Highly integrated intelligent power modules and electrical equipment

Abstract

The present invention discloses a highly integrated intelligent power module and electrical equipment, the highly integrated intelligent power module comprises: a rectifier bridge, used to access an AC power supply and rectify the AC power supply into a DC power supply; a control module, used to output a first control signal and a second control signal; a power switch module, used to work according to the first control signal so that the PFC circuit formed by it performs power factor correction on the DC power supply; a plurality of power modules, used to drive the corresponding load to work according to the second control signal and the DC power supply after power factor correction; and an installation carrier, the control module, the rectifier bridge, the power switch module and the plurality of power modules are integrated on the installation carrier. The present invention solves the problem that when the electric control board is implemented with a plurality of discrete components, there are many components, resulting in complicated assembly of the air conditioner, as well as the problem that the power consumption of the electric control board is large, the heat generation is also serious, the thermal efficiency of the air conditioner is reduced, and it is not conducive to the energy saving and emission reduction of the air conditioner.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to a highly integrated intelligent power module and electrical equipment. Background Art

[0002] With the advancement of science and technology and the development of social productivity, problems such as excessive resource consumption, environmental pollution, ecological destruction, and climate warming have become increasingly prominent. Green development and energy conservation and emission reduction have become the direction of change and development for various enterprises and industrial fields. Therefore, how to reduce energy consumption and save energy for refrigeration equipment such as air conditioners and refrigerators, which consume a lot of energy, has become the direction of researchers' efforts. Summary of the invention

[0003] The main purpose of the present invention is to propose a highly integrated intelligent power module and electrical equipment, aiming to improve the integration of the integrated intelligent power module, realize the integrated drive control of the fan and compressor, reduce the volume of the electric control board, facilitate installation problems, and achieve energy conservation and emission reduction.

[0004] To achieve the above object, the present invention proposes a highly integrated intelligent power module, the highly integrated intelligent power module comprising:

[0005] A rectifier bridge is used to connect to an AC power source and rectify the AC power source into a DC power source;

[0006] A power switch module, used for correcting the DC power output by the rectifier bridge;

[0007] A control module, used for outputting a control signal;

[0008] A plurality of power modules, used to drive corresponding loads to work according to the control signal and the DC power supply corrected by the power switch module; and

[0009] A mounting carrier, on which the control module, the rectifier bridge, the power switch module and a plurality of power modules are integrated.

[0010] Optionally, the number of the power modules is two, and they are a fan drive power module and a compressor drive power module respectively.

[0011] Optionally, the control module includes an MCU, a PFC driver chip, a fan power driver chip and a compressor power driver chip, the MCU has a first control end, multiple second control ends and multiple third control ends, the first control end of the MCU is connected to the signal input end of the PFC driver chip; the multiple second control ends of the MCU are connected to the multiple signal input ends of the fan power driver chip in a one-to-one correspondence; the multiple third control ends of the MCU are connected to the multiple signal input ends of the compressor power driver chip in a one-to-one correspondence;

[0012] The signal output end of the PFC driver chip is connected to the controlled end of the power switch module;

[0013] The multiple output terminals of the fan power driving chip are connected to the multiple controlled terminals of the fan driving power module in a one-to-one correspondence;

[0014] The multiple output terminals of the compressor power driving chip are connected to the multiple controlled terminals of the compressor driving power module in a one-to-one correspondence.

[0015] Optionally, the fan power driving chip drives the fan driving power module to work based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the fan driving power module;

[0016] The compressor power driving chip drives the compressor driving power module to work based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the compressor driving power module;

[0017] The PFC driving chip drives the power switch module to operate based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the compressor driving power module.

[0018] Optionally, the control module further includes a rectifier bridge protection chip, and a detection end of the rectifier bridge protection chip is connected to an output end of the rectifier bridge.

[0019] Optionally, the PFC driver chip, the fan power driver chip and the compressor power driver chip are packaged into an integrated chip.

[0020] Optionally, the PFC driver chip and the fan power driver chip are packaged as an integrated chip, or the PFC driver chip and the compressor power driver chip are packaged as an integrated chip.

[0021] Optionally, the fan power driver chip and the compressor power driver chip are packaged as an integrated chip.

[0022] Optionally, the fan drive power module includes a fan power drive chip and a fan drive inverter circuit, the multiple signal input ends of the fan power drive chip are connected one-to-one with the multiple control ends of the control module, and the multiple output ends of the fan power drive chip are connected one-to-one with the multiple controlled ends of the fan power module.

[0023] Optionally, the fan power driver chip and the fan power module are packaged as an integrated chip.

[0024] Optionally, the compressor drive power module includes a compressor power drive chip and a compressor drive inverter circuit, the multiple signal input ends of the compressor power drive chip are connected one-to-one with the multiple control ends of the control module, and the multiple output ends of the compressor power drive chip are connected one-to-one with the multiple controlled ends of the compressor power module.

[0025] Optionally, the compressor power driver chip and the compressor power module are packaged as an integrated chip.

[0026] Optionally, the power switch module includes a PFC driver chip and a passive PFC unit, the signal input end of the PFC driver chip is connected to the control end of the control module, and the signal output end of the PFC driver chip is connected to the controlled end of the passive PFC unit.

[0027] Optionally, the PFC driver chip and the passive PFC unit are packaged as an integrated chip.

[0028] Optionally, the PFC unit includes a power switch tube and a first diode, and a first lead terminal and a second lead terminal for respectively connecting to an external switching power supply, the gate of the power switch tube is connected to the control end of the control module, the emitter of the power switch tube is connected to the first lead terminal, the collector of the power switch tube is connected to the anode of the first diode, and the cathode of the first diode is used to connect to the external switching power supply via the second lead terminal.

[0029] Optionally, the PFC unit further includes a second diode, an anode of the second diode is connected to an anode of the power switch tube, and a cathode of the second diode is connected to a collector of the power switch tube.

[0030] Optionally, the PFC unit further includes an inductor, a first end of the inductor is connected to the collector of the rectifier bridge and / or the power switch tube, and a second end of the inductor is connected to the first diode.

[0031] Optionally, the highly integrated intelligent power module further comprises a packaging shell, wherein the packaging shell is covered on the mounting carrier, and the control module, the rectifier bridge, the power switch module and the plurality of power modules integrated on the mounting carrier.

[0032] Optionally, the highly integrated intelligent power module further includes a packaging shell, which is wrapped around the periphery of the mounting carrier, the control module, the rectifier bridge, the power switch module and the plurality of power modules.

[0033] Optionally, the mounting carrier is a PCB board and / or a lead frame.

[0034] The present invention also proposes an electrical device including the highly integrated intelligent power module as described above; the highly integrated intelligent power module includes: a rectifier bridge, used to connect to an AC power supply and rectify the AC power supply into a DC power supply; a control module, used to output a first control signal and a second control signal; a power switch module, used to operate according to the first control signal so that the PFC circuit constituted by it performs power factor correction on the DC power supply; multiple power modules, used to drive corresponding loads to operate according to the second control signal and the DC power supply after power factor correction; and an installation carrier, on which the control module, rectifier bridge, power switch module and multiple power modules are integrated.

[0035] Optionally, the electrical device is an air conditioner or a refrigerator.

[0036] The highly integrated intelligent power module of the present invention is provided with an installation carrier, and the control module, the rectifier bridge, the power switch module and the multiple power modules are integrated with the installation carrier. Through the control module, a control signal is output to control the power switch module to work, so that the PFC circuit constituted by it performs power factor correction on the DC power supply, and the DC power after power factor correction is output to the power module, and the control module outputs a corresponding control signal to control the multiple power modules to drive the corresponding load to work. The present invention integrates the control module, the rectifier bridge, the power switch module and the multiple power modules with the installation carrier without the need for wire connection, which can shorten the distance between the control module and the rectifier bridge, the power switch module and the multiple power modules, and reduce the electromagnetic interference caused by the excessive length and excessive number of jumpers. In addition, the above functional modules are integrated on a mounting carrier, which can improve the integration of the integrated intelligent power module, realize the integrated drive control of the fan and the compressor, thereby reducing the volume of the electric control board and facilitating installation. At the same time, the components of the electric control board can be reduced, the PCB board layout of the electric control board can be simplified, and the production cost of the air conditioner can be effectively reduced. The present invention solves the problem that when the electric control board is implemented with discrete components, there are many components, which leads to complicated assembly of the air conditioner, large power consumption, high maintenance rate and production cost of the air conditioner, and is not conducive to the stable use of the air conditioner. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0038] Figure 1 A schematic diagram of the structure of an embodiment of a highly integrated intelligent power module of the present invention;

[0039] Figure 2 for Figure 1 A schematic diagram of the structure of an embodiment of a control module;

[0040] Figure 3 for Figure 1 A schematic structural diagram of an embodiment of multiple power modules.

[0041] Description of Figure Numbers:

[0042] Label name Label name 100 Installation carrier 40 Multiple power modules 10 Rectifier Bridge 41 Fan drive power module 20 Power switch module 42 Compressor drive power module 30 Control Module 411 Wind turbine power driver chip 31 PFC driver chip 412 Fan drive inverter circuit 32 Wind turbine power driver chip 421 Compressor power driver chip 33 Compressor power driver chip 422 Compressor drive inverter circuit 34 Rectifier bridge protection chip

[0043] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0046] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] The present invention provides a highly integrated intelligent power module suitable for electrical appliances such as air conditioners and refrigerators.

[0048] In electrical appliances such as air conditioners, washing machines, and refrigerators, most of them are equipped with motors, and other loads are driven by motors. For example, in air conditioners, traditional air conditioners generally include indoor units and outdoor units, and motors and electric control boards that drive motors are set in both outdoor units and indoor units. Taking the electric control board of the outdoor unit as an example, the electric control board of the outdoor unit is mostly equipped with functional modules such as an intelligent power module for driving the compressor, an intelligent power module for driving the fan, a main control module, and a power module. Most of these functional modules are implemented using discrete or partially integrated circuit modules, and are dispersedly arranged in various parts of the electric control PCB board. However, due to the requirements of the electric control board's own structure, strong and weak electrical isolation, anti-signal interference, and heat dissipation, the spacing between the functional modules is required to be within a safe distance, making the volume of the outdoor unit electric control board larger and not conducive to installation. Or these are dispersed on multiple circuit boards, and then jumpers are used to realize the electrical connection between the main control module and other functional modules, as well as between the functional modules. However, the dispersed arrangement of the functional modules will result in more and longer jumpers, resulting in a decrease in the EMC performance of the electrical appliance. In addition, the electric control boards of these two structures have more components, which makes the assembly of the outdoor unit complicated, and also increases the production cost of the air conditioner. The maintenance rate will also increase, which is not conducive to the stable use of the air conditioner. More importantly, when the electric control board is implemented with multiple components, the multiple components themselves have high energy consumption and serious heat generation, which leads to the thermal efficiency of the air conditioner, which is not conducive to the energy saving and emission reduction of the air conditioner.

[0049] To solve the above problems, refer to Figure 1 In one embodiment of the present invention, the highly integrated intelligent power module includes: a mounting carrier 100 and a rectifier bridge 10, a power switch module 20, a control module 30 and a plurality of power modules 40 integrated on the mounting carrier 100.

[0050] In this embodiment, the input end of the rectifier bridge 10 is used to connect to the AC power supply, and the output end of the rectifier bridge 10 is connected to the input end of the power switch module 20; the output end of the power switch module 20 is connected to the power input end of multiple power modules; and the multiple control ends of the control module 30 are connected one-to-one with the controlled ends of the power switch module 20 and the controlled ends of multiple power modules.

[0051] In this embodiment, the rectifier bridge 10 is used to rectify the connected AC power into a DC power;

[0052] The power switch module 20 is used to correct the DC power output by the rectifier bridge 10;

[0053] A control module 30, configured to output a control signal;

[0054] The plurality of power modules 40 are used to drive corresponding loads to work according to the control signal and the DC power supply calibrated by the power switch module 20 .

[0055] In this embodiment, the mounting carrier 100 can be implemented by a circuit substrate made of materials such as a PCB board, a lead frame, a cardboard, a semi-fiberglass board, a fiberglass board, etc. The shape of the mounting carrier 100 can be determined according to the specific position and size of the control module 30, the rectifier bridge 10, the power switch module 20, and the multiple power modules 40 integrated on the mounting carrier 100 in the highly integrated intelligent power module, and can be a square shape, but is not limited to a square shape. In specific implementation, the control module 30, the rectifier bridge 10, the power switch module 20, and the multiple power modules 40 can be arranged on one mounting carrier 100 to form a highly integrated intelligent power module, or they can be arranged on two mounting carriers 100 and then packaged into a whole by packaging materials.

[0056] An insulating layer and a circuit wiring layer are also provided on the mounting carrier 100. The insulating layer can be made of materials such as thermoplastic glue or thermosetting glue to achieve fixed connection and insulation between the mounting carrier 100 and the circuit wiring layer. The circuit wiring layer forms corresponding circuits and corresponding mounting positions, i.e., pads, for mounting each electronic component in the control module 30, the rectifier bridge 10, the power switch module 20 and the multiple power modules 40 on the mounting carrier 100 according to the circuit design of the highly integrated intelligent power module. Specifically, after the insulating layer is set on the mounting substrate, copper foil is laid on the insulating layer, and the copper foil is etched according to the preset circuit design to form a circuit wiring layer. After the electronic components of the circuit modules such as the control module 30, the rectifier bridge 10, the power switch module 20 and the multiple power modules 40 are integrated into the circuit wiring layer on the mounting carrier 100, the electrical connection between the circuit modules can also be achieved through metal leads.

[0057] In this embodiment, the rectifier bridge 10 can be implemented by combining four SMD diodes. The rectifier bridge 10 composed of four SMD diodes converts the input AC power into DC power and then outputs it.

[0058] In this embodiment, the power switch module 20 can be implemented only by a PFC switch, or can also form a PFC circuit with other components such as diodes and inductors to achieve power factor correction of the DC power supply. The PFC circuit can be implemented using a passive PFC circuit to form a boost PFC circuit, a buck PFC circuit, or a buck-boost PFC circuit. It can be understood that in actual applications, the position and connection relationship between the power switch module 20 and the rectifier bridge can be adaptively adjusted according to the type of PFC circuit setting, and no limitation is made here. The power switch module 20 is based on the control of the control module 30, and adjusts the power factor of the DC power input by the rectifier bridge 10. The adjusted DC power can generate various driving voltages through an external switching power supply circuit, such as 5V, 15V, etc., which are used to power the MCU and each IPM driver IC respectively.

[0059] In this embodiment, the control module 30 may have a driving circuit unit and a control circuit unit. The driving circuit unit is also integrated with a real-time detection circuit that can continuously detect the current, temperature, and voltage parameters of the rectifier bridge 10, the power switch module 20, and each component in the power module. When a serious overload or even a direct short circuit occurs, or when the temperature is overheated, the driving voltage is overvoltage, etc., the power components in the power module can be controlled to be softly shut down, and a fault signal is sent to the control circuit unit at the same time, so that the control circuit unit controls the operation of other circuit modules, thereby avoiding damage to other circuit modules due to the fault. In addition, the control module 30 can also integrate a bridge arm tube interlocking circuit and a driving power supply undervoltage protection circuit to ensure that the power module can operate safely and stably.

[0060] Multiple power switch tubes are integrated in each power module, and multiple power switch tubes form a driving inverter circuit, for example, a three-phase inverter bridge circuit can be composed of six power switch tubes, or a two-phase inverter bridge circuit can be composed of four power switch tubes. The three-phase inverter bridge circuit includes a three-phase upper bridge arm power switch tube and a three-phase lower bridge arm power switch tube, wherein the three-phase upper bridge arm power switch tube and the three-phase lower bridge arm power switch tube can be implemented entirely or partially by MOS tubes, and entirely or partially by IGBTs. In this embodiment, the six power switch tubes in the three-phase upper bridge arm power switch tube and the three-phase lower bridge arm power switch tube can be selected to be implemented by IGBTs. The two-phase inverter bridge circuit includes a two-phase upper bridge arm power switch tube and a two-phase lower bridge arm power switch tube, wherein the two-phase upper bridge arm power switch tube and the two-phase lower bridge arm power switch tube can be implemented entirely or partially by MOS tubes, and entirely or partially by IGBTs. In this embodiment, the four power switch tubes in the two-phase upper bridge arm power switch tube and the two-phase lower bridge arm power switch tube can be selected to be implemented by IGBTs. It can be understood that by integrating the control module 30 and the power module on the same mounting carrier 100, the distance between the control module 30 and the power module can be shortened, the driving delay can be reduced, the switching speed of each power switch tube in the power module can be increased, and the switching loss and electromagnetic interference of the power module can be reduced, thereby ensuring that the power module can operate reliably for a long time.

[0061] The highly integrated intelligent power module of the present invention is provided with an installation carrier 100, and a control module 30, a rectifier bridge 10, a power switch module 20 and multiple power modules 40 are integrated on the installation carrier 100. The control module 30 drives the power switch module 20 to correct the DC voltage output by the rectifier bridge 10 and output it to the control module 30, so as to provide a stable working voltage for the control module 30. At the same time, the DC power supply after power factor correction is output to each power module, and the control module 30 outputs a corresponding control signal to control the multiple power modules 40 to drive the corresponding loads to work. The present invention integrates the control module 30, the rectifier bridge 10, the power switch module 20 and the multiple power modules 40 on the mounting carrier 100 without the need for wire connection, thereby shortening the distance between the control module 30 and the rectifier bridge 10, the power switch module 20 and the multiple power modules 40, and reducing the electromagnetic interference caused by the excessive length and excessive number of jumpers. In addition, the above functional modules are integrated on a mounting carrier 100, which can improve the integration of the integrated intelligent power module and realize the integrated drive control of multiple loads, such as fans and compressors, thereby reducing the volume of the electric control board and facilitating installation. At the same time, the components of the electric control board can be reduced, the PCB board layout of the electric control board can be simplified, and the production cost of the air conditioner can be effectively reduced. The present invention solves the problem that when the electric control board is implemented with multiple discrete components, there are many components, resulting in complicated assembly of the air conditioner, and the power consumption of the electric control board is large, and the heat generation is also serious, which leads to the thermal efficiency of the air conditioner, which is not conducive to the air conditioner to achieve energy saving and emission reduction.

[0062] It should be noted that the current research direction of energy conservation in the industry is still focused on improving the performance of home appliances, researching home appliance frequency conversion control, energy recovery, etc. This is because the chip manufacturers in the industry currently do not produce electrical appliances, and the manufacturers of electrical appliances do not produce chips. In addition, from the market perspective, the higher the chip integration, the higher the chip cost, and the narrower the market application scope. Conversely, the lower the chip integration, the lower the chip cost, and the wider the market application scope. Therefore, chip manufacturers basically do not conduct research in the direction of high integration. In order to further save energy and overcome industry prejudice, this patent starts from the intelligent power module that controls the work of the load, and provides a new path and direction for the industry to study energy conservation of electrical appliances by providing a highly integrated intelligent power module.

[0063] Reference Figure 1 and Figure 3 In an optional embodiment, the number of the plurality of power modules is two, and they are a fan drive power module 41 and a compressor drive power module 42 respectively.

[0064] In this embodiment, the fan drive power module 41 integrated in the highly integrated intelligent power module is used to drive the wind wheel motor, and the compressor drive power module 42 is used to drive the compressor motor. Of course, in other embodiments, the power module can also be used to drive the frequency converter and various inverter power supplies of other motors, and is applied to the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo drive, and variable frequency home appliances such as air conditioners. The fan drive power module 41 and the compressor drive power module 42 are respectively integrated with a plurality of power switch tubes such as IGBTs and MOS tubes. The number of the plurality of power switch tubes can be four or six, and the specific number can be set according to the motor type, drive power, etc., and is not limited here.

[0065] Reference Figure 1 and Figure 2 In an optional embodiment, the control module 30 includes an MCU, a PFC driver chip 31, a fan power driver chip 32 and a compressor power driver chip 33, the first control end of the MCU is connected to the signal input end of the PFC driver chip 31; the multiple second control ends of the MCU are connected one-to-one with the multiple signal input ends of the fan power driver chip 32; the multiple third control ends of the MCU are connected one-to-one with the multiple signal input ends of the compressor power driver chip 33; the multiple output ends of the fan power driver chip 32 are connected one-to-one with the multiple controlled ends of the fan drive power module 41; the multiple output ends of the compressor power driver chip 33 are connected one-to-one with the multiple controlled ends of the compressor drive power module 42.

[0066] In this embodiment, the MCU is integrated with a timing controller, a memory, a data processor, and a software program and / or module stored in the memory and executable on the data processor. The MCU outputs corresponding timing control signals to the PFC driver chip 31, the fan power driver chip 32, and the compressor power driver chip 33 by running or executing the software program and / or module stored in the memory and calling the data stored in the memory. In this way, the PFC driver chip 31 converts the received timing control signal into a corresponding drive signal to drive the power switch tube in the power switch module 20 to work. The fan power driver chip 32 converts the received timing control signal into a corresponding drive signal to drive the corresponding power switch tube in the fan power driver chip 32 to turn on / off, thereby driving the fan to work. And the compressor power driver chip 33 converts the received timing control signal into a corresponding drive signal to drive the corresponding power switch tube in each power module to turn on / off, thereby driving the compressor to work.

[0067] Reference Figure 1 and Figure 2In the above embodiment, the fan power driver chip 32, the compressor power driver chip 33, and the PFC driver chip 31 are all provided with real-time detection circuits such as temperature detection circuits, current detection circuits, and voltage detection circuits, so as to respectively detect the real-time detection circuits of the rectifier bridge 10, the power switch module 20, and the current, temperature, voltage and other parameters of each component in the power module, and when a serious overload or even a direct short circuit, or a temperature overheating, a driving voltage overvoltage and other faults occur, the power components in the power module can be controlled to be softly shut down, and a fault signal can be sent to the control circuit unit at the same time, so that the control circuit unit controls the operation of other circuit modules, thereby avoiding damage to other circuit modules due to the fault.

[0068] Specifically, the fan power driver chip 32 drives the fan drive power module 41 to work based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the fan drive power module 41; the compressor power driver chip 33 drives the compressor drive power module 42 to work based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the compressor drive power module 42; the PFC driver chip 31 drives the power switch module 20 to work based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the PFC driver chip.

[0069] It can be understood that the fan power driver chip 32 and the compressor power driver chip 33 generally have a high-voltage side power driver circuit and a low-voltage side power driver circuit, the high-voltage side power driver circuit includes a three-phase high-voltage side driver unit, and the low-voltage side power driver circuit includes a three-phase low-voltage side driver unit. In this embodiment, the number of the fan power driver chip 32 and the compressor power driver chip 33 can be one or more. For example, when the number of the fan power driver chip 32 is one, the three-phase high-voltage side driver unit and the three-phase low-voltage side driver unit are packaged and integrated in the same chip. When the number of the fan power driver chips 32 is two, the three-phase high-voltage side driver unit of the high-voltage side power driver circuit is packaged and integrated in a high-voltage integrated chip, and the three-phase low-voltage side power driver circuit of the low-voltage side power driver circuit is packaged and integrated in another low-voltage integrated chip. When the number of the fan power driver chips 32 is three, each phase high-voltage side driver unit of the three-phase high-voltage side driver unit corresponds to a phase high-voltage side driver unit in the three-phase low-voltage side driver unit and is packaged and integrated in the same chip. Alternatively, the number of the fan power driver chips 32 can be set to six independent ones, and the six independent fan power driver chips 32 correspond to the three-phase upper bridge arm power switch tubes and the three-phase lower bridge arm power switch tubes one by one. The specific setting method can be different according to the internal structure of the highly integrated intelligent power module, and is not limited here.

[0070] Reference Figure 1 and Figure 2 In an optional embodiment, the PFC driver chip 31, the fan power driver chip 32 and the compressor power driver chip 33 can be separately set as a chip, or packaged and integrated with other driver chips, that is, to form an integrated chip, for example, the PFC driver chip 31, the fan power driver chip 32 and the compressor power driver chip 33 can be packaged and integrated in the same chip, or the PFC driver chip 31 and the fan power driver chip 32 are packaged and integrated in the same chip, or the PFC driver chip 31 and the compressor power driver chip 33 are packaged and integrated in the same chip, or the fan power driver chip 32 and the compressor power driver chip 33 are packaged and integrated in the same chip. In this embodiment, the PFC driver chip 31, the fan power driver chip 32 and the compressor power driver chip 33 can be respectively integrated into an independent chip. Of course, in other embodiments, the PFC driver chip 31, the fan power driver chip 32 and the compressor power driver chip 33 can also be set in other forms and other forms, which are not limited here.

[0071] Reference Figure 1 and Figure 2 In the above embodiment, the control module 30 may further include a rectifier bridge protection chip 34 , and a detection end of the rectifier bridge protection chip 34 is connected to the output end of the rectifier bridge 10 .

[0072] In this embodiment, the rectifier bridge protection chip 34 integrates a temperature detection circuit, a current detection circuit, and a voltage detection circuit to respectively detect the temperature, current, and voltage of the rectifier bridge 10, and when the rectifier bridge 10 has a short circuit, overcurrent, or overheating, driving voltage overvoltage, or other faults, it can control the power elements in the power module to softly shut down, and control other circuit modules to stop working, so that the working power module stops outputting power.

[0073] Reference Figure 1 and Figure 3 In an optional embodiment, the fan drive power module 41 includes a fan power drive chip 411 and a fan drive inverter circuit 412, and the multiple signal input terminals of the fan power drive chip 411 are connected one-to-one with the multiple control terminals of the control module 30, and the multiple output terminals of the fan power drive chip 411 are connected one-to-one with the multiple controlled terminals of the fan drive inverter circuit 412.

[0074] In this embodiment, the fan power driver chip 411 and the fan drive inverter circuit 412 can be integrated into an integrated chip, that is, packaged into an integrated chip, so that the fan power driver chip 411 and the fan drive inverter circuit 412 are integrated.

[0075] Reference Figure 1 and Figure 2 In an optional embodiment, the compressor drive power module 42 includes a compressor power drive chip 421 and a compressor drive inverter circuit 422, the multiple signal input terminals of the compressor power drive chip 421 are connected one-to-one with the multiple control terminals of the control module 30, and the multiple output terminals of the compressor power drive chip 421 are connected one-to-one with the multiple controlled terminals of the compressor drive inverter circuit 422.

[0076] In this embodiment, the compressor driving power driving chip and the compressor driving inverter circuit 422 can be integrated into an integrated chip, that is, packaged as an integrated chip, so that the compressor driving power driving chip and the compressor driving inverter circuit 422 are integrated.

[0077] Reference Figures 1 to 3 In an optional embodiment, the power switch module 20 includes a PFC driver chip 31 and a passive PFC unit (not shown), the signal input end of the PFC driver chip 31 is connected to the control end of the control module 30, and the signal output end of the PFC driver chip 31 is connected to the controlled end of the passive PFC unit.

[0078] In this embodiment, the PFC driver chip 31 and the passive PFC unit may be packaged and integrated into an integrated chip, that is, packaged into an integrated chip, so that the PFC driver chip 31 and the passive PFC unit are integrated.

[0079] The PFC unit includes a power switch tube (not shown) and a first diode (not shown), as well as a first lead-out terminal and a second lead-out terminal for connecting to an external switch power supply, respectively. The gate of the power switch tube is connected to the control end of the control module 30, the emitter of the power switch tube is connected to the first lead-out terminal, the power switch tube is connected to the anode of the first diode, and the cathode of the first diode is used to connect to the external switch power supply via the second lead-out terminal. The anode of the first diode is connected to the collector of the power switch tube, the cathode of the diode, and the emitter lead-out terminal of the power switch tube to connect the components in the external switch power supply circuit.

[0080] It should be noted that the PFC unit can also be provided with a second diode according to the type of the power switch tube. For example, when the power switch tube is set to an IGBT, the anode of the second diode is connected to the anode of the power switch tube, and the cathode of the second diode is connected to the collector of the power switch tube. The second diode is a high-power anti-parallel diode (which can be an FRD, Fast Recovery Diode) for realizing fast shutdown of the power switch tube. The PFC unit can also include an inductor, and the position of the inductor and the connection relationship with the power switch tube and the first diode can be adaptively set according to the type of the PFC unit, and is not limited here.

[0081] It can be understood that in the above embodiments, the MCU, each single bare chip in the power switch module 20, each single bare chip in the fan drive power module 41, and each single bare chip in the compressor drive power module 42 can be first integrated into an independent chip, and then repackaged with the power switch tube in each power module, and integrated into an integrated arrangement to obtain a highly integrated intelligent power module.

[0082] Reference Figures 1 to 3 In an optional embodiment, the highly integrated intelligent power module further includes a packaging shell (not shown), and the packaging shell covers the mounting carrier 100, and the control module 30, the rectifier bridge 10, the power switch module 20 and the plurality of power modules 40 integrated on the mounting carrier 100, or the packaging shell wraps the mounting carrier 100, and the control module 30, the rectifier bridge 10, the power switch module 20 and the plurality of power modules 40 integrated on the mounting carrier 100.

[0083] In this embodiment, the packaging shell may be a resin frame of an epoxy resin molding compound, and the packaging shell may be formed of any one of a thermosetting material and a thermoplastic material.

[0084] Specifically, when the package shell can be covered on the mounting substrate, the control module 30, the rectifier bridge 10, the power switch module 20 and the multiple power modules 40, the highly integrated intelligent power module does not need to be separately provided with a heat sink to dissipate the heat of the power components in the highly integrated intelligent power module, and the lower surface of the mounting carrier 100 is exposed outside the package to accelerate the heat dissipation of each component. Or the package shell is wrapped around the mounting carrier 100, and the periphery of the control module 30, the rectifier bridge 10, the power switch module 20 and the multiple power modules 40 integrated on the mounting carrier 100, so that the package shell and the mounting substrate, the control module 30, the rectifier bridge 10, the power switch module 20 and the multiple power modules 40 are integrally formed. When the package shell and the mounting carrier 100, the control module 30, the rectifier bridge 10, the power switch module 20 and the multiple power modules 40 are integrally formed, they can be integrally formed by a plastic encapsulation or potting process.

[0085] The present invention further proposes an electrical device, the electrical device comprising the highly integrated intelligent power module as described above. The detailed structure of the highly integrated intelligent power module can be referred to the above embodiment, and will not be described in detail here; it can be understood that since the highly integrated intelligent power module is used in the air conditioner of the present invention, the embodiment of the air conditioner of the present invention includes all technical solutions of all embodiments of the highly integrated intelligent power module, and the technical effects achieved are also exactly the same, and will not be described in detail here.

[0086] In this embodiment, the electrical device may be a refrigeration device such as an air conditioner or a refrigerator.

[0087] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A highly integrated intelligent power module, characterized in that: The highly integrated intelligent power module comprises: A rectifier bridge, used to connect to an AC power source and rectify the AC power source into a DC power source; A control module, configured to output a first control signal and a second control signal; a power switch module, configured to operate according to the first control signal so that a PFC circuit constituted by the power switch module performs power factor correction on the DC power supply; a plurality of power modules, configured to drive corresponding loads to operate according to the second control signal and the DC power supply after power factor correction; and A mounting carrier, on which the control module, the rectifier bridge, the power switch module and the plurality of power modules are integrated; The number of the power modules is two, and they are a fan drive power module and a compressor drive power module respectively; the fan drive power module includes a fan power drive chip and a fan drive inverter circuit, and the fan power drive chip and the fan drive inverter circuit are integrated into an integrated chip; the compressor drive power module includes a compressor power drive chip and a compressor drive inverter circuit, and the compressor power drive chip and the compressor drive inverter circuit are integrated into an integrated chip; The power switch module includes a PFC driver chip and a passive PFC unit, and the PFC driver chip and the passive PFC unit are packaged into an integrated chip.

2. The highly integrated intelligent power module according to claim 1, characterized in that: The control module includes an MCU, a PFC driver chip, a fan power driver chip, and a compressor power driver chip. The MCU has a first control end, a plurality of second control ends and a plurality of third control ends, the first control end of the MCU is connected to the signal input end of the PFC driver chip; the plurality of second control ends of the MCU are connected to the plurality of signal input ends of the fan power driver chip in a one-to-one correspondence; the plurality of third control ends of the MCU are connected to the plurality of signal input ends of the compressor power driver chip in a one-to-one correspondence; The signal output end of the PFC driver chip is connected to the controlled end of the power switch module; The multiple output terminals of the fan power driving chip are connected to the multiple controlled terminals of the fan driving power module in a one-to-one correspondence; The multiple output terminals of the compressor power driving chip are connected to the multiple controlled terminals of the compressor driving power module in a one-to-one correspondence.

3. The highly integrated intelligent power module according to claim 2, characterized in that: The fan power driving chip drives the fan driving power module to work based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the fan driving power module; The compressor power driving chip drives the compressor driving power module to work based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the compressor driving power module; The PFC driving chip drives the power switch module to operate based on the control of the MCU and according to the detected current signal, voltage signal and temperature signal of the compressor driving power module.

4. The highly integrated intelligent power module according to claim 2, characterized in that: The control module also includes a rectifier bridge protection chip, and a detection end of the rectifier bridge protection chip is connected to the output end of the rectifier bridge.

5. The highly integrated intelligent power module according to claim 2, characterized in that: The PFC driver chip, the fan power driver chip and the compressor power driver chip are packaged into an integrated chip.

6. The highly integrated intelligent power module according to claim 2, characterized in that: The PFC driver chip and the fan power driver chip are packaged as an integrated chip, or the PFC driver chip and the compressor power driver chip are packaged as an integrated chip.

7. The highly integrated intelligent power module according to claim 2, characterized in that: The fan power driving chip and the compressor power driving chip are packaged into an integrated chip.

8. The highly integrated intelligent power module according to claim 1, characterized in that: The fan drive power module includes a fan power drive chip and a fan drive inverter circuit. The multiple signal input terminals of the fan power drive chip are connected one-to-one with the multiple control terminals of the control module, and the multiple output terminals of the fan power drive chip are connected one-to-one with the multiple controlled terminals of the fan power module.

9. The highly integrated intelligent power module according to claim 8, characterized in that: The fan power drive chip and the fan power module are packaged as an integrated chip.

10. The highly integrated intelligent power module according to claim 1, characterized in that: The compressor drive power module includes a compressor power drive chip and a compressor drive inverter circuit. The multiple signal input ends of the compressor power drive chip are connected one-to-one with the multiple control ends of the control module, and the multiple output ends of the compressor power drive chip are connected one-to-one with the multiple controlled ends of the compressor power module.

11. The highly integrated intelligent power module according to claim 10, characterized in that: The compressor power drive chip and the compressor power module are packaged as an integrated chip.

12. The highly integrated intelligent power module according to claim 1, characterized in that: The power switch module includes a PFC driver chip and a passive PFC unit. The signal input end of the PFC driver chip is connected to the control end of the control module, and the signal output end of the PFC driver chip is connected to the controlled end of the passive PFC unit.

13. The highly integrated intelligent power module according to claim 12, characterized in that: The PFC unit includes a power switch tube and a first diode, and a first lead terminal and a second lead terminal for respectively connecting to an external switching power supply, the gate of the power switch tube is connected to the control end of the control module, the emitter of the power switch tube is connected to the first lead terminal, the collector of the power switch tube is connected to the anode of the first diode, and the cathode of the first diode is used to connect to the external switching power supply via the second lead terminal.

14. The highly integrated intelligent power module according to any one of claims 1 to 13, characterized in that: The highly integrated intelligent power module further comprises a packaging shell, which is covered on the mounting carrier, and the control module, the rectifier bridge, the power switch module and a plurality of power modules integrated on the mounting carrier.

15. The highly integrated intelligent power module according to any one of claims 1 to 13, characterized in that: The highly integrated intelligent power module further comprises a packaging shell, which is wrapped around the periphery of the mounting carrier, the control module, the rectifier bridge, the power switch module and the plurality of power modules.

16. The highly integrated intelligent power module according to any one of claims 1 to 13, characterized in that: The mounting carrier is a PCB board and / or a lead frame.

17. An electrical device, characterized in that: Comprising a highly integrated intelligent power module as described in any one of claims 1 to 16.

18. The electrical device according to claim 17, characterized in that: The electrical equipment is an air conditioner or a refrigerator.

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