CPU socket contacts for improved bandwidth throughput

Abstract

A CPU socket contact having a CPU socket contact body that improves bandwidth throughput facilitates high-speed data transmission through a CPU socket. The CPU socket contact body partially depends from the CPU socket contact and may include a cavity. The CPU socket contact body includes a capacitive impedance that substantially cancels the inductive impedance of the CPU socket contact. This cancellation of the inductive impedance causes the CPU socket contact to operate like an impedance-matched coaxial transmission line, enabling better bandwidth throughput than a non-impedance-matched transmission line.

Description

Technical Field

[0001] The present disclosure relates to systems and methods for improving bandwidth over electrical component connections. Background Art

[0002] Next-generation motherboard architectures will support faster speeds than some motherboard components currently support. For example, the fifth-generation "PCI-Express" architecture will support differential signaling speeds of up to 32 gigabits per second, resulting in 128 gigabits per second in a full-duplex networking configuration. Regardless of the bandwidth potential of certain motherboard components and next-generation central processing units ("CPUs"), the socket between the CPU and the motherboard is a bottleneck in current CPU socket designs. In particular, the current CPU socket contacts are the bandwidth bottleneck between the motherboard and the CPU because they have impedance characteristics that are not well designed for higher frequency operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Features and advantages of various embodiments of the claimed subject matter will become apparent as the following detailed description proceeds, and when reference is made to the accompanying drawings, in which like numerals designate like parts, and in which:

[0004] Figure 1 is a schematic diagram depicting an illustrative CPU socket including a CPU socket contact for improving bandwidth throughput according to at least one embodiment described herein;

[0005] Figure 2A 、 2B 2C and 2D are schematic diagrams depicting some illustrative CPU socket contacts with limited bandwidth and some illustrative CPU socket contacts for improving bandwidth throughput in a CPU socket according to at least one embodiment described herein;

[0006] Figure 3 is a schematic diagram depicting an illustrative configuration of a first insulating CPU socket contact coupled to a second insulating CPU socket contact according to at least one embodiment described herein; and

[0007] Figure 4 is a high-level logical flow diagram of an illustrative method of manufacturing a CPU socket contact according to at least one embodiment described herein.

[0008] While the following detailed description will be made with reference to illustrative embodiments, many alternatives, modifications, and variations therein will be apparent to those skilled in the art. DETAILED DESCRIPTION

[0009] According to at least one embodiment described herein, high-speed data transmission through a central processing unit ("CPU") socket is facilitated by utilizing a CPU socket contact having a CPU socket contact body that improves bandwidth throughput. The CPU socket contact body is partially suspended from the CPU socket contact and includes a cavity. The CPU socket contact body can induce a capacitive impedance that substantially cancels the inductive impedance of the CPU socket contact body. Cancelling the inductive impedance can cause the CPU socket contact to operate like an impedance-matched coaxial transmission line, which can achieve better bandwidth throughput than a non-impedance-matched transmission line. Advantageously, by utilizing the capacitive impedance to cancel the inductive impedance of the CPU socket contact, the CPU socket contact can exhibit less standing wave reflection loss and, therefore, can provide improved high-speed data throughput.

[0010] The CPU socket contact can be a stamped metal contact. The stamped metal contact can include a CPU socket contact body having metal features that create capacitive interaction with surrounding CPU socket contact bodies (e.g., ground pins). This capacitive interaction with the surrounding CPU socket contact bodies can reduce impedance mismatch and losses associated with contact designs and can push the resonant frequency of the CPU socket contact to a higher band, which can support a wider frequency spectrum and higher data rates. Advantageously, the disclosed CPU socket contact can be manufactured using existing manufacturing infrastructure and distribution channels.

[0011] A CPU socket contact is provided. The CPU socket contact may include: a solder ball base configured to couple the CPU socket contact to a motherboard; a contact tip configured to receive contact from a landing pad of a CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; a spine coupled between the solder ball base and the spring arm; and a CPU socket contact body coupled to the spine and suspended between the spring arm and the solder ball base. The solder ball base, contact tip, spring arm, spine, and CPU socket contact body may be formed from a single piece of metal.

[0012] A CPU socket is provided. The CPU socket may include a socket body. The socket body may include: a first side configured to mate adjacent to a motherboard; and a second side configured to carry a CPU. The CPU socket may include a CPU socket contact, which is one of a plurality of CPU socket contacts coupled to the socket body and extending between the first and second sides to electrically couple the CPU to the motherboard. The CPU socket contact may include: a solder ball base configured to couple the CPU socket contact to the motherboard; a contact tip configured to receive contact from a landing pad of the CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; a stem coupled between the solder ball base and the spring arm; and a CPU socket contact body coupled to the stem and suspended between the spring arm and the solder ball base. The solder ball base, contact tip, spring arm, stem, and CPU socket contact body may be formed from a single piece of metal.

[0013] A CPU socket is provided. The CPU socket may include a socket body. The socket body may include: a first side configured to mate adjacent to a motherboard; and a second side configured to carry a CPU. The CPU socket may include a CPU socket contact, which is one of a plurality of CPU socket contacts coupled to the socket body and extending between the first and second sides to electrically couple the CPU to the motherboard. The CPU socket contact may include: a solder ball base configured to couple the CPU socket contact to the motherboard; a contact tip configured to receive contact from a landing pad of the CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; a backbone coupled between the solder ball base and the spring arm; and a CPU socket contact body member for providing capacitive impedance to substantially offset the inductive impedance of the CPU socket contact.

[0014] A method for manufacturing a CPU socket contact. The method may include forming a solder ball base configured to couple a CPU socket contact to a CPU socket; forming a contact tip configured to receive contact from a landing pad of a CPU; forming a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; forming a stem coupled between the solder ball base and the spring arm; and forming a CPU socket contact body coupled to the stem and suspended between the spring arm and the solder ball base. The solder ball base, contact tip, spring arm, stem, and CPU socket contact body may be formed from a single piece of metal.

[0015] As used herein, the term motherboard refers to a computing device (eg, personal computer, server, tablet, smartphone, graphics card, etc.) motherboard that is the interface between the CPU and one or more electronic components or interface cards.

[0016] Figure 1 An illustrative central processing unit ("CPU") socket 100 is depicted that includes CPU socket contacts for improving bandwidth throughput by improving signal integrity between the CPU and a motherboard between which the CPU socket 100 is coupled, in accordance with at least one embodiment described herein. In accordance with at least one embodiment described herein, the CPU socket 100 includes a socket body 102 and a contact array 104 for improving bandwidth throughput between the CPU and the motherboard.

[0017] The socket body 102 carries the contact array 104 and provides a mechanical interface for receiving and carrying the CPU. The socket body 102 can be formed from one or more of a polymer, a thermoplastic, or other composite material. According to at least one embodiment described herein, the socket body 102 can provide an interface between the CPU and the motherboard, between which the CPU socket 100 is electrically and physically coupled. According to at least one embodiment described herein, the socket body 102 receives and carries the CPU and physically and electrically couples the CPU to the motherboard through the contact array 104. According to at least one embodiment described herein, the CPU socket 100 couples the CPU to the contact array 104 such that each of the contacts in the contact array 104 contacts a corresponding conductive landing pad disposed on a surface of the CPU.

[0018] According to at least one embodiment described herein, socket body 102 includes a first side 105 and a second side (not shown). According to at least one embodiment described herein, first side 105 is a top side or CPU side that faces away from the motherboard and toward the CPU. According to at least one embodiment described herein, second side is a bottom side or motherboard side that faces toward the motherboard and away from the CPU.

[0019] The contact array 104 can be physically coupled to the socket body 102. According to at least one embodiment described herein, each of the contacts of the contact array 104 is pressed into the socket body 102 to physically couple each contact of the contact array 104 to the socket body 102. According to at least one embodiment described herein, each of the contacts of the contact array 104 is frictionally coupled to the socket body 102 to maintain the contact's position within the socket body 102. According to at least one embodiment described herein, the contact array 104, once physically coupled to the socket body 102, enables a user to selectively secure a CPU to the CPU socket 100 for electrical communication with a motherboard. According to at least one embodiment described herein, the contact array 104 can have 2011 contacts with a hexagonal pitch (e.g., 39 mm) between contacts to provide increased contact density over a square-pitch contact array or contact arrays having other design characteristics.

[0020] Inset 106 illustrates a subset 108 of the contact array 104, in accordance with at least one embodiment described herein. In accordance with at least one embodiment described herein, the subset 108 of the contact array 104 illustrates each of the CPU socket contacts 110 that comprise the contact array 104. Inset 106 illustrates a top view of the subset 108 of the contact array 104 and provides a top view of the CPU socket contacts 110, in accordance with at least one embodiment described herein.

[0021] Figure 2A 、 2B , 2C and 2D depict illustrative views of a conventional CPU socket contact 200 whose bandwidth is limited by impedance mismatch according to at least one embodiment described herein, and depict an impedance-matched CPU socket 100 ( Figure 1 illustrative view of the CPU socket contact portion 202 showing the bandwidth throughput of the CPU socket. Figure 2A depicts a diagram of a rear perspective view of a conventional CPU socket contact 200, and Figure 2B FIG2 shows a front perspective view of a conventional CPU socket contact portion 200. In contrast, according to at least one embodiment described herein, Figure 2C A rear perspective view of the CPU socket contact portion 202 is shown, and Figure 2DA front perspective view of a CPU socket contact 202 is shown. As discussed above, conventional CPU socket contacts 200 suffer from signal reflections and losses at frequencies likely to be used in next-generation motherboard architectures (e.g., 32 Gigabits per second for Gen 5 PCI-E). Signal reflections and losses functionally represent a bottleneck for information transmission speeds between the CPU and the motherboard, between which the CPU socket 100 is coupled. Advantageously, according to at least one embodiment described herein, the CPU socket contact 202 includes a metal contact body that is integrated into the CPU socket contact 202 and enables the CPU socket contact 202 to function as an impedance-matched (or nearly-matched) transmission line at operating frequencies for the CPU (e.g., 128 Gigabits per second in a full-duplex networking configuration). In particular, according to at least one of the embodiments described herein, the metal contact body of the CPU socket contact 202 can enable the CPU socket contact 202 to operate or behave with the inductive and capacitive characteristics of a coaxial transmission line. According to at least one embodiment described herein, the inductive and capacitive coaxial transmission line characteristics enable the CPU socket contact 202 to transfer data or information from the CPU, through the CPU socket 100, to the motherboard at a higher frequency and with less signal reflection or other losses (e.g., standing wave reflection loss).

[0022] refer to Figure 2C and Figure 2DAccording to at least one embodiment described herein, the CPU socket contact 202 functions as an electrical connection, such as a transmission line, between the CPU and the motherboard. According to at least one embodiment described herein, the CPU socket contact 202 includes a solder ball base 204, a contact tip 206, a spring arm 208, a stem 209, and a CPU socket contact body 210, for electrically coupling the CPU to the motherboard while also functioning as a transmission line. According to at least one embodiment described herein, the solder ball base 204 provides a foundation upon which solder balls can physically and electrically couple the CPU socket contact 202 to the motherboard. In one implementation, the solder ball base 204 is replaced by a second spring arm (not shown), which physically and electrically couples to a landing pad on the motherboard, making the CPU socket 100 a dual-compression socket. According to at least one embodiment described herein, the contact tip 206 provides a non-rough surface that physically and electrically couples to the CPU's landing pad for receiving and transmitting information between the CPU and the motherboard. In accordance with at least one embodiment described herein, spring arm 208 positions contact tip 206 at a designed distance above solder ball base 204 while providing a flexible and compressible structure that provides a compressive force on the CPU when the CPU is secured to socket body 102. In one embodiment, spring arm 208 positions contact tip 206 at a distance 224 of approximately 3 mm from solder ball base 204. In one embodiment, spring arm 208 positions contact tip 206 at a distance 224 of between 2 mm and 4 mm from solder ball base 204. In one embodiment, when spring arm 208 is compressed, spring arm 208 positions contact tip 206 at a distance 224 of between 1.7 mm and 3.4 mm from solder ball base 204.

[0023] According to at least one embodiment described herein, the CPU socket contact body 210, along with the solder ball base 204, contact tip 206, spring arm 208, and stem 209, is formed from a single piece of metal (e.g., stamped from a single sheet of metal). According to one embodiment, the CPU socket contact body 210 is a component that provides or induces capacitive impedance to substantially offset the inductive impedance of the CPU socket contact 202. According to at least one embodiment described herein, the CPU socket contact body 210 provides one or more surfaces that capacitively interact with other adjacent or proximately positioned contacts (e.g., a ground contact). According to at least one embodiment described herein, the capacitive impedance of the CPU socket contact body 210, combined with the inductive impedance of the entire CPU socket contact 202, is used to offset or negate the imaginary (relative to real) impedance of the CPU socket contact 202, thereby impedance matching the CPU socket contact 202. According to at least one embodiment described herein, the capacitive impedance of the CPU socket contact body 210, combined with the inductive impedance of the solder ball base 204, the landing pad contact 206, the spring arm 208, and the stem 209, is used to cancel or negate the imaginary impedance of the CPU socket contact 202, which is impedance matched to the CPU socket contact 202. According to at least one embodiment described herein, through this impedance matching, the resonant frequency of the CPU socket contact 202 is increased by the CPU socket contact body 210, which reduces signal reflections and signal losses that occur along metal structures that have not been matched or otherwise designed and manufactured to operate within a specific range of frequencies.

[0024] The CPU socket contact body 210 includes an outer surface and a cavity. According to at least one embodiment described herein, the CPU socket contact body 210 is a rectangular cuboid. According to at least one embodiment described herein, the CPU socket contact body 210 is cylindrical or polyhedral. According to one embodiment described herein, the CPU socket contact body 210 may include one or more of the following: a first contact body surface 212, a second contact body surface 214, a third contact body surface 216, a fourth contact body surface 218, and a cavity 220. In one embodiment, the CPU socket contact body 210 omits the fourth contact body surface 218 and includes the first contact body surface 212, the second contact body surface 214, and the third contact body surface 216. In one embodiment, the CPU socket contact body 210 is in the shape of a triangular prism. According to at least one embodiment described herein, the height of one or more of the first contact body surface 212, the third contact body surface 216, and the fourth contact body surface 218 is approximately half the distance from the bottom of the solder ball base 204 to the contact tip 206. According to at least one embodiment described herein, the width of one or more of the first contact body surface 212 , the third contact body surface 216 , and the fourth contact body surface 218 is approximately the length of the longest dimension of the solder ball base 204 .

[0025] According to at least one embodiment described herein, cavity 220 is a hole extending the longest dimension (e.g., length) of first, third, and fourth contact body surfaces 212, 216, and 218. According to at least one embodiment described herein, fourth contact body surface 218 includes a slot or opening 222, an artifact of CPU socket contact 202 being fabricated from a single piece of metal. According to at least one embodiment described herein, opening 222 of fourth contact body surface 218 can be closed or formed such that the surface area of ​​fourth contact body surface 218 is similar to the surface areas of third and first contact body surfaces 216 and 212, resulting in capacitive properties of first, third, and fourth contact body surfaces 212, 216, and 218 being similar to one another. According to at least one embodiment described herein, opening 222 can extend from first to third contact body surface 216, such that fourth contact body surface 218 is absent.

[0026] Figure 3An illustrative configuration 300 of a first insulating contact 302 coupled to a second insulating contact 304, according to at least one embodiment described herein, is depicted. According to at least one embodiment described herein, the first insulating contact 302 includes a first contact 306 at least partially enclosed by a first insulating shell 308, and the second insulating contact 304 includes a second contact 310 at least partially enclosed by a second insulating shell 312. According to at least one embodiment described herein, the first insulating shell 308 encloses the metal CPU socket contact body of the first contact 306. According to at least one embodiment described herein, the second insulating shell 312 encloses the metal CPU socket contact body of the second contact 310. According to at least one embodiment described herein, the first insulating shell 308 and the second insulating shell 312 are rectangular cuboids, cylindrical, or otherwise polyhedron-shaped. According to at least one embodiment described herein, the first insulating contact 302 is adhered to the second insulating contact 304 by applying an adhesive between the first insulating shell 308 and the second insulating shell 312. According to at least one embodiment described herein, the first insulating contact portion 302 is physically contacted with the second insulating contact portion 304 by placing the first insulating housing 308 adjacent to the second insulating housing 312. According to at least one embodiment described herein, the first insulating housing 308 and the second insulating housing 312 can represent the socket body 102 ( Figure 1 ), or the first and second insulating shells 308, 312 can be slid into openings in the socket body 102. In accordance with at least one embodiment described herein, the insulation and thickness of the first and second insulating shells 308, 312 provide a dielectric or spacing between the metal portions of the CPU socket contact body for at least partially defining the capacitive coupling between the first and second insulating contact portions 302, 304.

[0027] In accordance with at least one embodiment described herein, first and second insulation contacts 302 and 304 are illustrated with illustrative examples of solder balls 314 and 316 that can physically and electrically couple first and second insulation contacts 302 and 304 to a motherboard.

[0028] Figure 4 4 is a high-level logic flow diagram of an illustrative method 400 for manufacturing a CPU socket contact according to at least one embodiment described herein. According to various embodiments, the described operations of method 400 may be performed in any order, regardless of the order described below. Method 400 begins at 402.

[0029] In accordance with at least one embodiment described herein, at 404 , method 400 includes forming a solder ball substrate configured to couple the CPU socket contacts to a motherboard.

[0030] In accordance with at least one embodiment described herein, at 406 , method 400 includes forming a contact tip configured to receive contact from a landing pad of a CPU.

[0031] In accordance with at least one embodiment described herein, at 408 , method 400 includes forming a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base.

[0032] In accordance with at least one embodiment described herein, at 410 , method 400 includes forming a backbone coupled between a solder ball base and a spring arm.

[0033] In accordance with at least one embodiment described herein, at 412 , method 400 includes forming a CPU socket contact body coupled to the stem and suspended between the spring arms and the solder ball base.

[0034] Method 400 ends at 414 .

[0035] In addition, the operation of the embodiments has been further described with reference to the above figures and accompanying examples. Some of the figures may include logic flows. Although such figures presented herein may include specific logic flows, it will be appreciated that the logic flows merely provide examples of how the general functionality described herein may be implemented. Furthermore, a given logic flow does not necessarily have to be executed in the order presented unless otherwise indicated. The embodiments are not limited in this context.

[0036] Various features, aspects, and embodiments have been described herein. As will be appreciated by those skilled in the art, such features, aspects, and embodiments are susceptible to combination with one another and to variations and modifications. Therefore, this disclosure should be construed as encompassing such combinations, variations, and modifications. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined solely in accordance with the following claims and their equivalents.

[0037] The terms and expressions employed herein are used as terms of description rather than limitation, and there is no intention in the use of such terms and expressions to exclude any equivalents of the features shown and described (or portions thereof), and it is recognized that various modifications are possible within the scope of the claims. Accordingly, the claims are intended to cover all such equivalents. Various features, aspects, and embodiments have been described herein. As will be appreciated by those skilled in the art, such features, aspects, and embodiments are susceptible to combination with one another and to variations and modifications. Accordingly, this disclosure should be construed as encompassing such combinations, variations, and modifications.

[0038] Reference throughout this specification to "one embodiment," "an embodiment," or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0039] The following examples relate to additional embodiments. The following examples of the present disclosure may include subject matter such as at least one apparatus, method, at least one machine-readable medium for storing instructions that, when executed, cause a machine to perform actions based on the method, and / or a system for manufacturing a CPU socket contact.

[0040] According to Example 1, a central processing unit ("CPU") socket contact is provided. The CPU socket contact may include: a solder ball base configured to couple the CPU socket contact to a motherboard; a contact tip configured to receive contact from a landing pad of a CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; a stem coupled between the solder ball base and the spring arm; and a CPU socket contact body coupled to the stem and suspended between the spring arm and the solder ball base. The solder ball base, contact tip, spring arm, stem, and CPU socket contact body may be formed from a single piece of metal.

[0041] Example 2 may include the elements of Example 1, wherein the height of the CPU socket contact from the solder ball base to the contact tip is approximately 3 mm.

[0042] Example 3 may include the elements of Example 1, wherein a height of the CPU socket contact from solder ball base to contact tip is in a range of 1.7 mm to 4 mm.

[0043] Example 4 may include the elements of Example 1, wherein the CPU socket contact body includes a cavity extending through the CPU socket contact body, wherein the cavity extends perpendicular to the solder ball base.

[0044] Example 5 may include the elements of Example 1, wherein the CPU socket contact body is cylindrical or polyhedron-shaped.

[0045] Example 6 may include the elements of Example 1, wherein the CPU socket contact body is a rectangular cuboid.

[0046] Example 7 may include elements of Example 1, wherein the CPU socket contact body includes one or more of a first surface, a second surface, and a third surface, wherein the first surface is substantially perpendicular to the second surface, wherein the second surface is substantially perpendicular to the third surface, and wherein the first surface, the second surface, and the third surface are perpendicular to the plane of the solder ball base.

[0047] Example 8 may include the elements of Example 7, wherein the first surface, the second surface, and the third surface capacitively couple the CPU socket contact to an adjacent CPU socket contact of the plurality of CPU socket contacts in the CPU socket.

[0048] Example 9 may include elements of Example 1, wherein the CPU socket contact body includes at least a first surface, a second surface, and a third surface, wherein the first surface is substantially perpendicular to the second surface, wherein the second surface is substantially perpendicular to the third surface, and wherein the first surface, the second surface, and the third surface are perpendicular to the plane of the solder ball base.

[0049] Example 10 may include the elements of Example 9, wherein the first surface, the second surface, and the third surface capacitively couple the CPU socket contact to an adjacent CPU socket contact of the plurality of CPU socket contacts in the CPU socket.

[0050] Example 11 may include the elements of Example 1, wherein the CPU socket contact body generates a capacitive impedance that negates an inductive impedance of the CPU socket contact.

[0051] According to Example 12, a central processing unit ("CPU") socket is provided. The CPU socket may include a socket body, the socket body may include: a first side configured to mate adjacent to a motherboard; and a second side configured to carry a CPU. The CPU socket may include a CPU socket contact, the CPU socket contact being one of a plurality of CPU socket contacts coupled to the socket body and extending between the first side and the second side to electrically couple the CPU to the motherboard. The CPU socket contact may include: a solder ball base configured to couple the CPU socket contact to the motherboard; a contact tip configured to receive contact from a landing pad of the CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; a stem coupled between the solder ball base and the spring arm; and a CPU socket contact body coupled to the stem and suspended between the spring arm and the solder ball base. The solder ball base, contact tip, spring arm, stem, and CPU socket contact body may be formed from a single piece of metal.

[0052] Example 13 may include the elements of Example 12, wherein the CPU socket contact body includes a cavity extending through the CPU socket contact body, wherein the cavity extends perpendicular to the solder ball base.

[0053] Example 14 may include the elements of Example 12, wherein the CPU socket contact body is a rectangular cuboid.

[0054] Example 15 may include elements of Example 12, wherein the CPU socket contact body includes one or more of a first surface, a second surface, and a third surface, wherein the first surface is substantially perpendicular to the second surface, wherein the second surface is substantially perpendicular to the third surface, and wherein the first surface, the second surface, and the third surface are perpendicular to the plane of the solder ball base.

[0055] Example 16 may include the elements of Example 15, wherein the first surface, the second surface, and the third surface capacitively couple the CPU socket contact to an adjacent CPU socket contact of the plurality of CPU socket contacts in the CPU socket.

[0056] Example 17 may include elements of Example 12, wherein the CPU socket contact body includes at least a first surface, a second surface, and a third surface, wherein the first surface is substantially perpendicular to the second surface, wherein the second surface is substantially perpendicular to the third surface, and wherein the first surface, the second surface, and the third surface are perpendicular to the plane of the solder ball base.

[0057] Example 18 may include the elements of Example 17, wherein the first surface, the second surface, and the third surface capacitively couple the CPU socket contact to an adjacent CPU socket contact of the plurality of CPU socket contacts in the CPU socket.

[0058] Example 19 may include the elements of Example 12, wherein the CPU socket contact body generates a capacitive impedance that substantially cancels an inductive impedance of the CPU socket contact.

[0059] Example 20 may include the elements of Example 12, and the CPU socket may further include a plurality of insulating housings, wherein each of the plurality of insulating housings at least partially encapsulates each of the plurality of CPU socket contacts.

[0060] According to Example 21, a central processing unit ("CPU") socket is provided. The CPU socket may include a socket body, the socket body may include: a first side configured to mate adjacent to a motherboard; and a second side configured to carry a CPU. The CPU socket may include a CPU socket contact, the CPU socket contact being one of a plurality of CPU socket contacts coupled to the socket body and extending between the first side and the second side to electrically couple the CPU to the motherboard. The CPU socket contact may include: a solder ball base configured to couple the CPU socket contact to the motherboard; a contact tip configured to receive contact from a landing pad of the CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; a stem coupled between the solder ball base and the spring arm; and a member for inducing a capacitive impedance to substantially offset an inductive impedance of the CPU socket contact.

[0061] Example 22 can include the elements of Example 21, wherein the solder ball base, the contact tip, the spring arm, the stem, and the member for inducing a capacitive impedance to substantially cancel an inductive impedance of the CPU socket contact are formed from a single piece of metal.

[0062] Example 23 may include the elements of Example 21, and the CPU socket may further include an insulating housing, wherein the insulating housing at least partially encapsulates the CPU socket contacts.

[0063] Example 24 may include the elements of Example 21, wherein the insulating housing is cylindrical or polyhedral in shape.

[0064] Example 25 may include the elements of Example 21, wherein the insulating housing is a rectangular cuboid.

[0065] According to Example 26, a method for manufacturing a central processing unit ("CPU") socket contact is provided. The method includes forming a solder ball base configured to couple the CPU socket contact to a motherboard; forming a contact tip configured to receive contact from a landing pad of the CPU; forming a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; forming a stem coupled between the solder ball base and the spring arm; and forming a CPU socket contact body coupled to the stem and suspended between the spring arm and the solder ball base. The solder ball base, contact tip, spring arm, stem, and CPU socket contact body can be formed from a single piece of metal.

[0066] Example 27 may include the elements of Example 26, wherein the height of the CPU socket contact from the solder ball base to the contact tip is 3 mm.

[0067] Example 28 may include the elements of Example 26, wherein a height of the CPU socket contact from solder ball base to contact tip is in a range of 1.7 mm to 4 mm.

[0068] Example 29 may include the elements of Example 26, wherein forming the CPU socket contact body includes forming the CPU socket contact body having a cavity extending through the CPU socket contact body, wherein the cavity extends perpendicular to the solder ball base.

[0069] Example 30 may include the elements of Example 26, wherein the CPU socket contact body is a rectangular cuboid.

[0070] Example 31 may include the elements of Example 26, wherein the CPU socket contact body generates a capacitive impedance that effectively cancels an inductive impedance of the CPU socket contact.

[0071] According to Example 32, a motherboard may have a CPU socket comprising an array of CPU socket contacts, wherein the array of CPU socket contacts comprises at least one CPU socket contact according to any one of Examples 1 to 11.

[0072] According to Example 33, a motherboard may have the CPU socket according to any one of Examples 12 to 25.

[0073] According to Example 34, at least one machine-readable medium may include a plurality of instructions that, in response to being executed on a computing device, cause the computing device to perform the method according to any one of Examples 26 to 31.

[0074] According to Example 35, an electronic device is provided, which may have the CPU socket according to any one of Examples 12 to 25.

[0075] The terms and expressions which have been employed herein are used as terms of description and not of limitation, and there is no intention in the use of such terms and expressions to exclude any equivalents of the features shown and described (or portions thereof), and it is recognized that various modifications are possible within the scope of the claims. Accordingly, the claims are intended to cover all such equivalents.

Claims

1. A central processing unit ("CPU") socket contact portion comprising: a solder ball substrate configured to couple the CPU socket contacts to a motherboard; a contact tip configured to receive contact from a landing pad of a CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; A backbone coupled between the solder ball base and the spring arm; as well as a CPU socket contact body coupled to the stem and suspended between the spring arms and the solder ball base, wherein the CPU socket contact body generates a capacitive impedance that substantially cancels the inductive impedance of the CPU socket contact, The solder ball base, contact tip, spring arm, stem, and CPU socket contact body are formed from a single piece of metal.

2. The CPU socket contact of claim 1, wherein the height of the CPU socket contact from the solder ball base to the contact tip is approximately 3 mm. 3 . The CPU socket contact according to claim 1 , wherein a height of the CPU socket contact from a solder ball base to a contact tip is in a range of 1.7 mm to 4 mm. 4 . The CPU socket contact of claim 1 , wherein the CPU socket contact body includes a cavity extending through the CPU socket contact body, wherein the cavity extends perpendicular to the solder ball base. 5 . The CPU socket contact portion according to claim 1 , wherein the CPU socket contact body is cylindrical or polyhedral in shape. The CPU socket contact portion according to claim 1 , wherein the CPU socket contact body is a rectangular cuboid.

7. The CPU socket contact portion according to claim 1, wherein the CPU socket contact body includes one or more of a first surface, a second surface, and a third surface, wherein the first surface is substantially perpendicular to the second surface, wherein the second surface is substantially perpendicular to the third surface, and wherein the first surface, the second surface, and the third surface are perpendicular to the plane of the solder ball base.

8. The CPU socket contact of claim 7, wherein the first surface, the second surface, and the third surface capacitively couple the CPU socket contact to an adjacent CPU socket contact of the plurality of CPU socket contacts in the CPU socket.

9. The CPU socket contact portion according to claim 1, wherein the CPU socket contact body includes at least a first surface, a second surface, and a third surface, wherein the first surface is substantially perpendicular to the second surface, wherein the second surface is substantially perpendicular to the third surface, and wherein the first surface, the second surface, and the third surface are perpendicular to the plane of the solder ball base.

10. The CPU socket contact of claim 9, wherein the first surface, the second surface, and the third surface capacitively couple the CPU socket contact to an adjacent CPU socket contact of the plurality of CPU socket contacts in the CPU socket.

11. The CPU socket contact of claim 1, wherein the CPU socket contact body generates a capacitive impedance that negates an inductive impedance of the CPU socket contact.

12. A central processing unit ("CPU") socket comprising: A slot body, comprising: configured to mate adjacent to the first side of the motherboard; and a second side configured to carry a CPU; and A CPU socket contact portion, the CPU socket contact portion being one of a plurality of CPU socket contacts coupled to a socket body and extending between a first side and a second side to electrically couple a CPU to a motherboard, wherein the CPU socket contact portion comprises: a solder ball substrate configured to couple the CPU socket contacts to a motherboard; a contact tip configured to receive contact from a landing pad of a CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; a backbone coupled between the solder ball base and the spring arm; and a CPU socket contact body coupled to the stem and suspended between the spring arms and the solder ball base, wherein the CPU socket contact body generates a capacitive impedance that substantially cancels the inductive impedance of the CPU socket contact, The solder ball base, contact tip, spring arm, stem, and CPU socket contact body are formed from a single piece of metal.

13. The CPU socket of claim 12, wherein the CPU socket contact body includes a cavity extending through the CPU socket contact body, wherein the cavity extends perpendicular to the solder ball base.

14. The CPU socket according to claim 12, wherein the CPU socket contact body is a rectangular cuboid.

15. The CPU socket according to claim 12, further comprising: A plurality of insulating housings, wherein each of the plurality of insulating housings at least partially encapsulates each of the plurality of CPU socket contacts.

16. A central processing unit ("CPU") socket comprising: A slot body, comprising: configured to mate adjacent to the first side of the motherboard; and a second side configured to carry a CPU; and A CPU socket contact portion, the CPU socket contact portion being one of a plurality of CPU socket contacts coupled to a socket body and extending between a first side and a second side to electrically couple a CPU to a motherboard, wherein the CPU socket contact portion comprises: a solder ball substrate configured to couple the CPU socket contacts to a motherboard; a contact tip configured to receive contact from a landing pad of a CPU; a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; a backbone coupled between the solder ball base and the spring arm; and A means for inducing capacitive impedance to substantially cancel the inductive impedance of the CPU socket contacts.

17. A method of manufacturing a central processing unit ("CPU") socket contact, the method comprising: forming a solder ball base configured to couple the CPU socket contacts to a motherboard; forming a contact tip configured to receive contact from a landing pad of a CPU; forming a spring arm coupled to the contact tip for suspending the contact tip at one or more distances from the solder ball base; forming a backbone coupled between the solder ball base and the spring arm; as well as forming a CPU socket contact body coupled to the stem and suspended between the spring arms and the solder ball base, wherein the CPU socket contact body generates a capacitive impedance that substantially cancels the inductive impedance of the CPU socket contact, The solder ball base, contact tip, spring arm, stem, and CPU socket contact body are formed from a single piece of metal.

18. The method of claim 17, wherein a height of the CPU socket contact from a solder ball base to a contact tip is in a range of 1.7 mm to 4 mm.

19. The method of claim 17, wherein forming a CPU socket contact body comprises forming a CPU socket contact body having a cavity extending through the CPU socket contact body, wherein the cavity extends perpendicular to the solder ball base.

20. The method of claim 17, wherein the CPU socket contact body is a rectangular cuboid.

21. A motherboard having a CPU socket, the CPU socket comprising an array of CPU socket contacts, wherein the array of CPU socket contacts comprises at least one CPU socket contact according to any one of claims 1 to 11.

22. A motherboard having a CPU socket according to any one of claims 12 to 16.

23. At least one machine-readable medium comprising a plurality of instructions which, in response to being executed on a computing device, cause the computing device to perform the method according to any one of claims 17 to 20.

24. An electronic device comprising the CPU socket according to any one of claims 12 to 16.

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