Manufacturing method of optical fingerprint module, optical fingerprint module and electronic device

Abstract

The present invention discloses a method for manufacturing an optical fingerprint module, comprising the following steps: providing a fingerprint recognition component, the fingerprint recognition component comprising a packaging layer, a fingerprint chip arranged in the packaging layer, and a light source arranged on the side of the packaging layer; providing an adhesive film and covering the fingerprint recognition component, the adhesive film having an opening formed at a corresponding position of the light source; providing a cover plate and covering the adhesive film to form a packaging semi-finished product; and baking the packaging semi-finished product so that the adhesive film fills the opening and bonds the fingerprint recognition component to the cover plate. The present invention avoids the occurrence of concave or convex spots on the adhesive film at the light source during the manufacture of the optical fingerprint module due to the inconsistency between the thermal expansion coefficient of the packaging layer and the thermal expansion coefficient of the light source, thereby affecting the appearance of the optical fingerprint module by opening holes in the adhesive film. The present invention also discloses an optical fingerprint module and an electronic device.

Description

Technical Field

[0001] The present invention relates to the field of biometrics, and in particular to a method for manufacturing an optical fingerprint module, an optical fingerprint module and an electronic device. Background Art

[0002] The optical fingerprint module and the cover plate are generally assembled using adhesive or other filling materials. However, since the thermal expansion coefficient of the light source on the fingerprint module is inconsistent with the thermal expansion coefficient of the material used to encapsulate the fingerprint module, concave or convex spots will appear at the position of the light source when encapsulating the fingerprint module and the cover plate. Summary of the invention

[0003] The invention provides a manufacturing method of an optical fingerprint module, an optical fingerprint module and an electronic device.

[0004] The method for manufacturing an optical fingerprint module according to an embodiment of the present invention comprises the following steps:

[0005] A fingerprint recognition component is provided, the fingerprint recognition component comprising a packaging layer, a fingerprint chip arranged in the packaging layer, and a light source arranged on a side of the packaging layer;

[0006] Providing an adhesive film and covering the fingerprint recognition component, wherein the adhesive film is formed with openings at positions corresponding to the light source;

[0007] Providing a cover plate and covering the cover plate on the adhesive film to form a semi-finished package product; and

[0008] The packaged semi-finished product is baked so that the adhesive film fills the opening and bonds the fingerprint recognition component and the cover plate.

[0009] In some embodiments, the material of the adhesive film includes any one of acrylic adhesive, epoxy resin adhesive and silicone adhesive.

[0010] In certain embodiments, the opening comprises a blind hole or a through hole.

[0011] In some embodiments, the orthographic projection of the opening on the fingerprint recognition component falls within the light source or covers the light source.

[0012] In some embodiments, the material of the cover plate includes any one of polymethyl methacrylate, glass, ceramic, sapphire and quartz.

[0013] In some embodiments, the step of baking the semi-finished package product so that the adhesive film fills the opening and bonds the fingerprint recognition component to the cover plate includes:

[0014] Using a predetermined pressure to press the cover plate against the adhesive film and the fingerprint recognition component; and

[0015] The packaged semi-finished product is placed in an environment within a predetermined temperature range and baked for a predetermined time.

[0016] In certain embodiments, the predetermined pressure is 1-10 kgf.

[0017] In certain embodiments, the predetermined temperature is 80-150 degrees Celsius.

[0018] In certain embodiments, the predetermined time is 5-90 minutes.

[0019] The optical fingerprint module of the embodiment of the present invention comprises:

[0020] A fingerprint recognition component, the fingerprint recognition component comprising a packaging layer, a fingerprint chip arranged in the packaging layer, and a light source arranged on a side of the packaging layer;

[0021] An adhesive film covering the fingerprint recognition component; and

[0022] A cover plate covering the adhesive film;

[0023] Before forming the optical fingerprint module, the adhesive film is formed with an opening at a position corresponding to the light source;

[0024] When forming the optical fingerprint module, the adhesive film fills the opening and bonds the fingerprint recognition component and the cover plate.

[0025] In certain embodiments, the opening comprises a blind hole or a through hole.

[0026] In some embodiments, the orthographic projection of the opening on the fingerprint chip falls within the light source or covers the light source.

[0027] An electronic device according to an embodiment of the present invention includes:

[0028] ontology; and

[0029] The optical fingerprint module described in any one of the above embodiments is arranged on a surface of the body.

[0030] The electronic device, optical fingerprint module and method for manufacturing an optical fingerprint module of the embodiments of the present invention open holes in the adhesive film to avoid the occurrence of concave or convex spots on the adhesive film at the light source during the manufacturing of the optical fingerprint module due to the inconsistency between the thermal expansion coefficient of the packaging layer and the thermal expansion coefficient of the light source, thereby affecting the appearance of the optical fingerprint module.

[0031] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0033] Figure 1 is a schematic flow chart of a method for manufacturing an optical fingerprint module according to certain embodiments of the present invention;

[0034] Figure 2 It is a structural schematic diagram of a method for manufacturing an optical fingerprint module according to certain embodiments of the present invention;

[0035] Figure 3 is a cross-sectional view of an optical fingerprint module according to some embodiments of the present invention;

[0036] Figure 4 is a schematic diagram of an exploded view of an optical fingerprint module according to some embodiments of the present invention;

[0037] Figure 5 is a schematic flow chart of a method for manufacturing an optical fingerprint module according to certain embodiments of the present invention;

[0038] Figure 6 is a schematic plan view of an electronic device according to some embodiments of the present invention.

[0039] Description of main component symbols:

[0040] The electronic device 200 , the body 202 , the optical fingerprint module 100 , the fingerprint recognition component 10 , the packaging layer 12 , the fingerprint chip 14 , the light source 16 , the sensor 18 , the adhesive film 20 , the opening 22 , the cover plate 30 , and the packaging semi-finished product 40 . DETAILED DESCRIPTION

[0041] The embodiments of the present invention are further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the accompanying drawings represent the same or similar elements or elements with the same or similar functions.

[0042] In addition, the embodiments of the present invention described below in conjunction with the drawings are exemplary and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0043] See also Figure 1-4 The manufacturing method of the optical fingerprint module 100 according to the embodiment of the present invention comprises the following steps:

[0044] S1, providing a fingerprint recognition component 10, the fingerprint recognition component 10 comprising a packaging layer 12, a fingerprint chip 14 disposed in the packaging layer 12, and a light source 16 disposed on a side of the packaging layer;

[0045] S2, providing an adhesive film 20 and covering the fingerprint recognition component 10, wherein the adhesive film 20 is formed with an opening 22 at a position corresponding to the light source 16;

[0046] S3, providing a cover 30 and covering the adhesive film 20 to form a package semi-finished product 40; and

[0047] S4 , baking the semi-finished packaged product 40 so that the adhesive film 20 fills the opening 22 and bonds the fingerprint recognition component 10 and the cover plate 30 .

[0048] Specifically, the material of the encapsulation layer 12 includes but is not limited to epoxy molding compound (EMC). The light source 16 may be but is not limited to a light emitting diode (LED). In some embodiments, the thermal expansion coefficient of the encapsulation layer 12 is inconsistent with the thermal expansion coefficient of the light source 16.

[0049] The manufacturing method of the optical fingerprint module 100 of the embodiment of the present invention opens a hole 22 on the adhesive film 20 to avoid the appearance of concave or convex points on the adhesive film 20 at the light source 16 when manufacturing the optical fingerprint module 100 due to the inconsistency between the thermal expansion coefficient of the packaging layer 12 and the thermal expansion coefficient of the light source 16, thereby affecting the appearance of the optical fingerprint module 100.

[0050] See also Figure 3 and Figure 4 In some embodiments, the adhesive film 20 is a hot-pressed adhesive film, and the adhesive film 20 includes but is not limited to any one of acrylic adhesive, epoxy resin adhesive and silica gel.

[0051] In this way, the adhesive film 20 has a faster curing speed, a lower shrinkage rate and a lower viscosity, so that the adhesive film 20 can quickly fill the opening 22 and quickly cure to bond the fingerprint recognition component 10 and the cover plate 30 .

[0052] See also Figure 3 and Figure 4 In some embodiments, the opening 22 includes a blind hole or a through hole. Specifically, whether the opening 22 is a blind hole or a through hole is related to the material of the adhesive film 20, and the predetermined pressure, predetermined temperature, and predetermined time for baking the semi-finished packaged product 40. If the material viscosity of the adhesive film 20 is low, the thickness is small, the predetermined pressure is large, the predetermined temperature is high, or the predetermined time is long, then the adhesive film 20 can choose to open a through hole; if the material viscosity of the adhesive film 20 is high, the thickness is large, the predetermined pressure is small, the predetermined temperature is low, or the predetermined time is short, then the adhesive film 20 can choose to open a blind hole. In this way, it can be ensured that the adhesive film 20 can fill the opening 22 when baking the semi-finished packaged product 40.

[0053] See also Figure 3 and Figure 4 In some embodiments, the orthographic projection of the opening 22 on the fingerprint recognition component 10 falls within the light source 16 or covers the light source 16. That is, the size of the opening 22 can be smaller or larger than the size of the light source 16. Specifically, the size relationship between the size of the opening 22 and the size of the light source 16 is related to the material of the adhesive film 20, and the predetermined pressure, predetermined temperature, and predetermined time for baking the semi-finished packaged product 40. If the material viscosity of the adhesive film 20 is low, the thickness is small, the predetermined pressure is large, the predetermined temperature is high, or the predetermined time is long, the size of the opening 22 can be larger than the size of the light source 16; if the material viscosity of the adhesive film 20 is high, the thickness is large, the predetermined pressure is small, the predetermined temperature is low, or the predetermined time is short, the size of the opening 22 can be smaller than the size of the light source 16. In this way, it can be ensured that the adhesive film 20 can fill the opening 22 when baking the semi-finished packaged product 40.

[0054] See also Figure 3 and Figure 4 In some embodiments, the material of the cover plate 30 includes but is not limited to any one of polymethylmethacrylate (PMMA), glass, ceramic, sapphire and quartz. In this way, the cover plate 30 has the characteristics of being pressure-resistant, scratch-resistant and light-transmissive. By arranging the cover plate 30 on the fingerprint recognition component 10, the fingerprint recognition component 10 does not directly contact the user's finger, thereby making the fingerprint module 100 durable. The cross-sectional shape of the cover plate 30 can be a sheet structure of a circular, elliptical, triangular, pentagonal, hexagonal, etc.

[0055] See also Figure 2 and Figure 5 In some embodiments, the step of baking the semi-finished package 40 so that the adhesive film 20 fills the opening 22 and bonds the fingerprint recognition component 10 and the cover plate 30 (ie, step S4) includes:

[0056] S41, pressing the cover plate 30 against the adhesive film 20 and the fingerprint recognition component 10 with a predetermined pressure; and

[0057] S42, placing the semi-finished packaged product 40 in an environment within a predetermined temperature range and baking it for a predetermined time.

[0058] When baking the semi-finished package product 40, the predetermined pressure is set so that the adhesive film 20 can more firmly bond the fingerprint recognition component 10 and the cover plate 30. The predetermined pressure, predetermined temperature and predetermined time for baking the semi-finished package product 40 are related to the material and thickness of the adhesive film 20; if the material of the adhesive film 20 is low or the thickness is small, the predetermined pressure can be set to be lower or the predetermined temperature can be set to be lower or the predetermined time can be set to be shorter. Of course, the predetermined pressure, predetermined temperature and predetermined time are all selected under the conditions of satisfying the manufacturing conditions.

[0059] In certain embodiments, the predetermined pressure is 1-10 kilograms force.

[0060] When the predetermined pressure is less than 1 kgf, the adhesive film 20 cannot bond the cover plate 10 and the fingerprint chip 20 well, and the adhesive film 20 cannot fill the opening 22 well, so that the optical fingerprint module 100 has concave or convex points at the opening 22; when the predetermined pressure is greater than 10 kgf, part of the adhesive film 20 between the fingerprint recognition component 10 and the cover plate 30 will be pressed out along the edges of the fingerprint recognition component 10 and the cover plate 30, resulting in a reduction in the adhesive film 20 between the fingerprint recognition component 10 and the cover plate 30, resulting in a decrease in the bonding strength.

[0061] In certain embodiments, the predetermined temperature is 80-150 degrees Celsius.

[0062] When the predetermined temperature is less than 80 degrees Celsius, the adhesive film 20 cannot be melted well, resulting in a high viscosity of the adhesive film 20, so that the adhesive film 20 cannot fill the opening 22 well, and the optical fingerprint module 100 has concave or convex points at the opening 22. When the predetermined temperature is greater than 150 degrees Celsius, it is easy to cause the viscosity of the adhesive film 20 to be low, and then part of the adhesive film 20 will be pressed out along the edge of the fingerprint recognition component 10 and the cover plate 30, resulting in a reduction of the adhesive film 20 between the fingerprint recognition component 10 and the cover plate 30, resulting in a decrease in the bonding strength; of course, if the predetermined temperature is high, when the semi-finished package 40 is baked, the deformation of the encapsulation layer 12 and the light source 16 is greatly different. After the baking of the semi-finished package 40 is completed, the deformation and shrinkage of the encapsulation layer 12 and the light source 16 will cause the optical fingerprint module 100 to have concave or convex points at the light source 16 and affect the appearance of the optical fingerprint module 100.

[0063] In certain embodiments, the predetermined time is 5-90 minutes.

[0064] When the scheduled time is less than 5 minutes, the adhesive film 20 cannot fill the opening 22 well and causes the optical fingerprint module 100 to have concave or convex points at the opening 22; if the scheduled time is within 90 minutes, the adhesive film 20 can fill the opening 22 well. If the scheduled time exceeds 90 minutes, there is an obvious waste of resources.

[0065] See also Figure 3 and Figure 4The optical fingerprint module 100 of the embodiment of the present invention includes a fingerprint recognition component 10, a film 20 covering the fingerprint recognition component 10, and a cover plate 30 covering the film 20. The fingerprint recognition component 10 includes a packaging layer 12, a fingerprint chip 14 disposed in the packaging layer 12, and a light source 16 disposed on the side of the packaging layer 12. Before forming the optical fingerprint module 100, the film 20 is formed with an opening 22 at a position corresponding to the light source 16; when forming the optical fingerprint module 100, the film 20 fills the opening 22 and bonds the fingerprint recognition component 10 and the cover plate 30.

[0066] See also Figure 3 and Figure 6 In the optical fingerprint module 100 of the embodiment of the present invention, before forming the optical fingerprint module 100, a hole 22 is opened on the adhesive film 20 to avoid the appearance of concave or convex points on the adhesive film 20 at the light source 16 after the optical fingerprint module 100 is formed due to the inconsistency between the thermal expansion coefficient of the packaging layer 12 and the thermal expansion coefficient of the light source 16, thereby affecting the appearance of the optical fingerprint module 100.

[0067] The electronic device 200 according to the embodiment of the present invention includes a body 202 and an optical fingerprint module 100 . The optical fingerprint module 100 is disposed on a surface of the body 202 .

[0068] See also Figure 3 Specifically, the fingerprint recognition component 10 further includes a sensor 18 disposed on the surface of the fingerprint recognition component 10 close to the cover plate 30, and the sensor 18 is used to receive light reflected from the finger to the optical fingerprint module 100. By disposing the optical fingerprint module 100 on the surface of the body 202, the optical fingerprint module 100 can receive the light reflected by the finger and identify the fingerprint on the finger. In some embodiments, the sensor 18 includes at least one sensor element, and the plurality of sensor elements can be but are not limited to being distributed in a strip-like or array-like manner.

[0069] In some embodiments, the electronic device 200 further includes a circuit board (not shown) and a flexible circuit board (not shown) disposed in the body 202, the flexible circuit board is electrically connected to the circuit board, and the optical fingerprint module 100 is disposed on the flexible circuit board. Specifically, the optical fingerprint module 100 is bonded to the flexible printed circuit (FPC) by a conductive adhesive (not shown). In this way, the optical fingerprint module 100 can be electrically connected to the circuit board in the body 202.

[0070] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0071] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0072] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A method for manufacturing an optical fingerprint module, characterized in that: The following steps are involved: A fingerprint recognition component is provided, the fingerprint recognition component comprising a packaging layer, a fingerprint chip arranged in the packaging layer, and a light source arranged on a side of the packaging layer; Providing an adhesive film and covering the fingerprint recognition component, wherein the adhesive film is formed with openings at positions corresponding to the light source; Providing a cover plate and covering it on the adhesive film to form a semi-finished package product; and The packaged semi-finished product is baked so that the adhesive film fills the opening and bonds the fingerprint recognition component and the cover plate.

2. The method for manufacturing an optical fingerprint module according to claim 1, wherein: The material of the adhesive film includes any one of acrylic adhesive, epoxy resin adhesive and silicone adhesive.

3. The method for manufacturing an optical fingerprint module according to claim 1, wherein: The opening includes a blind hole or a through hole.

4. The method for manufacturing an optical fingerprint module according to claim 3, characterized in that: The orthographic projection of the opening on the fingerprint recognition component falls within the light source or covers the light source.

5. The method for manufacturing an optical fingerprint module according to claim 1, wherein: The material of the cover plate includes any one of polymethyl methacrylate, glass, ceramic, sapphire and quartz.

6. The method for manufacturing an optical fingerprint module according to claim 1, wherein: The step of baking the semi-finished package product so that the adhesive film fills the opening and bonds the fingerprint recognition component to the cover plate comprises: Using a predetermined pressure to press the cover plate against the adhesive film and the fingerprint recognition component; and The packaged semi-finished product is placed in an environment within a predetermined temperature range and baked for a predetermined time.

7. The method for manufacturing an optical fingerprint module according to claim 6, wherein: The predetermined pressure is 1-10 kgf.

8. The method for manufacturing an optical fingerprint module according to claim 6, wherein: The predetermined temperature is 80-150 degrees Celsius.

9. The method for manufacturing an optical fingerprint module according to claim 6, wherein: The predetermined time is 5-90 minutes.

10. An optical fingerprint module, characterized in that: include: A fingerprint recognition component, the fingerprint recognition component comprising a packaging layer, a fingerprint chip arranged in the packaging layer, and a light source arranged on a side of the packaging layer; An adhesive film covering the fingerprint recognition component; and A cover plate covering the adhesive film; The fingerprint recognition component further includes a sensor disposed on a surface of the fingerprint recognition component close to the cover plate, the sensor being used to receive light reflected from the finger to the optical fingerprint module; Before forming the optical fingerprint module, the adhesive film is formed with an opening at a position corresponding to the light source; When forming the optical fingerprint module, the adhesive film fills the opening and bonds the fingerprint recognition component and the cover plate.

11. The optical fingerprint module according to claim 10, characterized in that: The opening includes a blind hole or a through hole.

12. The optical fingerprint module according to claim 11, characterized in that: The orthographic projection of the opening on the fingerprint chip falls within the light source or covers the light source.

13. An electronic device, characterized in that: include: ontology; and The optical fingerprint module according to any one of claims 10 to 12, wherein the optical fingerprint module is arranged on a surface of the body.

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