on the metal material. According to one embodiment, the operation of cutting (e.g., CNC machining) the inner surface (330a) of the metal part (330) on the metal material may include the operation of cutting (e.g., CNC machining) to form a metal rib structure (335) on the inner surface (330a) of the metal part (330).

[0119] Referring to FIG. 10a and FIG. 11a, according to one embodiment, to form the inner surface (330a) of a metal part (330), FIG. 11a (b) may show a first metal workpiece (11) that has been subjected to primary cutting (e.g., CNC machining) on ​​a metal material (10), and a cross-sectional view of the first metal workpiece (11) along line L1. FIG. 11a (c) may show a second metal workpiece (12) that has been subjected to secondary cutting (e.g., CNC machining) to form an under-cut structure on the first metal workpiece (11) of FIG. 11a (b), and a cross-sectional view along line L2. Figure 11a (d) may show a first injection molded product (21) formed or molded on the inner surface (f1) of the second metal workpiece (12) of Figure 11a (c), and a cross-sectional view of the second metal workpiece (12) and the first injection molded product (21) along line L3. Figure 11a (e) may show a third metal workpiece (13) formed by cutting the outer surface (f2) of the second metal workpiece (12) of Figure 11a (d), and a cross-sectional view of the third metal workpiece (13) and the first injection molded product (21) along line L4. Fig. 11a (f) may show a side frame structure (303) comprising a second injection molded part (22) and a third metal workpiece (13) formed by cutting the first injection molded part (21) of Fig. 11a (e), and a cross-sectional view of the side frame structure (303) along line L5. The third metal workpiece (13) of Fig. 11a (f) may be referred to as a metal part (330) according to the embodiments of Figs. 3 to 8b.

[0120] FIG. 11b may show a side frame structure (303) formed through the manufacturing method (500) of FIG. 10a and the manufacturing processes of FIG. 11a. The side frame structure (303) of FIG. 11b may be referred to as a side frame structure (e.g., the side frame structure (303) of FIG. 3 to 4c). Referring to FIG. 11b, according to one embodiment, a cross-sectional view of an injection part (340) formed by removing unnecessary parts from the second injection part (22) of FIG. 11a (f) and a metal part (330) along line L6 may be shown. FIG. 11b may be referred to as an injection part (340) according to the embodiment of FIG. 3 to 8b. According to one embodiment, the thickness (t1) of the metal part (330) may be about 0.3 mm to about 0.32 mm.

[0121] Referring to FIG. 10a and FIG. 12, according to one embodiment, the operation (501) of preparing the metal part (330) of the side frame structure (303) may include bending a long strip-shaped metal material (10-1) to form the metal part (330) of the side frame structure (303). According to one embodiment, the first metal workpiece (11-1) of FIG. 12 (b) may be formed by bending the long strip-shaped metal material (10-1) of FIG. 12 (a) to form the metal part (330). According to one embodiment, the second metal workpiece (12-1) of FIG. 12 (c) may be formed by cutting (e.g., CNC machining) the inner surface (f1) of the first metal workpiece (11-1) of FIG. 12 (b). According to one embodiment, FIG. 12 (d) may show a first injection molded product (21-1) formed on the inner surface (f1) of the second metal workpiece (12-1) of FIG. 12 (c). The third metal workpiece (13-1) of FIG. 12 (e) may be formed by cutting (e.g., CNC machining) the outer surface (f2) of the second metal workpiece (12-1) of FIG. 12 (e) may be formed by cutting (e.g., CNC machining) the first injection molded product (22-1). The third metal workpiece (13) of FIG. 12 may be referred to as a metal part (330) according to the embodiments of FIG. 3 to FIG. 8b.

[0122] Referring to FIGS. 10a, FIGS. 13, FIGS. 14 and FIGS. 15, according to one embodiment, the manufacturing method (500) further includes a cutting operation (e.g., CNC machining) (e.g., f in FIG. 11a, e in FIG. 12, c and (d) in FIG. 13, d and (e) in FIG. 14 and FIG. 15) to form a rib structure (342, 343) on at least a portion of the injection-molded product before the operation (505) to remove at least a portion of the injection-molded product to form an injection-molded portion (340), or according to the embodiment of FIG. 14 and FIG. 15, the operation (502) of molding the injection-molded product may include an injection-molding operation (dP: b in FIG. 14 and b in FIG. 15) to form a rib structure (342, 343) on the inner surface (330a) of the metal portion (330). According to one embodiment, the operation (505) of forming (or completing) the injection part (340) by removing at least a portion of the injection part can be formed (or completed) in a designed shape by removing unnecessary parts of the injection part formed by the operation (502) of molding the injection part along the inner surface (330a) of the metal part (330) and the operation (504) of cutting (e.g., CNC machining) to form a rib structure (342, 343) on at least a portion of the injection part, and can contribute to the lightweighting of the entire side frame structure (303).

[0123] According to one embodiment, FIG. 13 (a) may show the second metal workpiece (12) described above with reference to FIG. 11. According to one embodiment, FIG. 13 (b) may show the first injection molded product (21) formed on the inner surface (f1) of the second metal workpiece (12). FIG. 13 (c) may show the second metal workpiece (12) of FIG. 13 (b) being machined (e.g., CNC machined) to form a third metal workpiece (13) including an outer surface (f2), and the first injection molded product (21) of FIG. 13 (b) being machined (e.g., CNC machined) to form a second injection molded product (22). FIG. 13(d) may show a second injection molded part (22) of FIG. 13(c) formed by cutting (e.g., CNC machining) to form a rib structure (or first rib structure) (342). According to one embodiment, the rib structure (or first rib structure) (342) may include ribs (3421, 3422) extending in one or more directions and a portion (3423) between the ribs (3421, 3422). The ribs (3421, 3422) may include a first rib (3421) and a second rib (3422) that intersects (or is orthogonal) the first rib (3421). The configuration of the injection part (340) (or second injection part (22)) including the rib structure (or first rib structure) (342) of FIG. 13 (d) may be partly or entirely identical or similar to the configuration of the injection part (340) according to the embodiments of FIG. 4a to FIG. 8b.

[0124] According to one embodiment, FIG. 14 (a) may show the second metal workpiece (12) described above with reference to FIG. 11. According to one embodiment, FIG. 14 (b) may show the first injection molded product (21) and the rib structure (or second rib structure) (343) formed or injection molded on the inner surface (f1) of the second metal workpiece (12). FIG. 14 (c) may show the second metal workpiece (12) of FIG. 13 (b) with a third metal workpiece (13) including an outer surface (f2) formed by cutting (e.g., CNC machining), and the first injection molded product (21) with a second injection molded product (22) formed by cutting (e.g., CNC machining). According to one embodiment, the rib structure (or second rib structure) (343) may include ribs (3431, 3432) extending in one or more directions. The ribs (3431, 3432) may include a first rib (3431) and a second rib (3432) that intersects (or is orthogonal) to the first rib (3431). An injection part (340) (or second injection part (22)) including the rib structure (or second rib structure) (343) of FIG. 14 (c) may be referred to as an injection part (340) including the rib structure (or second rib structure) (343) according to the embodiments of FIG. 4a through FIG. 8b.

[0125] Referring to FIG. 10a and FIG. 15, according to one embodiment, the manufacturing method (500) may further include, before the operation (503) of cutting (e.g., CNC machining) the outer surface (330b), the operation of cutting (e.g., CNC machining) the outer surface (330b) of the metal part (330) after forming the reinforcing injection part (M1) on the injection part, and the operation of removing the reinforcing injection part (M1).

[0126] Referring to FIG. 15, according to one embodiment, FIG. 15 (a) may show the second metal workpiece (12) described above with reference to FIG. 11. According to one embodiment, FIG. 15 (b) may show the first injection molded part (21) and the rib structure (or second rib structure) (343) formed or injection molded on the inner surface (f1) of the second metal workpiece (12). FIG. 15 (c) may show the reinforcing injection molded part (M1) formed or molded on the inner surface (f1) and the rib structure (or second rib structure) (343). FIG. 15(d) may show a third metal workpiece (13) including an outer surface (f2) formed by cutting (e.g., CNC machining) the second metal workpiece (12) while maintaining the reinforcing injection part (M1) of FIG. 15(c), and then cutting (e.g., CNC machining) the reinforcing injection part (M1) and cutting (e.g., CNC machining) the first injection part (21) to form the second injection part (22). FIG. 15(e) may show a view with the reinforcing injection part (M1) removed. For example, the reinforcing injection part (M1) may be formed of a material different from that of the second injection part (22). For example, the second injection molded part (22) may be formed from a synthetic resin material (e.g., polybutylene terephthalate (PBT)), and the reinforcing injection molded part (M1) may be formed from a synthetic resin material that is soluble in water (e.g., polyvinyl alcohol (PVA)). According to one embodiment, as illustrated in (d) of FIG. 15, the second metal workpiece (12) (or metal part (330)) may be reinforced during the process of forming the outer surface (f2) of the third metal workpiece (13) (or metal part (330)) by cutting (e.g., CNC machining) the second metal workpiece (12), thereby contributing to forming the thickness of the third metal workpiece (13) (or metal part (330)) as a thin film.

[0127] In FIG. 15 (e), the reinforcing injection portion (M1) can be removed by being dissolved by immersing it in water. According to one embodiment, the rib structure (or second rib structure) (343) may include ribs (3431, 3432) extending in one or more directions. The ribs (3431, 3432) may include a first rib (3431) and a second rib (3432) that intersects (or is orthogonal) to the first rib (3431). The injection portion (340) (or second injection part (22)) including the rib structure (or second rib structure) (343) of FIG. 15 (e) may be referred to as the injection portion (340) including the rib structure (or second rib structure) (343) according to the embodiments of FIG. 4a through 8b.

[0128] Referring to FIG. 16, according to one embodiment, FIG. 16 (a) may show a metal rib structure (335) formed by cutting (e.g., CNC machining) a part of the inner surface (f1) of the second metal workpiece (12) described above with reference to FIG. 11. According to one embodiment, FIG. 16 (b) may show a first injection molded product (21) formed on the inner surface (f1) of the second metal workpiece (12). FIG. 16 (c) may show a third metal workpiece (13) including an outer surface (f2) formed by cutting (e.g., CNC machining) the second metal workpiece (12) of FIG. 13 (b), and a second injection molded product (22) formed by cutting (e.g., CNC machining) the first injection molded product (21). FIG. 16 (d) may show the appearance after removing the second injection molded part (22) placed on the metal rib structure (335). According to one embodiment, the metal rib structure (335) may include metal ribs (3351, 3352) extending in one or more directions and a recess (3353) formed between the metal ribs (3351, 3352). The metal ribs (3351, 3352) may include a first metal rib (3351) and a second metal rib (3352) that intersects (or is orthogonal) the first metal rib (3351). According to one embodiment, the metal rib structure (335) can contribute to forming the thickness of the third metal workpiece (13) (or metal part (330)) as a thin film by reinforcing the second metal workpiece (12) (or metal part (330)) during the process of forming the outer surface (f2) of the third metal workpiece (13) (or metal part (330)) by cutting (e.g., CNC machining) the second metal workpiece (12) as illustrated in (b) of FIG. 13.

[0129] Referring to FIG. 10b and FIG. 17, according to one embodiment, a manufacturing method (500) for forming a side frame structure (303) of a housing (301) of a wearable electronic device (101) may include: an operation (601) of preparing a metal part (330) of the side frame structure (303) by hydraulically processing a rod-shaped metal material (10-2); an operation (602) of forming an injection molded product on the inner surface of the metal part (330); an operation (603) of cutting the injection molded product (e.g., CNC machining); and an operation (604) of forming (or completing) an injection molded part (340) by at least partially removing the injection molded product. For example, the operation (604) of forming (or completing) the injection part (340) can form (or complete) the injection part (340) in a designed shape and contribute to the weight reduction of the entire side frame structure (303) by removing unnecessary parts of the injection part formed by the operation (603) through a process such as cutting (e.g., CNC machining). According to one embodiment, the operation (601) of preparing the metal part (330) may include extracting a corresponding part (111 in (d) of FIG. 17) from the metal part (330) that has been deformed by hydraulic processing among the rod-shaped metal material.

[0130] Referring to FIG. 17, according to one embodiment, a rod-shaped metal material (10-2) is placed inside a mold or die (P) as in FIG. 17 (b), and hydraulic pressure is applied as in FIG. 17 (b) to deform or shape the rod-shaped metal material (10-2). FIG. 17 (e) may show a metal part (330) prepared by extracting or cutting out a metal processing part (111) that has been deformed by hydraulic processing from the rod-shaped metal material (10-2) of FIG. 17 (d). FIG. 17 (f) and FIG. 17 (g) may show a first injection part formed on the inner surface of the metal part (330) and a second injection part (21-2) formed by cutting the surface (e.g., CNC machining). The injection portion (340) of the embodiment of FIGS. 4a to 8b can be formed by removing a part of the second injection portion (21-2) of FIG. (g) or by additionally machining it (e.g., CNC machining).

[0131] According to one embodiment of the present disclosure, a wearable electronic device (101) may be provided. The device may include a window member (311) comprising a first surface (311a) configured to face the outside of the wearable electronic device and a second surface (311b) configured to face the face of a user wearing the wearable electronic device and opposite to the first surface, and a housing (301) forming the exterior of the wearable electronic device, comprising a support structure (320) positioned facing the second surface of the window member and a side frame structure (303) positioned along the edge of the support structure and including a curved surface. The above side frame structure comprises a metal part (330) and at least one injection part (340) disposed on a portion of an inner surface (330a; f1) facing the space enclosed by the housing of the metal part, and at least one of the metal part or the at least one injection part may comprise at least one rib structure (342, 343, 335).

[0132] According to one embodiment, the electronic components (370) disposed on the support structure are further included, and the at least one injection portion may further include at least one first injection portion (341) comprising a receiving space (3411a, 3411b) in which a portion of the electronic components is disposed.

[0133] According to one embodiment, the electronic components may include at least one key assembly comprising a circuit board disposed in the receiving space of the at least one first injection part and an input part disposed to be exposed to the outside of the wearable electronic device and electrically connected to the circuit board.

[0134] According to one embodiment, the thickness measured in a direction intersecting the inner surface of the metal part may be 0.3 mm or more and 0.32 mm or less.

[0135] According to one embodiment, the at least one injection portion includes a first rib structure (342), and the first rib structure may include ribs (3421, 3422) extended in one or more directions and concave portions (3423) disposed between the ribs.

[0136] According to one embodiment, the at least one injection portion includes a second rib structure (343) comprising ribs (3431, 3432) extending in one or more directions, and the second rib structure may be formed such that a portion of the inner surface of the metal portion is exposed to the outside of the second rib structure between the ribs.

[0137] According to one embodiment, the metal portion includes a metal rib structure (335), and the metal rib structure may include ribs (3351, 3352) extending in one or more directions and concave portions (3353) disposed between the ribs.

[0138] According to one embodiment, the metal part includes a first part (330-1) that is positioned around the bridge of the user's nose and includes a curved surface, and the at least one injection part may include at least one rib structure disposed on the inner surface of the metal part located in the first part.

[0139] According to one embodiment, the first part may include a concave shape having a smaller curvature compared to other parts of the side frame structure.

[0140] According to one embodiment, the metal part includes a second part (330-2) extending from one end of the first part and including a curved surface, and a third part (330-3) extending from the opposite end of the first part and including a curved surface, and the at least one injection part may include at least one rib structure disposed on the inner surface of the metal part located on at least one of the second part or the third part.

[0141] According to one embodiment, the side frame structure includes at least one second through hole (332), and the at least one injection part may include at least one second injection part (344) including a plurality of air bent holes formed in an area overlapping with the at least one second through hole.

[0142] According to one embodiment, the at least one second through hole may include a single circular hole or a plurality of elongated holes spaced apart from each other. The plurality of air vent holes may include at least one of circular holes spaced apart from each other or elongated holes spaced apart from each other.

[0143] According to one embodiment, the at least one injection portion includes at least one rib structure (342, 343), and the second injection portion may be connected to a part of the rib structure.

[0144] According to one embodiment of the present disclosure, a manufacturing method (500) for forming a side frame structure (303) of a housing (301) of a wearable electronic device (101) may be provided. The manufacturing method may include an operation (501) of preparing a metal part (330) of the side frame structure (303) by processing a metal material (10; 10-1; 10-2), an operation (502) of forming an injection molded part along an inner surface (330a, f1) of the metal part, an operation (503) of cutting an outer surface (330b, f2) opposite to the inner surface of the metal part, and an operation (505) of removing at least a portion of the injection molded part to form an injection part (340).

[0145] According to one embodiment, the operation (501) of preparing the metal part may include the operation of cutting the inner surface (330a, f1) of the metal part on the metal material (10).

[0146] According to one embodiment, the operation (501) of preparing the metal part may include bending a long strip-shaped metal material (10-1) to form the metal part (330) of the side frame structure (303).

[0147] According to one embodiment, the operation (505) of forming the injection part (340) may further include a cutting operation (504) to form a rib structure (342, 343) on at least a portion of the injection part, or the operation (502) of forming the injection part may include an injection molding operation to form a rib structure (342, 343) on the inner surface (330a) of the metal part (330).

[0148] According to one embodiment, prior to the operation (503) of cutting the outer surface of the metal part, the operation of cutting the outer surface of the metal part after forming the reinforcing injection part (M1) on the injection molded product and the operation of removing the reinforcing injection part (M1) may be further included.

[0149] According to one embodiment of the present disclosure, a manufacturing method (500) for forming a side frame structure (303) of a housing (301) of a wearable electronic device (101) may be provided. The manufacturing method may include an operation (601) of preparing a side frame structure (303) of the housing by hydraulically processing a rod-shaped metal material (10-3), an operation (602) of forming an injection molded product (21) along the inner surface of the side frame structure, and an operation (603, 604) of performing at least one of cutting the injection molded product or at least partially removing the injection molded product.

[0150] According to one embodiment, the operation (601) of preparing the metal part (330) may include the operation of extracting a corresponding part (111) from the metal part (330) that has been deformed by hydraulic processing among the rod-shaped metal material.

[0151] The side frame structure of the present disclosure and the wearable electronic device including it described above are not limited by the aforementioned embodiments and drawings, and it will be obvious to those skilled in the art that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0152] Although the present disclosure has been described by way of example with respect to one embodiment, it should be understood that the embodiment is for illustrative purposes only and is not intended to limit the invention. It will be obvious to those skilled in the art that various changes in form and detailed configuration may be made without departing from the whole context of the present disclosure, including the appended claims and their equivalents.

[0153] An electronic device according to one embodiment of the present disclosure may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the aforementioned devices.

[0154] The embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to a specific embodiment, and should be understood to include various modifications, equivalents, or substitutions of said embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include said item or multiple items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0155] As used in one embodiment of this document, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0156] One embodiment of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0157] According to one embodiment, the method according to one embodiment of the present disclosure may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0158] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a wearable electronic device (101), A window member (311) comprising a first surface (311a) configured to face the outside of the wearable electronic device and a second surface (311b) configured to face the face of a user wearing the wearable electronic device and opposite to the first surface; A housing (301) forming the exterior of the above-described wearable electronic device comprises a housing including a support structure (320) disposed facing the second surface of the window member and a side frame structure (303) disposed along the edge of the support structure and including a curved surface. A wearable electronic device, wherein the side frame structure comprises a metal part (331) and at least one injection part (340) disposed on a portion of an inner surface (330a; f1) facing the space enclosed by the housing of the metal part, and at least one of the metal part or the at least one injection part comprises at least one rib structure (342, 343, 335).

2. In Paragraph 1, A wearable electronic device further comprising electronic components (370) disposed on the support structure, wherein the at least one injection portion further comprises at least one first injection portion (341) comprising a receiving space (3411a, 3411b) in which a portion of the electronic components is disposed.

3. In Paragraph 2, The above electronic components comprise at least one key assembly including a circuit board disposed in the receiving space of the at least one first injection portion and an input portion disposed to be exposed to the outside of the wearable electronic device and electrically connected to the circuit board.

4. In any one of paragraphs 1 to 3, An electronic device having a thickness of 0.3 mm or more and 0.32 mm or less, measured in a direction intersecting the inner surface of the metal part.

5. In any one of paragraphs 1 through 4, A wearable electronic device, wherein at least one injection portion comprises a first rib structure (342), the first rib structure comprises ribs (3421, 3422) extending in one or more directions and concave portions (3423) disposed between the ribs.

6. In any one of paragraphs 1 through 5, A wearable electronic device, wherein at least one injection portion comprises a second rib structure (343) including ribs (3431, 3432) extending in one or more directions, and the second rib structure is formed such that a portion of the inner surface of the metal portion is exposed to the outside of the second rib structure between the ribs.

7. In any one of paragraphs 1 through 6, A wearable electronic device, wherein the metal portion comprises a metal rib structure (335), the metal rib structure comprises ribs (3351, 3352) extending in one or more directions and recesses (3353) disposed between the ribs.

8. In any one of paragraphs 1 through 7, A wearable electronic device, wherein the metal part comprises a first part (330-1) that is positioned around the bridge of the user's nose and includes a curved surface, and the at least one injection part comprises at least one rib structure disposed on the inner surface of the metal part positioned in the first part.

9. In Paragraph 8, A wearable electronic device, wherein the first part comprises a concave shape having a smaller curvature compared to other parts of the side frame structure.

10. In Paragraph 8 or 9, A wearable electronic device, wherein the metal part comprises a second part (330-2) extending from one end of the first part and including a curved surface, and a third part (330-3) extending from the opposite end of the first part and including a curved surface, and the at least one injection part comprises at least one rib structure disposed on the inner surface of the metal part located on at least one of the second part or the third part.

11. In any one of paragraphs 1 through 10, A wearable electronic device, wherein the above-described side frame structure includes at least one second through hole (332), and the at least one injection portion includes at least one second injection portion (344) comprising a plurality of air bent holes formed in an area overlapping with the at least one second through hole.

12. In Paragraph 11, The above at least one second through hole includes a single circular hole or a plurality of elongated holes spaced apart from each other, and A wearable electronic device comprising at least one of circular holes spaced apart from each other or elongated holes spaced apart from each other, wherein the plurality of air vent holes described above include at least one of circular holes spaced apart from each other.

13. In Article 11 or Article 12, A wearable electronic device, wherein the at least one injection portion comprises at least one rib structure (342, 343), and the second injection portion is connected to a part of the rib structure.

14. A manufacturing method (500) for forming a side frame structure (303) of a housing (301) of a wearable electronic device (101) is, The operation (501) of preparing a metal part (330) of a side frame structure (303) by processing a metal material (10; 10-1; 10-2); The operation (502) of forming an injection molded product along the inner surface (330a, f1) of the metal part above; A cutting operation (503) of the outer surface (330b, f2) opposite to the inner surface of the metal part; and A manufacturing method comprising the operation (505) of removing at least a portion of the above-mentioned injection part to form an injection part (340).

15. In Paragraph 14, A manufacturing method in which the operation (501) of preparing the metal part includes the operation of cutting the inner surface (330a, f1) of the metal part on the metal material (10).

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