Ceramic substrate unit for power module and method for manufacturing ceramic substrate unit for power module

The ceramic substrate unit for power modules addresses bonding defects and thermal conductivity issues by using Ag alloy filler layers with varying Ag-to-Cu ratios, ensuring efficient heat dissipation and mechanical rigidity for stable power transfer in high-voltage and high-current conditions.

WO2026116806A1PCT designated stage Publication Date: 2026-06-04AMOGREENTECH CO LTD
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Patent Information

Application Number
PCT/KR2025/017702
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-26
Filing Date
2025-10-31
Publication Date
2026-06-04

AI Technical Summary

Technical Problem

Conventional power module semiconductor designs face challenges in achieving miniaturization while maintaining high efficiency, mechanical rigidity, and effective heat dissipation, particularly due to bonding defects and thermal conductivity issues, which can lead to semiconductor chip degradation and mechanical damage.

Method used

A ceramic substrate unit for power modules is designed with a ceramic substrate having upper and lower metal layers, reinforced by a filler layer composed of Ag alloy with varying Ag-to-Cu ratios, and a reinforcing substrate, which includes a second filler layer with a higher Ag content to reduce bonding temperatures and enhance thermal conductivity and mechanical rigidity.

Benefits of technology

The design effectively dissipates heat from semiconductor chips, maintains stable bonding, and ensures robust mechanical rigidity, enabling reliable power transfer in high-voltage and high-current environments by reducing thermal stress and preventing layer separation.

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Abstract

Disclosed are a ceramic substrate unit for a power module and a method for manufacturing the ceramic substrate unit for a power module. The disclosed ceramic substrate unit for a power module comprises: a ceramic substrate having an upper metal layer and a lower metal layer formed respectively on the upper surface and the lower surface of a ceramic base material; first filler layers disposed respectively between the ceramic base material and the upper metal layer and between the ceramic base material and the lower metal layer; a reinforcing substrate bonded to the lower metal layer of the ceramic substrate; and a second filler layer disposed between the lower metal layer and the reinforcing substrate, wherein the first filler layers and the second filler layer are composed of Ag-containing alloys, and the alloy for the first filler layers and the alloy for the second filler layer have different compositional ratios.
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Citation Information

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