A mechanism, system and method for screwing a speed control module onto a MOSFET

Abstract

The present invention provides a mechanism for screwing a MOSFET on a speed regulating module, comprising a radiator fixing support structure and an upper plate pressed on a radiator top plate, the upper plate being provided with a first small hole for the MOSFET pin on the radiator top plate to extend out, a second small hole for the fuse pin on the radiator top plate to extend out, and a third small hole for the screw to pass through to fix a pressure plate for limiting the MOSFET and the fuse together with the MOSFET on the radiator top plate by screws, and a first profiling groove for clamping the pressure plate and the MOSFET on the side of the upper plate facing the radiator top plate. The present invention also provides a system for screwing a MOSFET on a speed regulating module, comprising a radiator, a MOSFET, a fuse and a pressure plate, and also the mechanism for screwing a MOSFET on a speed regulating module. The present invention also provides a method for screwing a MOSFET on a speed regulating module, comprising the following steps: placing a pressure plate, a MOSFET and a fuse into the first profiling groove of the flipped upper plate, placing a radiator into a middle plate and flipping it to dock with the upper plate, and pressing the upper plate and the middle plate together and flipping them into a base.

Description

Technical Field

[0001] The invention relates to the technical field of production of a speed regulating module of an automobile air-conditioning assembly, and in particular to a mechanism, system and method for screwing a speed regulating module onto a MOSFET. Background Art

[0002] In the production process of screwing the MOSFET on the speed control module, the MOSFET, fuse and pressure plate are directly placed on the top plate of the radiator and then the screws are screwed. All parts are not completely limited, and it is impossible to completely and accurately position the parts, especially the pressure plate has no limit measures, resulting in different degrees of deflection of various parts each time the screws are screwed. After the deflection, there are the following problems:

[0003] 1. After the screws are tightened, the MOSFET and the tooling interfere with each other, causing the MOSFET to be damaged;

[0004] 2. After screwing, the pressure plate is tilted and cannot press the upper part of the fuse or only presses a little;

[0005] 3. After the screws are tightened, the fuse is not in the corresponding position, resulting in the thermal grease at the bottom not being able to fully contact the fuse and effectively protect the speed control module. Summary of the invention

[0006] The purpose of the present invention is to overcome the defects of the prior art and provide a mechanism, system and method for screwing a speed control module onto a MOSFET to overcome the quality problem caused by the inability to accurately position the parts before screwing.

[0007] The present invention is achieved in that:

[0008] The invention provides a mechanism for screwing a MOSFET on a speed regulating module, comprising a radiator fixing support structure and an upper plate pressed on a radiator top plate, wherein the upper plate is provided with a first small hole for extending a MOSFET pin on the radiator top plate, a second small hole for extending a fuse pin on the radiator top plate, and a third small hole for screws to pass through so that a pressure plate for limiting a MOSFET and a fuse is fixed to the radiator top plate together with the MOSFET by screws, and a first profiling groove for clamping the pressure plate and the MOSFET is provided on one side of the upper plate facing the radiator top plate.

[0009] Preferably, the radiator fixed support structure includes a base and a middle plate that fixedly supports the radiator top plate, the middle plate is supported on the base, and the middle plate is provided with a second contoured groove for the radiator's heat dissipation plate to pass through and for snapping the radiator.

[0010] Preferably, the base includes four supporting feet and a flat plate supporting the heat sink, the four supporting feet respectively supporting an end corner of the square middle plate, the four supporting feet are all supported on the flat plate, and the tops of the four supporting feet are provided with recessed platforms supporting the corresponding end corners.

[0011] Preferably, the first contoured groove comprises three pin branch grooves for respectively limiting three pins of the MOSFET.

[0012] Preferably, the middle plate is provided with two second profiling grooves, the two second profiling grooves are arranged in parallel and spaced apart, and the top plate is provided with two first profiling grooves, the two second profiling grooves correspond to the two first profiling grooves one by one.

[0013] Preferably, two guide posts are provided between the two first profiling grooves, the two guide posts are arranged side by side and parallel to the two first profiling grooves, and two guide post holes for the guide posts to pass through are opened on the middle plate, and the two guide post holes correspond one-to-one to the two guide posts.

[0014] Preferably, the middle plate is provided with mounting holes for fixing the top plate of the radiator.

[0015] Preferably, the parts of the heat sink top plate that contact the MOSFET and the fuse are coated with thermal grease.

[0016] The present invention also provides a system for screwing a speed regulating module onto a MOSFET, comprising a heat sink, a MOSFET, a fuse and a pressure plate, and also comprising a mechanism for screwing the speed regulating module onto the MOSFET. The heat sink is mounted on a heat sink fixed support structure, the MOSFET and the fuse are both located on a heat sink top plate, the pressure plate is pressed onto the MOSFET and the fuse, and an arc groove is provided on the heat sink top plate for accommodating the fuse and limiting the position of the fuse together with the pressure plate.

[0017] The present invention also provides a method for screwing a speed regulating module onto a MOSFET, comprising the following steps:

[0018] S1. First, place the upper plate with the first profiling groove facing upwards; S2. Place the pressing plate into the first profiling groove; S3. Place the MOSFET into the first profiling groove, with the MOSFET pin extending out of the first small hole and the side of the MOSFET with poor thermal conductivity in contact with the pressing plate; S4. Extend the fuse pin out of the second small hole, with the fuse body located on the pressing plate; S5. Apply thermal grease to the part of the radiator top plate that contacts the MOSFET and the fuse; S6. Place the radiator into the middle plate, press the radiator and the middle plate tightly with both hands, and at the same time flip them over and buckle them into the upper plate along the guide pillars; S7. After the upper plate, radiator and middle plate are pressed tightly, flip them over at the same time and place them into the base to screw in the screws.

[0019] The present invention has the following beneficial effects:

[0020] 1. The mechanism for screwing the MOSFET on the speed control module provided by the present invention can accurately locate the position of the MOSFET chip and the pressure plate. Most of the wrong parts cannot be put in according to the copying style, thus avoiding most of the wrong installation.

[0021] 2. The mechanism for screwing the MOSFET on the speed control module provided by the present invention can avoid poor quality caused by the deviation of the position of the components after the screws are tightened.

[0022] 3. After accurately positioning each component, the mechanism for screwing the MOSFET on the speed control module provided by the present invention can use an automatic screwing machine to screw, thereby avoiding human influence and improving quality and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A partial schematic diagram of a system for screwing a speed regulating module onto a MOSFET according to an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of a system for screwing a speed regulating module onto a MOSFET according to an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of a heat sink provided by an embodiment of the present invention;

[0027] Figure 4 A top view of a system for screwing a speed regulating module onto a MOSFET provided by an embodiment of the present invention;

[0028] Figure 5 The embodiment of the present invention provides Figure 4 Cross-section of LL. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figure 1-Figure 5, Embodiment 1 of the present invention provides a mechanism for screwing MOSFET on a speed control module, comprising a radiator fixing support structure and an upper plate 2 pressed on a radiator top plate 1, the upper plate 2 is provided with a first small hole 4 for the pins of the MOSFET chip 3 on the radiator top plate 1 to extend out, a second small hole 6 for the pins of the fuse 5 on the radiator top plate 1 to extend out, and a third small hole 8 for the screw to pass through to fix the pressure plate 7 for limiting the MOSFET and the fuse together with the MOSFET chip 3 on the radiator top plate 1 by screws, and the upper plate 2 is provided with a first profiling groove 9 for clamping the pressure plate 7 and the MOSFET chip 3 on the side facing the radiator top plate 1, and the first profiling groove 9 includes three pin support grooves 17 for respectively limiting the three pins of the MOSFET. This mechanism is used to screw the MOSFET chip 3 of the automobile speed control module and fix the MOSFET chip 3 to the radiator top plate 1, and this mechanism is also suitable for other places where product parts need to be accurately positioned. This mechanism can accurately locate the MOSFET chip 3, the fuse 5 and the pressure plate 7, avoiding the quality problems caused by the position deviation of the above parts when screwing. The first profiling groove 9 provided by this mechanism can avoid taking the wrong parts. Most of the wrong parts cannot be put into the first profiling groove 9 according to the profiling style, which can avoid most of the wrong installation. After using this mechanism for accurate positioning, a screw driver or an intelligent electric screwdriver can be used to lock the screws into the threaded holes of the top plate of the radiator, avoiding human influence, and further improving production efficiency while ensuring quality.

[0031] The mechanism for screwing the speed regulating module onto the MOSFET provided by the present invention can solve the problem of low production efficiency in the existing manufacturing process and avoid potential quality risks.

[0032] In this embodiment, the radiator fixed support structure includes a base 10 and a middle plate 11 that fixedly supports the radiator top plate 1, the middle plate 11 is supported on the base 10, the middle plate 11 is provided with a second contoured groove 14 for the heat dissipation plate 12 of the radiator to pass through and can be clamped with the radiator 13, the radiator top plate 1 is provided with two openings 20, and the radiator top plate 1 can be firmly locked on the middle plate 11 by screw fixation or the like through the openings 20 and the mounting holes on the middle plate 11. The base 10 includes four supporting legs 15 and a flat plate 16 that supports the heat dissipation plate, the four supporting legs 15 respectively support an end corner of the square middle plate 11, the four supporting legs 15 are all supported on the flat plate 16, and the tops of the four supporting legs 15 are provided with concave platforms that support the corresponding end corners.

[0033] The specific implementation steps of the present invention are as follows: first, put the upper plate 2 on the table in the reverse direction, and then put the pressing plate 7 into the tooling according to the profiling style. Then, put the MOSFET chip 3 in the reverse direction on the pressing plate 7 in the tooling according to the profiling style, and insert the two pins of the fuse 2 into the tooling and fully put it in to ensure that the body is at the upper end of the pressing plate 7. Then put the heat sink 13 coated with thermal conductive silicone grease into the middle plate 11, hold the heat sink 13 and the middle plate 11 with both hands, and turn them over along the guide column to buckle the upper plate 2, ensure that the upper plate 2, the heat sink 13 and the middle plate 11 are pressed tightly, and then put them into the base 10 and screw them in (all parts are accurately positioned and fixed, and screws can be screwed in with a screw driver).

[0034] The middle plate 11 is provided with two second profiling grooves 14, which are arranged in parallel and spaced apart, and the top plate is provided with two first profiling grooves 9, which correspond one to one with the two second profiling grooves 14. The mechanism can screw two MOSFET chips 3 at one time.

[0035] Two guide posts 18 are provided between the two first profiling grooves 9, and the two guide posts 18 are arranged side by side and parallel to the two first profiling grooves 9. Two guide post holes for the guide posts 18 to pass through are opened on the middle plate 11, and the two guide post holes correspond one-to-one to the two guide posts. The guide posts 18 facilitate the alignment of the middle plate 11 and the upper plate 2 as soon as possible.

[0036] The parts of the radiator top plate 1 that contact the MOSFET chip 3 and the fuse 5 are coated with thermal grease. The radiator dissipates heat for the MOSFET chip 3, and the MOSFET chip 3 transfers its heat to the radiator. If the fuse senses that the temperature of the radiator is too high, it will cut off the circuit of the entire speed regulation module to protect the MOSFET chip 3 from being damaged.

[0037] Embodiment 2 of the present invention provides a system for screwing a speed regulating module onto a MOSFET, comprising a heat sink 13, a MOSFET chip 3, a fuse 5 and a pressure plate 7, and also comprising the above-mentioned mechanism for screwing the speed regulating module onto the MOSFET, wherein the heat sink 13 is mounted on a heat sink fixed support structure, the MOSFET chip 3 and the fuse 5 are both located on a heat sink top plate 1, the pressure plate 7 is pressed on the MOSFET chip 3 and the fuse 5, and an arc groove 19 is provided on the heat sink top plate 1 for accommodating the fuse 5 and limiting the position of the fuse together with the pressure plate 7.

[0038] Embodiment 3 of the present invention provides a method for screwing a speed regulating module onto a MOSFET, comprising the following steps:

[0039] S1, first face the side of the upper plate 2 with the first profiling groove 9 upward; S2, place the pressing plate 7 into the first profiling groove 9; S3, place the MOSFET chip 3 into the first profiling groove 9, the pin of the MOSFET chip 3 extends out of the first small hole 4, and the side of the MOSFET chip 3 with poor thermal conductivity contacts the pressing plate 7. In this embodiment, the MOSFET chip 3 includes a ceramic material side with words printed on it and another side that is away from the ceramic material and easily heats up, the ceramic material side contacts the pressing plate 7, and the other side that is easily heated contacts the radiator top plate 1; S4, extend the pin of the fuse tube 5 out of the second small hole 6, and the body of the fuse tube 5 is located on the pressing plate 7; S5, apply thermal conductive silicone grease to the part of the radiator top plate 1 that contacts the MOSFET chip 3 and the fuse tube 5; S6, place the radiator 13 into the middle plate 11, press the radiator 13 and the middle plate 11 with both hands, and at the same time turn it over and buckle it into the upper plate 2 along the guide column 18; S7, after the upper plate 2, the radiator 13 and the middle plate 11 are pressed tightly, they are turned over and placed in the base 10 to screw.

[0040] The implementation steps of the present invention are to screw in the parts after they are completely positioned, thereby ensuring product consistency and reducing the phenomenon of defective screwing. By flipping over multiple times, each part can be more conveniently and accurately positioned, thereby ensuring work efficiency and product quality. The present invention can be widely used in mechanisms that cannot be positioned from the front and need to be flipped over for positioning.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A mechanism for screwing a speed control module onto a MOSFET, characterized in that: The invention comprises a radiator fixing support structure and an upper plate pressed on a radiator top plate, wherein the upper plate is provided with a first small hole for extending a MOSFET pin on the radiator top plate, a second small hole for extending a fuse pin on the radiator top plate, and a third small hole for screws to pass through to fix a pressure plate for limiting a MOSFET and a fuse together with the MOSFET on the radiator top plate by screws, and a first profiling groove for clamping the pressure plate and the MOSFET on the radiator top plate is provided on one side of the upper plate facing the radiator top plate; the radiator fixing support structure comprises a base and a middle plate for fixing and supporting the radiator top plate; a method for screwing a speed regulating module onto a MOSFET comprises the following steps: Steps: S1. First, turn the upper plate with the first profiling groove upwards; S2. Place the pressing plate into the first profiling groove; S3. Place the MOSFET into the first profiling groove, with the MOSFET pin extending out of the first small hole and the side of the MOSFET with poor thermal conductivity in contact with the pressing plate; S4. Extend the fuse pin out of the second small hole, with the fuse body located on the pressing plate; S5. Apply thermal grease to the part of the radiator top plate that contacts the MOSFET and the fuse; S6. Place the radiator into the middle plate, press the radiator and the middle plate tightly with both hands, and at the same time turn them over and buckle them into the upper plate along the guide pillars; S7. After the upper plate, radiator and middle plate are pressed tightly, turn them over and put them into the base to screw in.

2. The mechanism for screwing a speed control module onto a MOSFET according to claim 1, characterized in that: The middle plate is supported on the base, and the middle plate is provided with a second contoured groove for the heat dissipation plate of the radiator to pass through and for clamping the radiator.

3. The mechanism for screwing the speed regulating module onto the MOSFET according to claim 2, characterized in that: The base includes four supporting feet and a flat plate supporting the heat sink, the four supporting feet respectively support an end corner of the square middle plate, the four supporting feet are all supported on the flat plate, and the tops of the four supporting feet are provided with concave platforms supporting the corresponding end corners.

4. The mechanism for screwing a speed regulating module onto a MOSFET according to claim 1, characterized in that: The first contoured groove includes three pin branch grooves for respectively limiting three pins of the MOSFET.

5. The mechanism for screwing a speed regulating module onto a MOSFET as claimed in claim 2, characterized in that: The middle plate is provided with two second profiling grooves, the two second profiling grooves are arranged in parallel and spaced apart, the top plate is provided with two first profiling grooves, the two second profiling grooves correspond to the two first profiling grooves one by one.

6. The mechanism for screwing a speed regulating module onto a MOSFET as claimed in claim 5, characterized in that: Two guide posts are arranged between the two first profiling grooves, the two guide posts are arranged side by side and parallel to the two first profiling grooves, two guide post holes for the guide posts to pass through are opened on the middle plate, and the two guide post holes correspond to the two guide posts one by one.

7. The mechanism for screwing a speed regulating module onto a MOSFET as claimed in claim 1, characterized in that: The middle plate is provided with mounting holes for fixing the top plate of the radiator.

8. The mechanism for screwing a speed regulating module onto a MOSFET as claimed in claim 1, characterized in that: The parts of the radiator top plate that contact the MOSFET and the fuse are all coated with thermal conductive silicone grease.

9. A system for screwing a speed control module onto a MOSFET, characterized in that: It includes a heat sink, a MOSFET, a fuse and a pressure plate, and also includes a mechanism for screwing the speed control module onto the MOSFET as described in any one of claims 1 to 8, the heat sink is installed on a heat sink fixed support structure, the MOSFET and the fuse are both located on the top plate of the heat sink, the pressure plate is pressed on the MOSFET and the fuse, and the top plate of the heat sink is provided with an arc groove for accommodating the fuse and limiting the fuse together with the pressure plate.

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