A display motherboard and manufacturing method thereof

Abstract

The present invention discloses a display motherboard and a manufacturing method thereof, which relates to the field of display technology, and is intended to solve the problem that OLED display devices are easily corroded by water vapor and oxygen during the manufacturing process of OLED display devices. The display motherboard comprises: a first substrate and a second substrate arranged in a box, and a plurality of mutually independent display devices located between the first substrate and the second substrate. In the peripheral area of ​​the display motherboard, the first substrate and the second substrate are sealed by a first sealant. The display motherboard also comprises: a cutting area located around the display device, a second sealant arranged in the cutting area, and the second sealant surrounds at least one of the display devices, and is used to seal the at least one surrounded display device. The display motherboard provided by the present invention is used to manufacture display devices.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display motherboard and a manufacturing method thereof. Background Art

[0002] As a new type of flat panel display, organic electroluminescent display (OLED) has attracted more and more attention due to its characteristics of active luminescence, high luminous brightness, high resolution, wide viewing angle, fast response speed, low energy consumption and flexibility. It has become the next generation display technology that may replace liquid crystal display.

[0003] In the prior art, when manufacturing OLED devices, an OLED motherboard is generally manufactured first, and then the OLED motherboard is cut to form multiple OLED devices. Since there are organic layer materials in OLED devices that are extremely sensitive to water vapor and oxygen, when the substrate with multiple OLED devices formed thereon is combined with the cover plate to form the OLED motherboard, the OLED motherboard is initially packaged with ultraviolet curing glue between the substrate and the cover plate located around the OLED motherboard to prevent water vapor and oxygen from affecting the organic layer materials in the OLED device during the manufacturing process of the OLED device. However, if foreign matter is encountered in the box of the OLED motherboard during the initial packaging, the ultraviolet curing glue is easily broken by the gas, which in turn causes the entire product to be scrapped, reducing the manufacturing yield of the OLED device. Summary of the invention

[0004] The object of the present invention is to provide a display motherboard and a manufacturing method thereof, so as to solve the problem that an OLED display device is easily corroded by water vapor and oxygen during the manufacturing process of the OLED display device.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A first aspect of the present invention provides a display motherboard, comprising: a first substrate and a second substrate arranged in a box, and a plurality of independent display devices located between the first substrate and the second substrate, wherein the first substrate and the second substrate are sealed by a first sealant in a peripheral area of ​​the display motherboard, and the display motherboard further comprises:

[0007] a cutting area located at the periphery of the display device,

[0008] A second sealant is disposed in the cutting area, and the second sealant surrounds at least one of the display devices and is used to seal the surrounded at least one of the display devices.

[0009] Furthermore, the display motherboard also includes:

[0010] A blocking pattern is located in the cutting area, wherein the blocking pattern defines a sealing area in the cutting area for forming the second sealant, and an orthographic projection of the sealing area on the first substrate does not overlap with an orthographic projection of a cutting line in the cutting area on the first substrate.

[0011] Further, the orthographic projection of the blocking pattern on the first substrate does not overlap with the orthographic projection of the cutting line in the cutting area on the first substrate.

[0012] Furthermore, the blocking pattern includes: a first blocking wall-shaped sub-pattern and a second blocking wall-shaped sub-pattern, and the sealing area is defined between the first blocking wall-shaped sub-pattern and the second blocking wall-shaped sub-pattern.

[0013] Furthermore, the blocking pattern includes a plurality of mutually independent spacers, the sealing area is defined between the plurality of spacers, and the spacers are provided in the same layer and material as the spacers in the display device.

[0014] Furthermore, the plurality of spacers are evenly distributed.

[0015] Furthermore, the cutting lines in the cutting area include: first cutting lines corresponding one-to-one to the display devices and surrounding the corresponding display devices, and strip cutting lines located between adjacent first cutting lines and extending in a direction parallel to an edge of the first cutting lines, and the sealing area is located between the first cutting lines and the strip cutting lines.

[0016] Furthermore, a width of the cutting area along a direction perpendicular to the cutting line is greater than or equal to 7.2 mm, and a width of the second sealant along a direction perpendicular to the cutting line is less than or equal to 2.6 mm.

[0017] Based on the technical solution of the above display motherboard, the second aspect of the present invention provides a method for manufacturing a display motherboard, which is used to manufacture the above display motherboard. The manufacturing method comprises:

[0018] Providing a first substrate and a second substrate, wherein a plurality of mutually independent display devices are formed on the first substrate;

[0019] forming a first sealant in a peripheral area of ​​the first substrate, and forming a second sealant in a cutting area around the display device, wherein the second sealant surrounds at least one of the display devices;

[0020] The first substrate and the second substrate are assembled into a box, so that the first sealant seals all the display devices, and the second sealant seals at least one of the enclosed display devices.

[0021] Furthermore, when the display motherboard further includes a blocking pattern, before forming the second sealant, the manufacturing method further includes:

[0022] forming a blocking pattern in the cutting area, wherein the blocking pattern defines a sealing area in the cutting area for forming the second sealant, and an orthographic projection of the sealing area on the first substrate does not overlap with an orthographic projection of a cutting line in the cutting area on the first substrate;

[0023] The step of forming a second sealant in the cutting area around the display device specifically includes:

[0024] The second sealant is formed in the sealing area.

[0025] The technical solution provided by the present invention includes a first sealant located in the peripheral area of ​​the display motherboard and a second sealant located in the cutting area around each display device. The two layers of sealant can provide dual protection for the display devices included in the display motherboard, that is, when the first sealant is broken, the second sealant can still protect the display devices to prevent water vapor and oxygen from corroding the functional film layer in the display devices, thereby better ensuring the production yield of the display devices.

[0026] In addition, since the second sealant is made in the cutting area of ​​the display motherboard, when the display motherboard is subsequently cut to obtain the display device, the second sealant located in the cutting area can be completely cut off, so the second sealant will not affect the luminous efficiency of the display device, nor will it affect the frame width of the display device. It can be seen that the technical solution provided by the present invention can avoid the erosion of the display device by water vapor and oxygen without any impact on the display device, and better ensure the manufacturing yield of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0028] Figure 1 A schematic diagram of the structure of a display motherboard provided by an embodiment of the present invention;

[0029] Figure 2 A schematic cross-sectional view of a display motherboard provided by an embodiment of the present invention;

[0030] Figure 3 A specific schematic diagram of a cutting area provided by an embodiment of the present invention.

[0031] Reference numerals:

[0032] 1-display motherboard, 10-first substrate,

[0033] 11-display device, 110-functional film layer,

[0034] 111-sealing glue, 12-second substrate,

[0035] 13-first sealant, 14-second sealant,

[0036] 15-blocking pattern, 150-first blocking wall sub-pattern,

[0037] 151-a second retaining wall-shaped sub-figure, 153-a spacer,

[0038] 16- cutting line, 160- first cutting line,

[0039] 161- Strip cutting line. DETAILED DESCRIPTION

[0040] In order to further illustrate the display motherboard and the manufacturing method thereof provided by the embodiments of the present invention, a detailed description is given below in conjunction with the accompanying drawings.

[0041] In the prior art, when manufacturing OLED display devices, in order to improve production efficiency, the motherboard of the OLED display device is generally manufactured first, and then the motherboard is cut to obtain multiple OLED display devices. The manufacturing of the motherboard of the OLED display device generally includes the following process: first, the functional film layers included in the OLED display device are manufactured on the substrate, and then the frame sealant is manufactured in the peripheral area of ​​the functional film layers included in each OLED display device (i.e., the packaging area of ​​the OLED display device). The frame sealant can generally be glass glue (Frit glue), and then the sealant is manufactured in the peripheral area of ​​the substrate substrate, and then the substrate substrate and the cover plate are matched, and all the OLED display devices formed on the substrate substrate are sealed by the sealant located at the periphery of the substrate substrate, and finally the frame sealant corresponding to each OLED display device is cured by a laser sealing process, so that the functional film layer of each OLED display device is sealed by the corresponding frame sealant, and the manufacturing of the motherboard of the OLED display device is completed.

[0042] It can be seen from the above production process that since the curing process of the frame sealant is carried out last, in the process of making the motherboard, the external water vapor and oxygen are easy to affect the functional film layer in the OLED display device. In order to avoid the functional film layer in the OLED display device being affected, a sealant is made in the peripheral area of ​​the motherboard, but as described in the background technology, the sealant cannot guarantee a good sealing effect. Based on the existence of the above problems, the inventor of the present application has found through research that a sealant can be further made inside the motherboard, that is, in the cutting area between each OLED display device, and the OLED display device can be protected secondary by the sealant.

[0043] See also Figure 1 and Figure 2 An embodiment of the present invention provides a display motherboard 1, comprising: a first substrate 10 and a second substrate 12 arranged in a box, and a plurality of mutually independent display devices 11 located between the first substrate 10 and the second substrate 12. In the peripheral area of ​​the display motherboard 1, the first substrate 10 and the second substrate 12 are sealed by a first sealant 13. The display motherboard 1 also comprises: a cutting area located around the display device 11, and a second sealant 14 arranged in the cutting area. The second sealant 14 surrounds at least one display device 11 and is used to seal the at least one surrounded display device 11.

[0044] Specifically, the display motherboard 1 includes a first substrate 10 and a second substrate 12 arranged in a box, and a plurality of independent display devices 11 are arranged between the first substrate 10 and the second substrate 12, each display device 11 includes a functional film layer 110 and a frame sealant 111 surrounding the functional film layer 110. The plurality of display devices 11 can be distributed in a matrix, and a cutting area is formed between adjacent display devices 11. When manufacturing the display motherboard 1, the first sealant 13 located in the peripheral area of ​​the display motherboard 1 can be manufactured while the second sealant 14 is manufactured in the cutting area. The specific distribution position of the second sealant 14 can be set according to actual needs. For example, the second sealant 14 can enclose a plurality of closed areas, and each closed area can include one display device 11 or a plurality of display devices 11. It is worth noting that the first sealant 13 and the second sealant 14 are of various types, for example, the first sealant 13 and the second sealant 14 are both ultraviolet curing glue, but are not limited thereto.

[0045] When the display motherboard 1 is cut, the display motherboard 1 can be cut into a plurality of sub-boards first, and then each sub-board is cut to separate the display devices 11 on each sub-board. In more detail: when the motherboard includes N rows of display devices 11, the display motherboard 1 can be cut into N sub-boards first, each sub-board corresponds to a row of display devices 11, and then each sub-board is cut to cut off the cutting area around each sub-board to obtain an independent display device 11. It is worth noting that when the display motherboard 1 is cut to obtain the display device 11, the cutting area on the motherboard is completely cut off, and the corresponding first sealant 13 formed in the peripheral area of ​​the motherboard and the second sealant 14 formed in the cutting area are also completely cut off.

[0046] According to the specific structure and cutting process of the above-mentioned display motherboard 1, the display motherboard 1 provided in the embodiment of the present invention includes a first sealant 13 located in the peripheral area of ​​the display motherboard 1, and a second sealant 14 located in the cutting area around each display device 11. These two layers of sealants can provide double protection for the display devices 11 included in the display motherboard 1, that is, when the first sealant 13 is broken, the second sealant 14 can still protect the display device 11 to prevent water vapor and oxygen from corroding the functional film layer 110 in the display device 11, thereby better ensuring the production yield of the display device 11.

[0047] In addition, since the second sealant 14 is made in the cutting area of ​​the display motherboard 1, when the display motherboard 1 is subsequently cut to obtain the display device 11, the second sealant 14 located in the cutting area can be completely cut off, so the second sealant 14 will not affect the luminous efficiency of the display device 11, nor will it affect the border width of the display device 11. It can be seen that the display motherboard 1 provided by the embodiment of the present invention can prevent the corrosion of the display device 11 by water vapor and oxygen without having any impact on the display device 11, thereby better ensuring the manufacturing yield of the display device 11.

[0048] In some embodiments, Figure 3 As shown, the above-mentioned display motherboard 1 also includes: a blocking pattern 15 located in the cutting area, the blocking pattern 15 defines a sealing area in the cutting area for forming a second sealant 14, and the orthographic projection of the sealing area on the first substrate 10 does not overlap with the orthographic projection of the cutting line 16 in the cutting area on the first substrate 10.

[0049] Specifically, a blocking pattern 15 can be made in the cutting area, and a sealing area is defined in the cutting area by the blocking pattern 15, and the orthographic projection of the sealing area on the first substrate 10 does not overlap with the orthographic projection of the cutting line 16 in the cutting area on the first substrate 10, so that when the second sealant 14 is subsequently made, the second sealant 14 can be directly formed in the sealing area, so that the second sealant 14 will not cover the cutting line 16 in the cutting area. It can be seen that the blocking pattern 15 is provided in the cutting area, and the sealing area for forming the second sealant 14 is defined by the blocking pattern 15, which can prevent the second sealant 14 from being squeezed and diffused onto the cutting line 16 when the first substrate 10 and the second substrate 12 are assembled, or further expanded to the edge of the frame sealant 111 of the display device 11.

[0050] Therefore, in the display motherboard 1 provided in the above embodiment, the introduced second sealant 14 not only better ensures the production yield of the display device 11, but also avoids the second sealant 14 from affecting the subsequent cutting process, and avoids the subsequent impact on the laser sealing process (Frit Laser Sealing) of the frame sealing glue 111 (Frit glue) of the display device 11.

[0051] In some embodiments, the orthographic projection of the blocking pattern 15 on the first substrate 10 does not overlap with the orthographic projection of the cutting line 16 in the cutting area on the first substrate 10 .

[0052] Specifically, the orthographic projection of the blocking pattern 15 on the first substrate 10 and the orthographic projection of the cutting line in the cutting area on the first substrate 10 may be arranged not to overlap, so that the blocking pattern 15 will not cover the cutting line in the cutting area. Therefore, in the display motherboard 1 provided by the above embodiment, the introduced blocking pattern 15 not only better defines the flow area of ​​the second sealant 14, but also avoids the blocking pattern 15 from affecting the subsequent cutting process, and avoids the subsequent impact on the laser sealing process (Frit Laser Sealing) of the frame sealant 111 (Frit glue) of the display device 11.

[0053] The specific structures of the blocking pattern 15 provided in the above embodiments are various, and two specific structures are exemplified below.

[0054] The first structure, such as Figure 3 As shown, the barrier pattern 15 includes a first barrier-wall sub-pattern 150 and a second barrier-wall sub-pattern 151 , and a sealing area is defined between the first barrier-wall sub-pattern 150 and the second barrier-wall sub-pattern 151 .

[0055] Specifically, the above-mentioned blocking pattern 15 is arranged to include two relatively arranged first retaining wall-shaped sub-patterns 150 and second retaining wall-shaped sub-patterns 151, and a sealing area is formed between the two retaining wall-shaped sub-patterns, so that the second sealant 14 formed in the sealing area will not expand to other areas outside the sealing area during the pressing process, thereby better avoiding the second sealant 14 from affecting the subsequent cutting process, and avoiding the subsequent impact on the laser sealing process (Frit Laser Sealing) of the frame sealing glue 111 (Frit glue) of the display device 11.

[0056] The second structure, such as Figure 3 As shown, the barrier pattern 15 includes a plurality of independent spacers 153 , and a sealing area is defined between the plurality of spacers 153 . The spacers 153 are provided in the same layer and material as the spacers in the display device 11 .

[0057] Specifically, by setting a plurality of mutually independent spacers 153 as the blocking pattern 15, and forming a sealing area between the plurality of spacers 153, the plurality of spacers 153 can play a role in blocking the second sealant 14 formed in the sealing area, and limit the second sealant 14 from expanding to the cutting line 16 or the edge of the display device 11. Moreover, the plurality of spacers 153 can be further arranged to be evenly distributed, so that the distances between adjacent spacers 153 are the same, so that the second sealant 14 can be evenly expanded during the lamination process, and its sealing performance is better guaranteed.

[0058] In addition, by setting the multiple independent spacers included in the above-mentioned blocking pattern 15 in the same layer and the same material as the spacers in the display device 11, it is possible to simultaneously manufacture the spacers in the display device 11 and the spacers 153 included in the blocking pattern 15 through the same composition process, thereby avoiding the need to add an additional process for manufacturing the spacers 153 included in the blocking pattern 15, thereby simplifying the manufacturing process of the display motherboard 1.

[0059] In some embodiments, the cutting lines 16 in the cutting area include: first cutting lines 160 corresponding to the display devices 11 one by one and surrounding the corresponding display devices 11, and strip cutting lines 161 located between adjacent first cutting lines 160 and extending in a direction parallel to one side of the first cutting lines 160, and the sealing area is located between the first cutting lines 160 and the strip cutting lines 161, such as Figure 3 shown.

[0060] Specifically, when cutting the display motherboard 1, it is generally first cut into multiple sub-boards along the strip cutting line 161 (Stick Cut Line), and then cut along the first cutting line 160 (also called the cell cutting line) corresponding to each display device 11 to separate the corresponding display device 11.

[0061] It is worth noting that Figure 1 As shown, in the display motherboard 1, the display devices 11 are generally distributed in an array, and the shape of the display devices 11 is generally rectangular, and the corresponding first cutting lines 160 surrounding the display devices 11 are enclosed in a rectangle. There are multiple distribution modes and extension directions of the strip cutting lines. For example, the strip cutting lines 161 can be arranged between adjacent first cutting lines 160 and extend in a direction parallel to one of the sides of the first cutting lines 160. In more detail, two sides of the first cutting lines 160 can be arranged to be parallel to the horizontal direction, and the other two sides can be arranged to be parallel to the vertical direction. At the same time, the strip cutting lines 161 can be arranged to extend in the horizontal direction, and the number of the strip cutting lines 161 can be equal to the number of rows of the display devices 11 on the display motherboard 1 minus 1; or, the strip cutting lines 161 can be arranged to extend in the vertical direction, and the number of the strip cutting lines 161 can be equal to the number of columns of the display devices 11 on the display motherboard 1 minus 1.

[0062] like Figure 3 As shown, when the cutting area includes both the first cutting line 160 and the strip cutting line 161, the sealing area can be set between the first cutting line 160 and the strip cutting line 161, so that the second sealant 14 formed in the sealing area will not be squeezed and diffused onto the cutting line or the edge of the frame sealant 111 of the display device 11 during the lamination process, thereby avoiding the second sealant 14 from affecting the subsequent cutting process, and avoiding the subsequent impact on the laser sealing process of the frame sealant 111 of the display device 11.

[0063] The width of the cutting area in the above-mentioned display motherboard 1 and the width of the second sealant 14 formed in the cutting area can be set according to actual needs. For example, the width of the cutting area along the direction perpendicular to the cutting line can be set to be greater than or equal to 7.2 mm, and the width of the second sealant 14 along the direction perpendicular to the cutting line can be set to be less than or equal to 2.6 mm.

[0064] Specifically, the width of the cutting area along the direction perpendicular to the cutting line is set to be greater than or equal to 7.2 mm, and the width of the second sealant 14 along the direction perpendicular to the cutting line is set to be less than or equal to 2.6 mm. This not only ensures the good sealing performance of the second sealant 14, but also leaves a sufficiently wide blank area in the cutting area in addition to the sealing area where the second sealant 14 is set, so that when the display motherboard 1 is cut, the cutting yield can be better guaranteed.

[0065] In addition, preferably, the width of the cutting area along the direction perpendicular to the cutting line can be set to 7.2 mm, and the width of the second sealant 14 along the direction perpendicular to the cutting line can be set to 2.6 mm. This not only ensures good sealing performance of the second sealant 14, but also effectively improves the utilization rate of the display motherboard 1.

[0066] It is worth noting that when making the second sealant 14, the second sealant 14 with a width of 0.45 mm in the direction perpendicular to the cutting line can be first applied to the sealing area, and then during the pressing process, the second sealant 14 expands, and finally a second sealant 14 with a width of 2.6 mm in the direction perpendicular to the cutting line can be formed.

[0067] The embodiment of the present invention further provides a method for manufacturing a display motherboard, which is used to manufacture the display motherboard 1 provided in the above embodiment. The manufacturing method comprises:

[0068] A first substrate 10 and a second substrate 12 are provided, wherein a plurality of mutually independent display devices 11 are formed on the first substrate 10;

[0069] A first sealant 13 is formed in the peripheral area of ​​the first substrate 10, and a second sealant 14 is formed in the cutting area around the display device 11, and the second sealant 14 surrounds at least one display device 11;

[0070] The first substrate 10 and the second substrate 12 are assembled to seal all the display devices 11 with the first sealant 13 and to seal at least one of the enclosed display devices 11 with the second sealant 14 .

[0071] Specifically, a plurality of mutually independent display devices 11 are manufactured on the first substrate 10 by the existing process, and each display device 11 includes a functional film layer 110 and a sealing glue 111 surrounding the functional film layer 110. The plurality of display devices 11 may be distributed in a matrix, and a cutting area may be formed between adjacent display devices 11. When manufacturing the display motherboard 1, the second sealing glue 14 may be manufactured in the cutting area while manufacturing the first sealing glue 13 located in the peripheral area of ​​the display motherboard 1. The specific distribution position of the second sealing glue 14 may be set according to actual needs. For example, the second sealing glue 14 may enclose a plurality of closed areas, and each closed area may include one display device 11 or a plurality of display devices 11. Then, the first substrate 10 and the second substrate 12 are assembled to achieve the sealing of all the display devices 11 by the first sealing glue 13 and the sealing of at least one surrounded display device 11 by the second sealing glue 14, and the manufacture of the display motherboard 1 is completed.

[0072] When cutting the display motherboard 1 manufactured by the above manufacturing method, the display motherboard 1 can be cut into a plurality of sub-boards first, and then each sub-board can be cut to separate the display devices 11 on each sub-board. In more detail: when the motherboard includes N rows of display devices 11, the display motherboard 1 can be cut into N sub-boards first, each sub-board corresponding to a row of display devices 11, and then each sub-board can be cut to cut off the cutting area around each sub-board to obtain an independent display device 11. It is worth noting that when the display motherboard 1 is cut to obtain the display device 11, the cutting area on the display motherboard 1 is completely cut off, and the corresponding first sealant 13 formed in the peripheral area of ​​the motherboard and the second sealant 14 formed in the cutting area are also completely cut off.

[0073] The display motherboard 1 manufactured by the display motherboard manufacturing method provided by the embodiment of the present invention includes a first sealant 13 located in the peripheral area of ​​the display motherboard 1, and a second sealant 14 located in the cutting area around each display device 11. The two layers of sealant can provide double protection for the display devices 11 included in the display motherboard 1, that is, when the first sealant 13 is broken, the second sealant 14 can still protect the display devices 11 to prevent water vapor and oxygen from corroding the functional film layer 110 in the display device 11, thereby better ensuring the manufacturing yield of the display device 11.

[0074] In addition, since the second sealant 14 is made in the cutting area of ​​the display motherboard 1, when the display motherboard 1 is subsequently cut to obtain the display device 11, the second sealant 14 located in the cutting area can be completely cut off, so the second sealant 14 will not affect the luminous efficiency of the display device 11, nor will it affect the border width of the display device 11. It can be seen that the display motherboard 1 manufactured by the manufacturing method provided by the embodiment of the present invention can avoid the corrosion of the display device 11 by water vapor and oxygen without any impact on the display device 11, and better ensure the manufacturing yield of the display device 11.

[0075] Furthermore, when the display motherboard 1 to be manufactured further includes a blocking pattern 15, before forming the second sealant 14, the manufacturing method provided in the above embodiment further includes:

[0076] A blocking pattern 15 is formed in the cutting area, the blocking pattern 15 defines a sealing area in the cutting area for forming the second sealant 14, and the orthographic projection of the sealing area on the first substrate 10 does not overlap with the orthographic projection of the cutting line in the cutting area on the first substrate 10;

[0077] The above-mentioned step of forming the second sealant 14 in the cutting area around the display device 11 specifically includes:

[0078] A second sealant 14 is formed in the sealing area.

[0079] Specifically, a blocking pattern 15 can be made in the cutting area, and a sealing area is defined in the cutting area by the blocking pattern 15, so that the orthographic projection of the sealing area on the first substrate 10 does not overlap with the orthographic projection of the cutting line in the cutting area on the first substrate 10, so that when the second sealant 14 is subsequently made, the second sealant 14 can be directly formed in the sealing area, so that the second sealant 14 will not cover the cutting line in the cutting area. It can be seen that in the manufacturing method provided by the above embodiment, a blocking pattern 15 is set in the cutting area, and a sealing area for forming the second sealant 14 is defined by the blocking pattern 15, which can prevent the second sealant 14 from being squeezed and diffused to the cutting line when the first substrate 10 and the second substrate 12 are assembled, or further expanded to the edge of the frame sealant 111 of the display device 11.

[0080] Therefore, in the display motherboard 1 manufactured by the manufacturing method provided by the above embodiment, the introduction of the second sealant 14 not only better ensures the manufacturing yield of the display device 11, but also avoids the second sealant 14 from affecting the subsequent cutting process, and avoids the subsequent impact on the laser sealing process of the frame sealant 111 of the display device 11.

[0081] Furthermore, when making the above-mentioned blocking pattern 15, the orthographic projection of the blocking pattern 15 on the first substrate 10 and the orthographic projection of the cutting line in the cutting area on the first substrate 10 can be made not to overlap, so that the blocking pattern 15 will not cover the cutting line in the cutting area, thereby achieving that the introduced blocking pattern 15 not only better defines the flow area of ​​the second sealant 14, but also avoids the blocking pattern 15 from affecting the subsequent cutting process, and avoids the subsequent impact on the laser sealing process of the frame sealant 111 of the display device 11.

[0082] Furthermore, the specific structure of the produced blocking pattern 15 is varied. For example, the blocking pattern 15 can include a first blocking wall-like sub-pattern 150 and a second blocking wall-like sub-pattern 151, and a sealing area is defined between the first blocking wall-like sub-pattern 150 and the second blocking wall-like sub-pattern 151; or, the blocking pattern 15 can include a plurality of independent spacers 153, and a sealing area is defined between the plurality of spacers 153, and the spacers 153 are arranged in the same layer and material as the spacers in the display device 11.

[0083] It is worth noting that when the barrier pattern 15 is made to include a plurality of mutually independent spacers, the plurality of spacers may be further arranged to be evenly distributed.

[0084] In some embodiments, the cutting lines in the cutting area of ​​the display motherboard 1 manufactured using the above-mentioned manufacturing method include: a first cutting line 160 corresponding one-to-one to the display device 11 and surrounding the corresponding display device 11, and a strip cutting line 161 located between adjacent first cutting lines 160 and extending in a direction parallel to an edge of the first cutting line 160, and the sealing area is located between the first cutting line 160 and the strip cutting line 161.

[0085] In some embodiments, the width of the cutting area in the display motherboard 1 manufactured by the above-mentioned manufacturing method and the width of the second sealant 14 formed in the cutting area can be set according to actual needs. For example, the width of the cutting area along the direction perpendicular to the cutting line can be set to be greater than or equal to 7.2 mm, and the width of the second sealant 14 along the direction perpendicular to the cutting line can be set to be less than or equal to 2.6 mm.

[0086] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should be understood by people with ordinary skills in the field to which the present invention belongs. "First", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0087] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0088] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0089] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A display motherboard, comprising: A first substrate and a second substrate are arranged in a cell, and a plurality of independent display devices are located between the first substrate and the second substrate, and in the peripheral area of ​​the display motherboard, the first substrate and the second substrate are sealed by a first sealant, wherein the display motherboard further comprises: a cutting area located at the periphery of the display device; A second sealant is provided in the cutting area, the second sealant surrounds at least one of the display devices and is used to seal the at least one of the display devices; when the display motherboard is cut to obtain the display device, the cutting area on the motherboard is completely cut off, and the second sealant formed in the cutting area is completely cut off; The display device comprises a functional film layer and a frame sealing adhesive surrounding the functional film layer.

2. The display motherboard according to claim 1, characterized in that: The display motherboard also includes: A blocking pattern is located in the cutting area, wherein the blocking pattern defines a sealing area in the cutting area for forming the second sealant, and an orthographic projection of the sealing area on the first substrate does not overlap with an orthographic projection of a cutting line in the cutting area on the first substrate.

3. The display motherboard according to claim 2, characterized in that: The orthographic projection of the blocking pattern on the first substrate does not overlap with the orthographic projection of the cutting line in the cutting area on the first substrate.

4. The display motherboard according to claim 2 or 3, characterized in that: The blocking pattern includes: a first blocking wall-shaped sub-pattern and a second blocking wall-shaped sub-pattern, and the sealing area is defined between the first blocking wall-shaped sub-pattern and the second blocking wall-shaped sub-pattern.

5. The display motherboard according to claim 2 or 3, characterized in that: The blocking pattern includes a plurality of mutually independent spacers, the sealing area is defined between the plurality of spacers, and the spacers are provided in the same layer and material as the spacers in the display device.

6. The display motherboard according to claim 5, characterized in that: The plurality of spacers are evenly distributed.

7. The display motherboard according to claim 2 or 3, characterized in that: The cutting lines in the cutting area include: first cutting lines corresponding to the display devices one by one and surrounding the corresponding display devices, and strip cutting lines located between adjacent first cutting lines and extending in a direction parallel to an edge of the first cutting lines, and the sealing area is located between the first cutting lines and the strip cutting lines.

8. The display motherboard according to claim 2 or 3, characterized in that: The width of the cutting area along a direction perpendicular to the cutting line is greater than or equal to 7.2 mm, and the width of the second sealant along a direction perpendicular to the cutting line is less than or equal to 2.6 mm.

9. A method for manufacturing a display motherboard, characterized in that: Used to manufacture the display motherboard according to any one of claims 1 to 8, the manufacturing method comprising: Providing a first substrate and a second substrate, wherein a plurality of mutually independent display devices are formed on the first substrate, and the display devices include a functional film layer and a frame sealant surrounding the functional film layer; A first sealant is formed in the peripheral area of ​​the first substrate, and a second sealant is formed in the cutting area around the display device, wherein the second sealant surrounds at least one of the display devices; when the display motherboard is cut to obtain the display device, the cutting area on the motherboard is completely cut off, and the second sealant formed in the cutting area is completely cut off; The first substrate and the second substrate are assembled into a box, so that the first sealant seals all the display devices, and the second sealant seals at least one of the enclosed display devices.

10. The method for manufacturing a display motherboard according to claim 9, characterized in that: When the display motherboard further includes a blocking pattern, before forming the second sealant, the manufacturing method further includes: forming a blocking pattern in the cutting area, wherein the blocking pattern defines a sealing area in the cutting area for forming the second sealant, and an orthographic projection of the sealing area on the first substrate does not overlap with an orthographic projection of a cutting line in the cutting area on the first substrate; The step of forming a second sealant in the cutting area around the display device specifically includes: The second sealant is formed in the sealing area.

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