Light emitting device and light source module including the same

Abstract

A light emitting device and a light source module including the light emitting device are provided. The light source module includes: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of sub-arrays, each of the plurality of sub-arrays including a plurality of light emitting monomers; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips drives a corresponding sub-array of the plurality of sub-arrays, respectively, wherein the plurality of sub-arrays are electrically isolated from each other.

Description

[0001] This application claims the priority benefit of Korean Patent Application No. 10-2018-0079576 filed on Jul. 9, 2018 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The inventive concept relates to a light emitting device and a light source module including the same. Background Art

[0003] Semiconductor light emitting devices include devices such as light emitting diodes (LEDs). LEDs have various advantages such as low power consumption, high brightness, and long life. As a result, their application areas have gradually expanded to include light sources such as lamps. Specifically, semiconductor light emitting devices have been used to replace traditional halogen lamps or xenon lamps as light sources in automobile headlights or taillights.

[0004] When a semiconductor light-emitting device is used for lighting, it may be necessary to adjust its brightness, light orientation angle, or irradiation angle. For example, in the case of a car headlight or taillight, the brightness of the light can be adjusted according to the external environment. Summary of the invention

[0005] According to an exemplary embodiment of the inventive concept, a light source module is provided, comprising: a printed circuit board; a light emitting device, mounted on the printed circuit board and comprising a plurality of sub-arrays, each of the plurality of sub-arrays comprising a plurality of light emitting monomers; and a plurality of driving chips, mounted on the printed circuit board, wherein each of the plurality of driving chips drives a corresponding sub-array of the plurality of sub-arrays, respectively, wherein the plurality of sub-arrays are electrically isolated from each other.

[0006] According to an exemplary embodiment of the inventive concept, there is provided a light emitting device including: a plurality of sub-arrays each including a plurality of light emitting monomers; and a plurality of pads for providing electrical connection between an external device and the plurality of sub-arrays, wherein the plurality of sub-arrays are electrically isolated from each other.

[0007] According to an exemplary embodiment of the inventive concept, a light source module is provided, which includes: a printed circuit board; a light emitting device, mounted on the printed circuit board and including a first sub-array and a second sub-array, wherein the first sub-array and the second sub-array each include a plurality of light emitting monomers; a first driving chip, mounted on the printed circuit board to drive the first sub-array; and a second driving chip, mounted on the printed circuit board to drive the second sub-array, wherein the first sub-array and the second sub-array are electrically isolated from each other, the first sub-array and the second sub-array are sequentially arranged in a first direction parallel to a first surface of the printed circuit board, and the first driving chip and the second driving chip are sequentially arranged in the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and other features of the inventive concept will be more clearly understood by describing in detail exemplary embodiments of the inventive concept with reference to the accompanying drawings, in which:

[0009] Figure 1 is a block diagram illustrating a light source module according to an exemplary embodiment of the inventive concept;

[0010] Figure 2 is a perspective view showing a light source module according to an exemplary embodiment of the inventive concept;

[0011] Figure 3 is along Figure 2 A cross-sectional view taken along line II';

[0012] Figure 4 is a plan view showing a light emitting device according to an exemplary embodiment of the inventive concept;

[0013] Figure 5A is along Figure 4 A cross-sectional view taken along line III-III', Figure 5B is along Figure 4 A cross-sectional view taken along line IV-IV';

[0014] Fig. 6A is a cross-sectional view showing a light emitting device according to an exemplary embodiment of the inventive concept, Figure 6B yes Fig. 6A An enlarged cross-sectional view of a portion of CX3;

[0015] Figure 7 is a circuit diagram illustrating a connection relationship of a sub-array and a pad included in a light emitting device according to an exemplary embodiment of the inventive concept;

[0016] Figure 8 is a circuit diagram illustrating a connection relationship of a sub-array and a pad included in a light emitting device according to an exemplary embodiment of the inventive concept;

[0017] Fig.9A , Fig. 9B , Fig. 9C , Fig.9D , Fig.9E , Fig.9F , Figure 9G , Figure 9H , Fig.9I , Figure 9J , Figure 9K and Figure 9L are sequential cross-sectional views illustrating a method of manufacturing a light emitting device according to an exemplary embodiment of the inventive concept;

[0018] Fig.10is a perspective view showing a lighting device according to an exemplary embodiment of the inventive concept;

[0019] Fig.11 is a perspective view showing a flat panel lighting device according to an exemplary embodiment of the inventive concept;

[0020] Fig.12 is an exploded perspective view showing a lighting device according to an exemplary embodiment of the inventive concept;

[0021] Fig.13 is an exploded perspective view showing a strip-type lighting device according to an exemplary embodiment of the inventive concept;

[0022] Fig.14 is an exploded perspective view showing a lighting device according to an exemplary embodiment of the inventive concept;

[0023] Fig.15 is a schematic diagram illustrating an indoor lighting control network system including lighting devices according to an exemplary embodiment of the inventive concept; and

[0024] Fig.16 is a schematic diagram illustrating a network system including a lighting device according to an exemplary embodiment of the inventive concept. DETAILED DESCRIPTION

[0025] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings. In the accompanying drawings, like reference numerals may represent like elements.

[0026] Figure 1 is a block diagram illustrating a light source module according to an exemplary embodiment of the inventive concept.

[0027] Reference Figure 1 , the light source module 10 may include a light source 100 and a light emitting diode (LED) driving unit 200 .

[0028] The light source 100 may include an LED array including a plurality of light emitting monomers. In an exemplary embodiment of the inventive concept, the LED array constituting the light source 100 may include a plurality of sub-arrays 110. Light emitting monomers included in different sub-arrays may be electrically isolated from each other.

[0029] The LED driving unit 200 may be connected to a power supply unit. The power supply unit may generate an input voltage to operate the light source 100, and provide the input voltage to the light source 100. In an exemplary embodiment of the inventive concept, when the light source module 10 is a headlight of a car, the power supply unit may be a battery installed in the car. In an exemplary embodiment of the inventive concept, when the light source module 10 is a home lighting device or a commercial lighting device, the light source module 10 may further include an AC power supply for generating an alternating current (AC) voltage and a voltage regulator circuit and a rectifier circuit for generating a direct current (DC) voltage by rectifying the AC voltage.

[0030] The LED driving unit 200 may include a plurality of driving chips 210. Each of the plurality of driving chips 210 may be an integrated circuit (IC).

[0031] The plurality of driving chips 210 may drive the LED array included in the light source 100. In an exemplary embodiment of the inventive concept, each of the plurality of driving chips 210 may be electrically connected to a corresponding sub-array among the plurality of sub-arrays 110, and may controllably operate the light-emitting monomers included in the corresponding sub-array. In an exemplary embodiment of the inventive concept, the number of the plurality of driving chips 210 may be equal to the number of the plurality of sub-arrays 110 included in the light source 100. However, the inventive concept is not limited thereto, and the number of the plurality of driving chips 210 and the number of the plurality of sub-arrays 110 may be different from each other.

[0032] Figure 2 is a perspective view illustrating a light source module according to an exemplary embodiment of the inventive concept. Figure 3 is along Figure 2 A cross-sectional view taken along line II'. Figure 2 The light emitting device 100 can be used with Figure 1 Corresponding to the light source 100.

[0033] Reference Figure 2 , the light source module 10 may include a light emitting device 100 mounted on a base printed circuit board (PCB) PCB and a plurality of driving chips 210_1, 210_2, 210_3, 210_4, 210_5, 210_6, 210_7, 210_8, 210_9, 210_10, 210_11, 210_12, 210_13, 210_14, 210_15 and 210_16. In an exemplary embodiment of the inventive concept, the light emitting device 100 may be one chip, and the light source module 10 may include the light emitting device 100 configured as one chip.

[0034] The light emitting device 100 may include an LED array in which a plurality of light emitting monomers are arranged. The LED array may be divided into a plurality of sub-arrays SA1, SA2, SA3, SA4, SA5, SA6, SA7, SA8, SA9, SA10, SA11, SA12, SA13, SA14, SA15, and SA16. Figure 2 16 sub-arrays SA1 to SA16 are shown in FIG. 1 , but the light source module 10 according to an exemplary embodiment of the inventive concept is not limited thereto. For example, the number of sub-arrays may vary, and the arrangement of the sub-arrays SA1 to SA16 may also vary.

[0035] The plurality of sub-arrays SA1 to SA16 (also identified by reference numeral 110 ) may be electrically isolated from one another. In other words, the light emitting monomers included in different sub-arrays may be electrically insulated from one another.

[0036] The light emitting device 100 may have a rectangular shape that is shorter in the second direction Y than in the first direction X. The first direction X and the second direction Y may be parallel to the main surface of the base PCB PCB and perpendicular to each other. In an exemplary embodiment of the inventive concept, a plurality of sub-arrays SA1 to SA16 may be arranged in two rows in the light emitting device 100. For example, the first sub-array SA1 to the eighth sub-array SA8 may be arranged sequentially in the first direction X, and the ninth sub-array SA9 to the sixteenth sub-array SA16 may be arranged sequentially in the opposite direction (-X) of the first direction X. The sixteenth sub-array SA16 and the first sub-array SA1 may be arranged in parallel in the second direction Y. Since the plurality of sub-arrays SA1 to SA16 are arranged in two rows, a plurality of pads (also referred to as "pads") for connecting the light emitting device 100 to the plurality of driving chips 210_1 to 210_16 may be easily formed in structure. The following will refer to Figure 4 Describes an arrangement of multiple pads.

[0037] Each of the plurality of driver chips 210_1 to 210_16 may controllably operate the light-emitting monomers included in its corresponding sub-array. For example, the first driver chip 210_1 may be electrically connected to the first sub-array SA1 and may control the operation of the first sub-array SA1. The second driver chip 210_2 may be electrically connected to the second sub-array SA2 and may control the operation of the second sub-array SA2. The description of the first driver chip 210_1 and the second driver chip 210_2 may also be similarly applied to the third driver chip 210_3 to the sixteenth driver chip 210_16. For example, the fifteenth driver chip 210_15 may be electrically connected to the fifteenth sub-array SA15 and may control the operation of the fifteenth sub-array SA15, and the sixteenth driver chip 210_16 may be electrically connected to the sixteenth sub-array SA16 and may control the operation of the sixteenth sub-array SA16.

[0038] The light source module 10 may further include an input unit 300 for receiving a signal for operating the light source module 10 from the outside. The plurality of driver chips 210_1 to 210_16 may receive a control signal CS from the input unit 300, and may control the operation of the plurality of driver chips 210_1 to 210_16 based on the control signal CS. For example, when the input unit 300 outputs a control signal CS to make only the fourth sub-array SA4, the fifth sub-array SA5, the twelfth sub-array SA12, and the thirteenth sub-array SA13 emit light, the fourth driver chip 210_4, the fifth driver chip 210_5, the twelfth driver chip 210_12, and the thirteenth driver chip 210_13 may apply voltages to the fourth sub-array SA4, the fifth sub-array SA5, the twelfth sub-array SA12, and the thirteenth sub-array SA13, respectively. In addition, the plurality of driver chips 210_1 to 210_16 may receive driving power from the input unit 300.

[0039] At least some of the plurality of driver chips 210_1 to 210_16 may be arranged to correspond to a specific sub-array. For example, in the light emitting device 100, the first sub-array SA1 to the eighth sub-array SA8 are sequentially arranged in the first direction X, and the first driver chips 210_1 to the eighth driver chips 210_8 corresponding to the first sub-array SA1 to the eighth sub-array SA8 may also be sequentially arranged in the first direction X. In addition, in the light emitting device 100, the ninth sub-array SA9 to the sixteenth sub-array SA16 are sequentially arranged in the opposite direction (-X) of the first direction X, and the ninth driver chips 210_9 to the sixteenth driver chips 210_16 corresponding to the ninth sub-array SA9 to the sixteenth sub-array SA16 may also be sequentially arranged in the opposite direction (-X) of the first direction X. However, the arrangement of the plurality of driver chips 210_1 to 210_16 is not limited thereto. For example, only some of the first driver chips 210_1 to the eighth driver chips 210_8 may be sequentially arranged in the first direction X. However, since the arrangement order of the plurality of driving chips 210_1 to 210_16 and the arrangement order of the plurality of sub-arrays SA1 to SA16 correspond to each other, lines or wirings for electrically connecting the plurality of driving chips 210_1 to 210_16 to the plurality of sub-arrays SA1 to SA16 may be easily formed.

[0040] In an exemplary embodiment of the inventive concept, the number of the plurality of driving chips 210_1 to 210_16 may be equal to the number of the plurality of sub-arrays SA1 to SA16. However, the light source module 10 according to an exemplary embodiment of the inventive concept is not limited thereto. For example, different driving chips may be connected to one sub-array and control the sub-array, or one driving chip may control different sub-arrays.

[0041] In an exemplary embodiment of the inventive concept, a plurality of driver chips 210_1 to 210_16 may be electrically connected in series. For example, the first driver chip 210_1 may be electrically connected to the second driver chip 210_2, the second driver chip 210_2 may be electrically connected to the first driver chip 210_1 and the third driver chip 210_3, and the third driver chip 210_3 may be electrically connected to the second driver chip 210_2 and the fourth driver chip 210_4. The first driver chip 210_1 may receive a control signal CS from the input unit 300 and transmit the received control signal CS to the second driver chip 210_2, the second driver chip 210_2 may receive a control signal CS from the first driver chip 210_1 and transmit the received control signal CS to the third driver chip 210_3. The description of the first driver chip 210_1 and the second driver chip 210_2 may also be similarly applied to the third driver chip 210_3 to the sixteenth driver chip 210_16. For example, the ninth driving chip 210_9 may receive the control signal CS from the eighth driving chip 210_8 and transmit the received control signal CS to the tenth driving chip 210_10 .

[0042] The light emitting device 100 may be mounted on the central area CA_P of the substrate PCB PCB, and a plurality of driving chips 210_1 to 210_16 may be arranged in the first peripheral area PA_P1 and the second peripheral area PA_P2 of the substrate PCB PCB to surround the light emitting device 100. For example, the first to eighth driving chips 210_1 to 210_8 may be arranged in the first peripheral area PA_P1, and the ninth to sixteenth driving chips 210_9 to 210_16 may be arranged in the second peripheral area PA_P2. Since the plurality of driving chips 210_1 to 210_16 are arranged in the first peripheral area PA_P1 and the second peripheral area PA_P2 of the substrate PCB PCB, lines or wirings for electrically connecting the plurality of driving chips 210_1 to 210_16 to the plurality of sub-arrays SA1 to SA16 may be easily formed.

[0043] In an exemplary embodiment of the inventive concept, the second peripheral area PA_P2, the central area CA_P, and the first peripheral area PA_P1 may be sequentially arranged in the second direction Y. In an exemplary embodiment of the inventive concept, the light emitting device 100 and the plurality of driving chips 210_1 to 210_16 may overlap each other in a direction parallel to the main surface of the base PCB PCB (e.g., in the first direction X or the second direction Y).

[0044] In the light source module 10 according to the exemplary embodiment of the inventive concept, one light emitting device 100 including a plurality of light emitting monomers for emitting light may be arranged in the central area CA_P of the light source module 10, and a plurality of driving chips 210_1 to 210_16 for driving the light emitting device 100 may be separately arranged in the first peripheral area PA_P1 and the second peripheral area PA_P2. Since the light emitting device 100 includes a plurality of light emitting monomers and the plurality of driving chips 210_1 to 210_16 are separate chips, the design of the plurality of driving chips 210_1 to 210_16 may not be affected by the structure of the plurality of light emitting monomers. Therefore, the design efficiency of the plurality of driving chips 210_1 to 210_16 may be improved.

[0045] In addition, since the light emitting device 100 is an LED chip and is arranged in the central area CA_P of the light source module 10, the light emitted by the light source module 10 can be concentrated at the central area CA_P. Since the emitted light is concentrated at the central area CA_P, the number of separate components (e.g., lenses) for concentrating the emitted light can be reduced. For example, the light source module 10 according to the exemplary embodiment of the inventive concept may not include a lens. Since the amount of light loss due to the lens increases as the number of lenses included in the light source module 10 increases, the luminous efficiency of the light source module 10 according to the exemplary embodiment of the inventive concept can be improved.

[0046] Reference Figure 2 and Figure 3 , the light emitting device 100 and the plurality of driving chips 210 may be mounted on a substrate (eg, PCB). In an exemplary embodiment of the inventive concept, the substrate PCB PCB may be formed of a metal, a metal compound. For example, the substrate PCB PCB may include a metal core printed circuit board (MCPCB), and may include, for example, copper (Cu).

[0047] In an exemplary embodiment of the inventive concept, the base PCB PCB may include a flexible printed circuit board (FPCB) that is freely bent and easily deformed into various shapes. In addition, the base PCB PCB may include a conventional FR4 type printed circuit board and may be formed of a resin material including epoxy resin, triazine, silicon or polyimide, etc., or may be formed of a material such as silicon nitride, AlN or Al. 2 O 3 of ceramic materials.

[0048] The heat dissipation member 530 may be arranged under the base PCB PCB (in the -Z direction). The heat dissipation member 530 may release heat generated in the light emitting device 100 to the outside while supporting the base PCB PCB, functioning like a heat sink. The heat dissipation member 530 may be formed of a material having high thermal conductivity to improve heat dissipation efficiency, and may be formed of, for example, a metal material, but is not limited thereto.

[0049] The heat dissipation member 530 may have various shapes. For example, the heat dissipation efficiency of the heat dissipation member 530 may be improved by including a plurality of protrusions protruding below the base PCB PCB (in the -Z direction); however, the inventive concept is not limited thereto.

[0050] An interposer 510 may be arranged on an area (e.g., a central area CA_P) of the base PCB PCB, and the light emitting device 100 may be mounted on the interposer 510. Due to the interposer 510, a plurality of pads for electrically connecting the light emitting device 100 to the plurality of driving chips 210_1 to 210_16 may be formed in a peripheral area surrounding the plurality of sub-arrays SA1 to SA16. The interposer 510 may provide electrical connection between at least some of the plurality of light emitting monomers included in the plurality of sub-arrays SA1 to SA16 and at least some of the plurality of pads. Figure 4 Describes the peripheral region in which the pad is formed.

[0051] In an exemplary embodiment of the inventive concept, the base PCB PCB may include an MCPCB. In this case, an insulating layer may not be formed on the base PCB PCB in the region where the interposer 510 and the light emitting device 100 are mounted, but an interposer bonding layer including a plating layer may be formed on the base PCB PCB in the region where the interposer 510 and the light emitting device 100 are mounted. Since the interposer 510 and the light emitting device 100 are mounted on the interposer bonding layer by eutectic bonding or welding, thermal resistance of the interposer 510 and the light emitting device 100 may be reduced, and thus heat generated in the light emitting device 100 may be easily released to the outside.

[0052] The insulating layer 520 may be stacked on additional regions (e.g., the first peripheral region PA_P1 and the second peripheral region PA_P2) of the base PCB PCB, and a plurality of driving chips 210_1 to 210_16 may be mounted on the insulating layer 520. In an exemplary embodiment of the inventive concept, the insulating layer 520 on which the plurality of driving chips 210_1 to 210_16 are mounted may be formed on the base PCB PCB to have a thickness of about 1 μm to about 30 μm; however, the inventive concept is not limited thereto.

[0053] Pads connecting the light emitting device 100 to the plurality of driving chips 210_1 to 210_16 may be formed on a light emitting surface of the light emitting device 100 (eg, a surface formed in the third direction Z). The plurality of driving chips 210_1 to 210_16 may be electrically connected to the light emitting device 100 through bonding wires 400 connected to the pads, respectively.

[0054] However, the light source module 10 according to the exemplary embodiment of the inventive concept is not limited thereto, and some electrodes of the light-emitting monomers included in the light-emitting device 100 may be formed on the opposite surface of the light-emitting surface (e.g., a surface formed in the opposite direction (-Z) of the third direction Z). Therefore, at least one pad among the plurality of pads that connect the plurality of driving chips 210_1 to 210_16 to the electrodes of the light-emitting monomers included in the light-emitting device 100 may be formed under the interposer 510 to electrically connect the substrate PCBPCB to the interposer 510. In this case, an insulating layer may be interposed between the substrate PCBPCB and the interposer 510, and the pad under the interposer 510 may be arranged in a region where the insulating layer is partially removed to expose the substrate PCBPCB to serve as an attachment pad for attaching the substrate PCBPCB to the interposer 510.

[0055] Figure 4 is a plan view illustrating a light emitting device according to an exemplary embodiment of the inventive concept.

[0056] Reference Figure 4 , the light emitting device 100 may include a light emitting monomer region CA_L in which a plurality of light emitting monomers are formed, and a first pad region PA_L1 and a second pad region PA_L2 in which a plurality of pads 120 are formed. The light emitting monomer region CA_L may be arranged in a central region of the light emitting device 100, and the first pad region PA_L1 and the second pad region PA_L2 may be arranged in an outer region surrounding the central region. For example, the second pad region PA_L2, the light emitting monomer region CA_L, and the first pad region PA_L1 may be sequentially arranged in the second direction Y.

[0057] The plurality of light emitting monomers may be divided into a plurality of sub-arrays SA1 to SA16. Figure 4 16 sub-arrays SA1 to SA16 are shown in total, but the light emitting device 100 according to the exemplary embodiment of the inventive concept is not limited thereto. For example, the number of sub-arrays may vary, and the arrangement of the sub-arrays SA1 to SA16 may also vary. In this case, the plurality of sub-arrays SA1 to SA16 may be electrically isolated from each other.

[0058] In an exemplary embodiment of the inventive concept, the plurality of sub-arrays SA1 to SA16 may be arranged in a rectangular shape such that the length "a" in the first direction X is longer than the length "b" in the second direction Y. For example, the plurality of sub-arrays SA1 to SA16 may be arranged in a total of two rows (including a first row and a second row). The first sub-array SA1 to the eighth sub-array SA8 may be sequentially arranged in the first row in the first direction X, and the ninth sub-array SA9 to the sixteenth sub-array SA16 may be sequentially arranged in the second row in the opposite direction (-X) of the first direction X. Although Figure 4 It is shown that two sub-arrays are arranged in the second direction Y, but the inventive concept is not limited thereto, and three or more sub-arrays may be arranged in the second direction Y.

[0059] The first to eighth sub-arrays SA1 to SA8 arranged in the first row may be electrically connected to the driving chip (eg, Figure 2 The ninth sub-array SA9 to the sixteenth sub-array SA16 arranged in the second row may be electrically connected to the driving chip (eg, Figure 2 210_9 to 210_16).

[0060] In the light emitting device 100 according to the exemplary embodiment of the inventive concept, the first pad area PA_L1 and the second pad area PA_L2 may be arranged in parallel in the second direction Y. The first pad area PA_L1 and the second pad area PA_L2 may not be arranged on the light emitting monomer area CA_L including the plurality of light emitting monomers. In other words, the first pad area PA_L1 and the second pad area PA_L2 arranged with the plurality of pads 120 and the light emitting monomer area CA_L may not overlap each other in the third direction Z perpendicular to the main surface of the substrate PCB PCB. Since the light emitting device 100 includes the first pad area PA_L1 and the second pad area PA_L2 separated from the light emitting monomer area CA_L, the density of the plurality of light emitting monomers in the light emitting monomer area CA_L may be increased. In addition, since the plurality of pads 120 are arranged in the outer area of ​​the light emitting device 100, a device for making a driving chip (for example, Figure 2 210_1 to 210_16 in (e.g., via Figure 3 The bonding wiring 400) is connected to a structure of multiple pads 120.

[0061] In an exemplary embodiment of the inventive concept, in a plan view, the light-emitting monomer region CA_L may have an area corresponding to about 50% to about 90% of the total area of ​​the light-emitting device 100, and the first pad region PA_L1 and the second pad region PA_L2 may have an area corresponding to about 10% to about 50% of the total area of ​​the light-emitting device 100; however, the inventive concept is not limited thereto.

[0062] Figure 5A is along Figure 4 A cross-sectional view taken along line III-III', Figure 5B is along Figure 4 A cross-sectional view taken along line IV-IV'. Figure 5A and Figure 5B Only some components of the light emitting device 100 are shown.

[0063] Reference Figure 5A and Figure 5B , the light emitting device 100 may include a light emitting monomer region CA_L and a first pad region PA_L1. A plurality of light emitting monomers PX in a matrix form may be arranged on the light emitting monomer region CA_L. The plurality of light emitting monomers PX may be divided into Figure 4 Each of the plurality of light emitting monomers PX may have a width of, for example, about 10 μm to several mm in the first direction X or in the second direction Y, but is not limited thereto.

[0064] The first pad 48A and the second pad 48B electrically connected to the plurality of light emitting device structures 20U may be disposed on the first pad area PA_L1. Figure 5A and Figure 5B Only one pad is respectively shown in FIG. 1 , but the light emitting device 100 may include additional pads connected to the plurality of light emitting device structures 20U.

[0065] A plurality of light emitting device structures 20U may be arranged in each light emitting monomer PX in the light emitting monomer region CA_L. In addition, a blocking structure 60 may be arranged on the plurality of light emitting device structures 20U, and the blocking structure 60 may be arranged to surround each of the plurality of light emitting device structures 20U in a plan view. In the first pad region PA_L1, the light emitting stack 20 may be arranged outside the blocking structure 60 and surround the plurality of light emitting device structures 20U.

[0066] The barrier structure 60 may include: a first barrier layer 62 disposed between adjacent light-emitting monomers PX in the light-emitting monomer region CA_L; and a second barrier layer 64 formed at the periphery of the light-emitting monomer region CA_L. The second barrier layer 64 may be arranged in a plan view to surround the first barrier layer 62. The width of the first barrier layer 62 in the horizontal direction (e.g., the second direction Y) may be smaller than the width of the second barrier layer 64 in the horizontal direction. For example, the width of the first barrier layer 62 may be about 10 μm to about 100 μm, and the width of the second barrier layer 64 may be about 10 μm to about 1 mm. Accordingly, the structural stability of the light-emitting device 100 may be improved. For example, even when repetitive vibrations and impacts are applied when the light-emitting device 100 is used as a vehicle headlamp, the reliability of the light-emitting device 100 may be improved due to the excellent structural stability between the barrier structure 60 and the fluorescent layer 74 disposed in the barrier structure 60.

[0067] The light-emitting stack 20 may include a first-conductive-type semiconductor layer 22, an active layer 24, and a second-conductive-type semiconductor layer 26. In the light-emitting monomer region CA_L, a plurality of light-emitting device structures 20U may be separated from each other through device isolation openings IAH. In an exemplary process, by removing a part of the light-emitting stack 20 to form the device isolation openings IAH, a plurality of light-emitting device structures 20U may be formed on the light-emitting monomer region CA_L, and the part of the light-emitting stack 20 that surrounds the plurality of light-emitting device structures 20U in a plan view may be retained in the first pad region PA_L1.

[0068] The plurality of light-emitting device structures 20U may include a first-conductive-type semiconductor layer 22, an active layer 24, and a second-conductive-type semiconductor layer 26. A first insulating layer 32, first electrodes 42A and 42A', second electrodes 42B and 42B', first connection electrodes 44A and 44A', and second connection electrodes 44B and 44B' may also be disposed on the plurality of light-emitting device structures 20U.

[0069] The first-conductive-type semiconductor layer 22 may include a nitride semiconductor layer having a composition of n-type In x Al y Ga (1-x-y) N (0 ≤ x < 1, 0 ≤ y < 1, 0 < x + y < 1), and the n-type impurity may be, for example, silicon (Si). For example, the first-conductive-type semiconductor layer 22 may include GaN containing an n-type impurity.

[0070] In an exemplary embodiment of the inventive concept, the first-conductive-type semiconductor layer 22 may include a first-conductive-type semiconductor contact layer and a current diffusion layer. The impurity concentration of the first-conductive-type semiconductor contact layer may be about 2 × 10 18 atoms·cm -3 to about 9 × 1019 Atom cm -3 The thickness of the first conductive type semiconductor contact layer may be about 1 μm to about 5 μm. The current diffusion layer may have a plurality of In layers having different components or different impurity contents alternately stacked therein. x Al y Ga (1-x-y) For example, the current diffusion layer may have a structure in which n-type GaN layers and / or Al layers each having a thickness of about 1 nm to about 500 nm are alternately stacked. x In y Ga z The impurity concentration of the current diffusion layer can be about 2×10 18 Atom cm -3 Up to about 9×10 19 Atom cm -3 .

[0071] The active layer 24 may be disposed between the first conductive type semiconductor layer 22 and the second conductive type semiconductor layer 26, and may emit light having energy due to the recombination of electrons and holes. The active layer 24 may have a multi-quantum well (MQW) structure in which quantum well layers and quantum barrier layers are alternately stacked. For example, the quantum well layers and the quantum barrier layers may include In having different compositions. x Al y Ga (1-x-y) N(0≤x, y≤1, 0≤x+y≤1). For example, the quantum well layer may include In x Ga (1-x) N(0≤x≤1), the quantum barrier layer may include GaN or AlGaN. The thickness of each of the quantum well layer and the quantum barrier layer may be about 1nm to about 50nm. The active layer 24 is not limited to the MQW structure and may have a single quantum well (SQW) structure.

[0072] The second conductive semiconductor layer 26 may include p-type In x Al y Ga (1-x-y) The nitride semiconductor layer may have a composition of N (0≤x<1, 0≤y<1, 0≤x+y<1), and the p-type impurity may be, for example, magnesium (Mg).

[0073] In an exemplary embodiment of the inventive concept, the second conductivity type semiconductor layer 26 may include an electron blocking layer, a low-concentration p-type GaN layer, and a high-concentration p-type GaN layer provided as a contact layer. For example, the electron blocking layer may have a structure in which a plurality of In x Al y Ga (1-x-y) N (0 ≤ x, y ≤ 1, 0 ≤ x + y ≤ 1) layers, each having a thickness of about 5 nm to about 100 nm and having different compositions or different impurity contents, are alternately stacked. Alternatively, the electron blocking layer may include a single layer containing Al y Ga (1-y) N (0 < y ≤ 1). The energy bandgap of the electron blocking layer may decrease as it moves away from the active layer 24. For example, the Al composition of the electron blocking layer may decrease as it moves away from the active layer 24.

[0074] The first conductivity type semiconductor layer 22, the active layer 24, and the second conductivity type semiconductor layer 26 may be sequentially stacked in a vertical direction. Here, the top surface of the first conductivity type semiconductor layer 22 may be referred to as the first surface 20F1 of the plurality of light-emitting device structures 20U, and the bottom surface of the second conductivity type semiconductor layer 26 may be referred to as the second surface 20F2 of the plurality of light-emitting device structures 20U.

[0075] The first electrodes 42A and 42A' may be connected to the first conductivity type semiconductor layer 22 in an opening E passing through the active layer 24 and the second conductivity type semiconductor layer 26. The second electrodes 42B and 42B' may be disposed on the bottom surface (e.g., the second surface 20F2) of the second conductivity type semiconductor layer 26. The first insulating layer 32 may be disposed on the inner wall of the opening E to electrically insulate the first electrodes 42A and 42A' from the active layer 24 and the second conductivity type semiconductor layer 26. The first insulating layer 32 may be disposed on the bottom surface of the second conductivity type semiconductor layer 26 between the first electrodes 42A and 42A' and the second electrodes 42B and 42B', and may electrically insulate the first electrodes 42A and 42A' from the second electrodes 42B and 42B'. The first electrodes 42A and 42A' and the second electrodes 42B and 42B' may include Ag, Al, Ni, Cr, Au, Pt, Pd, Sn, W, Rh, Ir, Ru, Mg, Zn, or any combination thereof. The first electrodes 42A and 42A' and the second electrodes 42B and 42B' may include a metal material having a high reflectivity.

[0076] The first connection electrodes 44A and 44A' may be arranged on the first electrodes 42A and 42A' and the first insulating layer 32. The second connection electrodes 44B and 44B' may be arranged on the second electrodes 42B and 42B' and the first insulating layer 32. The first connection electrodes 44A and 44A' and the second connection electrodes 44B and 44B' may be electrically connected to the first electrodes 42A and 42A' and the second electrodes 42B and 42B', respectively. The first connection electrodes 44A and 44A' and the second connection electrodes 44B and 44B' may include Ag, Al, Ni, Cr, Au, Pt, Pd, Sn, W, Rh, Ir, Ru, Mg, Zn, or any combination thereof.

[0077] Each of the plurality of light emitting device structures 20U may be spaced apart from an adjacent one of the light emitting device structures 20U, and the device isolation opening IAH may be located between the light emitting device structures 20U. For example, the device isolation opening IAH may include a sidewall inclined at an angle of about 60 to about 90 degrees relative to the first surface 20F1 of the plurality of light emitting device structures 20U.

[0078] The insulating liner 34 may be conformally arranged on the inner wall of the device isolation opening IAH, the side surface of each of the plurality of light emitting device structures 20U, and the second surface 20F2 of the plurality of light emitting device structures 20U to cover the first connection electrodes 44A and 44A' and the second connection electrodes 44B and 44B'. The top surface of the insulating liner 34 may be at the same level as the first surface 20F1 of the plurality of light emitting device structures 20U. In an exemplary embodiment of the inventive concept, the insulating liner 34 may include silicon oxide or silicon nitride.

[0079] The pad opening PH passing through the light emitting stack 20 may be arranged on the first pad area PA_L1, and the first pad 48A and the second pad 48B may be arranged in the pad opening PH. The first pad 48A may be electrically connected to the first connection electrode 44A through the first line pattern 46A. The second connection electrode 44B may be connected to another pad through another line pattern. The second pad 48B may be electrically connected to the second connection electrode 44B' through the second line pattern 46B. The first connection electrode 44A' may be connected to another pad through another line pattern.

[0080] The light-emitting monomer PX (for example, Figure 5A and Figure 5B The first line pattern 46A and the second line pattern 46B in the rightmost light emitting monomer PX in the device isolation opening IAH may extend through the device isolation opening IAH and may be respectively connected to the first pad 48A and the second pad 48B on the first pad area PA_L1. Therefore, the first line pattern 46A and the second line pattern 46B may be conformally arranged on the insulating liner 34 in the device isolation opening IAH.

[0081] The buried insulating layer 36 may be disposed on the insulating liner 34, the first line pattern 46A and the second line pattern 46B. The buried insulating layer 36 may contact the insulating liner 34, the first line pattern 46A and the second line pattern 46B in the device isolation opening IAH and fill the remaining space of the device isolation opening IAH. The buried insulating layer 36 may be formed using silicone resin, epoxy resin or acrylic resin.

[0082] The support substrate 54 may be arranged on the buried insulating layer 36, and the adhesive layer 52 is located between the support substrate 54 and the buried insulating layer 36. In an exemplary embodiment of the inventive concept, the adhesive layer 52 may include an electrically insulating material such as a resin or a polymer material (such as an ultraviolet (UV) curable material). In an exemplary embodiment of the inventive concept, the adhesive layer 52 and the buried insulating layer 36 may be formed of the same material, and the boundary between the adhesive layer 52 and the buried insulating layer 36 may not be visible to the naked eye. In an exemplary embodiment of the inventive concept, the adhesive layer 52 may include a eutectic adhesive material such as AuSn or NiSi. The support substrate 54 may include, but is not limited to, a sapphire substrate, a glass substrate, a transparent conductive substrate, a silicon substrate, a silicon carbide substrate, etc.

[0083] As described above, the barrier structure 60 may be disposed on the first surface 20F1 of the plurality of light emitting device structures 20U. The barrier structure 60 may include silicon (Si), silicon carbide (SiC), sapphire, or gallium nitride (GaN).

[0084] The blocking structure 60 may be arranged in a matrix form in a plan view, and a plurality of pixel spaces PXU may be defined by the blocking structure 60. The blocking structure 60 may be arranged to vertically overlap the device isolation opening IAH, and a bottom surface of the blocking structure 60 may contact a top surface of the insulating liner 34. Therefore, the first surfaces 20F1 of the plurality of light emitting device structures 20U may be exposed to the bottom of the plurality of pixel spaces PXU.

[0085] The reflective layer 72 may be disposed on the sidewall of the barrier structure 60. The reflective layer 72 may reflect light emitted from the plurality of light emitting device structures 20U. The reflective layer 72 may be formed on the sidewall of the first barrier layer 62, and thus the sidewalls of the plurality of pixel spaces PXU may be covered by the reflective layer 72. The reflective layer 72 may not be formed on the sidewall of the second barrier layer 64 facing the first pad area PA_L1.

[0086] In an exemplary embodiment of the inventive concept, the reflective layer 72 may include a metal layer containing Ag, Al, Ni, Cr, Au, Pt, Pd, Sn, W, Rh, Ir, Ru, Mg, Zn, or any combination thereof. In an exemplary embodiment of the inventive concept, the reflective layer 72 may be a resin layer such as polyphthalamide (PPA) containing a metal oxide such as titanium oxide or aluminum oxide. In an exemplary embodiment of the inventive concept, the reflective layer 72 may include a distributed Bragg reflector layer. For example, the distributed Bragg reflector layer may have a structure in which a plurality of insulating films having different refractive indices are repeatedly stacked several to several hundred times. Each insulating film included in the distributed Bragg reflector layer may include a dielectric such as SiO 2 、SiN、SiO x N y 、TiO 2 、Si 3 N 4 、Al 2 O 3 、TiN、AlN、ZrO 2 , TiAlN, TiSiN oxides or nitrides or any combination thereof.

[0087] The fluorescent layer 74 may be arranged in a plurality of pixel spaces PXU on the first surface 20F1 of the plurality of light emitting device structures 20U. Figure 5A and Figure 5B As shown in FIG. 1 , the fluorescent layer 74 may substantially fill all of the plurality of pixel spaces PXU, and a top surface level of the fluorescent layer 74 may be equal to a top surface level LV2 of the blocking structure 60. The fluorescent layer 74 may have a substantially flat top surface.

[0088] The fluorescent layer 74 may include a single type of material capable of converting light emitted from a plurality of light emitting device structures 20U into a desired color. Therefore, the fluorescent layer 74 capable of producing the same color may be arranged in a plurality of pixel spaces PXU. However, the inventive concept is not limited thereto. For example, the fluorescent layer 74 arranged in some pixel spaces PXU may produce a color different from the color produced by the fluorescent layer 74 arranged in other pixel spaces PXU.

[0089] The fluorescent layer 74 may include a resin in which a fluorescent substance is dispersed or a film containing a fluorescent substance. For example, the fluorescent layer 74 may include a fluorescent film in which fluorescent particles are uniformly dispersed at a certain concentration. The fluorescent particles may be a wavelength conversion material for converting the wavelength of light emitted from the plurality of light emitting device structures 20U. In order to increase the density of the fluorescent particles and increase the color uniformity thereof, the fluorescent layer 74 may include two or more types of fluorescent particles having different size distributions.

[0090] In an exemplary embodiment of the inventive concept, the fluorescent material may have various components and colors, such as oxides, silicates, nitrides, and fluorides. For example, the fluorescent material may include β-SiAlON:Eu 2+ (green), (Ca,Sr)AlSiN 3 :Eu 2+ (red), La 3 Si 6 N 11 :Ce 3+ (yellow), K 2 SiF 6 :Mn 4+ (red), SrLiAl 3 N 4 :Eu(red), Ln 4-x (Eu z M 1-z ) x Si 12-y Al y O 3+x+y N 18-x-y (0.5 ≤ x ≤ 3, 0 < z < 0.3, 0 < y ≤ 4)(red), K 2 TiF 6 :Mn 4+ (red), NaYF 4 :Mn 4+ (red) or NaGdF 4 :Mn 4+ (red), etc. However, the types of fluorescent materials are not limited thereto.

[0091] In an exemplary embodiment of the inventive concept, a wavelength conversion material such as a quantum dot may also be disposed on the fluorescent layer 74. The quantum dot may have a core-shell structure of a group III-V or II-VI compound semiconductor and may have a core such as CdSe or InP and a shell such as ZnS or ZnSe. In addition, the quantum dot may include ligands for stabilizing the core and the shell.

[0092] Different from Figure 5A and Figure 5B the illustration, the reflective layer 72 may not be formed on the sidewalls of the blocking structure 60. In this case, the sidewalls of the first blocking layer 62 and the sidewalls of the second blocking layer 64 may be in direct contact with the fluorescent layer 74.

[0093] The top surface horizontal plane LV1 of the first pad 48A and the second pad 48B in the first pad region PA_L1 may be substantially equal to the horizontal plane of the first surface 20F1 of the plurality of light-emitting device structures 20U. For connection with a driving chip (e.g., Figure 2A connection member such as bonding wires 400A and 400B electrically connected to the first driving chip 210_1 of the first pad region PA_L1 may be arranged on the first pad 48A and the second pad 48B in the first pad region PA_L1. A top surface level LV2 of a blocking structure (e.g., a second blocking layer 64) located at a boundary between the first pad region PA_L1 and the light-emitting monomer region CA_L may be higher than a top surface level LV1 of the first pad 48A and the second pad 48B.

[0094] Generally, a light source module including a plurality of light emitting device chips can be used in an intelligent lighting system such as a vehicle headlight, and by individually controlling the light emitting device chips, various light emitting modes can be realized according to the surrounding environment. When a plurality of light emitting devices are arranged in a matrix form, light emitted from each of the plurality of light emitting devices may be mixed with light emitted from a nearby (e.g., adjacent) light emitting device or may penetrate into light emitted from a nearby (e.g., adjacent) light emitting device. Therefore, the contrast characteristics of the light source module may be unsatisfactory.

[0095] However, according to an exemplary embodiment of the inventive concept, the blocking structure 60 can prevent light emitted by one light-emitting monomer PX from being mixed with light emitted from a nearby or adjacent light-emitting monomer PX or from penetrating into light emitted from a nearby or adjacent light-emitting monomer PX, and therefore, the contrast characteristics of the light-emitting device 100 can be excellent. In addition, because the plurality of light-emitting device structures 20U are completely isolated from each other by the device isolation opening IAH, light emitted from the plurality of light-emitting device structures 20U can be prevented from being mixed with light emitted from a nearby or adjacent light-emitting device structure 20U or from penetrating into light emitted from a nearby or adjacent light-emitting device structure 20U, thereby contributing to excellent contrast characteristics of the light-emitting device 100.

[0096] Fig. 6A is a cross-sectional view showing a light emitting device according to an exemplary embodiment of the inventive concept, Figure 6B yes Fig. 6A An enlarged cross-sectional view of a portion of CX3.

[0097] Reference Fig. 6A and Figure 6B , the blocking structure 60A may include a first blocking layer 62A having an inclined sidewall and a second blocking layer 64A having an inclined sidewall. The width of the first blocking layer 62A in the horizontal direction (e.g., the second direction Y) and the width of the second blocking layer 64A in the horizontal direction may gradually decrease as moving away from the third direction Z. The width of each of the plurality of pixel spaces PXU in the horizontal direction (e.g., the second direction Y) may gradually increase as moving away from the first surface 20F1 of the light emitting device structure 20U, and thus, the light extraction efficiency of the light emitting device structure 20U may be improved.

[0098] like Fig. 6A and Figure 6B As shown in , an uneven structure 20SP may be formed at the first surfaces 20F1 of the plurality of light emitting device structures 20U, and thus the light extraction efficiency of the light emitting device structures 20U may be improved.

[0099] In an exemplary embodiment of the inventive concept, the second electrode 42B1 may be disposed on the second conductive semiconductor layer 26, and the second contact layer 42B2 may be formed between the second conductive semiconductor layer 26 and the second electrode 42B1. In addition, the insulating liner 34A may be conformally formed on the inner wall of the device isolation opening IAH and the second surface 20F2 of the plurality of light emitting device structures 20U, and may surround the first electrode 42A and the second electrode 42B1. Although the insulating liner 34A is Fig. 6A and Figure 6B Although shown as a single layer in FIG. 3 , the insulating liner 34A may alternatively have a multilayer structure including a plurality of insulating layers. The first connection electrode 44A1 and the second connection electrode 44B1 may be disposed on the insulating liner 34A and may be electrically connected to the first electrode 42A and the second electrode 42B1, respectively.

[0100] The first pads 48A1 and 48B1 may be conformally disposed on the inner wall of the pad opening PH, and the insulating liner 34A may be disposed between the first pads 48A1 and 48B1 and the light emitting stack 20. The first pads 48A1 and 48B1 may be electrically connected to the first and second connection electrodes 44A1 and 44B1 through the first and second line patterns 46A1 and 46B1, respectively.

[0101] The intermediate insulating layer 56 may be disposed on the first connection electrode 44A1, the second connection electrode 44B1, and the first line pattern 46A1. The second line pattern 46B1 may be disposed on the intermediate insulating layer 56, and may be connected to one of the first pads 48A1 and 48B1 through the intermediate insulating layer 56. Since the intermediate insulating layer 56 is disposed between the first line pattern 46A1 and the second line pattern 46B1, the first line pattern 46A1 and the second line pattern 46B1 may be spaced apart from each other in a third direction (e.g., a vertical direction) Z. However, the arrangement of the first line pattern 46A1 and the second line pattern 46B1 is not limited thereto.

[0102] In the first pad area PA_L1, a drive chip (eg, Figure 2 Connection members such as bonding wires 400_1 and 400_2 electrically connected to the first driving chip 210_1) may be arranged on the first pads 48A1 and 48B1, respectively.

[0103] According to the above light emitting device 100, the blocking structure 60A can prevent light emitted from one light emitting monomer PX from mixing with light emitted from an adjacent light emitting monomer PX or from penetrating into light emitted from an adjacent light emitting monomer PX, and therefore, the contrast characteristics of the light emitting device 100 can be excellent. In addition, since the blocking structure 60A has an inclined sidewall, the light extraction efficiency of the light emitting device structure 20U can be improved.

[0104] Figure 7 is a circuit diagram illustrating a connection relationship of a sub-array and a pad included in a light emitting device according to an exemplary embodiment of the inventive concept. Figure 7 It is shown Figure 4 An equivalent circuit diagram of the first sub-array SA1, the second sub-array SA2, the fifteenth sub-array SA15 and the sixteenth sub-array SA16 and a plurality of pads connected to the first sub-array SA1, the second sub-array SA2, the fifteenth sub-array SA15 and the sixteenth sub-array SA16. Figure 7 In the embodiment, one light emitting monomer may correspond to one diode.

[0105] Reference Figure 4 and Figure 7 , each of the first sub-array SA1, the second sub-array SA2, the fifteenth sub-array SA15, and the sixteenth sub-array SA16 may include a plurality of light emitting monomers implemented by LEDs. Figure 7 It is shown that each of the first sub-array SA1, the second sub-array SA2, the fifteenth sub-array SA15, and the sixteenth sub-array SA16 includes twelve light-emitting monomers, but the inventive concept is not limited thereto, and the number of light-emitting monomers included in one sub-array may be more than twelve or less than twelve. Figure 7 Only the first sub-array SA1, the second sub-array SA2, the fifteenth sub-array SA15 and the sixteenth sub-array SA16 are shown in FIG. 1 , but the same description can also be applied to Figure 4 The other sub-arrays are shown in FIG.

[0106] A plurality of sub-arrays SA1 to SA16 including a first sub-array SA1, a second sub-array SA2, a fifteenth sub-array SA15, and a sixteenth sub-array SA16 may be electrically insulated from each other, and the plurality of sub-arrays SA1 to SA16 may be controlled by different driving chips, respectively. In the light-emitting device 100 according to the exemplary embodiment of the inventive concept, since a plurality of light-emitting monomers constituting the LED array are subdivided into a plurality of sub-arrays SA1 to SA16, the operations of the respective sub-arrays may be controlled by different driving chips, respectively, and therefore, the light-emitting device may be easily controlled. For example, the brightness adjustment of the light-emitting device may be subdivided, and the brightness adjustment rate of the light-emitting device may be increased.

[0107] The light-emitting monomers included in each sub-array (for example, the plurality of first light-emitting monomers 111_1 included in the first sub-array SA1) may be electrically connected to each other through one of the cathode and the anode. The plurality of light-emitting monomers included in one sub-array may be connected to a driving chip that drives each light-emitting monomer in an on or off state. Here, the driving chip may adjust the brightness of each of the plurality of light-emitting monomers by a pulse width modulation (PWM) method. For example, the plurality of first light-emitting monomers 111_1 may be connected to a first driving chip (for example, Figure 2 210_1), and the first driving chip may adjust the brightness of each of the plurality of first light-emitting monomers 111_1 by pulse width modulation. The plurality of first light-emitting monomers 111_1 included in the first sub-array SA1 may be connected in series to each other, and both ends of the plurality of first light-emitting monomers 111_1 may be connected to different pads, respectively. Since the plurality of first light-emitting monomers 111_1 are connected in series to each other, the operation of the plurality of first light-emitting monomers 111_1 may be controlled when the voltage applied to the node at which the plurality of first light-emitting monomers 111_1 are connected to each other is controlled. Therefore, the number of the plurality of first pads 120_1 connected to the plurality of first light-emitting monomers 111_1 may be less than twice the number of the plurality of first light-emitting monomers 111_1. The first driving chip may be electrically connected to the plurality of first pads 120_1. By adjusting the voltage applied to two different pads among the plurality of first pads 120_1, the first driving chip may drive a light-emitting monomer having a cathode and an anode connected to the two pads, respectively. In other words, the first driving chip may apply a voltage to the plurality of first pads 120_1 to drive at least one of the plurality of first light emitting monomers 111_1 , thereby adjusting the brightness of light emitted from the at least one of the plurality of first light emitting monomers 111_1 .

[0108] The plurality of second light-emitting monomers 111_2 included in the second sub-array SA2 may be connected in series to each other, and both ends of the plurality of second light-emitting monomers 111_2 may be connected to different pads, respectively. Since the plurality of second light-emitting monomers 111_2 are connected in series to each other, when the voltage applied to the node at which the plurality of second light-emitting monomers 111_2 are connected to each other is controlled, the operation of the plurality of second light-emitting monomers 111_2 may be controlled. Therefore, the number of the plurality of second pads 120_2 connected to the plurality of second light-emitting monomers 111_2 may be less than twice the number of the plurality of second light-emitting monomers 111_2.

[0109] The second driver chip (for example, Figure 2 The second driving chip 210_2 may be electrically connected to the plurality of second pads 120_2. By adjusting the voltage applied to two different pads among the plurality of second pads 120_2, the second driving chip may drive one light emitting monomer having a cathode and an anode connected to the two pads, respectively.

[0110] Therefore, according to the arrangement order of the first sub-array SA1 and the second sub-array SA2, a plurality of first pads 120_1 and a plurality of second pads 120_2 corresponding to the first sub-array SA1 and the second sub-array SA2, respectively, may be arranged sequentially. In addition, according to the arrangement order of the plurality of sub-arrays SA1 to SA16, a plurality of pads corresponding to the plurality of sub-arrays SA1 to SA16, respectively, may be arranged sequentially.

[0111] In an exemplary embodiment of the inventive concept, the sixteenth sub-array SA16 and the first sub-array SA1 may be formed symmetrically to each other with respect to an axis parallel to the first direction X. The plurality of sixteenth pads 120_16 connected to the sixteenth sub-array SA16 and the plurality of first pads 120_1 connected to the first sub-array SA1 may be formed symmetrically to each other with respect to the axis parallel to the first direction X.

[0112] In an exemplary embodiment of the inventive concept, the fifteenth sub-array SA15 and the second sub-array SA2 may be formed symmetrically to each other with respect to an axis parallel to the first direction X. The plurality of fifteenth pads 120_15 connected to the fifteenth sub-array SA15 and the plurality of second pads 120_2 connected to the second sub-array SA2 may be formed symmetrically to each other with respect to the axis parallel to the first direction X.

[0113] Reference Figure 2 and Figure 3Since the plurality of driving chips 210_1 to 210_16 are electrically connected in series, directions in which the control signal CS is received by the first driving chip 210_1 and the sixteenth driving chip 210_16 may be opposite to each other. For example, the first driving chip 210_1 may receive the control signal CS from the input unit 300 in the first direction X, and the sixteenth driving chip 210_16 may receive the control signal CS from the fifteenth driving chip 210_15 in the opposite direction (-X) of the first direction X. Since the sixteenth sub-array SA16 is formed symmetrically with the first sub-array SA1 with respect to an axis parallel to the first direction X, and the plurality of sixteenth pads 120_16 are formed symmetrically with the plurality of first pads 120_1 with respect to an axis parallel to the first direction X, a method of electrically connecting the first driving chip 210_1 and the first sub-array SA1 and a method of electrically connecting the sixteenth driving chip 210_16 and the sixteenth sub-array SA16 may be similar to each other. Therefore, the bonding wiring 400 that electrically connects the first driving chip 210_1 and the plurality of first pads 120_1 and the bonding wiring 400 that electrically connects the sixteenth driving chip 210_16 and the plurality of sixteenth pads 120_16 can be easily formed. The above description can also be applied to other sub-arrays and pads. In other words, at least two sub-arrays among the sub-arrays arranged in parallel in the second direction Y can be formed symmetrically with respect to an axis parallel to the first direction X, and the pads respectively connected to the two sub-arrays can be formed symmetrically with respect to an axis parallel to the first direction X.

[0114] Figure 8 is a circuit diagram illustrating a connection relationship of a sub-array and a pad included in a light emitting device according to an exemplary embodiment of the inventive concept. Figure 8 It is shown Figure 4 An equivalent circuit diagram of the first sub-array SA1, the second sub-array SA2, the fifteenth sub-array SA15 and the sixteenth sub-array SA16 and a plurality of pads connected to these sub-arrays. Figure 8 In the embodiment, one light emitting monomer may correspond to one diode.

[0115] Reference Figure 8 Each of the first sub-array SA1', the second sub-array SA2', the fifteenth sub-array SA15', and the sixteenth sub-array SA16' may include a plurality of light emitting monomers implemented by LEDs. Figure 8 It is shown that each of the first sub-array SA1', the second sub-array SA2', the fifteenth sub-array SA15' and the sixteenth sub-array SA16' includes twelve light-emitting monomers, but the inventive concept is not limited thereto, and the number of light-emitting monomers included in one sub-array may be less than twelve or more than twelve. Figure 8Only the first sub-array SA1', the second sub-array SA2', the fifteenth sub-array SA15' and the sixteenth sub-array SA16' are shown in FIG. 1 , but the same description can also be applied to Figure 4 The other sub-arrays are shown in FIG.

[0116] The plurality of first light-emitting monomers 111_1' included in the first sub-array SA1' may be connected in parallel to each other, and both ends of the plurality of first light-emitting monomers 111_1' may be connected to different pads, respectively. In an exemplary embodiment of the inventive concept, the anodes of the plurality of first light-emitting monomers 111_1' may be connected to each other; however, the light-emitting device according to the exemplary embodiment of the inventive concept is not limited thereto. For example, the cathodes of the plurality of first light-emitting monomers 111_1' may be connected to each other.

[0117] Since the plurality of first pads 120_1 ′ may be connected to one node where anodes of the plurality of first light emitting monomers 111_1 ′ are connected to each other and may be connected to cathodes of the plurality of first light emitting monomers 111_1 ′, the number of the plurality of first pads 120_1 ′ may be less than twice the number of the plurality of first light emitting monomers 111_1 ′.

[0118] In an exemplary embodiment of the inventive concept, a first driving chip (eg, Figure 2 The first driving chip 210_1) may be electrically connected to the plurality of first pads 120_1'. By adjusting the voltage applied to two different pads among the plurality of first pads 120_1', the first driving chip may control the driving of a light emitting monomer having a cathode and an anode electrically connected to the two pads, respectively.

[0119] The plurality of second light-emitting monomers 111_2' included in the second sub-array SA2' may be connected in parallel to each other, and both ends of the plurality of second light-emitting monomers 111_2' may be connected to different pads, respectively. In an exemplary embodiment of the inventive concept, the anodes of the plurality of second light-emitting monomers 111_2' may be connected to each other; however, the light-emitting device according to the exemplary embodiment of the inventive concept is not limited thereto. For example, the cathodes of the plurality of second light-emitting monomers 111_2' may be connected to each other.

[0120] Since the second pads 120_2' may be connected to one node where anodes of the second light emitting monomers 111_2' are connected to each other and to cathodes of the second light emitting monomers 111_2', the number of the second pads 120_2' may be less than twice the number of the second light emitting monomers 111_2'.

[0121] In an exemplary embodiment of the inventive concept, the second driving chip (eg, Figure 2The second driving chip 210_2) may be electrically connected to the plurality of second pads 120_2'. By adjusting the voltage applied to two different pads among the plurality of second pads 120_2', the second driving chip may control the driving of a light emitting monomer having a cathode and an anode electrically connected to the two pads, respectively.

[0122] In an exemplary embodiment of the inventive concept, the sixteenth subarray SA16' and the first subarray SA1' may be formed symmetrically to each other with respect to an axis parallel to the first direction X. The plurality of sixteenth pads 120_16' connected to the sixteenth subarray SA16' and the plurality of first pads 120_1' connected to the first subarray SA1' may be formed symmetrically to each other with respect to the axis parallel to the first direction X. The plurality of sixteenth light-emitting monomers 111_16' included in the sixteenth subarray SA16' may be connected in parallel to each other, and both ends of the plurality of sixteenth light-emitting monomers 111_16' may be connected to different pads, respectively.

[0123] In an exemplary embodiment of the inventive concept, the fifteenth subarray SA15' and the second subarray SA2' may be formed symmetrically to each other with respect to an axis parallel to the first direction X. The plurality of fifteenth pads 120_15' connected to the fifteenth subarray SA15' and the plurality of second pads 120_2' connected to the second subarray SA2' may be formed symmetrically to each other with respect to the axis parallel to the first direction X. In other words, at least two subarrays among the subarrays arranged in parallel in the second direction Y may be formed symmetrically to each other with respect to an axis parallel to the first direction X, and the pads respectively connected to the two subarrays may be formed symmetrically to each other with respect to the axis parallel to the first direction X. The plurality of fifteenth light-emitting monomers 111_15' included in the fifteenth subarray SA15' may be connected in parallel to each other, and both ends of the plurality of fifteenth light-emitting monomers 111_15' may be connected to different pads, respectively.

[0124] like Figure 7 and Figure 8 As shown in , a plurality of light-emitting monomers included in a sub-array may be connected in series with each other or may be connected in parallel with each other. However, the light-emitting device according to the exemplary embodiment of the inventive concept is not limited thereto. For example, the light-emitting monomers in the first group of sub-arrays included in the light-emitting device may be connected in series with each other, and the light-emitting monomers in the second group of sub-arrays included in the light-emitting device may be connected in parallel with each other. Optionally, at least one of the plurality of sub-arrays may be configured so that some of its light-emitting monomers are connected in series with each other, and some of its light-emitting monomers are connected in parallel with each other. For example, every six first light-emitting monomers 111_1' of the plurality of first light-emitting monomers 111_1' may be connected in series with each other to form a monomer group, and the monomer groups may be connected in parallel with each other.

[0125] FIG. 9A to FIG. 9Lare sequential cross-sectional views illustrating a method of manufacturing a light emitting device according to an exemplary embodiment of the inventive concept. FIG. 9A to FIG. 9L is along Figure 4 A sectional view corresponding to the section taken along line III-III'.

[0126] Reference Fig.9A , a light-emitting stack 20 may be formed on the substrate 1 .

[0127] In an exemplary embodiment of the inventive concept, the substrate 1 may include, for example, a silicon (Si) substrate, a silicon carbide (SiC) substrate, a sapphire substrate, or a gallium nitride (GaN) substrate. The substrate 1 may include a light-emitting monomer region CA_L and a first pad region PA_L1. In a plan view, the light-emitting monomer region CA_L may be arranged in a central region of the light-emitting device, and the first pad region PA_L1 may be arranged in a peripheral region.

[0128] The light emitting stack 20 may include a first conductive type semiconductor layer 22 , an active layer 24 , and a second conductive type semiconductor layer 26 sequentially formed on the first surface 10F1 of the substrate 1 .

[0129] Reference Fig. 9B A mask pattern may be formed on the light emitting stack 20 and used as an etching mask to remove a portion of the light emitting stack 20 to form an opening E. The opening E may expose the top surface of the first conductive semiconductor layer 22. The opening E may not be formed on the first pad area PA_L1 of the substrate 1.

[0130] Reference Fig. 9C , a first insulating layer 32 may be formed on the light emitting stack 20 to conformally cover the opening E. The first insulating layer 32 may be formed on both the light emitting monomer region CA_L and the first pad region PA_L1.

[0131] Then, a portion of the first insulating layer 32 may be removed in the opening E and a portion of the first insulating layer 32 may be removed on the second conductive type semiconductor layer 26 to expose top surfaces of the first conductive type semiconductor layer 22 and the second conductive type semiconductor layer 26 , respectively.

[0132] A first electrode 42A and a second electrode 42B may be formed on the exposed top surface of the first conductive type semiconductor layer 22 and the exposed top surface of the second conductive type semiconductor layer 26, respectively. In addition, a first contact layer formed of a conductive ohmic material may be formed between the first electrode 42A and the first conductive type semiconductor layer 22, and a second contact layer formed of a conductive ohmic material may be formed between the second electrode 42B and the second conductive type semiconductor layer 26.

[0133] Reference Fig.9D, a first connection electrode 44A and a second connection electrode 44B may be formed on the first insulating layer 32, and the first connection electrode 44A and the second connection electrode 44B may be electrically connected to the first electrode 42A and the second electrode 42B, respectively. In an exemplary embodiment of the inventive concept, a conductive layer may be formed on the first electrode 42A, the second electrode 42B, and the first insulating layer 32, and the conductive layer may be patterned to form the first connection electrode 44A and the second connection electrode 44B. In an exemplary embodiment of the inventive concept, the first connection electrode 44A and the second connection electrode 44B may be formed by a plating process.

[0134] Reference Fig.9E , a portion of the light emitting stack 20 may be removed to form a device isolation opening IAH and a pad opening PH in the light emitting monomer region CA_L and the first pad region PA_L1, respectively. The device isolation opening IAH and the pad opening PH may completely penetrate the light emitting stack 20 so that the first surface 10F1 of the substrate 1 is exposed to the bottom of the device isolation opening IAH and the bottom of the pad opening PH.

[0135] In the light-emitting monomer region CA_L, the light-emitting stack 20 may be divided into a plurality of light-emitting device structures 20U by the device isolation opening IAH. In an exemplary embodiment of the inventive concept, the process of forming the device isolation opening IAH may be performed by a blade; however, the inventive concept is not limited thereto. Fig.9E As shown in , the side-sectional shape of the plurality of light emitting device structures 20U may have a trapezoidal shape whose top is shorter than the bottom, however, the inventive concept is not limited thereto.

[0136] Then, an insulating liner 34 may be formed on the top surface and side walls of the plurality of light emitting device structures 20U and the top surface and side walls of the light emitting stack 20. The insulating liner 34 may be conformally formed on the inner wall of the device isolation opening IAH and the inner wall of the pad opening PH, and the insulating liner 34 may contact the first surface 10F1 of the substrate 1 at the bottom of the device isolation opening IAH and the bottom of the pad opening PH.

[0137] Since one light-emitting device structure 20U is physically and electrically isolated from an adjacent light-emitting device structure 20U through the device isolation opening IAH and the insulating liner 34, light emitted from the one light-emitting device structure 20U may not be absorbed or penetrate into the adjacent light-emitting device structure 20U, thereby improving the contrast characteristics of the light-emitting device 100.

[0138] Reference Fig.9F , a portion of the insulating liner 34 may be removed to expose the top surface of the first connection electrode 44A. Fig.9FAlthough not shown, a portion of the insulating liner 34 may be removed to expose the top surface of the second connection electrode 44B. In addition, a portion of the insulating liner 34 disposed at the bottom of the pad opening PH may be removed to expose the first surface 10F1 of the substrate 1.

[0139] Then, a first line pattern 46A electrically connected to the first connection electrode 44A may be formed on the insulating liner 34. Fig.9F Although not shown in the drawings, another line pattern electrically connected to the second connection electrode 44B may be formed on the insulating liner 34 .

[0140] Furthermore, a first pad 48A electrically connected to the first connection electrode 44A may be formed in the pad opening PH. In an exemplary embodiment of the inventive concept, the first line pattern 46A may be formed, and then the first pad 48A may be formed. Alternatively, the first line pattern 46A and the first pad 48A may be formed simultaneously.

[0141] Reference Figure 9G , a buried insulating layer 36 may be formed on the insulating liner 34, the first line pattern 46A, and the first pad 48A. The buried insulating layer 36 may fill the remaining space of the device isolation opening IAH and the pad opening PH.

[0142] like Figure 9G As shown in , the first line pattern 46A may include a portion arranged on the insulating liner 34 in the device isolation opening IAH, and the buried insulating layer 36 may contact the first line pattern 46A in the device isolation opening IAH. For example, since a plurality of light-emitting device structures 20U are arranged in a matrix form, and the first line pattern 46A for the plurality of light-emitting device structures 20U is connected to the first pad 48A arranged in the first pad area PA_L1, the first line pattern 46A may pass through the inside of the device isolation opening IAH between the insulating liner 34 and the buried insulating layer 36. However, the inventive concept is not limited thereto. According to other exemplary embodiments of the inventive concept, a buried insulating layer filling the remaining space of the device isolation opening IAH may be formed on the insulating liner, and a first line pattern may be formed on the buried insulating layer. In other words, a buried insulating layer may also be arranged between the insulating liner and the first line pattern in the device isolation opening IAH.

[0143] Then, an adhesive layer 52 may be formed on the buried insulating layer 36 , and a support substrate 54 may be attached to the adhesive layer 52 .

[0144] Reference Figure 9H, the light emitting stack 20 attached to the supporting substrate 54 may be turned over so that the second surface 10F2 opposite to the first surface 10F1 of the substrate 1 faces upward. Then, the top of the substrate 1 may be removed from the second surface 10F2 of the substrate 1 by a grinding process, so that the level of the second surface 10F2 of the substrate 1 may be lowered.

[0145] Reference Fig.9I A mask pattern may be formed on the second surface 10F2 of the substrate 1, and the mask pattern may be used as an etching mask to remove a portion of the substrate 1 to form a plurality of pixel spaces PXU on the light-emitting monomer region CA_L. A portion of the substrate 1 disposed between the plurality of pixel spaces PXU in the light-emitting monomer region CA_L may be referred to as a first barrier layer 62.

[0146] The first barrier layer 62 may be vertically overlapped with the device isolation opening IAH, and the plurality of light emitting device structures 20U may be respectively arranged in the plurality of pixel spaces PXU. The top surface of the first conductive semiconductor layer 22 (in other words, the first surface 20F1 of the plurality of light emitting device structures 20U) may be exposed at the bottom of the plurality of pixel spaces PXU.

[0147] In addition, Fig.9I In the embodiment, an etching process may be performed on the first conductive type semiconductor layer 22 exposed at the bottom of the plurality of pixel spaces PXU to further form an uneven structure 20SP. In this case, a reference Fig. 6A and Figure 6B A light emitting device is described.

[0148] Reference Figure 9J A conductive layer may be formed on the top surface of the substrate 1 and the inner walls of the plurality of pixel spaces PXU, and an anisotropic etching process may be performed on the conductive layer to form a reflective layer 72 on the side walls of the plurality of pixel spaces PXU (or the side walls of the first barrier layer 62).

[0149] Reference Figure 9K , a fluorescent layer 74 may be formed to fill the plurality of pixel spaces PXU. In an exemplary embodiment of the inventive concept, the fluorescent layer 74 may be formed by applying or dispensing a resin including dispersed fluorescent particles into the plurality of pixel spaces PXU. The fluorescent layer 74 may include two or more types of fluorescent particles having different size distributions, so that the fluorescent particles may be uniformly dispersed in each of the plurality of pixel spaces PXU.

[0150] Reference Figure 9L A mask pattern M11 may be formed in the light emitting monomer region CA_L to cover the fluorescent layer 74 and the first barrier layer 62 , and the mask pattern M11 may be used as an etching mask to remove a portion of the substrate 1 to form the second barrier layer 64 .

[0151] In a plan view, the second barrier layer 64 may be disposed between the plurality of light emitting device structures 20U and the first pad area PA_L1, and the second barrier layer 64 may surround the first barrier layer 62. Thus, a barrier structure 60 including the first and second barrier layers 62 and 64 may be formed.

[0152] Since a portion of the substrate 1 covering the first pad area PA_L1 is removed, the top surface of the light emitting stack 20 and the top surface of the first pad 48A may be exposed in the first pad area PA_L1. The top surface of the first pad 48A may be located on the same plane as the first surfaces 20F1 of the plurality of light emitting device structures 20U.

[0153] Then, the mask pattern M11 may be removed.

[0154] Through the above processes, the light emitting device 100 can be completed.

[0155] In an exemplary embodiment of the inventive concept, since the plurality of light emitting device structures 20U are physically isolated from each other by the insulating liner 34 in the device isolation opening IAH, light emitted from each of the plurality of light emitting device structures 20U can be prevented from diffusing or penetrating into a nearby or adjacent light emitting device structure 20U. In addition, since the blocking structure 60 is vertically overlapped with the device isolation opening IAH, light emitted from each of the plurality of light emitting device structures 20U can be prevented from mixing with light emitted from a nearby or adjacent light emitting device structure 20U. Therefore, the contrast characteristics of the plurality of light emitting device structures 20U arranged in a matrix form can be improved.

[0156] In addition, since the width of the second barrier layer 64 is greater than that of the first barrier layer 62 , the structural stability of the light emitting device 100 can be ensured in its use environment or in a process of manufacturing a fluorescent substance to form the fluorescent layer 74 .

[0157] Fig.10 is a perspective view illustrating a lighting apparatus 2000 according to an exemplary embodiment of the inventive concept.

[0158] Reference Fig.10 , the headlight module 2020 may be installed in the headlight unit 2010 of the automobile, the side mirror lamp module 2040 may be installed in the exterior side mirror unit 2030 of the automobile, and the taillight module 2060 may be installed in the taillight unit 2050 of the automobile. At least one of the headlight module 2020, the side mirror lamp module 2040, and the taillight module 2060 may be implemented as one of the light source modules 10 according to the embodiments of the above-described inventive concept.

[0159] Fig.11is a perspective view illustrating a flat panel lighting apparatus according to an exemplary embodiment of the inventive concept.

[0160] Reference Fig.11 , the flat panel lighting device 2100 may include a light source module 2110, a power supply unit 2120, and a housing 2130. According to an exemplary embodiment of the inventive concept, the light source module 2110 may include a light emitting monomer array as a light source. The light source module 2110 may be implemented as one of the light source modules 10 according to the embodiments of the above-described inventive concept. The light source module 2110 may include a light emitting device including a light emitting monomer array and a driving chip, and may have a planar shape.

[0161] The power supply unit 2120 may be configured to supply power to the light source module 2110. The housing 2130 may have an accommodation space for accommodating the light source module 2110 and the power supply unit 2120, and may be formed in a hexahedral shape having one open side, but the housing 2130 is not limited thereto. The light source module 2110 may be arranged to emit light to the open side of the housing 2130.

[0162] Fig.12 is an exploded perspective view illustrating a lighting apparatus according to an exemplary embodiment of the inventive concept.

[0163] Reference Fig.12 , the lighting device 2200 may include a socket 2210 , a power supply unit 2220 , a heat dissipation unit 2230 , a light source module 2240 , and an optical unit 2250 .

[0164] The socket 2210 may be configured to be replaceable with a lighting device of the prior art. Power supplied to the lighting device 2200 may be applied through the socket 2210. Fig.12 As shown in , the power supply unit 2220 may be divided into a first power supply unit 2221 and a second power supply unit 2222, and the first power supply unit 2221 and the second power supply unit 2222 are assembled in the power supply unit 2220. The heat dissipation unit 2230 may include an internal heat dissipation unit 2231 and an external heat dissipation unit 2232. The internal heat dissipation unit 2231 may be directly connected to the light source module 2240 and / or the power supply unit 2220 to transfer heat to the external heat dissipation unit 2232. The optical unit 2250 may include an internal optical unit and an external optical unit, and may be configured to uniformly distribute the light emitted by the light source module 2240.

[0165] The light source module 2240 may receive power from the power supply unit 2220 to emit light to the optical unit 2250. The light source module 2240 may be implemented as one of the light source modules 10 according to the embodiments of the above-described inventive concepts.

[0166] The light source module 2240 may include a light emitting device 2241 including a plurality of light emitting monomers, a circuit substrate 2242, and a plurality of driving chips 2243. Driving information of the light emitting device 2241 may be stored in the plurality of driving chips 2243.

[0167] Fig.13 is an exploded perspective view illustrating a strip type lighting apparatus according to an exemplary embodiment of the inventive concept.

[0168] Reference Fig.13 , the lighting device 2400 may include a heat dissipation member 2401, a cover 2427, a light source module 2421, a first socket 2405 and a second socket 2423. A plurality of heat dissipation fins 2500 and 2409 may be formed in an uneven shape on the inner surface and / or outer surface of the heat dissipation member 2401, and the heat dissipation fins 2500 and 2409 may have various shapes and intervals. A protruding support 2413 may be formed on the inner side of the heat dissipation member 2401. The light source module 2421 may be fixed to the protruding support 2413. Locking jaws 2411 may be formed at both ends of the heat dissipation member 2401.

[0169] A locking groove 2429 may be formed at the cover 2427, and the locking jaw 2411 may be coupled to the locking groove 2429 in a hook-coupling manner. Positions of the locking groove 2429 and the locking jaw 2411 may be interchanged with each other.

[0170] The light source module 2421 may be implemented as one of the light source modules 10 according to the embodiments of the above-described inventive concepts.

[0171] The light source module 2421 may include an array of light-emitting monomers. The light source module 2421 may include a printed circuit board 2419, a light source 2417, and a controller 2415. The controller 2415 may be implemented as a driving chip according to an exemplary embodiment of the above-described inventive concept, may store driving information of the light source 2417, and may drive the light source 2417. A circuit line for operating the light source 2417 may be formed at the printed circuit board 2419. In addition, a component for operating the light source 2417 may be included. The light source 2417 may be implemented as one of the light-emitting devices 100 according to the embodiments of the above-described inventive concept. Therefore, the light source 2417 may include a plurality of sub-arrays, and the plurality of sub-arrays may be electrically insulated from each other.

[0172] As a pair of sockets, the first socket 2405 and the second socket 2423 may have a structure coupled to both ends of a cylindrical cover unit including a heat dissipation member 2401 and a cover 2427. For example, the first socket 2405 may include an electrode terminal 2403 and a power supply unit 2407, and the second socket 2423 may be provided with a dummy terminal 2425. In addition, an optical sensor and / or a communication module may be embedded in any one of the first socket 2405 and the second socket 2423. For example, the optical sensor and / or the communication module may be embedded in the second socket 2423 provided with the dummy terminal 2425. As another example, the optical sensor and / or the communication module may be embedded in the first socket 2405 provided with the electrode terminal 2403.

[0173] Fig.14 is an exploded perspective view illustrating a lighting apparatus according to an exemplary embodiment of the inventive concept.

[0174] Reference Fig.14 ,and Fig.12 Unlike the lighting device 2200 of the present embodiment, the lighting device 2500 according to the present embodiment may include a reflective plate 2310 and a communication module 2320 located on the light source module 2240. The reflective plate 2310 may evenly distribute light from the light source to the side and rear to reduce glare.

[0175] The communication module 2320 can be mounted on the reflective plate 2310, and the home network communication can be realized by the communication module 2320. For example, the communication module 2320 can be a wireless communication module based on ZigBee, WiFi or LiFi, and can control the lighting device installed inside or outside the home, such as by adjusting the brightness of the lighting device or turning on / off the lighting device via a smart phone or a wireless controller. In addition, the LiFi communication module based on the visible light wavelength of the lighting device installed inside or outside the home can be used to control electronic products or automotive systems inside or outside the home, such as TV, refrigerator, air conditioner, door lock or car. The reflective plate 2310 and the communication module 2320 can be covered by the cover unit 2330.

[0176] Fig.15 is a schematic diagram illustrating an indoor lighting control network system including lighting devices according to an exemplary embodiment of the inventive concept.

[0177] Reference Fig.15, the network system 3000 may be a complex intelligent lighting network system in which lighting technology based on light emitting devices such as LEDs, Internet of Things (IoT) technology, and wireless communication technology are combined. The network system 3000 may be implemented by using various lighting devices and wired / wireless communication devices, and may be implemented by sensors, controllers, communication units, and / or software for network control and maintenance.

[0178] The network system 3000 can be applied not only to a closed space defined in a building such as a home or office, but also to an open space such as a park or a street. The network system 3000 can be implemented based on an IoT environment so that various information can be collected / processed and provided to users.

[0179] The LED lamp 3200 included in the network system 3000 can receive information about the surrounding environment from the gateway 3100 to control the lighting of the LED lamp 3200, and can check and control the operating states of other devices 3300 to 3800 included in the IoT environment based on the visible light communication function of the LED lamp 3200. The LED lamp 3200 can be implemented by the light emitting device 100 and the driving chip 210 constituting the light source module 10 according to the embodiment of the above-mentioned inventive concept.

[0180] The network system 3000 may include: a gateway 3100 for processing data transmitted / received according to different communication protocols; an LED lamp 3200, which is communicatively connected to the gateway 3100 and includes an LED light emitting device; and a plurality of devices 3300 to 3800, which are communicatively connected to the gateway 3100 according to various wireless communication methods. In order to implement the network system 3000 based on the IoT environment, each of the devices 3300 to 3800 except the LED lamp 3200 may include at least one communication module. In an exemplary embodiment of the inventive concept, the LED lamp 3200 may be communicatively connected to the gateway 3100 through a wireless communication protocol such as WiFi, ZigBee, or LiFi, and thus may include at least one lamp communication module 3210.

[0181] The network system 3000 can be applied not only to closed spaces such as homes or offices, but also to open spaces such as streets or parks. When the network system 3000 is applied to a home, a plurality of devices 3300 to 3800 included in the network system 3000 and communicatively connected to the gateway 3100 based on IoT technology may include, for example, a home appliance 3300 (e.g., a smart refrigerator 3320), a digital door lock 3400, a garage door lock 3500, a lighting switch 3600 mounted on a wall, a router 3700 for wireless network relay, and a mobile device 3800 such as a smart phone, a tablet computer, or a laptop computer. The mobile device 3800 and the gateway 3100 can communicate via the cloud.

[0182] In the network system 3000, the LED lamp 3200 can check the operating status of the devices 3300 to 3800 by using a wireless communication network (e.g., ZigBee, WiFi, or LiFi) installed in the home, or can automatically adjust the illumination of the LED lamp 3200. In addition, LiFi communication based on visible light emitted from the LED lamp 3200 can be used to control the devices 3300 to 3800 included in the network system 3000.

[0183] For example, the LED lamp 3200 may automatically adjust the illumination of the LED lamp 3200 based on the surrounding environment information received from the gateway 3100 through the lamp communication module 3210 or the surrounding environment information collected from the sensor installed on the LED lamp 3200. For example, the illumination brightness of the LED lamp 3200 may be automatically adjusted according to the brightness of the screen or the type of program broadcast on the TV 3310. To achieve this, the LED lamp 3200 may receive operation information of the TV 3310 from the lamp communication module 3210 connected to the gateway 3100. The lamp communication module 3210 may be modularized as one body together with the sensor and / or controller included in the LED lamp 3200.

[0184] For example, when the program value broadcast in the TV program is a human drama, the lighting can be reduced to a color temperature of 12000K or lower (e.g., 5000K) according to a preset value, and the color can be adjusted to create a comfortable atmosphere. Conversely, when the program value is a variety show (gag), the network system 3000 can be configured so that the lighting is increased to a color temperature of 5000K or higher according to a set value and is adjusted to blue-based white lighting.

[0185] In addition, when no one is at home, after a certain period of time has passed after locking the digital door lock 3400, all turned-on LED lights 3200 can be turned off to prevent power waste. Optionally, if a security mode is set through a mobile device 3800, etc., when the digital door lock 3400 is locked when no one is at home, the LED lights 3200 can remain turned on.

[0186] The operation of the LED lamp 3200 may be controlled based on the surrounding environment information collected by various sensors connected to the network system 3000. For example, when the network system 3000 is implemented in a building, the lighting, location sensors, and communication modules may be combined in the building to collect location information of people in the building to turn on or off the lighting, or to provide the collected information in real time to enable facility management or effective use of idle space. For example, since lighting equipment such as the LED lamp 3200 is arranged in almost every space on every floor in the building, various information in the building may be collected by sensors integrally provided with the LED lamp 3200, and the collected information may be used for facility management or utilization of idle space.

[0187] In addition, by combining the LED lamp 3200 with an image sensor, a storage device, or a lamp communication module 3210, etc., the LED lamp 3200 can be used as a device that can maintain building security or detect and respond to emergency situations. For example, when a smoke sensor or a temperature sensor is attached to the LED lamp 3200, damage can be minimized by quickly detecting whether a fire has occurred. In addition, the brightness of the lighting can be adjusted in consideration of the external weather and / or the amount of sunlight to save energy and provide a comfortable lighting environment.

[0188] As described above, the network system 3000 can be applied not only to closed spaces such as homes, offices, or buildings, but also to open spaces such as streets or parks. When the network system 3000 is applied to an open space without physical limitations, there are limitations in implementing the network system 3000 due to the distance limitation of wireless communication and communication interference due to various obstacles. However, by installing sensors and communication modules on each lighting device and using each lighting device as an information collection unit and a communication relay unit, the network system 3000 can be more effectively implemented in an open environment.

[0189] Fig.16 is a schematic diagram illustrating a network system including a lighting device according to an exemplary embodiment of the inventive concept.

[0190] Specifically, Fig.16 FIG. 4 shows an embodiment of a network system 4000 applied to an open space. Fig.16The network system 4000 may include, for example, a communication connection device 4100, a plurality of lighting devices 4120 and 4150 installed at specific intervals and communicatively connected to the communication connection device 4100, a server 4160, a computer 4170 for managing the server 4160, a communication base station 4180, a communication network 4190 for connecting communication devices, and a mobile device 4200.

[0191] A plurality of lighting devices 4120 and 4150 installed in an open external space such as a street or a park may include smart engines 4130 and 4140, respectively. The smart engines 4130 and 4140 may include, for example, a light emitting device for emitting light, a driver for driving the light emitting device, a sensor for collecting information about the surrounding environment, and a communication module. The smart engine may be implemented as the light source module 10 according to the embodiment of the above-described inventive concept.

[0192] Through the communication module, the smart engines 4130 and 4140 can communicate with other peripheral devices according to communication protocols such as WiFi, ZigBee and LiFi.

[0193] As an example, one smart engine 4130 may be communicatively connected to another smart engine 4140. In this case, WiFi extension technology (e.g., wireless mesh network (WiFi Mesh)) may be applied to the communication between the smart engines 4130 and 4140. At least one smart engine 4130 may be connected to a communication connection device 4100 connected to a communication network 4190 via wired / wireless communication. In order to improve communication efficiency, several smart engines 4130 and 4140 may be grouped into one group and connected to one communication connection device 4100.

[0194] As an access point (AP) capable of wired / wireless communication, the communication connection device 4100 can relay communication between the communication network 4190 and other devices. For example, the communication connection device 4100 can be connected to the communication network 4190 by at least one of a wired / wireless method, and can be mechanically accommodated in any one of the lighting devices 4120 and 4150.

[0195] The communication connection device 4100 can be connected to the mobile device 4200 through a communication protocol such as WiFi. The user of the mobile device 4200 can receive surrounding environment information collected by multiple intelligent engines 4130 and 4140 through the communication connection device 4100 connected to the intelligent engine 4130 of the lighting device 4120 adjacent to the mobile device 4200. The surrounding environment information may include surrounding traffic information or weather information, etc. The mobile device 4200 can be connected to the communication network 4190 through the communication base station 4180 in a wireless cellular communication method such as 3G, 4G or 5G.

[0196] In addition, the server 4160 connected to the communication network 4190 can monitor the operating state of each lighting device 4120 or 4150 while receiving information collected by each intelligent engine 4130 or 4140 attached to each lighting device 4120 or 4150. In order to manage each lighting device 4120 or 4150 based on the monitoring result of the operating state of each lighting device 4120 or 4150, the server 4160 can be connected to a computer 4170 that provides a management system. The computer 4170 can execute, for example, software that can monitor and manage the operating state of each lighting device 4120 or 4150 (particularly, each intelligent engine 4130 or 4140).

[0197] Exemplary embodiments of the inventive concept provide a light emitting device configured to easily adjust brightness and have high light emitting efficiency, and a light source module configured to easily design a driving chip.

[0198] While the inventive concept has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the inventive concept as defined by the claims.

Claims

1. A light source module, comprising: Printed circuit boards; A light emitting device mounted on a printed circuit board and comprising a plurality of sub-arrays, each of the plurality of sub-arrays comprising a plurality of light emitting monomers, the plurality of light emitting monomers being separated from each other by a blocking structure; as well as A plurality of driver chips are mounted on a printed circuit board, wherein each sub-array in the plurality of sub-arrays is driven by a different driver chip in the plurality of driver chips. wherein all of the plurality of light emitting monomers in each of the plurality of sub-arrays are electrically connected to each other, The multiple sub-arrays are electrically isolated from each other, including light-emitting monomers in different sub-arrays are electrically isolated from each other. The light emitting device is arranged in the central area of ​​the printed circuit board. The plurality of driving chips are arranged in a peripheral area of ​​the printed circuit board at a side of the central area, The light emitting device further comprises a plurality of pads for providing electrical connection between the plurality of driving chips and the plurality of sub-arrays, and Both ends of all of the plurality of light emitting monomers included in each of the plurality of sub-arrays are connected to different pads, respectively.

2. The light source module according to claim 1, further comprising an input unit for receiving a control signal from an external source, in, The plurality of driving chips are electrically connected in series with each other, and One of the plurality of driving chips receives a control signal from the input unit and transmits the received control signal to another of the plurality of driving chips.

3. The light source module according to claim 1, wherein: The light emitting device is a light emitting diode chip.

4. The light source module according to claim 1, wherein: The plurality of driving chips are sequentially arranged.

5. The light source module according to claim 1, wherein: The plurality of sub-arrays are arranged in a first direction and in a second direction perpendicular to the first direction, and the number of the plurality of sub-arrays arranged in the first direction is greater than the number of the plurality of sub-arrays arranged in the second direction.

6. The light source module according to claim 1, wherein: At least some of the plurality of light emitting monomers included in the same sub-array among the plurality of sub-arrays are connected to each other in series.

7. The light source module according to claim 1, wherein: At least some of the plurality of light emitting monomers included in the same sub-array among the plurality of sub-arrays are connected in parallel to each other. 8 . The light source module according to claim 1 , further comprising bonding wires electrically connecting the plurality of driving chips and the plurality of sub-arrays to each other.

9. The light source module according to claim 1, wherein: The number of the plurality of driving chips is equal to the number of the plurality of sub-arrays. 10 . The light source module according to claim 1 , further comprising an interposer disposed between the printed circuit board and the light emitting device.

11. The light source module according to claim 1, wherein: The plurality of sub-arrays are arranged in a central region of the light emitting device, and The plurality of pads are arranged in a peripheral region of the light emitting device at a side of a central region.

12. The light source module according to claim 1, wherein: The light emitting device and the plurality of driving chips overlap each other in a direction parallel to a top surface of the printed circuit board.

13. A light emitting device, comprising: A plurality of sub-arrays, each comprising a plurality of light-emitting monomers, wherein the plurality of light-emitting monomers are separated from each other by a blocking structure; as well as a plurality of pads for providing electrical connection between an external device and the plurality of sub-arrays so that each of the plurality of sub-arrays is independently driven by the external device, The multiple sub-arrays are electrically isolated from each other, including light-emitting monomers in different sub-arrays are electrically isolated from each other. wherein all of the plurality of light emitting monomers in each of the plurality of sub-arrays are electrically connected to each other, wherein the plurality of sub-arrays are arranged in a central region of the light emitting device, The plurality of pads are arranged in a peripheral region of the light emitting device away from a central region, and Both ends of all of the plurality of light emitting monomers included in each of the plurality of sub-arrays are connected to different pads, respectively.

14. The light emitting device according to claim 13, wherein: At least some of the plurality of light emitting monomers included in at least one subarray among the plurality of subarrays are connected to each other in series.

15. The light emitting device according to claim 13, wherein: At least some of the plurality of light emitting monomers included in at least one subarray among the plurality of subarrays are connected in parallel to each other.

16. The light emitting device according to claim 13, wherein: The plurality of sub-arrays are arranged in a first direction and in a second direction perpendicular to the first direction, and The number of the plurality of sub-arrays arranged in the first direction is greater than the number of the plurality of sub-arrays arranged in the second direction.

17. The light emitting device according to claim 16, wherein: At least two sub-arrays among the sub-arrays sequentially arranged in the second direction are symmetrical to each other with respect to an axis parallel to the first direction.

18. The light emitting device according to claim 13, wherein: The plurality of pads are sequentially arranged. 19 . The light emitting device of claim 13 , further comprising a bonding wire disposed on at least one pad among the plurality of pads. 20 . The light emitting device according to claim 13 , further comprising a blocking structure disposed between the plurality of light emitting monomers.

21. A light source module, comprising: Printed circuit boards; A light emitting device is mounted on a printed circuit board and includes a first sub-array and a second sub-array, wherein the first sub-array and the second sub-array each include a plurality of light emitting monomers, and the plurality of light emitting monomers are separated from each other by a blocking structure; A first driving chip mounted on the printed circuit board to drive the first sub-array; and A second driving chip is mounted on the printed circuit board to drive the second sub-array, Wherein, all of the plurality of light-emitting monomers included in the first sub-array are electrically connected to each other, All of the plurality of light emitting monomers included in the second sub-array are connected to each other, The first sub-array and the second sub-array are electrically isolated from each other, and the light-emitting monomers included in the first sub-array are electrically isolated from the light-emitting monomers included in the second sub-array. The first sub-array and the second sub-array are sequentially arranged in a first direction parallel to a first surface of the printed circuit board, and The first driving chip and the second driving chip are sequentially arranged in a first direction, The light emitting device is arranged in the central area of ​​the printed circuit board. The first driving chip and the second driving chip are arranged in a peripheral area of ​​the printed circuit board at a side of the central area, The light emitting device further comprises: a plurality of first pads for providing electrical connection between the first driving chip and the first sub-array; and a plurality of second pads for providing electrical connection between the second driving chip and the second sub-array. Both ends of all the light emitting monomers included in the first sub-array are connected to different pads among the plurality of first pads, respectively, and Both ends of all of the plurality of light emitting monomers included in the second sub-array are connected to different pads among the plurality of second pads, respectively.

22. The light source module according to claim 21, wherein: The light emitting device is a light emitting diode chip.

23. The light source module according to claim 21, wherein: The plurality of first pads and the plurality of second pads are sequentially arranged in a first direction, and The plurality of first pads include first pad rows and second pad rows arranged in a second direction perpendicular to the first direction.

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