Suction nozzle for automatic chip mounter and automatic chip mounter

Abstract

The invention discloses a suction nozzle for an automatic chip mounter and an automatic chip mounter. The automatic chip mounter comprises an image acquisition device arranged above the suction nozzle, wherein the suction nozzle is provided with a suction port used for sucking materials, a negative pressure port connected with external negative pressure and an airflow channel communicated with thesuction port and the negative pressure port, and the suction nozzle is provided with an upper surface facing the image acquisition device and a lower surface opposite to the upper surface; the suction nozzle is further provided with a hollow structure, the hollow structure comprises a stepped hole penetrating through the upper surface and the lower surface, and the stepped hole comprises a firstopening close to one end of the upper surface and a second opening close to one end of the lower surface; the aperture of the first opening is greater than that of the second opening; the image acquisition device acquires position information of the material sucked by the suction nozzle through the hollow structure; the suction port is located in the lower surface and is adjacent to the second opening. According to the invention, the mounting precision of the chip is relatively high.

Description

technical field

[0001] The invention relates to the technical field of chip placement, in particular to a suction nozzle for an automatic placement machine and the automatic placement machine. Background technique

[0002] Since the 21st century, China's electronic information product manufacturing industry has developed rapidly and has gradually become one of the pillar industries of the national economy, with a huge demand for automation. Chips are the core components of communication products such as optical modules, and their placement is an important process in the manufacture of electronic products. The level of placement accuracy will be directly related to product performance and manufacturing cost. Usually the size of the chip is small, there are strict requirements on the mounting position, parallelism, etc., and the position accuracy is extremely high, which requires the assistance of cameras or other sensors. However, due to the limitations of space, equipment s...

Examples

no. 4 example

[0053] Such as Figure 11 As shown, the fourth embodiment provided by the present invention is different from the first embodiment in that the location of the negative pressure port is different. In the following, only the different parts will be introduced in detail, and the parts that are the same as those in the first embodiment will not be introduced again.

[0054] In this embodiment, the negative pressure port 74 is located on the second side surface 76 . Of course, the negative pressure port 74 can also be disposed on the first side surface. There are two negative pressure ports 74. Specifically, the negative pressure port 74 includes a first negative pressure port 78 and a second negative pressure port 80, and both the first negative pressure port 78 and the second negative pressure port 80 are arranged on the second side. on surface 76. Certainly, both the first negative pressure port 78 and the second negative pressure port 80 may also be disposed on the first sid...

technical field

[0001] The invention relates to the technical field of chip placement, in particular to a suction nozzle for an automatic placement machine and the automatic placement machine. Background technique

[0002] Since the 21st century, China's electronic information product manufacturing industry has developed rapidly and has gradually become one of the pillar industries of the national economy, with a huge demand for automation. Chips are the core components of communication products such as optical modules, and their placement is an important process in the manufacture of electronic products. The level of placement accuracy will be directly related to product performance and manufacturing cost. Usually the size of the chip is small, there are strict requirements on the mounting position, parallelism, etc., and the position accuracy is extremely high, which requires the assistance of cameras or other sensors. However, due to the limitations of space, equipment s...

Examples

no. 4 example

[0053] Such as Figure 11 As shown, the fourth embodiment provided by the present invention is different from the first embodiment in that the location of the negative pressure port is different. In the following, only the different parts will be introduced in detail, and the parts that are the same as those in the first embodiment will not be introduced again.

[0054] In this embodiment, the negative pressure port 74 is located on the second side surface 76 . Of course, the negative pressure port 74 can also be disposed on the first side surface. There are two negative pressure ports 74. Specifically, the negative pressure port 74 includes a first negative pressure port 78 and a second negative pressure port 80, and both the first negative pressure port 78 and the second negative pressure port 80 are arranged on the second side. on surface 76. Certainly, both the first negative pressure port 78 and the second negative pressure port 80 may also be disposed on the first sid...

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