Optical transmitter components, optical transceivers, and optical communication systems

Abstract

This application relates to an optical emitting component, an optical transceiver, and an optical communication system. One optical emitting component includes: a control circuit; a substrate body; a first metal layer and a second metal layer spaced apart on the substrate body; a laser disposed on the first metal layer; the laser being electrically connected to the control circuit through the first metal layer; and a heating device disposed on the second metal layer; the heating device is positioned close to the laser, and one end of the heating device is electrically connected to the control circuit through the second metal layer. In this application, the laser can be electrically connected to the control circuit through the first metal layer, and the heating device can be electrically connected to the control circuit through the second metal layer. The heating device can switch its operating state according to the control of the control circuit, thereby enabling the laser to operate above a specific temperature and ensuring the laser's performance. This improves the yield rate of the optical emitting component and reduces its cost.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical transmitting component, an optical transceiver, and an optical communication system. Background Technology

[0002] With the development of communication technology, 5G (5th Generation Mobile Networks) communication technology has emerged. Due to its high bandwidth and low latency, 5G communication can be applied in fields requiring massive information communication, such as the Internet of Things, autonomous driving, and AI (Artificial Intelligence).

[0003] 5G signals are characterized by high frequency, resulting in significant signal loss during transmission. Therefore, typical 25Gbps (gigabits per second) WDM (Wavelength Division Multiplexing) optical modules employ a wavelength-tunable scheme, the schematic diagram of which is shown below. Figure 1 As shown.

[0004] However, during the implementation process, the inventors discovered at least the following problems with traditional technologies: current light-emitting components have a high overall cost. Summary of the Invention

[0005] Therefore, it is necessary to provide a low-cost optical transmitting component, optical transceiver, and optical communication system to address the aforementioned technical problems.

[0006] To achieve the above objectives, this application provides a light emitting component, including a control circuit and a substrate body; a first metal layer and a second metal layer are disposed on the substrate body at intervals.

[0007] It also includes a laser disposed on a first metal layer and a heating device disposed on a second metal layer; the laser is electrically connected to a control circuit through the first metal layer; the heating device is disposed close to the laser, and one end of the heating device is electrically connected to the control circuit through the second metal layer.

[0008] The control circuit acquires the current operating temperature of the laser and transmits an operating status control signal to the heating device based on the current operating temperature; the heating device switches operating states according to the received operating status control signal to adjust the operating temperature of the laser.

[0009] In one embodiment, it also includes a base, a heat sink, and pins extending through both sides of the base; the other end of the heating device is electrically connected to the base;

[0010] The heat sink is mounted on the base; the substrate body is attached to the heat sink, and the side of the substrate body with the first metal layer faces the pin.

[0011] In one embodiment, a through hole is formed on the second metal layer, penetrating both sides of the substrate body; the other end of the heating device is electrically connected to the heat sink through the through hole.

[0012] In one embodiment, a monitoring diode is also included between the substrate body and the pin;

[0013] The negative terminal of the monitoring diode is electrically connected to the control circuit, and the positive terminal is electrically connected to the base.

[0014] In one embodiment, a pad is further included; the pad includes a first contact surface and a second contact surface opposite to the first contact surface; a conductive layer is formed on the first contact surface;

[0015] The negative electrode of the monitoring diode is bonded to the conductive layer, which is electrically connected to the control circuit; the second contact surface is bonded to the base.

[0016] In one embodiment, it also includes a laser driving circuit and a first clock data recovery circuit for connecting to an external electrical signal processing circuit;

[0017] The laser driving circuit is connected to the laser, the monitoring diode, the control circuit, and the first clock data recovery circuit; the first clock data recovery circuit is connected to the control circuit.

[0018] In one embodiment, the laser is disposed on the side of the substrate body away from the base;

[0019] The heating device is positioned between the laser and the base, and the distance between the center of the heating device and the center of the laser is minimized.

[0020] In one embodiment, a solder layer is further included between the first metal layer and the laser;

[0021] The laser is electrically connected to the control circuit through the solder layer and the first metal layer in sequence.

[0022] In one embodiment, the heating device is a thin-film resistor;

[0023] The laser is an FP laser with a rate greater than or equal to 25 Gbps, or a DFB laser with a rate greater than or equal to 25 Gbps.

[0024] This application also provides an optical transceiver, including a photodetector, a second clock data recovery circuit, and an optical emitting component in any of the above embodiments; the second clock data recovery circuit is used to connect to an external electrical signal processing circuit.

[0025] The photodetector is connected to the control circuit and the second clock data recovery circuit respectively; the second clock data recovery circuit is connected to the control circuit.

[0026] This application also provides an optical communication system, including an optical fiber and a plurality of optical transceivers as described in any of the above embodiments; the optical fiber is connected to each optical transceiver.

[0027] One of the above technical solutions has the following advantages and beneficial effects.

[0028] A first metal layer and a second metal layer are spaced apart on the substrate. The laser is disposed on the first metal layer, and the heating device is disposed on the second metal layer. The heating device is positioned close to the laser, so that the laser can be electrically connected to the control circuit through the first metal layer, and the heating device can be electrically connected to the control circuit through the second metal layer. The heating device can switch its working state according to the control of the control circuit, so that the laser can operate above a specific temperature and ensure the working performance of the laser. This can improve the yield of the light emitting component and reduce the cost of the light emitting component. Attached Figure Description

[0029] The above and other objects, features, and advantages of this application will become clearer through a more detailed description of the preferred embodiments illustrated in the accompanying drawings. The same reference numerals denote the same parts throughout the drawings, and the drawings are not intentionally drawn to scale with actual dimensions; the focus is on illustrating the main points of this application.

[0030] Figure 1 This is a schematic diagram of the framework of a traditional color light module;

[0031] Figure 2 A schematic diagram of the light-emitting component encapsulated in a gold box;

[0032] Figure 3 This is a schematic diagram of the first structure of the light emitting component in one embodiment;

[0033] Figure 4 This is a schematic diagram of the second structure of the light emitting component in one embodiment;

[0034] Figure 5 This is a schematic block diagram of a light emitting component in one embodiment;

[0035] Figure 6 This is a schematic diagram of the structure of an optical transceiver in one embodiment;

[0036] Figure 7 This is a schematic diagram of the structure of an optical communication system in one embodiment. Detailed Implementation

[0037] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate preferred embodiments of the application. However, this application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0038] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to and integrated with the other element, or there may be an intervening element present. The terms "located at," "fitted at," "one side," "first side," "second side," and similar expressions used in this document are for illustrative purposes only.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0040] Currently, most tunable lasers used employ Sampled Grating Distributed Bragg Reflectors (SG-DBR). Tunable lasers need to be packaged in a Thermoelectric Cooler (TEC). Wavelength tunability is achieved by controlling the operating temperature of the tunable laser. To improve the reliability of the optical emitting component, the TEC, laser chip, monitoring diode, focusing lens, optical isolator, and other components all need to be packaged in a gold box. The gold box packaging process is quite complex, requires high surface mount precision, and necessitates specialized equipment for coupling between the laser, lens, and optical fiber. The structure of a gold box-packaged optical emitting component can be described as follows: Figure 2 As shown, the optical transmitting component also requires the addition of a TEC control chip and corresponding circuitry. Compared to DFB (Distributed Feedback Laser) and FP (Fabry-Perot) lasers, the manufacturing process of SG-DBR lasers is more complex. Furthermore, currently, the low-temperature operating temperature of 25Gbps lasers is difficult to reach the true industrial-grade limit of -40℃ (set temperature), resulting in low yield and increased cost of optical transceiver components. In addition, SG-DBR lasers have high overall power consumption and complex hardware design.

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0042] In one embodiment, Figure 3 As shown, a light emitting component is provided, including a control circuit and a substrate body 110; a first metal layer 120 and a second metal layer 130 are disposed on the substrate body 110 at intervals.

[0043] It also includes a laser 140 disposed on the first metal layer 120 and a heating device 150 disposed on the second metal layer 130; the laser 140 is electrically connected to the control circuit through the first metal layer 120; the heating device 150 is disposed close to the laser 140, and one end of the heating device 150 is electrically connected to the control circuit through the second metal layer 130.

[0044] The control circuit acquires the current operating temperature of the laser 140 and transmits an operating status control signal to the heating device 150 based on the current operating temperature; the heating device 150 switches operating statuses according to the received operating status control signal to adjust the operating temperature of the laser 140.

[0045] Specifically, the substrate body 110 can have good insulation properties; for example, the substrate body 110 can be an aluminum nitride ceramic substrate. A first metal layer 120 and a second metal layer 130 are spaced apart on the outer surface of the substrate body 110, and the first metal layer 120 and the second metal layer 130 are disposed on the same outer surface of the substrate body 110. The spaced-apart arrangement can mean that the first metal layer 120 and the second metal layer 130 are not electrically connected, that is, there is no direct contact area between the first metal layer 120 and the second metal layer 130, and the space between the first metal layer 120 and the second metal layer 130 can be filled with a material with good insulation properties.

[0046] For example, the first metal layer 120 partially covers the substrate body 110 and is completely surrounded by the substrate body 110; the second metal layer 130 partially covers the substrate body 110 and is completely surrounded by the substrate body 110, wherein the coverage area of ​​the first metal layer 120 and the coverage area of ​​the second metal layer 130 are independent of each other and there is no overlapping area.

[0047] The pattern of the first metal layer 120 can be an "n" shape or its variations, or Figure 3-4 The diagram shows the graphic and its variations. Furthermore, the pattern of the first metal layer 120 can be determined according to actual conditions and design requirements. The pattern of the second metal layer 130 can be an "n" shape or... Figure 3-4In the diagram shown, in one example, the coverage area of ​​the second metal layer 130 may be smaller than that of the first metal layer 120. Furthermore, the pattern of the second metal layer 130 can be determined according to actual conditions and design requirements.

[0048] The laser 140 is disposed on the first metal layer 120 and connected to the control circuit through the first metal layer 120, so that the laser 140 can form a laser loop with the control circuit. The control circuit can acquire the temperature signal, operating voltage signal, DC bias current signal, emitted optical power signal and received optical power of the laser 140.

[0049] Furthermore, the first metal layer 120 may include a first connection region and a second connection region that are independent of each other. A laser may be disposed in the first connection region, such that one end of the laser can be connected to the control circuit through the first connection region, and the laser is connected to the second connection region through a conductive line, so that the other end of the laser can be connected to the control circuit through the second connection region.

[0050] A heating device 150 is disposed on the second metal layer 130, and the heating device 150 is positioned close to the laser 140. The arrangement of the heating device 150 close to the laser 140 includes, but is not limited to, situations where the distance between the center of the heating device 150 and the center of the laser 140 is less than or equal to a preset threshold; or a coverage area within the second metal layer 130 where the distance between the center of the heating device 150 and the center of the laser 140 is less than or equal to the preset threshold. Further, the placement area of ​​the heating device 150 can be determined based on the distance between the center of the heating device 150 and the center of the laser 140 being less than or equal to the preset threshold, and the coverage area of ​​the second metal layer 130 can be determined based on the placement area of ​​the heating device 150; or, after determining the coverage area of ​​the second metal layer 130, the placement area of ​​the heating device 150 can be determined based on the coverage area within the second metal layer 130 where the distance between the center of the laser 140 and the preset threshold is less than or equal to the preset threshold.

[0051] One end of the heating device 150 can be connected to the control circuit via the second metal layer 130. Furthermore, the other end of the heating device 150 can be grounded, enabling a heating loop to be formed between the heating device 150 and the control circuit. Furthermore, the size of the second metal layer 130 can be determined based on the size of the first metal layer 120, the optical communication bandwidth, and / or the optical communication frequency band. In one example, the control circuit may include an MCU (Microcontroller Unit).

[0052] The control circuit acquires the temperature signal of the laser 140 through the laser circuit and transmits an operating status control signal to the heating device 150 based on the temperature signal. The heating status control signal is used to instruct the heating device 150 to switch its operating state. For example, the control circuit obtains the current operating temperature of the laser 140 based on the temperature signal of the laser 140. When the current operating temperature of the laser 140 reaches a set temperature threshold, it transmits an operating status control signal to the laser 140 to execute the start-up and shutdown of the heating device 150.

[0053] The heating device 150 switches its operating state according to the received operating state control signal. For example, it can switch from an on state to an off state, or from an off state to an on state, or from a first heating state to a second heating state, wherein the heating power of the first heating state and the second heating state are different.

[0054] When the heating device 150 is in the start-up state, the heat generated by the heating device 150 can be conducted to the laser 140 to adjust the operating temperature of the laser 140 in the subsequent period, so that the laser 140 can operate above a certain temperature, such as above 0°C, avoiding the laser 140 operating at a lower operating temperature (such as -40°C), thereby ensuring the performance of the laser 140.

[0055] In the aforementioned light emitting component, a first metal layer 120 and a second metal layer 130 are spaced apart on the substrate body 110. A laser 140 is disposed on the first metal layer 120, and a heating device 150 is disposed on the second metal layer 130. The heating device 150 is positioned close to the laser 140, thereby enabling the laser 140 to be electrically connected to the control circuit through the first metal layer 120, and the heating device 150 to be electrically connected to the control circuit through the second metal layer 130. The heating device 150 can switch its operating state according to the control of the control circuit, thereby enabling the laser 140 to operate above a specific temperature and ensuring the working performance of the laser 140. This improves the yield of the light emitting component and reduces its cost.

[0056] In one embodiment, Figure 4 As shown, a light emitting component is provided, including:

[0057] Control circuit;

[0058] Substrate body 110; a first metal layer 120 and a second metal layer 130 are disposed on the substrate body 110 at intervals.

[0059] A laser 140 is disposed on the first metal layer 120; the laser 140 is electrically connected to a control circuit through the first metal layer 120.

[0060] A heating device 150 is disposed on the second metal layer 130; one end of the heating device 150 is electrically connected to a control circuit through the second metal layer 130.

[0061] It also includes a base 210, a heat sink 220, and pins 230 penetrating both sides of the base 210; the other end of the heating device 150 is electrically connected to the base 210;

[0062] The heat sink 220 is mounted on the base 210; the substrate body 110 is attached to the heat sink 220, and the side of the substrate body 110 with the first metal layer 120 faces the pin 230.

[0063] Specifically, the base 210 includes a top surface and a bottom surface opposite to the top surface. The pin 230 extends from the bottom surface of the base 210 to the top surface of the base 210, and there is no electrical connection between the pin 230 and the base 210. In one example, the pin 230 can be connected to the base 210 using a material with good insulation properties. For example, a glass layer can be provided between the pin 230 and the base 210, allowing the pin 230 to be fixed to the base 210 without direct contact. Furthermore, each device module disposed on the base 210, each device module disposed on the heat sink 220, and each device module disposed on the substrate body 110 can be connected to one end of the corresponding pin 230 via conductive wires, while the other end of the corresponding pin 230 is connected to the control circuit. This eliminates the need for the control circuit to be disposed on the base 210, improving the applicability of the light emitting component and reducing its size.

[0064] A heat sink 220 is mounted on the top surface of the base 210, and the side of the heat sink 220 facing the pin 230 is attached to the substrate body 110. The substrate body 110 may include a first substrate surface and a second substrate surface opposite to the first substrate surface. A first metal layer 120 and a second metal layer 130 are formed at intervals on the first substrate surface. In this case, the first substrate surface faces the pin 230, and the second substrate surface is attached to the heat sink 220. Furthermore, the heat sink 220 and the base 210 can be an integrated structure.

[0065] The voltage of the base 210 or the heat sink 220 can be used as a reference voltage. When one end of the device is connected to the base 210 or the heat sink 220, that end of the device can be considered grounded. The other end of the heating device 150 is electrically connected to the base 210, that is, the other end of the heating device 150 is grounded.

[0066] Furthermore, the number of pins 230 can be four, that is, the light emitting component includes a first pin 231, a second pin 232, a third pin 233, and a fourth pin 234, and each pin 230 extends from the bottom surface of the base 210 to the top surface of the base 210. The first metal layer 120 includes a first electrode region and a second electrode region.

[0067] The first pin 231 can be electrically connected to the first electrode region, thereby connecting to the positive electrode of the laser 140 through the first metal layer 120. The second pin 232 can be electrically connected to the second electrode region, thereby connecting to the negative electrode of the laser 140 through the first metal layer 120. Alternatively, the first pin 231 can be connected to the negative electrode of the laser 140 through the first metal layer 120, and the second pin 232 can be connected to the positive electrode of the laser 140 through the first metal layer 120. In one example, the first pin 231 can be fixed to the first electrode region with conductive adhesive, and the second pin 232 can be fixed to the second electrode region with conductive adhesive, avoiding poor contact between the pin 230 and the electrode region, and improving the stability of signal transmission and the reliability of the optical emitting component.

[0068] In one specific embodiment, a through hole 240 is formed on the second metal layer 130, penetrating both sides of the substrate body 110; the other end of the heating device 150 is electrically connected to the heat sink 220 through the through hole 240.

[0069] Specifically, a through hole 240 is formed on the second metal layer 130, penetrating both sides of the substrate body 110. That is, the through hole 240 penetrates from the first surface of the substrate to the second surface of the substrate, so that the other end of the heating device 150 can be connected to the heat sink 220 through the through hole 240 and grounded.

[0070] Furthermore, the second metal layer 130 may include a third electrode region and a fourth electrode region. The third pin 233 may be electrically connected to the fourth electrode region, thereby connecting to one end of the heating device through the second metal layer 130. The through hole 240 may be formed in the third electrode region, thereby connecting the other end of the heating device 150 to the heat sink 220.

[0071] In one specific embodiment, a monitoring diode 250 is also included between the substrate body 110 and the pin 230;

[0072] The negative terminal of the monitoring diode 250 is electrically connected to the control circuit, and the positive terminal is electrically connected to the base 210.

[0073] Specifically, the first surface of the substrate body 110 faces the pin 230, and the monitoring diode 250 is fixed on the base 210 and disposed between the first surface of the substrate and the pin 230. The negative terminal of the monitoring diode 250 is electrically connected to the control circuit, and the positive terminal is electrically connected to the base 210, thereby enabling the monitoring diode 250 to form a monitoring loop with the control circuit. At the same time, the negative terminal of the monitoring diode 250 can also be connected to the laser driving circuit, thereby enabling the monitoring diode 250 to form an emitted light power feedback loop with the laser driving circuit.

[0074] Furthermore, the negative terminal of the monitoring diode 250 can be connected to one end of the fourth pin 234 via a conductive wire, and the other end of the fourth pin 234 can be connected to the control circuit, thereby realizing the electrical connection between the negative terminal of the monitoring diode 250 and the control circuit. At the same time, the other end of the fourth pin 234 can also be electrically connected to the laser driving circuit. The positive terminal of the monitoring diode 250 can be connected to the base 210 via a conductive wire, so that the positive terminal of the monitoring diode 250 can be grounded.

[0075] In one specific embodiment, a pad 260 is also included; the pad 260 includes a first contact surface and a second contact surface opposite to the first contact surface; a conductive layer is formed on the first contact surface;

[0076] The negative electrode of the monitoring diode 250 is attached to the conductive layer, which is electrically connected to the control circuit; the second contact surface is attached to the base 210.

[0077] Specifically, the pad 260 includes a first contact surface and a second contact surface, which are opposite to each other. A conductive layer is formed on the first contact surface, which may partially or completely cover the first contact surface. The negative electrode of the monitoring diode 250 is attached to the conductive layer. By electrically connecting the conductive layer to the control circuit and / or the laser driving circuit, the negative electrode of the monitoring diode 250 can be connected to the control circuit and / or the laser driving circuit through the conductive layer. In one example, the conductive layer can be connected to one end of the fourth pin 234 via a conductive wire, and the positive electrode of the monitoring diode 250 can be electrically connected to the base 210 via a conductive wire.

[0078] The second contact surface of the pad 260 is in contact with the base 210, thereby fixing the monitoring diode 250 in place. The monitoring diode 250 is mounted on the pad 260, which reduces the distance between the center of the monitoring diode 250 and the center of the laser 140, thereby increasing the received emitted light power of the monitoring diode 250.

[0079] In a specific embodiment, Figure 5 As shown, it also includes a laser driving circuit and a first clock data recovery circuit for connecting to an external electrical signal processing circuit;

[0080] The laser driving circuit is connected to the laser 140, the monitoring diode 250, the control circuit, and the first clock data recovery circuit, respectively; the first clock data recovery circuit is connected to the control circuit.

[0081] Specifically, the first clock data recovery circuit is used to connect to an external electrical signal processing circuit. In one example, the first clock data recovery circuit can be used to connect to a 25G Ethernet port.

[0082] An external electrical signal processing circuit is connected to a first clock data recovery circuit, which in turn is connected to a laser 140 driving circuit. The laser 140 driving circuit is connected to the laser 140. The first clock data recovery circuit extracts the first electrical signal transmitted from the external electrical signal processing circuit, determines the phase relationship between the clock signal and the data signal in the first electrical signal, and transmits the processed signal to the laser driving circuit. The laser driving circuit drives the laser 140 to convert the first electrical signal into a first optical signal and outputs the first optical signal. In one example, the first optical signal can be output via a 25G optical port.

[0083] The monitoring diode 250 is connected to the laser drive circuit, which allows the laser drive circuit to adjust the emitted light power according to the signal fed back by the monitoring diode 250.

[0084] Furthermore, the control circuit includes a controller and a digital diagnostic monitoring circuit connected to the controller. The controller is connected to the laser through a first metal layer 120 and to the heating device 150 through a second metal layer 130. The controller is also connected to the laser drive circuit and the first clock data recovery circuit. The digital diagnostic monitoring circuit can be used to monitor the characteristic parameters of the optical emitting component in real time, such as the operating temperature of the laser 140, the operating voltage of the laser 140, the DC bias current, the emitted optical power, and the received optical power. The controller can control the operating status of the heating device 150 based on the operating temperature of the laser 140 fed back by the digital diagnostic monitoring circuit.

[0085] In one specific embodiment, the laser 140 is disposed on the side of the substrate body 110 away from the base 210;

[0086] The heating device 150 is positioned between the laser 140 and the base 210, and the distance between the center of the heating device 150 and the center of the laser 140 is minimized.

[0087] Specifically, the first surface of the substrate of the substrate body 110 can be disposed perpendicular to the top surface of the base 210, or the first surface of the substrate of the substrate body 110 can be disposed nearly perpendicularly on the top surface of the base 210. Nearly perpendicular means perpendicular within a certain angular deviation range.

[0088] The laser 140 is located on the substrate body 110 and is disposed on the side away from the base 210. The heating device 150 is located on the substrate body 110 and is disposed between the laser 140 and the base. The placement area of ​​the heating device 150 can be determined according to the distance between the center of the heating device 150 and the center of the laser 140, and the heating device 150 can be placed in the area closest to the center of the laser 140. At this time, the first metal layer 120 and the second metal layer 130 are disposed alternately.

[0089] This application simplifies the wiring of the light emitting component by placing the heating device 150 between the laser 140 and the base 210, and minimizing the distance between the center of the heating device 150 and the center of the laser 140, thereby avoiding the use of transition blocks and reducing the cost of the light emitting component.

[0090] In one embodiment, a light emitting component is provided, comprising:

[0091] Control circuit;

[0092] Substrate body 110; a first metal layer 120 and a second metal layer 130 are disposed on the substrate body 110 at intervals.

[0093] A laser 140 is disposed on the first metal layer 120; the laser 140 is electrically connected to a control circuit through the first metal layer 120.

[0094] A heating device 150 is disposed on the second metal layer 130; one end of the heating device 150 is electrically connected to a control circuit through the second metal layer 130.

[0095] This also includes a solder layer disposed between the first metal layer 120 and the laser 140;

[0096] The laser 140 is electrically connected to the control circuit through the solder layer and the first metal layer 120 in sequence.

[0097] Specifically, a first metal layer 120 is formed on the substrate body 110, and a solder layer is formed on the first metal layer 120. The solder layer may be covered with gold tin. The laser 140 is soldered to the solder layer and connected to the control circuit in sequence through the solder layer and the first metal layer 120.

[0098] Furthermore, the size of the solder layer can be determined based on the size of the laser 140.

[0099] In one specific embodiment, the heating device 150 is a thin-film resistor;

[0100] Laser 140 is an FP laser with a rate greater than or equal to 25 Gbps, or a DFB laser with a rate greater than or equal to 25 Gbps.

[0101] Specifically, the heating device 150 can be a heating resistor. Further, the heating device 150 includes, but is not limited to, thin-film resistors, chip resistors, or wire bonding resistors. The heating device 150 can be selected according to the actual situation and design requirements.

[0102] FP lasers have a rate greater than or equal to 25 Gbps, meaning that the rate of an FP laser can be 25 Gbps or higher. FP lasers include uncooled FP lasers, commercial-grade FP lasers, and non-industrial-grade FP lasers. DFB lasers have a rate greater than or equal to 25 Gbps, meaning that the rate of a DFB laser can be 25 Gbps or higher. DFB lasers include uncooled DFB lasers, commercial-grade DFB lasers, and non-industrial-grade DFB lasers.

[0103] In one embodiment, Figure 6 As shown, an optical transceiver is provided, including a photodetector, a second clock data recovery circuit, and an optical emitting component in any of the above embodiments; the second clock data recovery circuit is used to connect to an external electrical signal processing circuit.

[0104] The photodetector is connected to the control circuit and the second clock data recovery circuit respectively; the second clock data recovery circuit is connected to the control circuit.

[0105] Specifically, the second clock data recovery circuit is used to connect to an external electrical signal processing circuit. The photodetector is connected to the second clock data recovery circuit. When the photodetector receives the second optical signal, it can convert the second optical signal into a second electrical signal and transmit the second electrical signal to the second clock data recovery circuit. The second clock data recovery circuit can extract the second electrical signal and determine the phase relationship between the clock signal and the data signal in the second electrical signal.

[0106] Furthermore, the photodetector can be a PIN receiver.

[0107] In one specific embodiment, the circuit board may further include a power supply circuit;

[0108] The power supply circuit is connected to the controller, digital diagnostic monitoring circuit, laser drive circuit, first clock data recovery circuit and second clock data recovery circuit respectively.

[0109] Specifically, the power supply circuit is used to provide operating voltage to the various devices and circuits in the optical emitting assembly.

[0110] In one specific embodiment, a transimpedance amplifier and a limiting amplifier are also included.

[0111] Specifically, the second clock data recovery circuit is connected to the photodetector in sequence through a limiting amplifier and a transimpedance amplifier.

[0112] In one embodiment, Figure 7 As shown, an optical communication system is provided, including optical fiber and multiple optical transceivers in any of the above embodiments; the optical fiber is connected to each optical transceiver respectively.

[0113] Specifically, the laser 140 in the optical emitting component is a DFB laser. Furthermore, the number of optical transceivers can be determined based on the optical communication wavelength, the number of wavelength channels, and the number of terminals. For example, in an optical communication system, the wavelength ranges from 1270 nm to 1610 nm, and there can be one wavelength channel every 20 nm, for a total of 18 wavelengths.

[0114] The aforementioned optical communication system can form a 25Gbps CWDM (Coarse Wavelength Division Multiplexing) system, and communication can be carried out through the CWDM system. This allows for efficient utilization of fiber optic resources in the communication network and reduces costs, based on the characteristics of optical communication.

[0115] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A light emitting component, characterized in that, The system includes a control circuit, a base, and a substrate body. Adjacent first and second metal layers are spaced apart on the substrate body. The substrate body is insulating. The first and second metal layers are disposed on the same outer surface of the substrate body. The spaced arrangement indicates that the first and second metal layers are not electrically connected, and an insulating material is filled between the first and second metal layers. The coverage area of ​​the second metal layer is smaller than that of the first metal layer. It also includes a laser disposed on the first metal layer and a heating device disposed on the second metal layer; the laser is electrically connected to the control circuit through the first metal layer; the heating device is disposed close to the laser, and one end of the heating device is electrically connected to the control circuit through the second metal layer; the laser is disposed on the side of the substrate body away from the base; the heating device is disposed between the laser and the base, and the distance between the center of the heating device and the center of the laser is minimized; The method of setting the heating device close to the laser includes: after determining the coverage area of ​​the second metal layer, determining the setting area of ​​the heating device based on the coverage area of ​​the second metal layer where the distance between it and the center of the laser is less than or equal to a preset threshold; The control circuit acquires the current operating temperature of the laser and transmits an operating status control signal to the heating device based on the current operating temperature; the heating device switches its operating status according to the received operating status control signal to adjust the operating temperature of the laser.

2. The light emitting component according to claim 1, characterized in that, It also includes a base, a heat sink, and pins extending through both sides of the base; the other end of the heating device is electrically connected to the base; The heat sink is mounted on the base; the substrate body is attached to the heat sink, and the side of the substrate body with the first metal layer faces the pin.

3. The optical emitting component according to claim 2, characterized in that, The second metal layer has through holes that penetrate both sides of the substrate body; the other end of the heating device is electrically connected to the heat sink through the through holes.

4. The optical emitting component according to claim 2, characterized in that, It also includes a monitoring diode disposed between the substrate body and the pin; The negative terminal of the monitoring diode is electrically connected to the control circuit, and the positive terminal is electrically connected to the base.

5. The light emitting component according to claim 4, characterized in that, It also includes a pad; the pad includes a first contact surface and a second contact surface opposite to the first contact surface; a conductive layer is formed on the first contact surface; The negative electrode of the monitoring diode is attached to the conductive layer, and the conductive layer is electrically connected to the control circuit; the second contact surface is attached to the base.

6. The optical emitting component according to claim 4, characterized in that, It also includes a laser driving circuit and a first clock data recovery circuit for connecting to an external electrical signal processing circuit; The laser driving circuit is connected to the laser, the monitoring diode, the control circuit, and the first clock data recovery circuit, respectively. The first clock data recovery circuit is connected to the control circuit.

7. The light emitting component according to any one of claims 1 to 6, characterized in that, It also includes a solder layer disposed between the first metal layer and the laser; The laser is electrically connected to the control circuit through the solder layer and the first metal layer in sequence.

8. The light emitting component according to any one of claims 1 to 6, characterized in that, The heating device is a thin-film resistor; The laser is an FP laser with a rate greater than or equal to 25 Gbps, or a DFB laser with a rate greater than or equal to 25 Gbps.

9. An optical transceiver, characterized in that, It includes a photodetector, a second clock data recovery circuit, and a light emitting component as described in any one of claims 1 to 8; the second clock data recovery circuit is used to connect to an external electrical signal processing circuit. The photodetector is connected to the control circuit and the second clock data recovery circuit, respectively; the second clock data recovery circuit is connected to the control circuit.

10. An optical communication system, characterized in that, It includes optical fibers and multiple optical transceivers as described in claim 9; the optical fibers are respectively connected to each of the optical transceivers.

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