Etching device and etching method

An etching device and etching technology, applied in the field of etching, can solve the problems of fast flow speed, fast update, uneven etching of circuit substrates, etc., and achieve the effect of consistent etching speed, same update speed, and avoiding pool effect.

CN101962774AInactive Publication Date: 2011-02-02JIANGSU TRANSIMAGE TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2011-02-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to an etching device and an etching method. The etching device comprises a spray pipe and a liquid scrapping device, wherein the spray pipe is provided with a plurality of spray heads; the plurality of spray heads are used for spraying etching liquid to a surface to be etched of a circuit substrate; and the liquid scrapping device is used for scrapping the etching liquid deposited in a center area of the surface to be etched out of the surface to be etched in a sliding mode. The etching method comprises the following steps of: using the plurality of spray heads arranged on the spray pipe to spray the etching liquid towards the surface to be etched of the circuit substrate; and using the liquid scrapping device to scrap the etching liquid deposited in the center area of the surface to be etched out of the surface to be etched in a sliding mode. The etching method can avoid generating water pit effect.
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Description

Technical field

[0001] The invention relates to the technical field of etching, and in particular to an etching device and an etching method used in a circuit board etching process. Background technique

[0002] The etching process is the basic process of circuit board production, which refers to the process of using etching solution to etch away the copper of the circuit substrate that is not protected by the resist layer, and finally forming a conductive circuit.

[0003] With the rapid development of electronic technology, the integration of circuit boards is getting higher and higher, and the conductive lines of the circuit board are made more and more fine. This requires the size tolerance of the conductive lines of the same circuit board to be as small as possible, that is, the etching in the etching process The effect needs to be as consistent as possible.

[0004] The horizontal wet process production line has a high degree of automation and low cost, and is widely used in t...

Examples

Embodiment Construction

[0015] The etching device and etching method provided by the present technical solution will be described in detail below in conjunction with the drawings and embodiments.

[0016] Refer to figure 1 The etching device 100 provided in the first embodiment of the technical solution includes two liquid infusion pipes 10, four nozzle pipes 20, pumps 11a, 11b, valves 12a, 12b, a liquid scraping device 30 and a control device 40.

[0017] The two infusion tubes 10 are opposite and arranged parallel to each other. Each liquid infusion tube 10 communicates with a liquid storage tank (not shown), and the etching liquid is delivered to the four nozzle tubes 20 through pumps 11a and 11b, respectively.

[0018] The four nozzles 20 are arranged parallel to each other, and the two ends of each nozzle 20 are respectively communicated with an infusion tube 10, so that the etching liquid can flow from the nozzle 20 through the infusion tube 10 from the liquid storage tank. Each nozzle 20 is provided...