Sound generator, display device, and method for driving the display device

By eliminating the need for a front speaker on the front of the display device and instead using an ultrasonic unit to generate sound and ultrasound, the problem of reduced display area is solved, achieving a cost-effective display device design.

CN110825339BActive Publication Date: 2025-01-07SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN201910721831.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2018-08-14
Filing Date
2019-08-06
Publication Date
2025-01-07
Estimated Expiration
2039-08-06

AI Technical Summary

Technical Problem

Existing display devices require a front speaker and proximity sensor in call mode, resulting in a reduced display area and higher costs.

Method used

Instead of placing a front speaker on the front of the display device, an ultrasonic unit is used as a sound generator. The proximity sensing function is achieved through ultrasonic emission and detection, and sound and ultrasonic waves are generated on the display panel by combining a sound output unit and an ultrasonic output unit.

Benefits of technology

Without reducing the display area, sound and ultrasound generation were achieved, reducing costs and increasing the functionality of the display device.

✦ Generated by Eureka AI based on patent content.

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Abstract

Disclosed are a sound generator for a display device, a display device, and a method for driving the display device, wherein the sound generator includes a first vibration generating unit having a first electrode and a second electrode, a second vibration generating unit having a third electrode and a fourth electrode, and a vibration layer, wherein the vibration layer includes a first sub-vibration layer arranged between the first electrode and the second electrode and a second sub-vibration layer arranged between the third electrode and the fourth electrode, wherein the first vibration generating unit is configured to contract and expand the first sub-vibration layer based on a first driving voltage applied to the first electrode and a second driving voltage applied to the second electrode, and wherein the second vibration generating unit is configured to contract and expand the second sub-vibration layer based on a third driving voltage applied to the third electrode and a fourth driving voltage applied to the fourth electrode.
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Description

Technical Field

[0001] Exemplary implementations of the present invention generally relate to a sound generator, a display device including the sound generator, and a method of driving the display device, and more specifically, to a sound generator including an ultrasonic unit serving as a proximity sensor of the display device and a method of driving the display device to generate sound or ultrasonic waves. Background Art

[0002] As the information-dependent society develops, the demand for display devices for displaying images increases in various forms. For example, display devices are applied to various electronic devices such as smart phones, digital cameras, notebook computers, navigators, and smart TVs. The display device may include a display panel for displaying images and a sound generator for providing sound.

[0003] Since the display device is applied to various electronic devices, display devices with various designs are required. For example, in the case of a smart phone, the display device can have an increased display area by omitting a sound generator and a proximity sensor provided on the front side of the display device for outputting a counterpart voice of a phone call in a call mode.

[0004] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute the prior art. Summary of the invention

[0005] The display device constructed according to the exemplary implementation of the present invention and the method of driving such a display device can generate sound or audible signal and ultrasonic wave. For example, the display device may include a sound generator which is not exposed to the outside and can generate sound and ultrasonic wave.

[0006] According to an exemplary implementation of the present invention, by not including a front speaker, an ultrasonic transmitter of an ultrasonic proximity sensor, and an ultrasonic detector of an ultrasonic proximity sensor on the front side of the display device, the display device can have an increased area for displaying an image on the front surface of the display device and have reduced cost.

[0007] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0008] According to one or more embodiments of the present invention, a sound generator for a display device includes a first vibration generating unit and a second vibration generating unit, wherein the first vibration generating unit has a first electrode, a second electrode and a first vibration layer located between the first electrode and the second electrode, and the second vibration generating unit has a third electrode, a fourth electrode and a second vibration layer located between the third electrode and the fourth electrode; wherein the first vibration generating unit is configured to contract and expand the first vibration layer based on a first driving voltage applied to the first electrode and a second driving voltage applied to the second electrode, and wherein the second vibration generating unit is configured to contract and expand the second vibration layer based on a third driving voltage applied to the third electrode and a fourth driving voltage applied to the fourth electrode.

[0009] An area of ​​the first vibration layer in a thickness direction of the first vibration layer may be larger than an area of ​​the second vibration layer in the thickness direction of the second vibration layer.

[0010] An area of ​​the first vibration layer in a width direction of the first vibration layer may be larger than an area of ​​the second vibration layer in the width direction of the second vibration layer.

[0011] The first electrode may include a first dry electrode and a first branch electrode extending from the first dry electrode, and the second electrode may include a second dry electrode and a second branch electrode extending from the second dry electrode.

[0012] The first branch electrodes and the second branch electrodes may be arranged substantially parallel to each other, and may be alternately arranged in a thickness direction of the first vibration layer.

[0013] The third electrode may include a third dry electrode and a third branch electrode extending from the third dry electrode, and the fourth electrode may include a fourth dry electrode and a fourth branch electrode extending from the fourth dry electrode.

[0014] The number of the first branch electrodes or the number of the second branch electrodes may be greater than the number of the third branch electrodes or the number of the fourth branch electrodes.

[0015] The first vibration layer and the second vibration layer may be arranged in one line in a thickness direction of the sound generator.

[0016] The first and second dry electrodes may be disposed on one side surface of the first vibration layer, and the third and fourth dry electrodes may be disposed on a side surface of the second vibration layer different from the side where the one side surface of the first vibration layer is located.

[0017] The first dry electrode and the second dry electrode may be disposed on one side surface of the first vibration layer, the third dry electrode may be disposed in a first contact hole penetrating the second vibration layer to be connected to the third branch electrode, and the fourth dry electrode may be disposed in a second contact hole penetrating the second vibration layer to be connected to the fourth branch electrode.

[0018] The first vibration layer and the second vibration layer may be arranged in a width direction of the first vibration layer substantially perpendicular to a thickness direction of the first vibration layer.

[0019] The first dry electrode may be disposed in a first contact hole penetrating the first vibration layer to be connected to the first branch electrode, the second dry electrode may be disposed on one side surface of the first vibration layer, the third dry electrode may be disposed on a side surface of the second vibration layer different from the side on which the one side surface of the first vibration layer is located, and the fourth dry electrode may be disposed in a second contact hole penetrating the second vibration layer to be connected to the fourth branch electrode.

[0020] The third dry electrode may be disposed in a third contact hole penetrating the second vibration layer to be connected to the third branch electrode, and the fourth dry electrode may be disposed in a fourth contact hole penetrating the second vibration layer to be connected to the fourth branch electrode.

[0021] The first vibration generating unit may be a sound output unit configured to generate an audible sound, and the second vibration generating unit may be an ultrasonic wave output unit configured to generate an ultrasonic wave.

[0022] According to one or more embodiments of the present invention, a display device includes a display panel and a sound generator, wherein the sound generator includes a sound output unit and an ultrasonic output unit, wherein the sound output unit is configured to vibrate the display panel to generate sound, and the ultrasonic output unit is configured to vibrate the display panel to generate ultrasonic waves, wherein an area of ​​the sound output unit is larger than an area of ​​the ultrasonic output unit.

[0023] The sound output unit may include a first electrode, a second electrode and a first sub-vibration layer, wherein a first driving voltage is applied to the first electrode, a second driving voltage is applied to the second electrode, and the first sub-vibration layer is arranged between the first electrode and the second electrode, wherein the first sub-vibration layer can be configured to contract and expand based on the first driving voltage applied to the first electrode and the second driving voltage applied to the second electrode.

[0024] The ultrasonic output unit may include a third electrode, a fourth electrode and a second sub-vibration layer, wherein a third driving voltage is applied to the third electrode, a fourth driving voltage is applied to the fourth electrode, and the second sub-vibration layer is arranged between the third electrode and the fourth electrode, wherein the second sub-vibration layer can be configured to contract and expand based on the third driving voltage applied to the third electrode and the fourth driving voltage applied to the fourth electrode.

[0025] The sound generator may further include a first pad electrode connected to the first electrode and a second pad electrode connected to the second electrode; and a third pad electrode connected to the third electrode and a fourth pad electrode connected to the fourth electrode.

[0026] The display device may also include a sound circuit board, an intermediate frame and a main circuit board, wherein the sound circuit board is connected to the first pad electrode, the second pad electrode, the third pad electrode and the fourth pad electrode, the intermediate frame is arranged under the display panel and has a first through hole, and the main circuit board is arranged under the intermediate frame and has a sound connector, wherein the sound circuit board can pass through the first through hole to be connected to the sound connector.

[0027] The main circuit board may also include a first sound driver and a second sound driver, wherein the first sound driver is configured to transmit the first driving voltage and the second driving voltage to the sound generator, and the second sound driver is configured to transmit the third driving voltage and the fourth driving voltage to the sound generator.

[0028] The display device may further include a first microphone and a second microphone, wherein the first microphone is configured to sense sound waves and ultrasonic waves, and the second microphone is configured to sense sound waves and ultrasonic waves, wherein a distance between the sound generator and the first microphone may be different from a distance between the sound generator and the second microphone.

[0029] According to one or more embodiments of the present invention, a method for driving a display device having a display panel, a touch sensor panel, a sound generator including a sound output unit and an ultrasonic output unit, and at least one microphone includes: vibrating the display panel to generate sound using the sound output unit of the sound generator in a sound output mode; vibrating the display panel to generate ultrasonic waves using the ultrasonic output unit of the sound generator in a proximity sensing mode; and sensing the ultrasonic waves reflected by an object using the at least one microphone.

[0030] The method of driving the display device may further include determining whether an object is located close to the display device in response to ultrasonic waves sensed by the at least one microphone.

[0031] The method of driving the display device may further include turning off the display panel and the touch sensor panel in response to determining that the object is located close to the display device.

[0032] Sensing ultrasonic waves may include determining that the object is positioned close to the display device in response to a first microphone of the at least one microphone sensing ultrasonic waves reflected by the object within a first threshold time and a second microphone of the at least one microphone sensing ultrasonic waves reflected by the object within a second threshold time.

[0033] Sensing ultrasonic waves may include: in response to a first microphone among at least one microphone sensing ultrasonic waves reflected by an object within a first threshold time, a second microphone among at least one microphone not sensing ultrasonic waves reflected by the object within a second threshold time, and the second microphone sensing ultrasonic waves reflected by the object within a third threshold time, determining that the object is positioned close to the display device.

[0034] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0036] Figure 1 is a perspective view of a display device constructed according to an exemplary embodiment.

[0037] Figure 2 is an exploded perspective view of a display device constructed according to an exemplary embodiment.

[0038] Figure 3 It is shown Figure 2 A bottom view of an example of a cover window, a touch circuit board, a display circuit board, a lower panel component, a sound generator, and a sound circuit board.

[0039] Figure 4 It is shown Figure 2 A plan view of an example of a display circuit board, a second connection cable, a sound generator, a sound circuit board, and a middle frame.

[0040] Figure 5 It is shown Figure 2 A plan view of an example of a second connecting cable, a sound circuit board, and a main circuit board.

[0041] Figure 6 It is along Figure 3 , Figure 4 and Figure 5 A cross-sectional view of the display device taken along section line II'.

[0042] Figure 7 It is shown Figure 6 A stereogram of an example of a sound generator.

[0043] Figure 8 It is shown Figure 7 A plan view of an example of a sound generator.

[0044] Fig. 9 It is along Figure 8 A sectional view taken along section line II-II'.

[0045] Fig. 10A is an exemplary diagram illustrating a method of vibrating a vibration layer disposed between a first branch electrode and a second branch electrode of a sound generator according to the principles of the present invention.

[0046] Fig. 10B and Fig. 10C is an exemplary view illustrating a method of vibrating a display panel by using vibration of a sound generator according to the principles of the present invention.

[0047] Fig.11 It is shown Figure 6 A perspective view of another example of a sound generator.

[0048] Fig.12 It is shown Fig.11 A plan view of the sound generator.

[0049] Fig.13 It is along Fig.12 A cross-sectional view taken along section line III-III'.

[0050] Fig.14 It is shown Figure 6 A perspective view of another example of a sound generator.

[0051] Fig.15 It is shown Fig.14 A plan view of the sound generator.

[0052] Fig.16 It is along Fig.15 A sectional view taken along section line IV-IV'.

[0053] Fig.17 It is shown Figure 6 A perspective view of another example of a sound generator.

[0054] Fig.18 It is shown Fig.17 A plan view of the sound generator.

[0055] Fig.19 It is along Fig.18 A cross-sectional view taken along section line V-V'.

[0056] Fig. 20 is a flowchart illustrating a method of driving a display device constructed according to an exemplary embodiment.

[0057] Fig.21 is a graph showing the sound pressure level of the sound generator with respect to frequency in the sound output mode.

[0058] Fig. 22 is a graph showing the sound pressure level of a sound generator with respect to frequency in a proximity sensing mode.

[0059] Fig.23 is a flow chart illustrating a method of sensing proximity in a proximity sensing mode.

[0060] Fig.24 is a waveform diagram illustrating a trigger signal of a main processor, an ultrasonic wave generated by a sound generator, and a first echo signal of a first microphone according to an exemplary embodiment.

[0061] Fig.25 and Fig.26 2 is an exemplary view illustrating a sound generator, a first microphone, a second microphone, and an object for explaining a method of sensing proximity in a proximity sensing mode according to an exemplary embodiment.

[0062] Fig. 27 is a cross-sectional view of, in particular, a display region of a display panel according to an exemplary embodiment.

[0063] Fig.28 is a cross-sectional view illustrating a panel lower member and a first sound generator according to an exemplary embodiment. DETAILED DESCRIPTION

[0064] In the following description, for the purpose of illustration, many specific details are elaborated to provide a thorough understanding of various exemplary embodiments or implementations of the present invention. As used herein, "implementation" and "implementation" are interchangeable words, which are non-limiting examples of one or more devices or methods using the inventive concept disclosed herein. However, it is obvious that various exemplary embodiments can be put into practice without these specific details or with one or more equivalent arrangements. In other examples, in order to avoid unnecessarily blurring various exemplary embodiments, known structures and devices are shown in block diagram form. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0065] Unless otherwise specified, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0066] The use of cross hatching and / or shading in the drawings is generally used to make the boundaries between adjacent elements clear. Therefore, unless specified, the presence or absence of cross hatching or shading does not represent or indicate any preference or requirement for a specific material, material property, size, ratio, commonality between the illustrated elements and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the exemplary embodiments can be implemented differently, the specific processing sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0067] When a layer or element is referred to as being "on", "connected to" or "coupled to" another element or layer, it may be directly located on, directly connected to or coupled to another element or layer, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly located" on, "directly connected to" or "directly coupled to" another element or layer, there is no intervening element or layer. For this reason, the term "connection" may represent a physical connection, electrical connection and / or fluid connection in the presence or absence of an intervening element. In addition, the X-axis, Y-axis and Z-axis are not limited to the three axes of a rectangular coordinate system, and may be interpreted in a broader sense. For example, the X-axis, Y-axis and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0068] Although the terms "first", "second", etc. can be used in this article to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below can be referred to as the second element.

[0069] Spatially relative terms such as "beneath," "below," "under," "lower," "above," "upper," "over," "higher," "side" (e.g., as in "sidewall"), and the like may be used herein for descriptive purposes, and thereby to describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" may include both the above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly.

[0070] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" are intended to also include plural forms. In addition, when used in this specification, the terms "comprising", "comprising", "including" and / or "including" represent the existence of stated features, integral bodies, steps, operations, elements, parts and / or their collections, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or their collections. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as degree terms, and are therefore used to allow for the inherent deviations in the measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0071] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views, which are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Therefore, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be understood as being limited to the specific illustrated shapes of the regions, but should include deviations in shape due to, for example, manufacturing. In this manner, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0072] According to the convention in the art, for functional blocks, units and / or modules, some exemplary embodiments are described and shown in the drawings. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc., which can be formed using semiconductor-based preparation technology or other manufacturing technology. In the case where the blocks, units and / or modules are implemented by microprocessors or other similar hardware, software (e.g., microcode) can be used to program and control the blocks, units and / or modules to perform the various functions discussed herein, and optionally, they can be driven by firmware and / or software. It is also considered that each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs some functions and processors (e.g., one or more programmed microprocessors and related circuits) that perform other functions. In addition, without departing from the scope of the inventive concept, each block, unit and / or module of some exemplary embodiments can be physically divided into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0073] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as those commonly understood by ordinary technicians in the field to which the present disclosure belongs. Unless explicitly defined as such herein, terms, such as terms defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or overly formal sense.

[0074] Figure 1 is a perspective view of a display device 10 constructed according to an exemplary embodiment. Figure 2 is an exploded perspective view of a display device 10 constructed according to an exemplary embodiment.

[0075] See also Figure 1 and Figure 2 , the display device 10 according to an exemplary embodiment includes a cover window 100, a touch sensing unit 200, a touch circuit board 210, a touch driving unit 220, a display panel 300, a display circuit board 310, a display driving unit 320, a panel lower member 400, a sound generator 510, a middle frame 600, a main circuit board 700, an auxiliary circuit board 800 and a lower cover 900.

[0076] In the present specification, "upper", "above", "top", "upper side" or "upper surface" means the direction in which the cover window 100 is disposed relative to the display panel 300 (i.e., the Z-axis direction), and "lower", "below", "bottom", "lower side" or "lower surface" means the direction in which the middle frame 600 is disposed relative to the display panel 300 (i.e., the direction opposite to the Z-axis direction). In addition, "left", "right", "upper" and "lower" mean directions when the display panel 300 is viewed from a plane. For example, "left" means the direction opposite to the X-axis direction, "right" means the X-axis direction, "upper" means the Y-axis direction, and "lower" means the direction opposite to the Y-axis direction.

[0077] The display device 10 may have a rectangular shape in a plan view in the Z-axis direction. Figure 1 and Figure 2 As shown in , the display device 10 may have a rectangular planar shape having a short side in a first direction (X-axis direction) and a long side in a second direction (Y-axis direction). The edge where the short side in the first direction (X-axis direction) intersects the long side in the second direction (Y-axis direction) may be formed into a rounded shape having a predetermined curvature or formed into a right angle shape. The planar shape of the display device 10 is not limited to a rectangular shape, and may be formed in other polygonal shapes, a circular shape, or an elliptical shape.

[0078] The display device 10 may include a first region DR1 formed to be flat and a second region DR2 extending from the right and left sides of the first region DR1. The second region DR2 may be formed to be flat or curved. When the second region DR2 is formed to be flat, an angle formed by the first region DR1 and the second region DR2 may be an obtuse angle. When the second region DR2 is formed to be curved, the second region DR2 may have a constant curvature or a variable curvature.

[0079] Figure 1 It is shown that the second region DR2 extends from the left and right sides of the first region DR1, but exemplary embodiments are not limited thereto. That is, the second region DR2 may extend from only one of the left and right sides of the first region DR1. In addition, the second region DR2 may extend from only one of the upper and lower sides of the first region DR1 and from only one of the left and right sides of the first region DR1. Hereinafter, it is assumed that the second region DR2 is disposed along the left and right edges of the display device 10.

[0080] The cover window 100 may be disposed on the display panel 300 to cover the upper surface of the display panel 300. Therefore, the cover window 100 may be used to protect the upper surface of the display panel 300. Figure 6, the touch sensing unit 200 is attached to the touch sensing unit 200 via a first adhesive member 910 as shown in FIG. The first adhesive member 910 may be an optically clear adhesive (OCA) film or an optically clear resin (OCR) film.

[0081] The cover window 100 may include a light-transmitting area 101 corresponding to the display panel 300 and a light-blocking area 102 corresponding to an area other than the display panel 300. The cover window 100 may be disposed in the first area DR1 and the second area DR2, and the light-transmitting area 101 may be disposed in a portion of the first area DR1 and a portion of the second area DR2. The light-blocking area 102 may be formed to be opaque. Alternatively, the light-blocking area 102 may be formed as a decorative layer having a pattern that a user can see when no image is displayed. For example, a company logo or various characters may be patterned on the light-blocking area 102. In addition, the light-blocking area 102 may be provided with a plurality of holes HH, etc., for exposing a front camera, a front speaker, an infrared sensor, an iris recognition sensor, an ultrasonic sensor, an illuminance sensor, etc., but exemplary embodiments are not limited thereto. For example, at least one of the front camera, the front speaker, the infrared sensor, the iris recognition sensor, the ultrasonic sensor, and the illuminance sensor may be installed in the display panel 300. In this case, some or all of the plurality of holes HH may be omitted.

[0082] The cover window 100 may be made of glass, sapphire and / or plastic. The cover window 100 may be rigid or flexible.

[0083] The touch sensing unit 200 may be disposed between the cover window 100 and the display panel 300. The touch sensing unit 200 may be disposed in the first region DR1 and the second region DR2. Therefore, the touch sensing unit 200 may sense a user's touch in the second region DR2 as well as the first region DR1.

[0084] The touch sensing unit 200 may be Figure 6 As shown in FIG. 1 , the touch sensing unit 200 is attached to the lower surface of the cover window 100 via the first adhesive member 910. A polarizing film may be additionally provided on the touch sensing unit 200 to prevent or reduce visibility degradation caused by reflection of external light. In this case, the polarizing film may be attached to the lower surface of the cover window 100 via the first adhesive member 910.

[0085] The touch sensing unit 200 is a unit for sensing a user's touch position, and may be implemented as a capacitance type, such as a self-capacitance type or a mutual capacitance type. When the touch sensing unit 200 is implemented as a self-capacitance type, the touch sensing unit 200 may include only a touch drive electrode, but when the touch sensing unit 200 is implemented as a mutual capacitance type, the touch sensing unit 200 may include both a touch drive electrode and a touch sensing electrode. Hereinafter, the touch sensing unit 200 is described assuming that the touch sensing unit 200 is implemented as a mutual capacitance type.

[0086] The touch sensing unit 200 may be a panel type or a film type. In this case, the touch sensing unit 200 may be Figure 6 9 is attached to the thin encapsulation film of the display panel 300 via the second adhesive member 920 as shown in FIG. The second adhesive member 920 may be an optically clear adhesive (OCA) film or an optically clear resin (OCR) film.

[0087] The touch sensing unit 200 may be integrally formed with the display panel 300. In this case, the touch driving electrodes and the touch sensing electrodes of the touch sensing unit 200 may be disposed on a thin packaging film of the display panel 300, or may be disposed on a packaging substrate and a packaging film covering a light emitting element layer of the display panel 300.

[0088] The touch circuit board 210 may be attached to one side of the touch sensing unit 200. Specifically, the touch circuit board 210 may be attached to a pad provided on one end of the touch sensing unit 200 using an anisotropic conductive film. In addition, the touch circuit board 210 may be provided with a touch connection portion on the other end of the touch sensing unit 200, and the touch connection portion may be connected to a touch connector 312a of the display circuit board 310. The touch circuit board 210 may be a flexible printed circuit board.

[0089] The touch drive unit 220 may apply a touch drive signal to the touch drive electrode of the touch sensing unit 200, sense a sensing signal from the touch sensing electrode of the touch sensing unit 200, and analyze the sensing signal to calculate a touch position of the user. The touch drive unit 220 may be formed as an integrated circuit and mounted on the touch circuit board 210.

[0090] The display panel 300 may be disposed under the touch sensing unit 200. The display panel 300 may be disposed to overlap the light transmission region 101 of the cover window 100. The display panel 300 may be disposed in the first region DR1 and the second region DR2. Therefore, an image of the display panel 300 may be seen not only in the first region DR1 but also in the second region DR2.

[0091] The display panel 300 may be a light-emitting display panel including a light-emitting element. Examples of the display panel 300 may include an organic light-emitting display panel using an organic light-emitting diode, an ultra-small light-emitting diode display panel using a micro LED, or a quantum dot light-emitting diode display panel using a quantum dot light-emitting diode. Fig. 27 The organic light emitting display panel shown in .

[0092] Reference Fig. 27 , the display area of ​​the display panel 300 indicates an area where the light emitting element layer 304 is formed to display an image, and the non-display area of ​​the display panel 300 indicates an area around the display area.

[0093] The display panel 300 may include a support substrate 301 , a flexible substrate 302 , a thin film transistor layer 303 , a light emitting element layer 304 , an encapsulation layer 305 , and a barrier film 306 .

[0094] The flexible substrate 302 is disposed on the support substrate 301. Each of the support substrate 301 and the flexible substrate 302 may include a polymer material having flexibility. For example, each of the support substrate 301 and the flexible substrate 302 may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof.

[0095] The thin film transistor layer 303 is provided on the flexible substrate 302. The thin film transistor layer 303 includes a thin film transistor 335, a gate insulating film 336, an interlayer insulating film 337, a protective film 338, and a planarizing film 339.

[0096] A buffer film may be formed on the flexible substrate 302. The buffer film may be formed on the flexible substrate 302 to protect the thin film transistor 335 and the light emitting element, which are susceptible to moisture, from being affected by moisture penetrating the support substrate 301 and the flexible substrate 302. The buffer film may be formed of a plurality of alternately stacked inorganic films. For example, the buffer film may be formed of a multilayer film in which silicon oxide (SiO x ), silicon nitride (SiN x ) and one or more inorganic layers of one or more of SiON. The buffer film may be omitted.

[0097] The thin film transistor 335 is formed on the flexible substrate 302 and the buffer film. The thin film transistor 335 includes an active layer 331, a gate electrode 332, a source electrode 333, and a drain electrode 334. Fig. 27The thin film transistor 335 is shown to be formed by a top gate method in which the gate electrode 332 is located on the active layer 331, but the exemplary embodiment is not limited thereto. That is, the thin film transistor 335 may be formed by a bottom gate method in which the gate electrode 332 is located below the active layer 331, or may be formed by a dual gate method in which the gate electrode 332 is located on the active layer 331 and below the active layer 331.

[0098] The active layer 331 is formed on the buffer film. The active layer 331 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer for blocking external light incident on the active layer 331 may be formed between the buffer film and the active layer 331.

[0099] The gate insulating film 336 may be formed on the active layer 331. The gate insulating film 336 may be made of, for example, silicon oxide (SiO x ) film, silicon nitride (SiN x ) film or a combination thereof.

[0100] The gate electrode 332 and the gate line may be formed on the gate insulating film 336. The gate electrode 332 and the gate line may be formed of a single layer or a multilayer including at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0101] An interlayer insulating film 337 may be formed on the gate electrode 332 and the gate line. The interlayer insulating film 337 may be made of, for example, silicon oxide (SiO x ) film, silicon nitride (SiN x ) film or a combination thereof.

[0102] The source electrode 333, the drain electrode 334, and the data line may be formed on the interlayer insulating film 337. Each of the source electrode 333 and the drain electrode 334 may be connected to the active layer 331 via a contact hole penetrating the gate insulating film 336 and the interlayer insulating film 337. The source electrode 333, the drain electrode 334, and the data line may be formed of a single layer or a multilayer including at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0103] A protective film 338 for insulating the thin film transistor 335 may be formed on the source electrode 333, the drain electrode 334, and the data line. The protective film 338 may be made of, for example, silicon oxide (SiO x ) film, silicon nitride (SiN x ) film or a combination thereof.

[0104] A planarization film 339 for planarizing a step caused by the thin film transistor 335 may be formed on the protective film 338. The planarization film 339 may be formed of an organic film including acrylic resin, epoxy resin, phenol resin, polyamide resin, or polyimide resin.

[0105] The light emitting element layer 304 is formed on the thin film transistor layer 303. The light emitting element layer 304 includes a light emitting element and a pixel definition film 344.

[0106] The light emitting element and the pixel defining film 344 are formed on the planarization film 339. The light emitting element may be an organic light emitting element. In this case, the light emitting element may include an anode electrode 341, a light emitting layer 342, and a cathode electrode 343.

[0107] The anode electrode 341 may be formed on the planarization film 339. The anode electrode 341 may be connected to the drain electrode 334 of the thin film transistor 335 via a contact hole penetrating the protection film 338 and the planarization film 339.

[0108] The pixel defining film 344 may be formed on the planarization film 339 to cover the edge of the anode electrode 341 and define the pixel. That is, the pixel defining film 344 is used to define the pixel. Each of the pixels represents a region where the anode electrode 341, the light emitting layer 342, and the cathode electrode 343 are sequentially stacked, and holes from the anode electrode 341 and electrons from the cathode electrode 343 are combined with each other in the light emitting layer 342 to emit light.

[0109] The light-emitting layer 342 is formed on the anode electrode 341 and the pixel defining film 344. The light-emitting layer 342 is an organic light-emitting layer. The light-emitting layer 342 can emit one of red light, green light and blue light. The peak wavelength range of red light can be about 620nm to about 750nm, and the peak wavelength range of green light can be about 495nm to about 570nm. In addition, the peak wavelength range of blue light can be about 450nm to about 495nm. The light-emitting layer 342 can be a white light emitting layer that emits white light. In this case, the light-emitting layer 342 can have a stacked structure of a red light emitting layer, a green light emitting layer and a blue light emitting layer, and can be a common layer formed together in the pixel. In this case, the display panel 300 may also include a color filter for displaying red, green and blue.

[0110] The light emitting layer 342 may include a hole transport layer, a light emitting layer, and an electron transport layer. In addition, the light emitting layer 342 may be formed in a tandem structure having two or more stacks, and in this case, a charge generation layer may be formed between the stacks.

[0111] The cathode electrode 343 is formed on the light emitting layer 342. The cathode electrode 343 may be formed to cover the light emitting layer 342. The cathode electrode 343 may be a common layer commonly formed in pixels.

[0112] When the light emitting element layer 304 is formed by a top emission method that emits light upward, the anode electrode 341 can be formed by a high reflectivity metal material such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy can be an alloy of silver (Ag), palladium (Pd) and copper (Cu). The cathode electrode 343 can be formed by a transparent conductive material (TCO) such as ITO or indium zinc oxide (IZO) that is light-transmitting, or can be formed by a semi-transmissive conductive material such as magnesium (Mg), silver (Ag) or an alloy of magnesium (Mg) and silver (Ag). When the cathode electrode 343 is formed by a semi-transmissive conductive material, the luminous efficiency can be increased by a microcavity.

[0113] When the light emitting element layer 304 is formed by a bottom emission method that emits light downward, the anode electrode 341 can be formed of a transparent conductive material (TCO) such as ITO or IZO, or can be formed of a semi-transmissive conductive material such as magnesium (Mg), silver (Ag) or an alloy of magnesium (Mg) and silver (Ag). The cathode electrode 343 can be formed of a high reflectivity metal material such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy or a stacked structure of an APC alloy and ITO (ITO / APC / ITO). When the anode electrode 341 is formed of a semi-transmissive conductive material, the luminous efficiency can be increased by a microcavity.

[0114] The encapsulation layer 305 is formed on the light emitting element layer 304. The encapsulation layer 305 is used to prevent or reduce oxygen or moisture from penetrating the light emitting layer 342 and the cathode electrode 343. To this end, the encapsulation layer 305 may include at least one inorganic film. The inorganic film may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide or titanium oxide. The encapsulation layer 305 may also include at least one organic film. The organic film may be formed to have a sufficient thickness to prevent or reduce foreign matter (particles) from penetrating the encapsulation layer 305 and entering the light emitting layer 342 and the cathode electrode 343. The organic film may include any one of epoxy resin, acrylate and polyurethane acrylate.

[0115] The display circuit board 310 may be attached to one side of the display panel 300. Specifically, the display circuit board 310 may be attached to a pad provided on one side of the display panel 300 using an anisotropic conductive film. The display circuit board 310 may be bent downward from the upper portion of the display panel 300. The touch circuit board 210 may also be bent downward from the upper portion of the display panel 300. Therefore, the touch connection portion provided at one end of the touch circuit board 210 may be connected to the touch connector 312a of the display circuit board 310. This will be referred to later. Figure 3 , Figure 4 and Figure 5 The details of the display circuit board 310 are described.

[0116] The display driving unit 320 transmits signals and voltages for driving the display panel 300 via the display circuit board 310. The display driving unit 320 may be formed as an integrated circuit and mounted on the display circuit board 310, but exemplary embodiments are not limited thereto. For example, the display driving unit 320 may be directly attached to the substrate of the display panel 300. In this case, the display driving unit 320 may be attached to the upper surface or the lower surface of the display panel 300.

[0117] The panel lower member 400 may be disposed under the display panel 300. The panel lower member 400 may be attached to the lower surface of the display panel 300 via the third adhesive member 930. The third adhesive member 930 may be an optically clear adhesive (OCA) film or an optically clear resin (OCR) film.

[0118] The panel lower member 400 may include at least one of a light absorbing member for absorbing external light, a buffer member for absorbing external impact, a heat dissipating member for effectively dissipating heat of the display panel 300 , and a light blocking layer for blocking external light.

[0119] The light absorbing member may be disposed under the display panel 300. The light absorbing member suppresses transmission of light to prevent or reduce components disposed under the light absorbing member (i.e., the sound generator 510, the display circuit board 310, etc.) from being observed from above the display panel 300. The light absorbing member may include a light absorbing material such as a black pigment or dye.

[0120] The buffer member may be disposed below the light absorbing member. The buffer member absorbs external impact to prevent or reduce damage to the display panel 300. The buffer member may be composed of a single layer or a plurality of layers. For example, the buffer member may be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or may be formed of an elastic material such as rubber, a polyurethane material, or a sponge formed by foaming an acrylic material. The buffer member may be a cushion layer.

[0121] The heat dissipation member may be disposed below the buffer member. The heat dissipation member may include a first heat dissipation layer including graphite or carbon nanotubes and a second heat dissipation layer capable of blocking electromagnetic waves and formed of a metal thin film of copper, nickel, ferrite or silver having excellent thermal conductivity.

[0122] The sound generator 510 may take the form of a speaker, a vibrator, an actuator, an ultrasonic generator, or any other device that can generate vibrations in response to an acoustic signal. Some specific examples of the types of sound generating devices that can be used include those discussed herein. For example, the sound generator 510 may be disposed below the panel lower member 400. The sound generator 510 may be disposed to overlap the panel lower member 400. In this case, the sound generator 510 may be attached to the lower surface of the panel lower member 400. The sound generator 510 may be attached to the lower surface of the panel lower member 400 via the fourth adhesive member 940. The fourth adhesive member 940 may be a pressure sensitive adhesive (PSA) member.

[0123] Meanwhile, when the sound generator 510 is disposed on the heat dissipation member of the panel lower member 400, the first heat dissipation layer or the second heat dissipation layer of the heat dissipation member may be damaged by the vibration of the sound generator 510. Therefore, in the area where the sound generator 510 is disposed, the heat dissipation member may be removed, and in this case, the sound generator 510 may be disposed on the buffer member. Fig.28 As shown in , in the region where the sound generator 510 is disposed, the panel lower member 400 may be removed, and in this case, the sound generator 510 may be disposed on the lower surface of the display panel 300 .

[0124] The sound generator 510 may include a piezoelectric actuator. In this case, the sound generator 510 may vibrate by applying an AC voltage to contract and expand the piezoelectric actuator. The sound generator 510 may vibrate in a vertical direction (Z-axis direction). In this case, the display panel 300 may vibrate up and down by the vibration of the sound generator 510, and thus may generate sound or ultrasonic waves.

[0125] The sound generator 510 may be connected to the sound circuit board 530. Specifically, one end of the sound circuit board 530 may be connected to a pad electrode provided on at least one side of the sound generator 510.

[0126] The sound circuit board 530 may be connected to the sound connector 740 of the main circuit board 700 via the first through hole CAH1 of the middle frame 600. Therefore, the sound generator 510 may be connected to the first sound driver 760 and the second sound driver (not shown) of the main circuit board 700. Therefore, the sound generator 510 may vibrate according to the first driving voltage and the second driving voltage of the first sound driver 760 to generate sound, and may vibrate according to the third driving voltage and the fourth driving voltage of the second sound driver to generate ultrasonic waves.

[0127] The middle frame 600 may be disposed under the panel lower member 400. The middle frame 600 may include a synthetic resin, a metal, or may include both a synthetic resin and a metal.

[0128] The middle frame 600 may include a first camera hole CMH1, a battery hole BH, a first through hole CAH1, and a second through hole CAH2, wherein the camera device 720 is inserted into the first camera hole CMH1, heat is discharged from the battery via the battery hole BH, the sound circuit board 530 passes through the first through hole CAH1, and the second connection cable 314 connected to the display circuit board 310 passes through the second through hole CAH2. In addition, the middle frame 600 may be provided with a receiving hole AH for accommodating the sound generator 510. The width of the receiving hole AH is larger than the width of the sound generator 510. When the height of the sound generator 510 is not high, the middle frame 600 may be provided with a receiving groove instead of the receiving hole AH. The receiving hole AH may be integrated with the battery hole BH.

[0129] When the sound generator 510 overlaps with the battery hole BH in which the battery is disposed, the sound generator 510 may be affected by the heat generated from the battery. Therefore, the sound generator 510 may be disposed so as not to overlap with the battery hole BH.

[0130] A waterproof member 610 may be provided at an edge of the middle frame 600. The waterproof member 610 may be attached to the upper surface of the panel lower member 400 and the lower surface of the middle frame 600. Therefore, penetration of water or dust between the display panel 300 and the middle frame 600 may be prevented or reduced. That is, a waterproof and dustproof display device 10 may be provided.

[0131] Specifically, the waterproof member 610 may include a base film, a first adhesive film and a second adhesive film, wherein the first adhesive film is arranged on one surface of the base film, and the second adhesive film is arranged on the other surface of the base film. The base film may be a polyethylene terephthalate (PET) film, a polyethylene terephthalate (PET) film, a relief layer or polyethylene foam (PE foam). Each of the first adhesive film and the second adhesive film may be a pressure-sensitive adhesive (PSA) film. The first adhesive film may be adhered to the lower surface of the panel lower member 400, and the second adhesive film may be adhered to the upper surface of the intermediate frame 600.

[0132] The main circuit board 700 may be disposed under the middle frame 600. The main circuit board 700 may be a printed circuit board or a flexible printed circuit board.

[0133] The main circuit board 700 may include a main processor 710, a camera device 720, a main connector 730, a sound connector 740, a first sound driver 760, a second sound driver, a first microphone 780, and a first auxiliary connector 790. The sound connector 740, the first sound driver 760, and the second sound driver may be disposed on an upper surface of the main circuit board 700 facing the middle frame 600. The main processor 710, the main connector 730, the first microphone 780, and the first auxiliary connector 790 may be disposed on a lower surface of the main circuit board 700 facing the lower cover 900. In addition, the camera device 720 may be disposed on both the upper surface and the lower surface of the main circuit board 700.

[0134] The main processor 710 may control all functions of the display device 10. For example, the main processor 710 may transmit image data to the display driving unit 320 via the display circuit board 310 so that the display panel 300 displays an image. The main processor 710 may receive touch data from the touch driving unit 220, determine the user's touch position, and then run an application indicated by an icon displayed at the user's touch position. The main processor 710 may receive touch data from the touch driving unit 220, and may run an application indicated by an icon displayed at the user's touch position according to the touch data.

[0135] The main processor 710 may transmit the sound data to the first sound driver 760 in the sound output mode. The main processor 710 may transmit the ultrasound data to the second sound driver in the proximity sensing mode.

[0136] The main processor 710 may be a system chip including an integrated circuit, an application processor, or a central processing unit.

[0137] The camera device 720 processes image frames such as still images or moving images obtained by an image sensor in a camera mode and transmits the processed image frames to the main processor 710 .

[0138] The second connection cable 314 may pass through the second through hole CAH2 of the middle frame 600 and be connected to the main connector 730. Therefore, the main circuit board 700 may be electrically connected to the display circuit board 310 and the touch circuit board 210.

[0139] The sound circuit board 530 may pass through the first through hole CAH1 of the middle frame 600 and be connected to the sound connector 740 disposed on the upper surface of the main circuit board 700 .

[0140] The first sound driver 760 receives sound data from the main processor 710. The first sound driver 760 generates a first driving voltage and a second driving voltage according to the sound data, and transmits the first driving voltage and the second driving voltage to the sound generator 510 via the sound connector 740 and the sound circuit board 530. Therefore, the sound generator 510 can vibrate the display panel 300 to generate sound.

[0141] The second sound driver receives the ultrasonic data from the main processor 710. The second sound driver generates a third driving voltage and a fourth driving voltage according to the ultrasonic data, and transmits the third driving voltage and the fourth driving voltage to the sound generator 510 via the sound connector 740 and the sound circuit board 530. Therefore, the sound generator 510 can vibrate the display panel 300 to generate ultrasonic waves.

[0142] Each of the first sound driver 760 and the second sound driver may include a digital signal processor (DSP), a digital-to-analog converter (DAC), and an amplifier, wherein the digital signal processor (DSP) is used to process digital signals such as sound data and ultrasonic data, the digital-to-analog converter (DAC) is used to convert the digital signals processed in the digital signal processor into analog signals such as a first drive voltage and a second drive voltage or a third drive voltage and a fourth drive voltage, and the amplifier is used to amplify the analog signal converted in the digital-to-analog converter and output the amplified analog signal.

[0143] The first microphone 780 may be disposed on one side of the display device 10. The first microphone 780 may sense sound waves and ultrasonic waves. For example, the first microphone 780 may sense sound waves having a frequency lower than 20 kHz and ultrasonic waves having a frequency of 20 kHz to 50 kHz. Therefore, when the sound generator 510 vibrates the display panel 300 in the proximity sensing mode to generate ultrasonic waves, the ultrasonic waves reflected by the object may be sensed by the first microphone 780. The first microphone 780 may convert the sensed ultrasonic waves into a first electrical signal and transmit the first electrical signal to the main processor 710.

[0144] The third connection cable 890 connected to the auxiliary circuit board 800 may be connected to the first auxiliary connector 790. The main circuit board 700 and the auxiliary circuit board 800 may be electrically connected to each other through the third connection cable 890.

[0145] In addition, the main circuit board 700 may also be provided with a mobile communication module capable of transmitting and receiving radio signals to and from at least one of a base station, an external terminal, and a server. The radio signal may include various types of data according to transmission / reception of a voice signal, a video call signal, or a text / multimedia message.

[0146] The auxiliary circuit board 800 may include a second microphone 810 and a second auxiliary connector 820. The second microphone 810 and the second auxiliary connector 820 may be disposed on a lower surface of the main circuit board 700 facing the lower cover 900.

[0147] The second microphone 810 may be disposed on a side of the display device 10 opposite to the side on which the first microphone 780 is disposed. The second microphone 810 may sense sound waves and ultrasonic waves. For example, the second microphone 810 may sense sound waves having a frequency lower than 20kHz and ultrasonic waves having a frequency of 20kHz to 50kHz. Therefore, when the sound generator 510 vibrates the display panel 300 in the proximity sensing mode to generate ultrasonic waves, the ultrasonic waves reflected by the object may be sensed by the second microphone 810. The second microphone 810 may convert the sensed ultrasonic waves into a second electrical signal and transmit the second electrical signal to the main processor 710.

[0148] The main processor 710 may determine whether the object is located close to the display device 10 based on the first electrical signal of the first microphone 780 and the second electrical signal of the second microphone 810. Fig.23 , Fig.24 and Fig.25 Details of the proximity sensing method of the main processor 710 are described.

[0149] The third connection cable 890 connected to the main circuit board 700 may be connected to the second auxiliary connector 820. The main circuit board 700 and the auxiliary circuit board 800 may be electrically connected to each other through the third connection cable 890.

[0150] The lower cover 900 may be disposed under the middle frame 600 and the main circuit board 700. The lower cover 900 may be coupled and fixed to the middle frame 600. The lower cover 900 may form a lower surface appearance of the display device 10. The lower cover 900 may include plastic and / or metal.

[0151] The lower cover 900 may be provided with a first micro hole MH1 at the location of the first microphone 780 so that the first microphone 780 senses sound waves or ultrasonic waves from the outside. In addition, the lower cover 900 may be provided with a second micro hole MH2 at the location of the second microphone 810 so that the second microphone 810 senses sound waves or ultrasonic waves from the outside.

[0152] The lower cover 900 may be provided with a second camera hole CMH2 into which the camera device 720 is inserted to protrude outward. The position of the camera device 720 and the positions of the first camera hole CMH1 and the second camera hole CMH2 corresponding to the camera device 720 are not limited to Figure 2 The exemplary embodiment shown in .

[0153] according to Figure 1 and Figure 2 In the exemplary embodiment shown in , since the sound generator 510 disposed below the display panel 300 vibrates the display panel 300 to provide sound, the sound generator 510 can be used as a front speaker. In addition, the sound generator 510 vibrates the display panel 300 to generate ultrasonic waves, and senses the ultrasonic waves reflected by the object via the first microphone 780 and the second microphone 810. Therefore, the sound generator 510 can be used as an ultrasonic generator of the ultrasonic proximity sensor, and the first microphone 780 and the second microphone 810 can be used as an ultrasonic detector of the ultrasonic proximity sensor. Therefore, by not including a front speaker, an ultrasonic transmitter of the ultrasonic proximity sensor, and an ultrasonic detector of the ultrasonic proximity sensor on the front side, the display device 10 can have an increased area for displaying an image on the front surface of the display device 10, and have a reduced cost.

[0154] Figure 3 It is shown Figure 2 1 is a bottom view of an example of a cover window 100, a touch circuit board 210, a display circuit board 310, a panel lower member 400, a sound generator 510, and a sound circuit board 530. Figure 4 It is shown Figure 2 3 is a plan view of an example of a display circuit board 310, a second connection cable 314, a sound generator 510, a sound circuit board 530, and a middle frame 600. Figure 5 It is shown Figure 2 FIG. 5 is a plan view of an example of a second connection cable 314 , a sound circuit board 530 , and a main circuit board 700 . Figure 4 and Figure 5 is a top view, and Figure 3 The bottom view may represent a plan view viewed from the side where the lower cover 900 is provided in the Z-axis direction. Therefore, it should be noted that Figure 4 and Figure 5 The left and right sides of the display device 10 are Figure 3 It is the opposite.

[0155] In the following, reference will be made to Figure 3 , Figure 4 and Figure 5 A method of connecting the sound circuit board 530 connected to the sound generator 510 to the sound connector 740 of the main circuit board 700 and a method of connecting the second connection cable 314 connected to the display circuit board 310 to the main connector 730 of the main circuit board 700 are described in detail.

[0156] Reference Figure 3 , Figure 4 and Figure 5, one end of the sound circuit board 530 may be connected to a pad electrode provided on at least one side of the sound generator 510. The other end of the sound circuit board 530 may be provided with a sound connection portion 531. The sound connection portion 531 of the sound circuit board 530 may be connected to a sound connector 740 provided on the upper surface of the main circuit board 700 via the first through hole CAH1 of the middle frame 600.

[0157] The display circuit board 310 may include a first circuit board 311 , a second circuit board 312 , and a first connection cable 313 .

[0158] The first circuit board 311 may be attached to one side of the upper surface or the lower surface of the substrate of the display panel 300, and may be bent toward the lower surface of the substrate of the display panel 300. Figure 4 As shown in FIG. 6 , the first circuit board 311 may be fixed to a fixing hole FH formed in the middle frame 600 by a fixing member.

[0159] The first circuit board 311 may include a display driving unit 320 and a first connector 311 a. The display driving unit 320 and the first connector 311 a may be disposed on one surface of the first circuit board 311 .

[0160] The first connector 311a may be connected to one end of a first connection cable 313 connected to the second circuit board 312. Therefore, the display driving unit 320 mounted on the first circuit board 311 may be electrically connected to the second circuit board 312 via the first connection cable 313.

[0161] The second circuit board 312 may include a touch connector 312a, a first connection connector 312b, and a second connection connector 312c. The first connection connector 312b and the second connection connector 312c may be disposed on one surface of the second circuit board 312, and the touch connector 312a may be disposed on another surface of the second circuit board 312.

[0162] The touch connector 312a may be connected to a touch connection portion provided at one end of the touch circuit board 210. Therefore, the touch driving unit 220 may be electrically connected to the second circuit board 312.

[0163] The first connection connector 312b may be connected to the other end of the first connection cable 313 connected to the first circuit board 311. Therefore, the display driving unit 320 mounted on the first circuit board 311 may be electrically connected to the second circuit board 312 via the first connection cable 313.

[0164] The second connection connector 312c may be connected to one end of the second connection cable 314 connected to the main connector 730 of the main circuit board 700. Therefore, the second circuit board 312 may be electrically connected to the main circuit board 700 via the second connection cable 314.

[0165] A connector connection portion 315 may be formed at the other end of the second connection cable 314. Figure 4 As shown in , the connector connection portion 315 of the second connection cable 314 may pass through the second through hole CAH2 of the middle frame 600 to extend to the lower portion of the middle frame 600. Figure 5 As shown in , the connector connection portion 315 of the second connection cable 314 that has passed through the second through hole CAH2 may pass through the gap between the middle frame 600 and the main circuit board 700 to extend to the lower portion of the main circuit board 700. Finally, as shown in Figure 5 As shown in FIG. 7 , the connector connection portion 315 of the second connection cable 314 may be connected to a main connector 730 disposed on a lower surface of the main circuit board 700 .

[0166] according to Figure 3 , Figure 4 and Figure 5 In the exemplary embodiment shown in FIG, the sound circuit board 530 connected to the sound generator 510 can be connected to the sound connector 740 of the main circuit board 700 via the first through hole CAH1 of the middle frame 600. Therefore, the sound generator 510 can be stably connected to the first sound driver 760 and the second sound driver of the main circuit board 700.

[0167] In addition, according to Figure 3 , Figure 4 and Figure 5 In the exemplary embodiment shown in FIG. 1 , the second connection cable 314 connected to the display circuit board 310 may extend to the lower portion of the middle frame 600 via the second through hole CAH2 of the middle frame 600 to be connected to the main connector 730 of the main circuit board 700. Therefore, the display circuit board 310 may be stably connected to the main circuit board 700.

[0168] Figure 6 It is along Figure 3 , Figure 4 and Figure 5 A cross-sectional view of the display device 10 taken along section line II′.

[0169] Since reference has been Figure 1 and Figure 2 Describes in detail Figure 6 The cover window 100, the touch sensing unit 200, the display panel 300, the panel lower member 400, the first adhesive member 910, the second adhesive member 920, and the third adhesive member 930 are shown in FIG. 1 , and thus, details thereof will not be described again.

[0170] Reference Figure 6, the sound generator 510 is disposed below the panel lower member 400. The sound generator 510 may be attached to the lower surface of the panel lower member 400 via the fourth adhesive member 940. The fourth adhesive member 940 may be a pressure sensitive adhesive (PSA) member.

[0171] The pad electrode 510a of the sound generator 510 may be disposed to protrude from at least one side of the sound generator 510. The pad electrode 510a of the sound generator 510 may be connected to one end of the sound circuit board 530. Figure 6 It is shown that the upper surface of one end of the sound circuit board 530 is connected to the lower surface of the pad electrode 510a, but the exemplary embodiment is not limited thereto. For example, the lower surface of the sound circuit board 530 may be connected to the upper surface of the pad electrode 510a. The other end of the sound circuit board 530 may be connected to the sound connector 740 provided on the upper surface of the main circuit board 700 via the first through hole CAH1 penetrating the middle frame 600.

[0172] The sound generator 510 may be disposed in a receiving hole AH penetrating the middle frame 600. When the height of the sound generator 510 is not high, the middle frame 600 may be provided with a receiving groove instead of the receiving hole AH.

[0173] Figure 7 It shows Figure 6 A stereogram of an example of a sound generator. Figure 8 It shows Figure 6 A plan view of an example of a sound generator. Fig. 9 It is along Figure 8 A cross-sectional view taken along the section line II-II'. Figure 6 Different from the Figures 7 to 9 The pad electrodes to which the sound generator 510 shown in FIG. 5 is connected are connected to the lower surface of the sound circuit board 530 .

[0174] In the following, reference will be made to Figure 7 , Figure 8 and Fig. 9 The sound generator 510 is described in detail.

[0175] Reference Figure 7 , Figure 8 and Fig. 9 The sound generator 510 may include a sound output unit SU and an ultrasonic output unit UU, wherein the sound output unit SU is used to vibrate the display panel 300 to generate sound or audible sound, and the ultrasonic output unit UU is used to vibrate the display panel 300 to generate ultrasonic waves.

[0176] Figure 7 , Figure 8 and Fig. 9It is shown that the sound output unit SU is disposed at the upper portion of the sound generator 510 and the ultrasonic output unit UU is disposed at the lower portion of the sound generator 510, but the exemplary embodiment is not limited thereto. For example, the sound output unit SU may be disposed at the lower portion of the sound generator 510 and the ultrasonic output unit UU may be disposed at the center of the sound generator 510. In addition, the sound output unit SU may be disposed at the upper portion of the sound generator 510 and the lower portion of the sound generator 510, respectively, and the ultrasonic output unit UU may be disposed between the sound output units SU. That is, the ultrasonic output unit UU may be disposed at the center of the sound generator 510. Figure 7 , Figure 8 and Fig. 9 , the sound output unit SU and the ultrasonic wave output unit UU may be arranged in a line in the vertical direction (Z-axis direction). The vertical direction (Z-axis direction) may be the height direction of the sound generator 510 (or the vibration layer 520).

[0177] The sound output unit SU may include a first electrode 511, a second electrode 512, and a first sub-vibration layer 521 of the vibration layer 520. The ultrasonic output unit UU may include a third electrode 513, a fourth electrode 514, and a second sub-vibration layer 522 of the vibration layer 520.

[0178] The first electrode 511 may include a first dry electrode 5111 and first branch electrodes 5112 . Figure 7 The first dry electrode 5111 is shown to be disposed on one side surface of the vibration layer 520, but exemplary embodiments are not limited thereto. For example, the first dry electrode 5111 may be disposed on a plurality of side surfaces of the vibration layer 520. The first dry electrode 5111 may be disposed on an upper surface of the vibration layer 520. The first branch electrodes 5112 may branch from the first dry electrode 5111. The first branch electrodes 5112 may be arranged in parallel with each other.

[0179] The second electrode 512 may include a second dry electrode 5121 and a second branch electrode 5122 . Figure 7 The second dry electrode 5121 is shown to be disposed on the other side surface of the vibration layer 520, but exemplary embodiments are not limited thereto. For example, the second dry electrode 5121 may be disposed on a plurality of side surfaces of the vibration layer 520 where the first dry electrode 5111 is not disposed. The second dry electrode 5121 may be disposed on the upper surface of the vibration layer 520. The second branch electrodes 5122 may branch from the second dry electrode 5121. The second branch electrodes 5122 may be arranged in parallel with each other.

[0180] The first branch electrode 5112 and the second branch electrode 5122 may be arranged parallel to each other in the horizontal direction (X-axis direction or Y-axis direction). In addition, the first branch electrode 5112 and the second branch electrode 5122 may be arranged alternately in the vertical direction (Z-axis direction). That is, the first branch electrode 5112 and the second branch electrode 5122 may be repeatedly arranged in the vertical direction (Z-axis direction) in the order of the first branch electrode 5112, the second branch electrode 5122, the first branch electrode 5112 and the second branch electrode 5122. The horizontal direction (X-axis direction or Y-axis direction) may be the first width direction or the second width direction of the vibration layer 520, and the vertical direction (Z-axis direction) may be the height direction of the vibration layer 520.

[0181] The third electrode 513 may include a third dry electrode 5131 and third branch electrodes 5132 . Figure 7 The third dry electrode 5131 is shown to be disposed on one side surface of the vibration layer 520, but exemplary embodiments are not limited thereto. For example, the third dry electrode 5131 may be disposed on a plurality of side surfaces of the vibration layer 520. The third dry electrode 5131 may be disposed on a side surface of the vibration layer 520 on which the first dry electrode 5111 is disposed. The third branch electrodes 5132 may branch from the third dry electrode 5131. The third branch electrodes 5132 may be arranged in parallel with each other.

[0182] The fourth electrode 514 may include a fourth dry electrode 5141 and fourth branch electrodes 5142 . Figure 7 The fourth dry electrode 5141 is shown to be disposed on the other side surface of the vibration layer 520, but exemplary embodiments are not limited thereto. For example, the fourth dry electrode 5141 may be disposed on a plurality of side surfaces of the vibration layer 520 where the third dry electrode 5131 is not disposed. The fourth dry electrode 5141 may be disposed on a side surface of the vibration layer 520 where the second dry electrode 5121 is disposed. The fourth branch electrode 5142 may branch from the fourth dry electrode 5141. The fourth branch electrodes 5142 may be arranged in parallel with each other.

[0183] The third branch electrode 5132 and the fourth branch electrode 5142 may be arranged parallel to each other in the horizontal direction (X-axis direction or Y-axis direction). In addition, the third branch electrode 5132 and the fourth branch electrode 5142 may be arranged alternately in the vertical direction (Z-axis direction). That is, the third branch electrode 5132 and the fourth branch electrode 5142 may be repeatedly arranged in the vertical direction (Z-axis direction) in the order of the third branch electrode 5132, the fourth branch electrode 5142, the third branch electrode 5132 and the fourth branch electrode 5142.

[0184] Since the manufacturing temperature of the vibration layer 520 is high, the first electrode 511, the second electrode 512, the third electrode 513, and the fourth electrode 514 are made of silver (Ag) or an alloy of silver (Ag) and palladium (Pd) having a high melting point. When the first electrode 511 and the second electrode 512 are made of the alloy of silver (Ag) and palladium (Pd), the content of silver (Ag) may be higher than the content of palladium (Pd).

[0185] The first pad electrode 511a may be connected to the first electrode 511. The first pad electrode 511a may protrude outward from the first dry electrode 5111 disposed on one side surface of the vibration layer 520.

[0186] The second pad electrode 512a may be connected to the second electrode 512. The second pad electrode 512a may protrude outward from the second dry electrode 5121 disposed on the other side surface of the vibration layer 520.

[0187] The third pad electrode 513a may be connected to the third electrode 513. The third pad electrode 513a may protrude outward from the third dry electrode 5131 disposed on one side surface of the vibration layer 520.

[0188] The fourth pad electrode 514a may be connected to the fourth electrode 514. The fourth pad electrode 514a may protrude outward from the fourth dry electrode 5141 disposed on the other side surface of the vibration layer 520.

[0189] The first pad electrode 511a, the second pad electrode 512a, the third pad electrode 513a, and the fourth pad electrode 514a may be connected to a lead line or pad electrode of the sound circuit board 530. The lead line or pad electrode of the sound circuit board 530 may be disposed on a lower surface of the sound circuit board 530.

[0190] like Figure 7 As shown in , when the first pad electrode 511a and the third pad electrode 513a protrude from one side of the vibration layer 520 and the second pad electrode 512a and the fourth pad electrode 514a protrude from the other side of the vibration layer 520, the sound circuit board 530 may be disposed on one side and the other side of the sound generator 510, but exemplary embodiments are not limited thereto. The first pad electrode 511a, the second pad electrode 512a, the third pad electrode 513a, and the fourth pad electrode 514a may protrude from one side of the vibration layer 520. In this case, the sound circuit board 530 may be disposed on one side surface of the sound generator 510.

[0191] The vibration layer 520 may be a piezoelectric actuator that is deformed according to a first driving voltage applied to the first electrode 511, a second driving voltage applied to the second electrode 512, a third driving voltage applied to the third electrode 513, and a fourth driving voltage applied to the fourth electrode 514. In this case, the vibration layer 520 may be made of any one of a piezoelectric material such as polyvinylidene fluoride (PVDF) or lead zirconate titanate (PZT), and an electroactive polymer.

[0192] The vibration layer 520 may include a first sub-vibration layer 521 and a second sub-vibration layer 522. The first sub-vibration layer 521 represents a region of the vibration layer 520 corresponding to the sound output unit SU, and the second sub-vibration layer 522 represents a region of the vibration layer 520 corresponding to the ultrasonic output unit UU.

[0193] In the first sub-vibration layer 521, the vibration layer 520 may be disposed between the first branch electrode 5112 and the second branch electrode 5122. In the first sub-vibration layer 521, the vibration layer 520 contracts or expands according to the difference between the first driving voltage applied to the first branch electrode 5112 and the second driving voltage applied to the second branch electrode 5122. In the second sub-vibration layer 522, the vibration layer 520 may be disposed between the third branch electrode 5132 and the fourth branch electrode 5142. In the second sub-vibration layer 522, the vibration layer 520 contracts or expands according to the difference between the third driving voltage applied to the third branch electrode 5132 and the fourth driving voltage applied to the fourth branch electrode 5142.

[0194] Since the sound volume of the sound output unit SU is proportional to the area of ​​the sound output unit SU, the area of ​​the first sub-vibration layer 521 may be larger than the area of ​​the second sub-vibration layer 522 in consideration of the sound volume of the sound output unit SU. For example, the area of ​​the first sub-vibration layer 521 in the thickness direction of the first sub-vibration layer 521 may be larger than the area of ​​the second sub-vibration layer 522 in the thickness direction of the second sub-vibration layer 522. For another example, the area of ​​the first sub-vibration layer 521 in the width direction of the first sub-vibration layer 521 may be larger than the area of ​​the second sub-vibration layer 522 in the width direction of the second sub-vibration layer 522. The number of the first branch electrodes 5112 or the number of the second branch electrodes 5122 may be larger than the number of the third branch electrodes 5132 or the number of the fourth branch electrodes 5142.

[0195] In the following, reference will be made to Fig. 9 , Fig. 10A , Fig. 10B and Fig. 10CA method of vibrating the first sub-vibration layer 521 of the vibration layer 520 according to the principles of the present invention is described in detail. Since the method of vibrating the second sub-vibration layer 522 of the vibration layer 520 is substantially the same as the method of vibrating the first sub-vibration layer 521 of the vibration layer 520, its details will not be described again.

[0196] Specifically, Fig. 9 As shown in , the polarity direction of the vibration layer 520 disposed between the first branch electrode 5112 and the second branch electrode 5122 disposed below the first branch electrode 5112 may be an upward direction (indicated by an arrow ↑). In this case, the vibration layer 520 has a positive polarity in an upper region adjacent to the first branch electrode 5112, and has a negative polarity in a lower region adjacent to the second branch electrode 5122. In addition, the polarity direction of the vibration layer 520 disposed between the second branch electrode 5122 and the first branch electrode 5112 disposed below the second branch electrode 5122 may be a downward direction (indicated by an arrow ↓). In this case, the vibration layer 520 has a negative polarity in an upper region adjacent to the second branch electrode 5122, and has a positive polarity in a lower region adjacent to the first branch electrode 5112. The polarity direction of the vibration layer 520 may be determined by applying an electric field to the vibration layer 520 using the first branch electrode 5112 and the second branch electrode 5122.

[0197] like Fig. 10A As shown in , in the case where the polarity direction of the vibration layer 520 disposed between the first branch electrode 5112 and the second branch electrode 5122 disposed below the first branch electrode 5112 is an upward direction (↑), when a first driving voltage having a positive polarity is applied to the first branch electrode 5112 and a second driving voltage having a negative polarity is applied to the second branch electrode 5122, the vibration layer 520 may be contracted by a first force F1. The first force F1 may be a contraction force. In addition, when a first driving voltage having a negative polarity is applied to the first branch electrode 5112 and a second driving voltage having a positive polarity is applied to the second branch electrode 5122, the vibration layer 520 may be expanded by a second force F2. The second force F2 may be an expansion force.

[0198] In the case where the polarity direction of the vibration layer 520 disposed between the second branch electrode 5122 and the first branch electrode 5112 disposed below the second branch electrode 5122 is a downward direction (↓), when a first driving voltage having a positive polarity is applied to the second branch electrode 5122 and a second driving voltage having a negative polarity is applied to the first branch electrode 5112, the vibration layer 520 may be expanded by an expansion force. The first force F1 may be a contraction force. When a first driving voltage having a negative polarity is applied to the second branch electrode 5122 and a second driving voltage having a positive polarity is applied to the first branch electrode 5112, the vibration layer 520 may be contracted by a contraction force. The second force F2 may be an expansion force.

[0199] according to Fig. 9 In the exemplary embodiment shown in FIG. 5 , when the first driving voltage applied to the first electrode 511 and the second driving voltage applied to the second electrode 512 are alternately repeated with positive polarity and negative polarity, the vibration layer 520 repeats contraction and expansion. Therefore, the sound generator 510 vibrates.

[0200] In addition, since the sound generator 510 is disposed below the display panel 300, when the vibration layer 520 of the sound generator 510 contracts and expands, the display panel 300 is Fig. 10B and 10C As shown in , the display panel 300 can vibrate downward and upward by stress. As such, since the display panel 300 can vibrate by the sound generator 510, the display device 10 can generate sound or ultrasonic waves.

[0201] Meanwhile, the sound volume of the sound output unit SU is proportional to the area of ​​the sound output unit SU. Therefore, in consideration of the sound volume of the sound output unit SU, the area of ​​the sound output unit SU may be larger than the area of ​​the ultrasonic wave output unit UU.

[0202] In addition, the first electrode 511 and the second electrode 512 of the sound output unit SU are connected to the first sound driver 760 via the sound circuit board 530, and receive the first driving voltage and the second driving voltage from the first sound driver 760. The third electrode 513 and the fourth electrode 514 of the ultrasonic output unit UU are connected to the second sound driver via the sound circuit board 530, and receive the third driving voltage and the fourth driving voltage from the second sound driver.

[0203] The impedance of the sound output unit SU may be represented by Equation 1. The impedance of the third electrode 513 or the fourth electrode 514 of the ultrasonic wave output unit UU may also be represented by Equation 1.

[0204] [Equation 1]

[0205]

[0206] In equation 1, X C is impedance, F is frequency, and C is capacitance. According to Equation 1, the impedance X of the sound output unit SU C The impedance X of the ultrasonic output unit UU is inversely proportional to the frequency F of the first driving voltage applied to the first electrode 511 or the second driving voltage applied to the second electrode 512 and the capacitance C of the first electrode 511 or the second electrode 512. C It is inversely proportional to the frequency F of the third driving voltage applied to the third electrode 513 or the fourth driving voltage applied to the fourth electrode 514 and the capacitance C of the third electrode 513 or the fourth electrode 514 .

[0207] Since the area of ​​the sound output unit SU is larger than that of the ultrasonic output unit UU, the area of ​​the first electrode 511 or the second electrode 512 of the sound output unit SU is larger than that of the third electrode 513 or the fourth electrode 514 of the ultrasonic output unit UU. Since capacitance is proportional to area, the capacitance C of the first electrode 511 or the second electrode 512 of the sound output unit SU may be larger than that of the third electrode 513 or the fourth electrode 514 of the ultrasonic output unit UU. Therefore, the impedance X of the sound output unit SU is C The impedance X of the ultrasonic output unit UU can be compared C Small.

[0208] The impedance X of the sound output unit SU C It should be set to be larger than the output impedance of the first sound driver 760. C Since the output impedance of the first sound driver 760 is smaller than that of the first sound driver 760, impedance matching is required because an overcurrent flows from the first sound driver 760 to the sound output unit SU. For this purpose, the main circuit board 700 may include a first resistor connected to the output terminal of the first sound driver 760. The resistance of the first resistor may be adjusted according to the impedance X of the sound output unit SU. C And the output impedance of the first sound driver 760 is designed.

[0209] In addition, the impedance X of the ultrasonic output unit UU C It should be set to be larger than the output impedance of the second sound driver. C When the output impedance of the second sound driver is smaller than that of the second sound driver, impedance matching is required because an overcurrent flows from the second sound driver to the ultrasonic output unit UU. For this purpose, the main circuit board 700 may include a second resistor connected to the output terminal of the second sound driver. The resistance of the second resistor may be adjusted according to the impedance X of the ultrasonic output unit UU. C and the output impedance of the second sound driver.

[0210] Fig.11 It is shown Figure 6 A perspective view of another example of a sound generator. Fig.12 It is shown Fig.11 A plan view of the sound generator. Fig.13 is along Fig.12 A cross-sectional view taken along the section line III-III'. Figure 6 Different from the Figures 11 to 13 The pad electrodes to which the sound generator 510 shown in FIG. 5 is connected are connected to the lower surface of the sound circuit board 530 .

[0211] Fig.11 , Fig.12 and Fig.13 The exemplary embodiments shown in Figure 7 , Figure 8 and Fig. 9 The exemplary embodiment shown in is different in that the third dry electrode 5131 of the third electrode 513 of the ultrasonic output unit UU and the fourth dry electrode 5141 of the fourth electrode 514 are not disposed on the side surface of the vibration layer 520, the third dry electrode 5131 is disposed in the first contact hole CT1 formed by removing the vibration layer 520, and the fourth dry electrode 5141 is disposed in the second contact hole CT2 formed by removing the vibration layer 520. Therefore, in Fig.11 , Fig.12 and Fig.13 In the Figure 7 , Figure 8 and Fig. 9 The description of the exemplary embodiments shown in FIG.

[0212] Reference Fig.11 , Fig.12 and Fig.13 , the vibration layer 520 may be provided with a first contact hole CT1 formed by removing a portion of the second sub-vibration layer 522 of the vibration layer 520 and a second contact hole CT2 formed by removing another portion of the second sub-vibration layer 522 of the vibration layer 520. The third dry electrode 5131 may be provided in the first contact hole CT1, and the fourth dry electrode 5141 may be provided in the second contact hole CT2.

[0213] The first contact hole CT1 and the second contact hole CT2 may be formed long in the vertical direction (Z-axis direction). Therefore, the third dry electrode 5131 may be disposed in the vertical direction (Z-axis direction), and the third branch electrode 5132 branched from the third dry electrode 5131 may be arranged in the horizontal direction (X-axis direction or Y-axis direction). In addition, the fourth dry electrode 5141 may be disposed in the vertical direction (Z-axis direction), and the fourth branch electrode 5142 branched from the fourth dry electrode 5141 may be arranged in the horizontal direction (X-axis direction or Y-axis direction). The horizontal direction (X-axis direction or Y-axis direction) may be the first width direction or the second width direction of the vibration layer 520, and the vertical direction (Z-axis direction) may be the height direction of the vibration layer 520.

[0214] Since the vibration layer 520 cannot vibrate when the third electrode 513 is connected to the fourth electrode 514 , the third dry electrode 5131 may be disposed to avoid the fourth branch electrode 5142 , and the fourth dry electrode 5141 may be disposed to avoid the third branch electrode 5132 .

[0215] The first and third pad electrodes 511a and 513a may protrude outward from one side surface of the vibration layer 520 where the first dry electrode 5111 is disposed. The second and fourth pad electrodes 512a and 514a may protrude outward from the other side surface of the vibration layer 520 where the second dry electrode 5121 is disposed.

[0216] like Fig.11 As shown in , when the first pad electrode 511a and the third pad electrode 513a protrude outward from one side surface of the vibration layer 520 and the second pad electrode 512a and the fourth pad electrode 514a protrude outward from the other side surface of the vibration layer 520, the sound circuit board 530 may be disposed on one side surface and the other side surface of the sound generator 510, but exemplary embodiments are not limited thereto. For example, when the first pad electrode 511a protrudes from the first side surface of the vibration layer 520, the second pad electrode 512a protrudes from the second side surface of the vibration layer 520, and the third pad electrode 513a and the fourth pad electrode 514a protrude from the third side surface of the vibration layer 520, the sound circuit board 530 may be disposed on the first side surface, the second side surface, and the third side surface of the sound generator 510. Alternatively, the first to fourth pad electrodes 511 a , 512 a , 513 a , and 514 a may protrude from different side surfaces of the vibration layer 520 , and in this case, the sound circuit board 530 may be disposed on four side surfaces of the sound generator 510 .

[0217] Fig.14 It is shown Figure 6 A perspective view of another example of a sound generator. Fig.15 It is shown Fig.14 A plan view of the sound generator. Fig.16 It is along Fig.15 A sectional view taken along section line IV-IV'.

[0218] Fig.14 , Fig.15 and Fig.16 The exemplary embodiments shown in Figure 7 , Figure 8 and Fig. 9 The exemplary embodiment shown in is different in that the first dry electrode 5111 of the first electrode 511 of the sound output unit SU of the sound generator 510 and the second dry electrode 5121 of the second electrode 512 are arranged on the respective side surfaces facing each other of the vibration layer 520, and the third dry electrode 5131 of the third electrode 513 of the ultrasonic output unit UU and the fourth dry electrode 5141 of the fourth electrode 514 are arranged on one side surface of the vibration layer 520. Therefore, in Fig.14 , Fig.15 and Fig.16 In the Figure 7 , Figure 8 and Fig. 9 The description of the exemplary embodiments shown in FIG.

[0219] Fig.14 , Fig.15 and Fig.16 It is shown that the ultrasonic output unit UU is disposed on the first side of the sound generator 510 and the sound output unit SU is disposed on the second side of the sound generator 510, but the exemplary embodiment is not limited thereto. For example, the sound output units SU may be disposed on the first side and the second side of the sound generator 510, respectively, and the ultrasonic output unit UU may be disposed between the sound output units SU. Fig.14 , Fig.15 and Fig.16 , the sound output unit SU and the ultrasonic output unit UU may be arranged in a line in the horizontal direction (X-axis direction or Y-axis direction). The horizontal direction (X-axis direction or Y-axis direction) may be the first width direction or the second width direction of the sound generator 510 (or the vibration layer 520).

[0220] Reference Fig.14 , Fig.15 and Fig.16, the first dry electrode 5111 of the first electrode 511 may be disposed on the first side surface of the vibration layer 520, and the second dry electrode 5121 of the second electrode 512 may be disposed on the second side surface facing the first side surface. The first dry electrode 5111 and the second dry electrode 5121 may also be disposed on the upper surface of the vibration layer 520. The first dry electrode 5111 and the second dry electrode 5121 may be disposed on the first sub-vibration layer 521 of the vibration layer 520.

[0221] The third dry electrode 5131 of the third electrode 513 and the fourth dry electrode 5141 of the fourth electrode 514 may be disposed on the third side surface of the vibration layer 520. The third dry electrode 5131 and the fourth dry electrode 5141 may also be disposed on the upper surface of the vibration layer 520. The third dry electrode 5131 and the fourth dry electrode 5141 may be disposed on the second sub-vibration layer 522 of the vibration layer 520.

[0222] Fig.14 , Fig.15 and Fig.16 It is shown that the area of ​​the third dry electrode 5131 disposed on the third side surface of the vibration layer 520 is larger than the area of ​​the fourth dry electrode 5141, but exemplary embodiments are not limited thereto. The area of ​​the third dry electrode 5131 disposed on the third side surface of the vibration layer 520 may be substantially the same as the area of ​​the fourth dry electrode 5141. Alternatively, the area of ​​the third dry electrode 5131 disposed on the third side surface of the vibration layer 520 may be smaller than the area of ​​the fourth dry electrode 5141.

[0223] The first pad electrode 511a may protrude outward from a first side surface of the vibration layer 520 on which the first dry electrode 5111 is disposed. The second pad electrode 512a may protrude outward from a second side surface of the vibration layer 520 on which the second dry electrode 5121 is disposed. The third pad electrode 513a and the fourth pad electrode 514a may protrude outward from a third side surface of the vibration layer 520 on which the third dry electrode 5131 and the fourth dry electrode 5141 are disposed. Fig.11 Similarly, when the first pad electrode 511a protrudes outward from the first side surface of the vibration layer 520, the second pad electrode 512a protrudes outward from the second side surface of the vibration layer 520, and the third pad electrode 513a and the fourth pad electrode 514a protrude outward from the third side surface of the vibration layer 520, the sound circuit board 530 can be set on the first side surface, the second side surface and the third side surface of the sound generator 510.

[0224] Fig.17 It is shown Figure 6 A perspective view of another example of a sound generator. Fig.18 It is shown Fig.17 A plan view of the sound generator. Fig.19 It is along Fig.18A cross-sectional view taken along section line V-V'.

[0225] Fig.17 , Fig.18 and Fig.19 The exemplary embodiments shown in Fig.14 , Fig.15 and Fig.16 The exemplary embodiment shown in is different in that the first dry electrode 5111 of the first electrode 511 of the sound output unit SU and the fourth dry electrode 5141 of the fourth electrode 514 of the ultrasonic output unit UU are not disposed on the side surface of the vibration layer 520, the first dry electrode 5111 is disposed in the first contact hole CT1 formed by removing the vibration layer 520, and the fourth dry electrode 5141 is disposed in the second contact hole CT2 formed by removing the vibration layer 520. Therefore, in Fig.17 , Fig.18 and Fig.19 In the Fig.14 , Fig.15 and Fig.16 The description of the exemplary embodiments shown in FIG.

[0226] Reference Fig.17 , Fig.18 and Fig.19 , the vibration layer 520 may be provided with a first contact hole CT1 formed by removing a portion of the first sub-vibration layer 521 of the vibration layer 520 and a second contact hole CT2 formed by removing a portion of the second sub-vibration layer 522 of the vibration layer 520. The first dry electrode 5111 may be provided in the first contact hole CT1, and the fourth dry electrode 5141 may be provided in the second contact hole CT2.

[0227] The first contact hole CT1 and the second contact hole CT2 may be formed long in the vertical direction (Z-axis direction). Therefore, the first dry electrode 5111 may be arranged in the vertical direction (Z-axis direction), and the first branch electrode 5112 branched from the first dry electrode 5111 may be arranged in the horizontal direction (X-axis direction or Y-axis direction). In addition, the fourth dry electrode 5141 may be arranged in the vertical direction (Z-axis direction), and the fourth branch electrode 5142 branched from the fourth dry electrode 5141 may be arranged in the horizontal direction (X-axis direction or Y-axis direction). The horizontal direction (X-axis direction or Y-axis direction) may be the first width direction or the second width direction of the vibration layer 520, and the vertical direction (Z-axis direction) may be the height direction of the vibration layer 520.

[0228] Since the vibration layer 520 cannot vibrate when the first electrode 511 is connected to the second electrode 512, the first dry electrode 5111 can be arranged to avoid the second branch electrode 5122. In addition, since the vibration layer 520 cannot vibrate when the third electrode 513 is connected to the fourth electrode 514, the fourth dry electrode 5141 can be arranged to avoid the third branch electrode 5132.

[0229] The first pad electrode 511a may protrude outward from a first side surface of the vibration layer 520 corresponding to the first contact hole CT1. The second pad electrode 512a may protrude outward from a second side surface of the vibration layer 520 where the second dry electrode 5121 is disposed. The third pad electrode 513a and the fourth pad electrode 514a may protrude outward from a third side surface of the vibration layer 520 where the third dry electrode 5131 is disposed.

[0230] Fig.17 , Fig.18 and Fig.19 It is shown that the first dry electrode 5111 is disposed in the first contact hole CT1 and the fourth dry electrode 5141 is disposed in the second contact hole CT2, but exemplary embodiments are not limited thereto. In other words, any one of the first dry electrode 5111 and the second dry electrode 5121 disposed in the sound output unit SU may be disposed in the first contact hole CT1, and any one of the third dry electrode 5131 and the fourth dry electrode 5141 disposed in the ultrasonic output unit UU may be disposed in the second contact hole CT2.

[0231] Fig. 20 is a flowchart illustrating a method of driving a display device constructed according to an exemplary embodiment.

[0232] Reference Fig. 20 First, the main processor 710 determines whether to drive the display device 10 in the sound output mode ( Fig. 20 The sound output mode is a mode in which the display device 10 generates sound by running an application such as music or video. In addition, the sound output mode may include a call mode. The call mode is a mode in which a user performs voice communication or video communication through the display device 10 using the mobile communication module of the main circuit board 700.

[0233] Second, the main processor 710 controls in the sound output mode to generate sound by vibrating the display panel 300 using the sound output unit SU of the sound generator 510 ( Fig. 20 S102).

[0234] Specifically, the main processor 710 transmits the sound data to the first sound driver 760 in the sound output mode. The first sound driver 760 generates the first driving voltage and the second driving voltage according to the sound data. The first sound driver 760 generates the first driving voltage and the second driving voltage to the first electrode 511 and the second electrode 512 of the sound output unit SU of the sound generator 510 via the sound connector 740 and the sound circuit board 530.

[0235] The sound generator 510 vibrates according to the first driving voltage and the second driving voltage, and the display panel 300 may vibrate up and down according to the vibration of the sound generator 510. Fig.21 As shown in , the display device 10 may generate a sound having a frequency F0 greater than or equal to 1 kHz. F0 represents a minimum frequency at which the vibration displacement of the display panel 300 vibrated by the sound generator 510 becomes greater than a reference displacement.

[0236] In the third step, when the sound output mode is the call mode, the main processor 710 drives the display device 10 in the proximity sensing mode ( Fig. 20 The proximity sensing mode is a mode for sensing whether an object approaches the display device 10 at a short distance.

[0237] Fourthly, the main processor 710 controls the display panel 300 to generate ultrasonic waves ( Fig. 20 S104).

[0238] The main processor 710 generates ultrasonic data to the second sound driver in the proximity sensing mode. The second sound driver generates a third driving voltage and a fourth driving voltage according to the ultrasonic data. The second sound driver transmits the third driving voltage and the fourth driving voltage to the third electrode 513 and the fourth electrode 514 of the ultrasonic output unit UU of the sound generator 510 via the sound connector 740 and the sound circuit board 530.

[0239] The ultrasonic output unit UU of the sound generator 510 vibrates according to the third driving voltage and the fourth driving voltage, and the display panel 300 may vibrate up and down according to the vibration of the ultrasonic output unit UU of the sound generator 510. Fig. 22 As shown in , the display device 10 can generate ultrasonic waves at a frequency of 20 kHz or more with a sound pressure level (expressed as “SPL”) of 50 dB or more.

[0240] like Fig. 20As shown in , since the sound output mode and the proximity sensing mode are controlled separately, the display device 10 can operate in the sound output mode and simultaneously operate in the proximity sensing mode. That is, the display device 10 can generate sound by allowing the sound output unit SU of the sound generator 510 to vibrate the display panel 300, and simultaneously generate ultrasonic waves by allowing the ultrasonic wave output unit UU of the sound generator 510 to vibrate the display panel 300.

[0241] In step 5, the first microphone 780 and the second microphone 810 sense the ultrasonic wave reflected by the object ( Fig. 20 S105).

[0242] The first microphone 780 and the second microphone 810 can sense sound waves and ultrasonic waves. For example, the first microphone 780 and the second microphone 810 can sense ultrasonic waves of 20kHz to 50kHz. The first microphone 780 converts the sensed ultrasonic waves into a first electrical signal and transmits the first electrical signal to the main processor 710, and the second microphone 810 converts the sensed ultrasonic waves into a second electrical signal and transmits the second electrical signal to the main processor 710.

[0243] In order to improve the accuracy of sensing ultrasonic waves reflected by an object, the first microphone 780 may be disposed on one side of the main circuit board 700, and the second microphone 810 may be disposed on the other side of the main circuit board 700. Therefore, the first microphone 780 may be disposed at one side of the display device 10, and the second microphone 810 may be disposed at the other side of the display device 10.

[0244] In step 6, the main processor 710 determines whether the object is positioned close to the display device 10 based on the first electrical signal input from the first microphone 780 and the second electrical signal input from the second microphone 810. When the object is close to the display device 10, the main processor 710 controls the display panel 300 not to display an image. That is, in response to detecting that the object is positioned close to the display device 10, the main processor 710 turns off the touch sensing unit 200 and the display panel 300 ( Fig. 20 Therefore, when the user's ear or other parts of the body touch the display device 10 in the call mode, the display panel 300 may maintain the closed state even if the touch sensing unit 200 detects the user's touch.

[0245] In the following, reference will be made to Fig.23 , Fig.24 , Fig.25 and Fig.26 A method in which the main processor 710 senses the proximity of an object in the proximity sensing mode is described in detail.

[0246] Fig.23is a flow chart illustrating a method of sensing proximity in a proximity sensing mode. Fig.24 is a waveform diagram showing a trigger signal TS of a main processor, an ultrasonic wave US generated by a sound generator, and a first echo signal ES1 of a first microphone according to an exemplary embodiment. Fig.25 and Fig.26 2 is an exemplary view illustrating a sound generator, a first microphone, a second microphone, and an object for explaining a method of sensing proximity in a proximity sensing mode according to an exemplary embodiment.

[0247] Reference Fig.23 , Fig.24 and Fig.25 First, the ultrasonic wave output unit UU of the sound generator 510 may vibrate the display panel 300 in the proximity sensing mode to generate ultrasonic waves ( Fig.23 S201).

[0248] Specifically, the main processor 710 generates ultrasonic data to the second sound driver in the proximity sensing mode. The second sound driver generates a third driving voltage and a fourth driving voltage according to the ultrasonic data. The second sound driver transmits the third driving voltage and the fourth driving voltage to the third electrode 513 and the fourth electrode 514 of the ultrasonic output unit UU of the sound generator 510 via the sound connector 740 and the sound circuit board 530.

[0249] The ultrasonic output unit UU of the sound generator 510 vibrates according to the third driving voltage and the fourth driving voltage, and the display panel 300 may vibrate up and down according to the vibration of the ultrasonic output unit UU of the sound generator 510. Fig. 22 As shown in , the display device 10 can generate ultrasonic waves at a frequency of 20 kHz or more with a sound pressure level of 50 dB or more. Fig.24 As shown in , the ultrasonic wave output unit UU of the sound generator 510 may vibrate the display panel 300 to generate ultrasonic waves US consisting of n pulses (n is an integer of 2 or more).

[0250] In the second step, it is determined whether the first microphone 780 senses the ultrasonic wave generated by the ultrasonic wave output unit UU of the sound generator 510 within the first threshold time TT1. Fig.23 S202).

[0251] Specifically, the main processor 710 transmits ultrasonic data to the second sound driver in the proximity sensing mode, and transmits a trigger signal TS to the first microphone 780 and the second microphone 810. After the first threshold time, the second microphone 810 converts the second echo signal into a first logic level voltage in response to the trigger signal TS. After the first threshold time, the first microphone 780 converts the first echo signal ES1 into a first logic level voltage in response to the trigger signal TS. The first threshold time can be defined as a time period taken for the ultrasonic output unit UU of the sound generator 510 to generate ultrasonic waves.

[0252] When the ultrasonic wave reflected by the object is sensed, the first microphone 780 converts the first echo signal ES1 into a second logic level voltage. When the ultrasonic wave reflected by the object is not sensed, the first microphone 780 converts the first echo signal ES1 into a second logic level voltage after the second threshold time. The first microphone 780 transmits the first echo signal ES1 as a first electrical signal to the main processor 710. The main processor 710 sets the period in which the first echo signal ES1 has the first logic level voltage as the first ultrasonic wave sensing time TD1, and determines whether the first ultrasonic wave sensing time TD1 is within the first threshold time TT1.

[0253] Meanwhile, the first threshold time TT1 may be as follows Fig.25 When the distance between the sound generator 510 and the first microphone 780 is 3 cm and the distance between the sound generator 510 and the object OBJ is 10 cm, the distance SR1 between the first microphone 780 and the object OBJ may be calculated by Equation 2.

[0254] [Equation 2]

[0255]

[0256] The distance SR1 between the first microphone 780 and the object OBJ may be about 10.44 cm. In this case, since the speed of the ultrasonic wave is 340 m / s and the distance sensed by the first microphone 780 when the ultrasonic wave generated by the sound generator 510 is reflected by the object OBJ is 0.2044 m, the first threshold time TT1 may be calculated by Equation 3.

[0257] [Equation 3]

[0258]

[0259] That is, the first threshold time TT1 may be 0.601 ms. Fig.25As shown in , according to the first threshold time TT1, the sensing area RA1 of the first microphone 780 to the object OBJ can be defined as an area where the sum of the distance between the sound generator 510 and the object OBJ (10 cm) and the distance between the first microphone 780 and the object OBJ (SR1≒10.4 cm) is 20.44 cm.

[0260] Meanwhile, the first microphone 780 may be disposed at one side of the display device 10, and the second microphone 810 may be disposed at the other side of the display device 10 facing the one side. Fig.25 As shown in , the distance between the sound generator 510 and the first microphone 780 is different from the distance between the sound generator 510 and the second microphone 810.

[0261] Therefore, if Fig.26 As shown in S203 and S204 , it is determined whether the object OBJ is close to the display device 10 according to the minimum distance SR2 and the maximum distance SR3 between the sensed object OBJ and the second microphone 810 .

[0262] In the third step, when the first ultrasonic wave sensing time TD1 is within the first threshold time TT1, it is determined whether the second microphone 810 senses the ultrasonic wave generated by the ultrasonic wave output unit UU of the sound generator 510 within the second threshold time ( Fig.23 S203).

[0263] Specifically, when the ultrasonic wave reflected by the object is sensed, the second microphone 810 converts the second echo signal into a second logic level voltage. When the ultrasonic wave reflected by the object is not sensed, the second microphone 810 converts the second echo signal into a second logic level voltage after the second threshold time. The second microphone 810 transmits the second echo signal as a second electrical signal to the main processor 710. The main processor 710 sets the period during which the second echo signal has the first logic level voltage as the second ultrasonic wave sensing time, and determines whether the second ultrasonic wave sensing time is within the second threshold time.

[0264] Meanwhile, the second threshold time may be as follows Fig.26 When the distance between the sound generator 510 and the second microphone 810 is 13 cm, the distance between the sound generator 510 and the object OBJ is 10 cm, and the minimum distance between the second microphone 810 and the object OBJ is defined by SR2, the contact point of the vertical line formed by the object OBJ and the straight line connecting the sound generator 510 and the second microphone 810 can be represented by A. Fig.26 In FIG. 5 , the distance between the sound generator 510 and the contact point A is defined as 1.5 cm. In this case, the distance a between the contact point A and the object OBJ can be calculated by Equation 4.

[0265] [Equation 4]

[0266]

[0267] In this case, the minimum distance SR2 between the second microphone 810 and the object OBJ may be calculated by Equation 5.

[0268] [Equation 5]

[0269]

[0270] The minimum distance SR2 between the second microphone 810 and the object OBJ may be about 15.166 cm. In this case, since the speed of the ultrasonic wave is 340 m / s and the distance sensed by the second microphone 810 when the ultrasonic wave generated by the sound generator 510 is reflected by the object OBJ is 0.25166 m, the second threshold time TT2 may be calculated by Equation 6.

[0271] [Equation 6]

[0272]

[0273] That is, the second threshold time TT2 may be 0.74 ms.

[0274] The fourth step is to determine whether the second microphone 810 senses the ultrasonic wave generated by the ultrasonic wave output unit UU of the sound generator 510 within the third threshold time TT3 when the second ultrasonic wave sensing time is within the second threshold time TT2. Fig.23 S204).

[0275] Specifically, the third threshold time TT3 can be as follows: Fig.26 When the distance between the sound generator 510 and the second microphone 810 is 13 cm, the distance between the sound generator 510 and the object OBJ is 10 cm, and the maximum distance between the second microphone 810 and the object OBJ is defined by SR3, the contact point of the vertical line formed by the object OBJ and the straight line connecting the sound generator 510 and the second microphone 810 can be represented by B. Fig.26 In FIG. 5 , the distance between the sound generator 510 and the contact point B is defined as 4.5 cm. In this case, the distance b between the contact point B and the object OBJ can be calculated by Equation 7.

[0276] [Equation 7]

[0277]

[0278] In this case, the maximum distance SR3 between the second microphone 810 and the object OBJ may be calculated by Equation 8.

[0279] [Equation 8]

[0280]

[0281] The maximum distance SR3 between the second microphone 810 and the object OBJ may be about 19.65 cm. In this case, since the speed of the ultrasonic wave is 340 m / s and the distance sensed by the second microphone 810 when the ultrasonic wave generated by the sound generator 510 is reflected by the object OBJ is 0.2965 m, the third threshold time TT3 may be calculated by Equation 9.

[0282] [Equation 9]

[0283]

[0284] That is, the third threshold time TT3 may be 0.872 ms.

[0285] According to the second threshold time TT2 and the third threshold time TT3, the final sensing area RA (taking into account the sensing area RA1 of the first microphone 780 and the sensing area of ​​the second microphone 810 for the object OBJ) can be limited by the minimum distance SR2 and the maximum distance SR3 between the second microphone 810 and the object OBJ located in the sensing area RA1 of the first microphone 780.

[0286] In step 5, when the first ultrasonic sensing time TD1 is within the first threshold time TT1, if the second ultrasonic sensing time is within the third threshold time TT3, even if the second ultrasonic sensing time is longer than the second threshold time TT2, the main processor 710 determines that there is an object close to the display device 10 ( Fig.23 S205).

[0287] For example, the main processor 710 may be configured to turn off the display panel 300 when determining that an object is close to the display device 10. Therefore, when the user's ear or other body parts contact the display device 10 in the call mode, the display panel 300 may maintain the off state even if the touch sensing unit 200 detects the user's touch.

[0288] In step 6, when the first ultrasonic sensing time TD1 is longer than the first threshold time TT1, or even if the first ultrasonic sensing time TD1 is within the first threshold time TT1, but if the second ultrasonic sensing time is longer than the second threshold time TT2 and longer than the third threshold time TT3, the main processor 710 also determines that there is no object close to the display device 10 ( Fig.23 S206).

[0289] As described above, in the sound generator according to the exemplary embodiment, the display device including the sound generator, and the method of driving the display device, the sound can be provided by vibrating the display panel using the sound output unit of the sound generator disposed under the display panel, and the sound generator can be used as a front speaker. Therefore, the front speaker disposed on the front surface of the display device can be omitted, thereby widening the area on the front surface of the display device where the image is displayed, and reducing the cost.

[0290] In addition, in the sound generator according to the exemplary embodiment, the display device including the sound generator, and the method of driving the display device, the display panel is vibrated to generate ultrasonic waves by the ultrasonic output unit of the sound generator, and the ultrasonic waves reflected by the object can be sensed by the first microphone and the second microphone. Therefore, the sound generator can be used as an ultrasonic transmitter of the ultrasonic proximity sensor, and the first microphone and the second microphone can be used as ultrasonic detectors of the ultrasonic proximity sensor. Therefore, since the ultrasonic transmitter and the ultrasonic detector of the ultrasonic proximity sensor can be omitted, it is possible not only to widen the area on the front surface of the display device where the image is displayed, but also to reduce costs.

[0291] In addition, in the sound generator, the display device including the sound generator, and the method of driving the display device according to the exemplary embodiment, the sound circuit board connected to the sound generator can be connected to the sound connector of the main circuit board via the first through hole of the middle frame. Therefore, the sound generator can be stably connected to the first sound driver and the second sound driver of the main circuit board.

[0292] In addition, in a sound generator, a display device including the sound generator, and a method of driving the display device according to an exemplary embodiment, the sound volume of the sound output unit is proportional to the area of ​​the sound output unit, and considering the sound volume of the sound output unit, the area of ​​the first sub-vibration layer can be larger than the area of ​​the second sub-vibration layer.

[0293] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. A display device, comprising: Display panel; as well as a sound generator, disposed on one surface of the display panel and comprising: a first vibration generating unit having a first electrode, a second electrode, and a first vibration layer between the first electrode and the second electrode, wherein the first vibration generating unit is configured to generate an audible sound; and a second vibration generating unit having a third electrode, a fourth electrode, and a second vibration layer located between the third electrode and the fourth electrode, wherein the second vibration generating unit is configured to generate ultrasonic waves; a first microphone configured to sense acoustic and ultrasonic waves; and a second microphone configured to sense the sound wave and the ultrasonic wave, wherein the first vibration generating unit is configured to contract and expand the first vibration layer based on a first driving voltage applied to the first electrode and a second driving voltage applied to the second electrode, wherein the second vibration generating unit is configured to contract and expand the second vibration layer based on a third driving voltage applied to the third electrode and a fourth driving voltage applied to the fourth electrode, and The distance between the sound generator and the first microphone is different from the distance between the sound generator and the second microphone.

2. The display device according to claim 1, wherein: An area of ​​the first vibration layer in a thickness direction of the first vibration layer is larger than an area of ​​the second vibration layer in the thickness direction of the second vibration layer.

3. The display device according to claim 1, wherein: An area of ​​the first vibration layer in a width direction of the first vibration layer is larger than an area of ​​the second vibration layer in the width direction of the second vibration layer.

4. The display device according to claim 1, wherein: The first electrode includes a first dry electrode and a first branch electrode extending from the first dry electrode, and The second electrode includes a second dry electrode and second branch electrodes extending from the second dry electrode.

5. The display device according to claim 4, wherein: The first branch electrodes and the second branch electrodes are arranged in parallel with each other and are alternately arranged in a thickness direction of the first vibration layer.

6. The display device according to claim 4, wherein: The third electrode includes a third stem electrode and a third branch electrode extending from the third stem electrode, and The fourth electrode includes a fourth dry electrode and fourth branch electrodes extending from the fourth dry electrode.

7. The display device according to claim 6, wherein: The number of the first branch electrodes or the number of the second branch electrodes is greater than the number of the third branch electrodes or the number of the fourth branch electrodes.

8. The display device according to claim 6, wherein: The first vibration layer and the second vibration layer are arranged in a thickness direction of the display device.

9. The display device according to claim 6, wherein: The first dry electrode and the second dry electrode are disposed on one side surface of the first vibration layer, and the third dry electrode and the fourth dry electrode are disposed on a side surface of the second vibration layer different from the side where the one side surface of the first vibration layer is located.

10. The display device according to claim 6, wherein: The first dry electrode and the second dry electrode are arranged on one side surface of the first vibration layer, the third dry electrode is arranged in a first contact hole penetrating the second vibration layer to be connected to the third branch electrode, and the fourth dry electrode is arranged in a second contact hole penetrating the second vibration layer to be connected to the fourth branch electrode.

11. The display device according to claim 6, wherein: The first vibration layer and the second vibration layer are arranged in a width direction of the first vibration layer that is perpendicular to a thickness direction of the first vibration layer.

12. The display device according to claim 6, wherein: The first dry electrode is arranged in a first contact hole penetrating the first vibration layer to be connected to the first branch electrode, the second dry electrode is arranged on one side surface of the first vibration layer, the third dry electrode is arranged on a side surface of the second vibration layer different from the side on which the one side surface of the first vibration layer is located, and the fourth dry electrode is arranged in a second contact hole penetrating the second vibration layer to be connected to the fourth branch electrode.

13. The display device according to claim 6, wherein: The third dry electrode is disposed in a third contact hole penetrating the second vibration layer to be connected to the third branch electrode, and the fourth dry electrode is disposed in a fourth contact hole penetrating the second vibration layer to be connected to the fourth branch electrode.

14. The display device according to claim 1, in, The first vibration generating unit is a sound output unit configured to generate an audible sound, and Wherein, the second vibration generating unit is an ultrasonic wave output unit configured to generate ultrasonic waves.

15. A display device comprising: Display panel; as well as Sound generator, including: a sound output unit configured to vibrate the display panel to generate audible sound; an ultrasonic wave output unit configured to vibrate the display panel to generate ultrasonic waves; a first microphone configured to sense acoustic and ultrasonic waves; and a second microphone configured to sense the sound wave and the ultrasonic wave, wherein the area of ​​the sound output unit is larger than the area of ​​the ultrasonic output unit, and The distance between the sound generator and the first microphone is different from the distance between the sound generator and the second microphone.

16. The display device according to claim 15, wherein: The sound output unit comprises: The first electrode is applied with a first driving voltage; A second electrode to which a second driving voltage is applied; and A first sub-vibration layer is provided between the first electrode and the second electrode, The first sub-vibration layer is configured to contract and expand based on the first driving voltage applied to the first electrode and the second driving voltage applied to the second electrode.

17. The display device according to claim 16, wherein: The ultrasonic output unit comprises: A third electrode to which a third driving voltage is applied; a fourth electrode to which a fourth driving voltage is applied; and The second sub-vibration layer is arranged between the third electrode and the fourth electrode, The second sub-vibration layer is configured to contract and expand based on the third driving voltage applied to the third electrode and the fourth driving voltage applied to the fourth electrode.

18. The display device according to claim 17, wherein: The sound generator also includes: a first pad electrode connected to the first electrode and a second pad electrode connected to the second electrode; and A third pad electrode connected to the third electrode and a fourth pad electrode connected to the fourth electrode.

19. The display device according to claim 18, further comprising: an audio circuit board connected to the first pad electrode, the second pad electrode, the third pad electrode and the fourth pad electrode; a middle frame, disposed below the display panel and having a first through hole; and A main circuit board, disposed below the middle frame and having a sound connector, The sound circuit board passes through the first through hole to be connected to the sound connector.

20. The display device according to claim 19, wherein: The main circuit board also includes: a first sound driver configured to transmit the first driving voltage and the second driving voltage to the sound generator; and The second sound driver is configured to transmit the third driving voltage and the fourth driving voltage to the sound generator.

21. A method for driving a display device, the display device having a display panel, a touch sensor panel, a sound generator including a sound output unit and an ultrasonic wave output unit, and at least one microphone, the method comprising: vibrating the display panel to generate sound using the sound output unit of the sound generator in a sound output mode; vibrating the display panel to generate ultrasonic waves using the ultrasonic wave output unit of the sound generator in a proximity sensing mode; as well as sensing the ultrasonic wave reflected by the object using a first microphone and a second microphone configured to sense the sound wave and the ultrasonic wave, The distance between the sound generator and the first microphone is different from the distance between the sound generator and the second microphone.

22. The method for driving the display device according to claim 21, further comprising: In response to ultrasonic waves being sensed by the at least one microphone, it is determined whether the object is located proximate to the display device.

23. The method for driving the display device according to claim 22, further comprising: The display panel and the touch sensor panel are turned off in response to determining that the object is positioned proximate to the display device.

24. The method for driving the display device according to claim 22, wherein: The sensing of the ultrasonic wave comprises: In response to a first microphone of the at least one microphone sensing the ultrasonic wave reflected by the object within a first threshold time and a second microphone of the at least one microphone sensing the ultrasonic wave reflected by the object within a second threshold time, it is determined that the object is located close to the display device.

25. The method for driving the display device according to claim 21, wherein: The sensing of the ultrasonic wave comprises: In response to a first microphone among the at least one microphone sensing the ultrasonic wave reflected by the object within a first threshold time, a second microphone among the at least one microphone not sensing the ultrasonic wave reflected by the object within a second threshold time, and the second microphone sensing the ultrasonic wave reflected by the object within a third threshold time, it is determined that the object is positioned close to the display device.

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