Display device

Abstract

A display device is provided. The display device includes: a substrate; a first insulating layer disposed on the substrate; a through-portion passing through the substrate and the first insulating layer; a display unit disposed on the first insulating layer and including a plurality of pixels surrounding at least a portion of the through-portion; and a dummy pixel unit. Each pixel includes a light-emitting element, the light-emitting element including a pixel electrode and a counter electrode facing each other and an emission layer disposed between the pixel electrode and the counter electrode. The dummy pixel unit includes a plurality of dummy pixels disposed between the through-portion and the display unit and including a metal pattern, the metal pattern including a material that is the same as that of the pixel electrode. The dummy pixel is disposed adjacent to the display unit.

Description

[0001] This application claims the priority benefit of Korean Patent Application No. 10-2018-0078935 filed on Jul. 6, 2018 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] Exemplary embodiments relate to a display device, and more particularly, to a display device providing various display area shapes and improving display quality. Background Art

[0003] As display devices become thinner and lighter, their use cases have expanded. For example, display devices having various shapes are being used for devices such as monitors, mobile phones, clocks, etc. When a display device is designed to have a specific shape, display quality may be deteriorated due to implementation of a specific change. Summary of the invention

[0004] Exemplary embodiments include a display device that diversifies the shape of a display area and simultaneously improves display quality.

[0005] According to an exemplary embodiment, a display device includes: a substrate; a first insulating layer disposed on the substrate; a through-portion passing through the substrate and the first insulating layer; a display unit disposed on the first insulating layer and including a plurality of pixels surrounding at least a portion of the through-portion; and a dummy pixel unit. Each pixel includes a light-emitting element, the light-emitting element including a pixel electrode and a counter electrode facing each other and an emission layer disposed between the pixel electrode and the counter electrode. The dummy pixel unit includes a plurality of dummy pixels disposed between the through-portion and the display unit and including a metal pattern, the metal pattern including a material that is the same as that of the pixel electrode. The dummy pixel is disposed adjacent to the display unit.

[0006] In an exemplary embodiment, the dummy pixels of the dummy pixel unit are disposed continuously with the pixels of the display unit.

[0007] In an exemplary embodiment, the display device further includes a first pixel circuit and a second pixel circuit. Each of the first pixel circuit and the second pixel circuit includes a thin film transistor disposed on a substrate. A first pixel from among the plurality of pixels is electrically connected to the first pixel circuit, and a first dummy pixel from among the plurality of dummy pixels is electrically insulated from the second pixel circuit.

[0008] In an exemplary embodiment, the display device further includes a via layer covering the first pixel circuit and the second pixel circuit. The via layer flattens the top surface of the via layer and includes a contact hole electrically connecting the first pixel to the first pixel circuit. The contact hole is not disposed between the second pixel circuit and the metal pattern.

[0009] In an exemplary embodiment, the pixel electrode is electrically connected to the thin film transistor of the first pixel circuit, and the metal pattern is electrically insulated from the thin film transistor of the second pixel circuit.

[0010] In an exemplary embodiment, the display device further includes a second insulating layer covering an edge of the pixel electrode. The second insulating layer exposes a portion of the pixel electrode and covers a top surface of the metal pattern.

[0011] In an exemplary embodiment, the display device further includes an organic pattern disposed on the second insulating layer in a region corresponding to the metal pattern. The organic pattern includes the same material as that of the emission layer.

[0012] In exemplary embodiments, the metal pattern and the organic pattern are spaced apart from each other, and the second insulating layer is disposed between the metal pattern and the organic pattern.

[0013] In an exemplary embodiment, the display device further includes a second insulating layer. The second insulating layer covers an edge of the pixel electrode and includes a first opening that exposes a portion of the pixel electrode, and the second insulating layer covers an edge of the metal pattern and includes a second opening that exposes a portion of the metal pattern. The portion of the metal pattern exposed by the second opening contacts the counter electrode.

[0014] In an exemplary embodiment, the emission layer is disposed on the portion of the pixel electrode exposed by the first opening, and is not disposed on the remaining portion of the pixel electrode.

[0015] In an exemplary embodiment, the display device further includes a groove disposed in the first insulating layer between the through portion and the dummy pixel unit.

[0016] In an exemplary embodiment, the display device further includes a capping layer disposed on the first insulating layer. The capping layer covers the groove and includes a material different from that of the first insulating layer.

[0017] In an exemplary embodiment, the depth of the trench is approximately equal to or less than the thickness of the first insulating layer.

[0018] In an exemplary embodiment, the display device further includes a wiring connection unit disposed between the groove and the dummy pixel unit.

[0019] In an exemplary embodiment, the display device further includes a spacing region disposed between the wiring connection unit and the dummy pixel unit.

[0020] In an exemplary embodiment, the display device further includes a metal layer having a ring shape. The metal layer is disposed in the spacing area and surrounds the through portion, and a diameter of the metal layer is greater than a diameter of the through portion.

[0021] In an exemplary embodiment, the substrate includes a display area in which the display unit is disposed and a non-display area disposed adjacent to the display area. The non-display area includes a first non-display area surrounding at least a portion of an outer edge of the display area along an edge of the substrate and a second non-display area surrounding at least a portion of an outer edge of the through portion between the through portion and the display area.

[0022] In an exemplary embodiment, the through portion is disposed adjacent to an edge of the substrate, and the first non-display area is connected to the second non-display area.

[0023] In an exemplary embodiment, the through portion includes a first through hole and a second through hole disposed adjacent to the first through hole. At least a portion of the dummy pixel unit is disposed between the first through hole and the second through hole.

[0024] In an exemplary embodiment, the through portion includes a single closed curve shape.

[0025] In an exemplary embodiment, the trench passes through the first insulating layer and extends to at least a portion of the substrate.

[0026] According to an exemplary embodiment, a display device includes: a substrate; a first insulating layer disposed on the substrate; a through portion passing through the substrate and the first insulating layer; a second insulating layer disposed on the first insulating layer; a plurality of pixels surrounding at least a portion of the through portion; and a plurality of dummy pixels disposed between the through portion and the plurality of pixels. Each of the plurality of pixels includes a light emitting element, the light emitting element including a pixel electrode and a counter electrode facing each other and an emission layer disposed between the pixel electrode and the counter electrode. Each of the plurality of dummy pixels includes a metal pattern, the metal pattern including the same material as that of the pixel electrode. The second insulating layer includes a plurality of openings exposing each pixel electrode of the plurality of pixels, and the second insulating layer completely covers each metal pattern of the plurality of dummy pixels. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other features of the present disclosure will become more apparent by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0028] Figure 1 is a plan view of a display device according to an exemplary embodiment;

[0029] Figure 2 According to an exemplary embodiment Figure 1 An enlarged plan view of a through portion in a display area;

[0030] Figure 3 According to an exemplary embodiment, Figure 2 A cross-sectional view taken along line III-III;

[0031] Figure 4 is a cross-sectional view of a display device according to an exemplary embodiment;

[0032] Figure 5 is a cross-sectional view of a display device according to an exemplary embodiment;

[0033] Figure 6 According to an exemplary embodiment Figure 5 an enlarged cross-sectional view of portion VI;

[0034] Figure 7 is a cross-sectional view of a display device according to an exemplary embodiment;

[0035] Figure 8 and Fig. 9 According to an exemplary embodiment Figure 1 An enlarged cross-sectional view of a pixel structure;

[0036] Fig.10 is an enlarged plan view of a through portion in a display area of ​​a display device according to an exemplary embodiment;

[0037] Fig.11 According to an exemplary embodiment, Fig.10 A cross-sectional view taken along line XI-XI;

[0038] Fig.12 is a plan view of a display device according to an exemplary embodiment;

[0039] Fig.13 According to an exemplary embodiment Fig.12 An enlarged plan view of a through portion in a display area;

[0040] Fig.14 is a plan view of a display device according to an exemplary embodiment;

[0041] Fig.15 According to an exemplary embodiment Fig.14 an enlarged plan view of a through portion in a display area of ​​; and

[0042] Fig.16 and Fig.17 is an enlarged cross-sectional view of a display device according to an exemplary embodiment. DETAILED DESCRIPTION

[0043] Hereinafter, exemplary embodiments of the present disclosure will be described more fully with reference to the accompanying drawings.Throughout the drawings, like reference numerals may represent like elements.

[0044] It will be understood that the terms "first", "second", "third", etc. are used herein to distinguish one element from another element, but the elements are not limited by these terms. Therefore, a "first" element in an exemplary embodiment may be described as a "second" element in another exemplary embodiment.

[0045] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0046] It will be understood that when a layer, region or component is referred to as being "formed on" another layer, region or component, the layer, region or component may be directly or indirectly formed on the other layer, region or component. That is, for example, intervening layers, regions or components may be present.

[0047] When a certain exemplary embodiment can be implemented differently, the specific process order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of the described order.

[0048] The exemplary embodiments can prevent display device components such as wiring disposed outside a display area from being viewed due to external light. The exemplary embodiments also allow realization of a display device that provides a different display area shape and improves display quality.

[0049] It will be understood that when a component such as a film, region, layer or element is referred to as being "on," "connected to," "coupled to," or "adjacent to" another component, the component may be directly on, directly connected to, directly coupled to, or directly adjacent to the other component, or intervening components may be present. It will also be understood that when a component is referred to as being "between" two components, the component may be the only component between the two components, or one or more intervening components may also be present. It will also be understood that when a component is referred to as "overlying" another component, the component may be the only component that overlies the other component, or one or more intervening components may also overlie the other component.

[0050] Figure 1 is a plan view of a display device 1 according to an exemplary embodiment. Figure 2 yes Figure 1 FIG. 1 is an enlarged plan view of the through portion TH in the display area DA. Figure 3 is along Figure 2 A cross-sectional view taken along line III-III. Figure 4 is a cross-sectional view of a display device according to an exemplary embodiment.

[0051] Reference Figures 1 to 4 , the display device 1 includes a substrate 100 and a display unit 10 disposed on the substrate 100 .

[0052] The substrate 100 may include a material such as glass, metal, or an organic material. According to an exemplary embodiment, the substrate 100 may include a flexible material. For example, the substrate 100 may include a material that can be warped and bent or rolled as needed, such as polyimide (PI) as an example. However, exemplary embodiments of the present disclosure are not limited thereto.

[0053] The substrate 100 includes a display area DA and a non-display area NDA. A through portion TH is disposed in the display area DA. The through portion TH is a hole that passes through the substrate 100 and various layers disposed on the substrate 100, and is disposed inside the display area DA and surrounded by the display unit 10 including a plurality of pixels P.

[0054] Each pixel P of the display unit 10 includes a pixel circuit 200 (hereinafter, may also be referred to as a first pixel circuit 200) and a light emitting element 500 such as an organic light emitting diode (OLED) electrically connected to the pixel circuit 200. Each pixel P provides a predetermined image by light emitted from the light emitting element 500. The display unit 10 is sealed by an encapsulation layer 400 described below. The encapsulation layer 400 may be, for example, a multilayer including a layer including an organic material and a layer including an inorganic material.

[0055] The non-display area NDA is an area where no image is provided, and includes a first non-display area NDA1 surrounding an outer edge of the display area DA along an edge of the substrate 100 and a second non-display area NDA2 surrounding an outer edge of the through portion TH.

[0056] A driving unit DU such as a scan driver and a data driver configured to transmit a preset signal to each pixel P of the display area DA may be disposed in the first non-display area NDA1. The second non-display area NDA2 is disposed between the through-portion TH and the display area DA. A wiring routing unit to which pixels P adjacent to the second non-display area NDA2 are connected may be disposed in the second non-display area NDA2.

[0057] Although it is shown that the through portion TH is disposed Figure 1 The through portion TH is disposed in the upper right end of the display area DA in the display device 1, but the exemplary embodiments of the present disclosure are not limited thereto. For example, according to exemplary embodiments, the through portion TH may be disposed at any position in the display area DA.

[0058] In addition, although the through portion TH is shown to be circular and one through portion TH is provided Figure 1In the display device 1, the exemplary embodiments of the present disclosure are not limited thereto. For example, according to exemplary embodiments, the through portion TH may have various shapes such as a polygonal shape or a single closed curve shape (e.g., an elliptical shape), and one or more through portions TH may be provided (see, for example, Fig.12 and Fig.13 ).

[0059] In addition, although the display area DA is shown in Figure 1 The display area DA may be a quadrilateral in the display device 1, but the exemplary embodiments of the present disclosure are not limited thereto. For example, the display area DA may be a polygon instead of a quadrilateral, or may have various shapes such as a circular shape and an elliptical shape.

[0060] Reference Figure 2 and Figure 3 , the through portion TH is disposed inside the display unit 10. As a result, the through portion TH is surrounded by the pixel P. An area in which the pixel P is not disposed (ie, the second non-display area NDA2) is disposed between the through portion TH and the pixel P.

[0061] The through portion TH passes through the substrate 100, the encapsulation layer 400, and a layer disposed between the substrate 100 and the encapsulation layer 400. The through portion TH may be formed by a cutting / punching device using a laser or the like. Due to an impact during a process of forming the through portion TH by using a cutting device, a crack may occur near the through portion TH. Therefore, in an exemplary embodiment, the crack prevention pattern 300A is disposed in the second non-display area NDA2. The crack prevention pattern 300A may prevent the crack from propagating toward the pixel P.

[0062] The crack prevention pattern 300A includes a groove 310A and a coating layer 320A covering the groove 310A. Figure 2 As shown in , the groove 310A has a ring shape with a radius greater than the radius of the through portion TH, and surrounds the outer edge of the through portion TH. Although the through portion TH is shown to be circular and the groove 310A has a circular ring shape, the exemplary embodiments of the present disclosure are not limited thereto. For example, in an exemplary embodiment, the groove 310A may have a polygonal ring shape such as a triangular ring shape and a quadrilateral ring shape or an elliptical ring shape.

[0063] The groove 310A is a recessed portion recessed in the thickness direction of the first insulating layer 110 disposed on the substrate 100, and may block the propagation of cracks toward the display area DA. For example, the groove 310A may be formed in the first insulating layer 110 and may be recessed in a direction toward the substrate 100. The groove 310A may have a depth d1 approximately equal to or less than the thickness t of the first insulating layer 110. In an exemplary embodiment, the depth d1 may be approximately To about range.

[0064] The first insulating layer 110 including the trench 310A is an inorganic layer, and may be a single inorganic layer or a plurality of inorganic layers including a plurality of layers. For example, the first insulating layer 110 may include an inorganic material such as silicon oxide, silicon nitride, and silicon oxynitride.

[0065] The cladding layer 320A overlaps with and covers the trench 310A. The cladding layer 320A may be directly disposed on the first insulating layer 110 such that the cladding layer 320A is in direct contact with the trench 310A. A portion of the cladding layer 320A may be disposed inside the trench 310A.

[0066] The capping layer 320A may include an organic insulating material. For example, the capping layer 320A may include the same material as that of the via layer 130 and / or the second insulating layer 150 .

[0067] The top surface of the cladding layer 320A may be relatively flat, and the cladding layer 320A may cover the trench 310A. In an exemplary embodiment, the total thickness of the cladding layer 320A (eg, the thickness from the bottom surface to the top surface of the cladding layer 320A filling the trench 310A) may be about 1000 mm. To about However, exemplary embodiments of the present disclosure are not limited thereto.

[0068] The coating layer 320A can reduce the stress of the portion of the first insulating layer 110 which is an inorganic layer in which the groove 310A has been formed, and can prevent crack propagation. In addition, the coating layer 320A covers the groove 310A, and can prevent particles from accumulating in the groove 310A during the manufacturing process and prevent the particles from moving to the light emitting element 500 of the pixel P (which will produce black spots).

[0069] The dummy pixel unit 20 is disposed in the second non-display area NDA2. The dummy pixel unit 20 may be disposed between the display area DA and the anti-crack pattern 300A and include a dummy pixel DP. The dummy pixel unit 20 may be disposed in a portion of the second non-display area NDA2 adjacent to the display area DA. The area in which the dummy pixel unit 20 is disposed may be defined as a dummy pixel area DMA.

[0070] like Figure 3As shown in , the dummy pixel unit 20 is a region extending from the display unit 10 and provided as one body with the display unit 10. The dummy pixel unit 20 is a unit in which a pixel is provided but in which the pixel does not actually emit light and is provided as a dummy. Therefore, the dummy pixel DP of the dummy pixel unit 20 is provided continuously with the pixel P of the display unit 10. For example, in an exemplary embodiment, the dummy pixel DP of the dummy pixel unit 20 and the pixel P of the display unit 10 are aligned with each other.

[0071] In an exemplary embodiment, about one pixel to three pixels may be set as the dummy pixel DP. However, the exemplary embodiments of the present disclosure are not limited thereto. For example, the number of dummy pixels DP may be changed by considering different factors (such as the size of the through portion TH, the shape of the through portion TH, the width of the invalid area, etc.).

[0072] As a comparative example, if a normally emitting pixel P (for example, not a dummy pixel DP) is provided in the dummy pixel unit 20, when the through portion TH is formed by a cutting / punching device using a laser or the like, some pixels P provided near the through portion TH may be damaged. In addition, the characteristics of the pixel circuit are changed by the arrangement change of the pixels P adjacent to the through portion TH due to the through portion TH, which results in a parasitic capacitance difference between the pixels P adjacent to the through portion TH and the pixels P not adjacent to the through portion TH. As a result, in the comparative example, spots of the pixels P adjacent to the through portion TH may be generated, and the reliability of the display unit 10 may be reduced.

[0073] The wiring connection unit 330 is disposed between the crack prevention pattern 300A and the dummy pixel unit 20 in the second non-display area NDA2. The wiring connection unit 330 includes wiring configured to supply signals to the pixels P disposed near the through-portion TH, may be a scan signal wiring or a data signal wiring, and is designed to bypass the through-portion TH.

[0074] Since the through-portion TH is disposed inside the display area DA, the design of the pixel P adjacent to the through-portion TH and the wiring configured to supply a signal to the pixel P is changed, which causes a deviation in parasitic capacitance between the pixels P, thereby causing spots of the pixel P adjacent to the through-portion TH.

[0075] Therefore, the display device 1 according to the exemplary embodiment may remove spot defects of the pixels P adjacent to the through-portion TH and may improve the quality of the display unit 10 by configuring the pixels P disposed near the through-portion TH using the dummy pixels DP that do not emit light.

[0076] Reference Figure 3 The display area DA, the pixel circuit 200 and the light emitting element 500 are arranged in the display area DA.

[0077] The light emitting element 500 includes a pixel electrode 510 electrically connected to the pixel circuit 200, an opposing electrode 530 facing the pixel electrode 510, and an emission layer 520 disposed between the pixel electrode 510 and the opposing electrode 530, and a via layer 130 having a contact hole CH is disposed between the pixel circuit 200 and the pixel electrode 510. In an exemplary embodiment, the via layer 130 may include an insulating organic material, and the via layer 130 has a flat top surface.

[0078] The pixel electrode 510 is exposed through the opening OP provided in the second insulating layer 150, and the edge of the pixel electrode 510 may be covered by the second insulating layer 150 including an insulating organic material. In an exemplary embodiment, the pixel electrode 510 may include, for example, Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a mixture thereof. The second insulating layer 150 is a pixel defining layer. In an exemplary embodiment, the second insulating layer 150 covers the edge of the pixel electrode 510 and exposes the central portion of the pixel electrode 510.

[0079] The counter electrode 530 may be provided as a whole and may completely cover the display area DA. In an exemplary embodiment, the counter electrode 530 may be a thin film metal layer including, for example, Ag and Mg, or a thin film metal layer such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or aluminum zinc oxide (AZO) transparent conductive oxide (TCO).

[0080] In an exemplary embodiment, if Figure 3 As shown in , the end portion 530E of the counter electrode 530 may cover the end portion 130E of the via layer 130 and may be disposed between the via layer 130 and the wiring connection unit 330. In an exemplary embodiment, as shown in FIG. Figure 4 As shown in FIG. 5 , the end portion 530E of the counter electrode 530 may extend to the edge 100E of the substrate 100 in which the through portion TH has been formed. Figure 4 The structure of the counter electrode 530 shown in FIG. 5 is applicable to other exemplary embodiments described herein.

[0081] The emission layer 520 may include an organic material including a fluorescent material or a phosphorescent material emitting red, green, or blue light, and may be patterned to correspond to the pixel P of the display area DA. At least one of a first functional layer 522 and a second functional layer 524 may be provided, the first functional layer 522 being provided between the emission layer 520 and the pixel electrode 510, and the second functional layer 524 being provided between the emission layer 520 and the counter electrode 530. Unlike the emission layer 520 patterned above the pixel electrode 510, the first functional layer 522 and the second functional layer 524 may be a common layer provided on the entire surface of the display unit 10.

[0082] The first functional layer 522 may include, for example, at least one of a hole injection layer (HIL) and a hole transport layer (HTL) The HIL allows holes to be emitted from the anode, and the HTL allows holes of the HIL to be transported to the emission layer 520 .

[0083] The HIL may include a phthalocyanine compound such as copper phthalocyanine, DNTPD (N,N'-diphenyl-N,N'-di-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4'-diamine), m-MTDATA (4,4',4"-tris(3-methylphenylphenylamino)triphenylamine), TDATA (4,4',4"-tris(N,N-diphenylamino)triphenylamine), 2T-NATA (4,4',4"-tris{N'-(2-naphthyl)-N-phenylamino}-triphenylamine), PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / poly(4-styrenesulfonate)), Pani / DBSA (polyaniline / dodecylbenzenesulfonic acid), Pani / CSA (polyaniline / camphorsulfonic acid), or PANI / PSS (polyaniline / poly(4-styrenesulfonate)), but is not limited thereto.

[0084] HTL may include carbazole derivatives such as N-phenylcarbazole, polyvinylcarbazole, etc., TPD (N,N'-di(3-methylphenyl)-N,N'-diphenyl-[1,1-biphenyl]-4,4'-diamine), NPB (N,N'-di(1-naphthyl)-N,N'-diphenylbenzidine) and triphenylamine materials such as TCTA (4,4',4"-tri(N-carbazolyl)triphenylamine), but are not limited thereto.

[0085] The second functional layer 524 may include at least one of an electron transport layer (ETL) and an electron injection layer (EIL). The EIL allows electrons to be emitted from the cathode, and the ETL allows electrons of the EIL to be transferred to the emission layer 520.

[0086] ETL may include, for example, Alq 3、BCP(2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Bphen(4,7-diphenyl-1,10-phenanthroline), TAZ(3-(4-biphenyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole), NTAZ(4-(naphthalene-1-yl)-3,5-diphenyl-4H-1,2,4-triazole), Butyl-PBD(2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole), BAlq(bis(2-methyl-8-hydroxyquinoline-N1,O8)-(1,1'-biphenyl-4-hydroxy)aluminum), Bebq 2 (bis(benzoquinoline-10-hydroxy)beryllium), ADN (9,10-di(naphthalene-2-yl)anthracene), but are not limited thereto.

[0087] The EIL may include materials such as LiF, NaCl, CsF, Li 2 O, BaO and Liq are exemplified materials, but are not limited thereto.

[0088] In an exemplary embodiment, unlike the actual pixel P, the opening OP is not formed in the second insulating layer 150 with respect to the dummy pixel DP.

[0089] As described above, in the pixel P of the display unit 10 , the central portion of the pixel electrode 510 is exposed through the opening OP of the second insulating layer 150 , and the emission layer 520 is disposed on the pixel electrode 510 such that the emission layer 520 is disposed between the pixel electrode 510 and the opposing electrode 530 .

[0090] On the contrary, unlike the actual pixel P, the dummy pixel DP includes a metal pattern 510D corresponding to the pixel electrode 510 of the pixel P, and the second insulating layer 150 completely covers the metal pattern 510D without including an opening OP. Therefore, in the dummy pixel DP, the second insulating layer 150 is completely disposed between the metal pattern 510D and the organic pattern 520D corresponding to the emission layer 520 of the pixel P. Therefore, since the organic pattern 520D of the dummy pixel DP is not in direct contact with the metal pattern 510D of the dummy pixel DP, the dummy pixel DP does not actually emit light. On the contrary, the dummy pixel DP is represented as a black inactive area similar to the second non-display area NDA2 when being driven.

[0091] Therefore, in an exemplary embodiment, the second insulating layer 150 includes a plurality of openings OP exposing each pixel electrode 510 of the plurality of pixels P, and the second insulating layer 150 does not include any openings in an area corresponding to the dummy pixel DP, and thus, the second insulating layer 150 completely covers each metal pattern 510D of the plurality of dummy pixels DP.

[0092] The encapsulation layer 400 is disposed on the pixel P and the dummy pixel DP. However, exemplary embodiments of the present disclosure are not limited thereto. For example, in an exemplary embodiment, instead of the encapsulation layer 400, the display unit 10 is sealed by disposing an encapsulation substrate over the substrate 100 and bonding the substrate 100 to the encapsulation substrate using a sealant on the periphery of the substrate 100. A structure for sealing the display unit 10 by using the encapsulation layer 400 is described herein.

[0093] The encapsulation layer 400 includes inorganic encapsulation layers 410 and 430 and an organic encapsulation layer 420. For example, the encapsulation layer 400 may include an inorganic encapsulation layer 410, an organic encapsulation layer 420, and an inorganic encapsulation layer 430 sequentially stacked on each other. The inorganic encapsulation layers 410 and 430 may include, for example, at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cesium oxide, and silicon oxynitride. The inorganic encapsulation layers 410 and 430 may be formed by chemical vapor deposition (CVD).

[0094] The organic encapsulating layer 420 may include, for example, at least one of acrylic resin, methacrylate resin, polyisoprene resin, epoxy resin, urethane resin, cellulose resin, and perylene resin.

[0095] In an exemplary embodiment, the organic encapsulation layer 420 may be formed by an atomic layer deposition (ALD) process using a material such as hexamethyldisiloxane (HMDSO) or tetraethylorthosilicate (TEOS) as a raw material gas.

[0096] In an exemplary embodiment, the organic encapsulation layer 420 may be formed by depositing a liquid monomer and then hardening the liquid monomer using heat or light (such as ultraviolet rays). In order to prevent the liquid monomer from flowing toward the anti-crack pattern 300A and prevent the edge tail of the organic encapsulation layer 420 from being formed, a dam may be provided in the second non-display area NDA2. One end of the organic encapsulation layer 420 may be provided between the dam and the pixel P through the dam.

[0097] Although the encapsulation layer 400 in the exemplary embodiment described herein includes two inorganic encapsulation layers 410 and 430 and one organic encapsulation layer 420 , the stacking order and number of the inorganic encapsulation layers and the organic encapsulation layers are not limited thereto.

[0098] Figures 5 to 7 is a cross-sectional view of a display device according to an exemplary embodiment.

[0099] Regarding the structure of the dummy pixel DP of the dummy pixel unit 20, Figure 5 and Figure 7 An exemplary embodiment of Figure 3For convenience of explanation, the difference regarding the structure of the dummy pixel DP is mainly described, and further description of previously described components may be omitted.

[0100] and Figure 3 Different, in Figure 5 In the dummy pixel DP, the organic pattern 520D (corresponding to the emission layer 520) is not provided.

[0101] In the pixel P of the display unit 10, the second insulating layer 150 includes a first opening OP1 exposing a central portion of the pixel electrode 510 and covers an edge of the pixel electrode 510, an emission layer 520 is disposed on the pixel electrode 510, and a counter electrode 530 is disposed on the emission layer 520. In an exemplary embodiment, the emission layer 520 is disposed on a portion of the pixel electrode 510 exposed by the first opening OP1 (e.g., the exposed central portion of the pixel electrode 510), and is not disposed on the remaining portion of the pixel electrode 510. That is, in an exemplary embodiment, only the portion of the pixel electrode 510 on which the emission layer 520 is disposed is the portion of the pixel electrode 510 exposed by the first opening OP1 (e.g., the exposed central portion of the pixel electrode 510).

[0102] Similarly, in the dummy pixel DP of the dummy pixel unit 20, the second insulating layer 150 includes a second opening OP2 exposing the central portion of the metal pattern 510D and covers the edge of the metal pattern 510D. However, in this case, the organic pattern 520D corresponding to the emission layer 520 is not disposed on the metal pattern 510D. Figure 5 An enlarged cross-sectional view of part VI Figure 6 As shown in , the counter electrode 530 may be in direct contact with the top surface of the metal pattern 510D.

[0103] Reference Figure 6 , an opening OP3 exposing the top surface of the metal pattern 510D may be formed in the first functional layer 522 and the second functional layer 524. The organic pattern may be formed on the metal pattern 510D during the manufacturing process, and simultaneously removed during the process of forming the opening OP3. At least a portion of the counter electrode 530 may be in direct contact with the top surface of the metal pattern 510D through the opening OP3 formed in the first functional layer 522 and the second functional layer 524.

[0104] Reference Figure 7 In an exemplary embodiment, the structure of the dummy pixel DP may be formed to be the same as that of the pixel P. In this case, the light emitting element 500 of the pixel P includes a pixel electrode 510, an emission layer 520, and an opposing electrode 530. Similarly, the dummy pixel DP includes a metal pattern 510D, an organic pattern 520D, and an opposing electrode 530.

[0105] However, in Figure 7 In an exemplary embodiment of the present invention, the dummy pixel DP is not electrically connected to the second pixel circuit 200D disposed under the dummy pixel DP. The second pixel circuit 200D may be the same circuit element as the first pixel circuit 200 disposed in the display unit 10.

[0106] In the pixel P of the display unit 10, the pixel electrode 510 is electrically connected to the first pixel circuit 200 disposed below the pixel electrode 510 through the contact hole CH formed in the via layer 130. The pixel electrode 510 electrically connected to the first pixel circuit 200 may mean that the pixel electrode 510 is electrically connected to the source electrode or the drain electrode of the thin film transistor of the first pixel circuit 200.

[0107] In the dummy pixel DP of the dummy pixel unit 20, the second pixel circuit 200D is disposed under the metal pattern 510D, but the metal pattern 510D is electrically insulated from the second pixel circuit 200D. For example, in an exemplary embodiment, the contact hole CH is not disposed between the second pixel circuit 200D and the metal pattern 510D, and as a result, the metal pattern 510D is not connected to the second pixel circuit 200D.

[0108] That is, in an exemplary embodiment, a contact hole is not formed in a portion of the via layer 130 on which the metal pattern 510D is disposed, and thus the dummy pixel DP is not electrically connected to the second pixel circuit 200D. In an exemplary embodiment, the pixel circuit 200 is not disposed under the dummy pixel DP.

[0109] Figure 8 and Fig. 9 According to an exemplary embodiment Figure 1 An enlarged cross-sectional view of the pixel structure.

[0110] Figure 8 and Fig. 9 is a cross-sectional view of a portion of a pixel P in a display area DA of a display device according to an exemplary embodiment. Figure 8 and Fig. 9 The display device includes a reference Figure 3 The configuration of the display device 1 described is the same configuration, so the pixel circuit 200 is mainly described below, and further description of the previously described components may be omitted.

[0111] Reference Figure 8 In an exemplary embodiment, the pixel circuit 200 includes a thin film transistor 210 and a storage capacitor 220. The first insulating layer 110 may include a buffer layer 101, a gate insulating layer 103, a dielectric insulating layer 105, and an interlayer insulating layer 107 sequentially disposed on the substrate 100.

[0112] The buffer layer 101 can prevent the penetration of impurities. The gate insulating layer 103 is disposed between the semiconductor layer 211 and the gate electrode 213 of the thin film transistor 210. The dielectric insulating layer 105 is disposed between the bottom electrode 221 and the top electrode 223 of the storage capacitor 220. The interlayer insulating layer 107 is disposed between the gate electrode 213 of the thin film transistor 210 and the source electrode 215s and the drain electrode 215d.

[0113] All of the buffer layer 101, the gate insulating layer 103, the dielectric insulating layer 105, and the interlayer insulating layer 107 may include an insulating inorganic material. For example, each of the buffer layer 101, the gate insulating layer 103, the dielectric insulating layer 105, and the interlayer insulating layer 107 may include silicon nitride, silicon oxide, and / or silicon oxynitride.

[0114] although Figure 8 The exemplary embodiment shows that the thin film transistor 210 is overlapped with the storage capacitor 220, and thus, the gate electrode 213 of the thin film transistor 210 serves as the bottom electrode 221 of the storage capacitor 220, but the exemplary embodiments of the present disclosure are not limited thereto.

[0115] Reference Fig. 9 , the thin film transistor 210 and the storage capacitor 220 of the pixel circuit 200 may be disposed at different positions.

[0116] According to the structure of the pixel circuit 200, the first insulating layer 110 may include a buffer layer 101, a gate insulating layer 103, and an interlayer insulating layer 107 sequentially disposed on the substrate 100. Fig. 9 As shown in FIG. 1 , the interlayer insulating layer 107 may be disposed between the bottom electrode 221 and the top electrode 223 of the storage capacitor 220 to perform a function of a dielectric.

[0117] although Figure 8 and Fig. 9 It has been described in the above that the thin film transistor 210 of the pixel circuit 200 is a top gate transistor, but the exemplary embodiment is not limited thereto. For example, in the exemplary embodiment, the thin film transistor 210 may be a bottom gate transistor. Fig. 9 A case has been described in which the bottom electrode 221 and the top electrode 223 of the storage capacitor 220 are respectively arranged on the same layer as the gate electrode 213 and the source electrode 215s and the drain electrode 215d and respectively include the same materials as the gate electrode 213 and the source electrode 215s and the drain electrode 215d, but the exemplary embodiment is not limited to this and various modifications may be made.

[0118] Fig.10is an enlarged plan view of a through portion TH in a display area DA of a display device 1 ′ according to an exemplary embodiment. Fig.11 According to an exemplary embodiment, Fig.10 A sectional view taken along line XI-XI.

[0119] Fig.10 and Fig.11 The exemplary embodiment of the present invention further includes a metal layer 600 disposed between the wiring connection unit 330 and the dummy pixel unit 20. The metal layer 600 may be disposed in the spacing area SA between the wiring connection unit 330 and the dummy pixel unit 20.

[0120] like Fig.10 As shown in , the metal layer 600 may surround the area around the through portion TH and may have a ring shape whose diameter is greater than the diameter of the through portion TH. However, the shape of the metal layer 600 is not limited thereto and may be modified according to the shape of the through portion TH and may be designed to be separated from the shape of the through portion TH.

[0121] Reference Fig.11 In an exemplary embodiment, the metal layer 600 may include the same material as that of the pixel electrode 510. In an exemplary embodiment, the metal layer 600 may include the same material as that of other conductive layers included in the pixel circuit 200. For example, in the structure of the pixel circuit 200, the metal layer 600 may include the same material as that of the gate electrode 213 of the thin film transistor 210 or the top electrode 223 of the storage capacitor 220, and may include the same material as that of the source electrode 215s and the drain electrode 215d of the thin film transistor 210. For example, in Figure 8 In the structure of the pixel circuit 200 , the metal layer 600 may include the same material as that of the gate electrode 213 of the thin film transistor 210 or that of the source electrode 215 s and the drain electrode 215 d of the thin film transistor 210 .

[0122] The metal layer 600 may physically separate the wiring connection unit 330 from the adjacent pixel P and may prevent coupling at the same time.

[0123] In the display device 1' according to the exemplary embodiment, the dummy pixel area DMA is implemented in an approximately circular shape and surrounds the vicinity of the through portion TH. However, the exemplary embodiment is not limited thereto. For example, according to the exemplary embodiment, the dummy pixel area DMA may be implemented in various shapes such as an elliptical shape, a straight line shape, and a U-shape.

[0124] Fig.12 is a plan view of a display device 2 according to an exemplary embodiment. Fig.13 According to an exemplary embodiment Fig.12FIG. 1 is an enlarged plan view of the through portion TH in the display area DA.

[0125] Fig.12 and Fig.13 The difference from the above exemplary embodiment lies in the shapes of the through portion TH and the second non-display area NDA2 in the vicinity of the through portion TH. For ease of explanation, since other configurations are similar to those of the above exemplary embodiment, the through portion TH and the second non-display area NDA2 are mainly described below, and further description of the previously described components may be omitted.

[0126] Reference Fig.12 In an exemplary embodiment, the display device 2 may include two or more through-portions, for example, a first through-portion TH1 and a second through-portion TH2, disposed inside the display area DA. The through-portion TH may include the first through-portion TH1 and the second through-portion TH2. The second non-display area NDA2 is disposed around the through-portion TH such that the second non-display area NDA2 surrounds the through-portion TH.

[0127] Reference Fig.13 In an exemplary embodiment, the through-portion TH is disposed inside the display area DA. The through-portion TH includes a first through-portion TH1 and a second through-portion TH2. Although the through-portion TH includes two through-portions TH1 and TH2 in the exemplary embodiment described herein, the exemplary embodiment is not limited thereto.

[0128] Similar to the above exemplary embodiment, the crack prevention pattern 300A may be disposed around the through portion TH such that the crack prevention pattern 300A surrounds the first through portion TH1 and the second through portion TH2. The wiring connection unit 330 may be disposed outside the crack prevention pattern 300A.

[0129] The dummy pixel unit 20 including the dummy pixel DP is disposed around the through portion TH. Regarding the structure of the dummy pixel DP, it is applicable Figures 3 to 7 The dummy pixel unit 20 is provided between the wiring connection unit 330 and the display unit 10.

[0130] The dummy pixel DP may be disposed in the second non-display area NDA2 disposed around the through-portion TH. The dummy pixel DP surrounds an area surrounding the first through-portion TH1 and the second through-portion TH2. For example, in an exemplary embodiment, the dummy pixel DP may also be disposed in an area between the first through-portion TH1 and the second through-portion TH2. Since the dummy pixel DP is recognized as an invalid area that does not emit light, visibility may be achieved by arranging the dummy pixel DP in the area between the first through-portion TH1 and the second through-portion TH2 as if the first through-portion TH1 is connected to the second through-portion TH2.

[0131] As described above, the through portion TH may be implemented in various shapes other than a circular shape. Fig.13 As shown in , in order to form the through portion TH itself into an elliptical shape (or a stripe shape), the substrate and the structure on the substrate are exposed to the laser for a relatively long time, which may cause defects in elements adjacent to the through portion TH.

[0132] Therefore, the shapes of the through portion TH and the second non-display area NDA2 visible from the outside (for example, visible to a user using the display device 2) can be differently realized by designing the through portion TH itself into a shape requiring a minimum or reduced formation duration and by arranging dummy pixels DP around the through portion TH.

[0133] Fig.14 is a plan view of a display device 3 according to an exemplary embodiment. Fig.15 According to an exemplary embodiment Fig.14 FIG. 1 is an enlarged plan view of a through portion in a display area DA and a non-display area NDA.

[0134] Fig.14 and Fig.15 The exemplary embodiment of the present invention is different from the above-described exemplary embodiment in the position of the through portion TH and the shape of the non-display area NDA around the through portion TH. For the convenience of explanation, since other configurations are similar to those of the above-described exemplary embodiment, the through portion TH and the non-display area NDA are mainly described below, and further description of the previously described components may be omitted.

[0135] Reference Fig.14In an exemplary embodiment, the display device 3 includes a first non-display area NDA1 surrounding at least a portion of an outer edge of the display area DA and a second non-display area NDA2 surrounding at least a portion of an outer edge of the through portion TH between the through portion TH and the display area DA. The through portion TH is disposed in an upper center portion of the display area DA and is disposed adjacent to an edge of the substrate 100. In the above exemplary embodiment, the second non-display area NDA2 is surrounded by the display area DA. In contrast, in the exemplary embodiment described herein, the display area DA surrounds a portion of the second non-display area NDA2, and the remaining portion of the second non-display area NDA2 is connected to the first non-display area NDA1.

[0136] In the case where the display unit 10 emits light, Fig.14 The display area DA of the display device 3 in FIG. 1 can be recognized as a U-shaped recess is formed in a portion of the display area DA in which the through portion TH is provided.

[0137] Reference Fig.15 Although the crack prevention pattern 300A and the wiring connection unit 330 surrounding the through portion TH are substantially spaced apart from the first non-display area NDA1, it can be recognized through the dummy pixel unit 20 disposed between the first non-display area NDA1 and the wiring connection unit 330 as if the first non-display area NDA1 is visually connected to the second non-display area NDA2.

[0138] As described above, by designing the position and area of ​​the dummy pixel unit 20 as described herein according to exemplary embodiments, degradation of emission uniformity of pixels P adjacent to the through-portion TH can be prevented or reduced, and the shape of the visual display of the non-display area NDA can be freely implemented.

[0139] Fig.16 and Fig.17 An exemplary embodiment of a crack prevention pattern 300A' is shown. Fig.16 and Fig.17 In an exemplary embodiment, the crack prevention pattern 300A′ includes a first trench 310A1 and a second trench 310A2. The first trench 310A1 and the second trench 310A2 may completely pass through the first insulating layer 110 and may extend to at least a portion of the substrate 100. For example, the depth t2 of the first trench 310A1 and the second trench 310A2 may be greater than the thickness t1 of the first insulating layer 110.

[0140] The step difference portions UC1 and UC2 of the undercut shape may be formed at the ends of the first groove 310A1 and the second groove 310A2. Each of the first groove 310A1 and the second groove 310A2 has a structure having a width gradually decreasing toward the substrate 100 while extending in the thickness direction of the substrate 100. The widths of the first groove 310A1 and the second groove 310A2 are relatively widened at the step difference portions UC1 and UC2. The counter electrode 530 is disconnected by the step difference portions UC1 and UC2 of the undercut shape as described below. Since the counter electrode 530 is disconnected, the lateral moisture transmission path passing through the interface between the counter electrode 530 and the layer disposed adjacent to the counter electrode 530 can be blocked.

[0141] The counter electrode 530 and the inorganic encapsulation layers 410 and 430 may be disposed above the first groove 310A1 and the second groove 310A2. The counter electrode 530 and the inorganic encapsulation layers 410 and 430 may be completely disposed above the substrate 100 and may extend to the edge 100E of the substrate 100. As described above, the counter electrode 530 may be disconnected by the step difference portions UC1 and UC2 of the undercut shape, and in this case, the portion 530A of the counter electrode 530 may be disposed inside the first groove 310A1 and the second groove 310A2.

[0142] Compared with the second groove 310A2, the first groove 310A1 of the anti-crack pattern 300A' is relatively close to the through portion TH. For example, compared with the second groove 310A2, the first groove 310A1 is closer to the through portion TH, and compared with the first groove 310A1, the second groove 310A2 is closer to the display area DA. The inside of the second groove 310A2 can be filled with an organic material 420A. The organic material 420A can be the same material as the material of the organic encapsulation layer 420 of the encapsulation layer 400. In the second groove 310A2, the inorganic encapsulation layer 410 covers the inner surface of the second groove 310A2, the organic material 420A fills the inside of the second groove 310A2, and the inorganic encapsulation layer 430 covers the organic material 420A.

[0143] Fig.16 and Fig.17 The stack structure including the crack prevention pattern 300A' is shown in more detail.

[0144] Fig.17 The substrate 100 may include a multilayer structure of an organic / inorganic composite layer. For example, the substrate 100 includes a first substrate layer 100a1 and a second substrate layer 100a2 having a double-layer structure and first and second barrier layers 100b1 and 100b2 alternately disposed with the first and second substrate layers 100a1 and 100a2.

[0145] and Figure 8 Similarly, a first insulating layer 110 including a buffer layer 101, a gate insulating layer 103, a dielectric insulating layer 105 and an interlayer insulating layer 107, a via layer 130 and a second insulating layer 150 are sequentially disposed on the substrate 100. Portions of the via layer 130 and the second insulating layer 150 corresponding to the groove area GA are removed. A crack prevention pattern 300A′ including a first groove 310A1 and a second groove 310A2 is disposed in the groove area GA.

[0146] The crack prevention pattern 300A' includes a first trench 310A1 disposed adjacent to the through portion TH and a second trench 310A2 disposed outside the first trench 310A1. The first trench 310A1 and the second trench 310A2 extend to the second substrate layer 100a2, and undercut-shaped step difference portions UC1 and UC2 are formed between the second substrate layer 100a2 and the second barrier layer 100b2.

[0147] like Fig.17 As shown in FIG. 1 , the first trench 310A1 and the second trench 310A2 may have step difference portions ST1 and ST2 between the buffer layer 101 and the gate insulating layer 103 and between the interlayer insulating layer 107 and the via layer 130 .

[0148] While the present disclosure has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the claims.

Claims

1. A display device, comprising: substrate; A first insulating layer, disposed on the substrate; A through portion passing through the substrate and the first insulating layer; a display unit disposed on the first insulating layer and comprising a plurality of pixels surrounding at least a portion of the through-portion, wherein each pixel comprises a light emitting element, the light emitting element comprising a pixel electrode and a counter electrode facing each other and an emission layer disposed between the pixel electrode and the counter electrode; a dummy pixel unit, comprising a plurality of dummy pixels disposed between the through portion and the display unit and comprising a metal pattern, wherein the metal pattern comprises a material that is the same as that of the pixel electrode; a wiring connection unit, disposed between the through portion and the dummy pixel unit; and a metal layer, disposed between the wiring connection unit and the dummy pixel unit, having a ring shape and surrounding the through portion, The plurality of dummy pixels are arranged adjacent to the display unit, and Wherein, the diameter of the metal layer is greater than the diameter of the through portion.

2. The display device according to claim 1, wherein: The plurality of dummy pixels of the dummy pixel unit are disposed continuously with the plurality of pixels of the display unit.

3. The display device according to claim 1, further comprising: a first pixel circuit; as well as The second pixel circuit, Wherein, each of the first pixel circuit and the second pixel circuit includes a thin film transistor disposed on the substrate, A first pixel from among the plurality of pixels is electrically connected to the first pixel circuit, and a first dummy pixel from among the plurality of dummy pixels is electrically insulated from the second pixel circuit.

4. The display device according to claim 3, further comprising: a via layer, covering the first pixel circuit and the second pixel circuit, wherein the via layer flattens a top surface of the via layer and includes a contact hole electrically connecting the first pixel to the first pixel circuit, Wherein, the contact hole is not arranged between the second pixel circuit and the metal pattern.

5. The display device according to claim 3, wherein: The pixel electrode is electrically connected to the thin film transistor of the first pixel circuit, and the metal pattern is electrically insulated from the thin film transistor of the second pixel circuit.

6. The display device according to claim 1, further comprising: a second insulating layer, covering the edge of the pixel electrode, The second insulating layer exposes a portion of the pixel electrode and covers a top surface of the metal pattern.

7. The display device according to claim 6, further comprising: an organic pattern disposed on the second insulating layer in a region corresponding to the metal pattern, The organic pattern includes the same material as that of the emission layer.

8. The display device according to claim 7, wherein: The metal pattern and the organic pattern are spaced apart from each other, and the second insulating layer is disposed between the metal pattern and the organic pattern.

9. The display device according to claim 1, further comprising: a second insulating layer, the second insulating layer covering an edge of the pixel electrode and including a first opening exposing a portion of the pixel electrode, and the second insulating layer covering an edge of the metal pattern and including a second opening exposing a portion of the metal pattern, The portion of the metal pattern exposed by the second opening is in contact with the counter electrode.

10. The display device according to claim 9, wherein: The emission layer is disposed on the portion of the pixel electrode exposed by the first opening, and is not disposed on a remaining portion of the pixel electrode.

11. The display device according to claim 1, further comprising: A groove is provided in the first insulating layer between the through portion and the dummy pixel unit.

12. The display device according to claim 11, further comprising: a coating layer, disposed on the first insulating layer, The cladding layer covers the groove and includes a material different from that of the first insulating layer.

13. The display device according to claim 11, wherein: A depth of the trench is equal to or less than a thickness of the first insulating layer.

14. The display device according to claim 11, wherein: The wiring connection unit is disposed between the groove and the dummy pixel unit.

15. The display device according to claim 14, further comprising: The spacing area is arranged between the wiring connection unit and the dummy pixel unit.

16. The display device according to claim 15, wherein: The metal layer is disposed in the spacing region.

17. The display device according to claim 1, in, The substrate includes a display area in which the display unit is disposed and a non-display area disposed adjacent to the display area. The non-display area includes a first non-display area surrounding at least a portion of an outer edge of the display area along an edge of the substrate and a second non-display area surrounding at least a portion of an outer edge of the through portion between the through portion and the display area.

18. The display device according to claim 17, wherein: The through portion is disposed adjacent to the edge of the substrate, and the first non-display area is connected to the second non-display area.

19. The display device according to claim 1, wherein: The through portion comprises: a first through hole; and a second through hole, disposed adjacent to the first through hole, Wherein, at least a portion of the dummy pixel unit is disposed between the first through hole and the second through hole.

20. The display device according to claim 1, wherein: The through portion includes a single closed curve shape.

21. The display device according to claim 11, wherein: The trench passes through the first insulating layer and extends to at least a portion of the substrate.

22. A display device, comprising: substrate; A first insulating layer, disposed on the substrate; A through portion passing through the substrate and the first insulating layer; a second insulating layer, disposed on the first insulating layer; a plurality of pixels surrounding at least a portion of the through-portion, wherein each pixel includes a light emitting element including a pixel electrode and a counter electrode facing each other and an emission layer disposed between the pixel electrode and the counter electrode; a plurality of dummy pixels disposed between the through portion and the plurality of pixels, wherein each dummy pixel comprises a metal pattern, and the metal pattern comprises a material that is the same as that of the pixel electrode; a wiring connection unit arranged between the through-portion and the plurality of dummy pixels; and a metal layer, arranged between the wiring connection unit and the plurality of dummy pixels, having a ring shape and surrounding the through portion, wherein the second insulating layer comprises a plurality of openings exposing each pixel electrode of the plurality of pixels, and the second insulating layer completely covers each metal pattern of the plurality of dummy pixels, and Wherein, the diameter of the metal layer is greater than the diameter of the through portion.

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